High-power low-pressure-drop module packaging structure forming die
By designing a high-power low-voltage drop module packaging structure forming mold, multiple positioning molds are used to fix multiple packaging modules at the same time, and heating pipes are used to facilitate tin liquid cleaning, the problem of low processing efficiency of packaging modules in the prior art is solved and high efficiency is achieved tin storage molding and tin liquid cleaning.
Patent Information
- Application Number
- CN202323609606.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-28
- Publication Date
- 2025-02-21
- Estimated Expiration
- 2033-12-28
AI Technical Summary
In the prior art, the module package is fixed by fixing the clamp and then storing the tin, resulting in low processing efficiency.
A high-power low-voltage drop module packaging structure forming mold is designed, including a bottom box, a positioning mold, a clamping column, a cover plate and a heating tube. Multiple packaging modules are fixed simultaneously through multiple positioning molds, and the heating tube is used to facilitate tin liquid. Clean up.
It realizes the fixing and tin storage forming of multiple package modules simultaneously, improves the tin storage efficiency of the package module, and simplifies the tin liquid cleaning process through heating pipes.
Smart Images
Figure CN222511396U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of module packaging, in particular to a high-power low-voltage drop module packaging structure forming die. Background Art
[0002] In the case of Figure 2 When the module package shown is subjected to tin storage molding, the module package needs to be fixed. In the prior art, a fixing fixture is used to fix the module package, and only a single packaged module can be fixed at a time. Repeated clamping leads to low processing efficiency of the module package. Therefore, we propose a high-power low-voltage drop module package structure molding mold to solve the above problems. Utility Model Content
[0003] The utility model aims to solve the disadvantage of low processing efficiency in the prior art of fixing the module package by a clamp and then storing tin, and proposes a high-power low-voltage drop module package structure molding die.
[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0005] A high-power low-voltage drop module packaging structure molding die, comprising a bottom box, a plurality of positioning dies are arranged on the bottom box, a positioning groove is arranged at the front end of the positioning dies, a placement groove is arranged on the positioning dies, and a clamping column is arranged at the front end of each positioning die, and the clamping column is fixed in the positioning groove;
[0006] A rotating shaft is arranged on the outer wall of the positioning groove, a cover plate is arranged on the rotating shaft, a torsion spring is arranged at the connection between the cover plate and the rotating shaft, and a clamping seat matched with the clamping column is arranged on the cover plate.
[0007] As a preferred technical solution of the utility model, a heating tube is arranged inside the bottom box, the heating tube is located at both ends of the placement groove, and a plug connector is also arranged on the bottom box, and the plug connector is used to energize the heating tube.
[0008] As a preferred technical solution of the utility model, the number of the positioning molds is five to ten, and the positioning molds are linearly arranged in the bottom box.
[0009] As a preferred technical solution of the utility model, each of the positioning molds is provided with two positioning pins, and the two positioning pins are diagonally arranged. The packaging module is positioned secondary by the positioning pins, thereby reducing the factor of unstable positioning caused by deformation of the end of the heat dissipation copper plate in the packaging module.
[0010] As a preferred technical solution of the utility model, when the torsion spring is in a natural state, the cover plate covers the positioning groove, and a handle is provided on the upper surface of the cover plate. The end of the heat dissipation copper plate in the packaging module is fixed by the cooperation of the clamping seat and the clamping column. At the same time, the cover plate can be easily opened by providing a handle on the cover plate.
[0011] The beneficial effects of the utility model are:
[0012] 1. By making a mold for fixing the packaging module, multiple packaging modules can be fixed at the same time, so that multiple packaging modules can be tin-stored and molded at the same time, thereby avoiding multiple reciprocating clamping and improving the tin storage efficiency of the packaging module.
[0013] 2. By arranging a heating tube in the bottom box, the tin dripping on the positioning mold can be heated by the heating tube, so as to facilitate its cleaning later. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a structural schematic diagram of a high-power low-voltage drop module packaging structure molding die proposed by the utility model;
[0015] Figure 2 It is a schematic diagram of the structure of the packaging module that needs to be processed;
[0016] Figure 3 This is a schematic diagram of the local structure of the connection between the cover plate and the rotating shaft in a molding die for a high-power low-voltage drop module packaging structure proposed by the utility model;
[0017] Figure 4 This is a schematic diagram of the structure inside a bottom box in a molding die for a high-power, low-voltage-drop module packaging structure proposed by the utility model.
