Surface treatment mechanism for semiconductor part processing

Abstract

The utility model belongs to the field of semiconductor part machining, and particularly relates to a surface treatment mechanism for semiconductor part machining, which comprises an outer shell, a controller is mounted on the outer surface of the outer shell, the outer shell can reduce flying powder generated in the polishing process, a mechanical arm is mounted on the inner top wall of the outer shell, and the mechanical arm is connected with the controller. The mechanical arm is electrically connected with a controller installed on the outer surface of the outer machine shell, an installation mechanism is arranged in the outer machine shell and installed on the outer surface of the mechanical arm, the installation mechanism comprises a first lead screw, and the first lead screw is fixedly connected to the outer surface of the mechanical arm. By means of the outer machine shell, the mechanical arm, the mounting mechanism and the polishing shaft, a worker can replace the polishing shaft easily and conveniently, so that the worker does not need to use a screwdriver and other tools to screw a plurality of screws one by one, and the replacement speed of the worker to the polishing shaft is effectively increased.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor component processing, in particular to a surface treatment mechanism for semiconductor component processing. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields.

[0003] Due to the special nature of the material, semiconductors need to be polished during the production and processing process to facilitate the subsequent bonding of semiconductors. However, in the process of polishing semiconductor components, it is usually divided into two steps: coarse grinding and fine grinding. First, a coarse grinding wheel with a rougher surface is used to grind the surface of the semiconductor component for the first time, and then a fine grinding wheel with a smoother outer surface is used to grind it again to ensure the stability of the semiconductor component after bonding. However, in the existing technology, multiple screws are usually used to fix the grinding wheel, which makes it more cumbersome for the staff to replace the grinding wheel. Not only does the staff need to use tools such as screwdrivers to screw multiple screws one by one, but the replacement rate of the grinding wheel is slow. At the same time, the staff's way of fixing the semiconductor components is relatively simple, and they can only fix them on both sides, which leads to low stability after the semiconductor components are fixed. To this end, we provide a surface treatment mechanism for semiconductor component processing to solve the above problems. Utility Model Content

[0004] The utility model provides a surface treatment mechanism for semiconductor component processing in order to solve the problems that it is complicated for workers to replace the grinding wheel and the stability of the semiconductor component is low after being fixed.

[0005] In order to solve the above technical problems, the utility model provides a surface treatment mechanism for semiconductor component processing, comprising an outer housing, a controller is installed on the outer surface of the outer housing, and the outer housing can reduce the flying of powder generated during the grinding process;

[0006] A mechanical arm is installed on the inner top wall of the outer housing, and the mechanical arm is electrically connected to a controller installed on the outer surface of the outer housing. A mounting mechanism is provided inside the outer housing, and the mounting mechanism is mounted on the outer surface of the mechanical arm. The mounting mechanism includes a first screw rod, and the first screw rod is fixedly connected to the outer surface of the mechanical arm. A fixing column is fixedly connected to the outer surface of the first screw rod, and a fixing plate is fixedly connected to the outer surface of the fixing column.

[0007] A group of Z-shaped connecting rods are hinged on the outer surface of the fixed plate, and the outer surface of each Z-shaped connecting rod is fixedly connected to an arc-shaped plate. The outer surface of the first screw rod is sleeved with a connecting sleeve, and the outer surface of the connecting sleeve is fixedly connected to a