[0018] In the figure: 1. base box; 11. heating tube; 2. positioning mold; 21. placement groove; 22. positioning pin; 3. positioning groove; 31. clamping column; 4. cover plate; 41. clamping seat; 5. torsion spring; 6. plug connector. DETAILED DESCRIPTION
[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.
[0020] Reference Figure 1-4 A high-power low-voltage drop module packaging structure molding die comprises a bottom box 1, a plurality of positioning dies 2 are arranged on the bottom box 1, the number of the positioning dies 2 is five to ten, and the positioning dies 2 are linearly arranged in the bottom box 1, and a positioning groove 3 is arranged at the front end of the positioning dies 2;
[0021] Each positioning mold 2 is provided with a placement groove 21, which is used to place the black plastic package of the packaging module, and a clamping column 31 is provided at the front end of each positioning mold 2, which is fixed in the positioning groove 3, and the end of the heat dissipation copper plate in the packaging module is clamped on the clamping column 31;
[0022] Among them, a rotating shaft is arranged on the outer wall of the positioning groove 3, and a cover plate 4 is arranged on the rotating shaft. The cover plate 4 rotates circumferentially around the rotating shaft 4. A torsion spring 5 is arranged at the connection between the cover plate 4 and the rotating shaft, and a clamping seat 41 adapted to the clamping column 31 is arranged on the cover plate 4. When the torsion spring 5 is in a natural state, the cover plate 4 covers the positioning groove 3, and a pull handle is arranged on the upper surface of the cover plate 4. The end of the heat dissipation copper plate in the packaging module is fixed by the cooperation of the clamping seat 41 and the clamping column 31. At the same time, the cover plate 4 can be easily opened by arranging a pull handle on the cover plate 4.
[0023] Secondly, a heating tube 11 is arranged inside the bottom box 1 . The heating tube 11 is located at both ends of the placement groove 21 . A plug connector 6 is also arranged on the bottom box 1 . The plug connector 6 is used to energize the heating tube 11 .
[0024] Furthermore, each positioning mold 2 is provided with two positioning pins 22, and the two positioning pins 22 are diagonally arranged. The positioning holes on the heat dissipation copper plate in the packaging module are adapted to the positioning pins. The packaging module is positioned secondary by the positioning pins 22, thereby reducing the factor of unstable positioning caused by deformation of the end of the heat dissipation copper plate in the packaging module.
[0025] In this embodiment: when storing tin, open the cover plate 4, and place the packaging module in each positioning mold 2 in turn, so that the end of the heat dissipation copper plate in the packaging module is clamped on the clamping column 31. After the installation is completed, loosen the cover plate 4, and drive the cover plate 4 to cover the positioning groove 3 through the torsion spring 5. The packaging module is fixed by the cooperation of the clamping seat 41 and the clamping column 31, and then the two ends of the packaging module can be tin-stored and molded.
[0026] When molten tin falls into the positioning mold 2, the positioning mold 2 is heated by the heating tube 11 later, so as to facilitate cleaning of the molten tin.
[0027] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A high-power low-voltage drop module packaging structure molding die, comprising a bottom box (1), characterized in that: The bottom box (1) is provided with a plurality of positioning molds (2), the front end of each positioning mold (2) is provided with a positioning groove (3), the positioning mold (2) is provided with a placement groove (21), and the front end of each positioning mold (2) is provided with a clamping column (31), and the clamping column (31) is fixed in the positioning groove (3); A rotating shaft is arranged on the outer wall of the positioning groove (3), a cover plate (4) is arranged on the rotating shaft, a torsion spring (5) is arranged at the connection between the cover plate (4) and the rotating shaft, and a clamping seat (41) adapted to the clamping column (31) is arranged on the cover plate (4).
2. The high-power low-voltage drop module packaging structure molding die according to claim 1, characterized in that: A heating tube (11) is arranged inside the bottom box (1), and the heating tube (11) is located at both ends of the placement groove (21). A plug connector (6) is also arranged on the bottom box (1), and the plug connector (6) is used to energize the heating tube (11).
3. The high-power low-voltage drop module packaging structure molding die according to claim 1, characterized in that: The number of the positioning molds (2) is five to ten, and the positioning molds (2) are linearly arranged in the bottom box (1).
4. A high-power low-voltage drop module packaging structure molding die according to claim 3, characterized in that: Each of the positioning molds (2) is provided with two positioning pins (22), and the two positioning pins (22) are arranged diagonally.
5. The high-power low-voltage drop module packaging structure molding die according to claim 1, characterized in that: When the torsion spring (5) is in a natural state, the cover plate (4) covers the positioning groove (3), and a handle is provided on the upper surface of the cover plate (4).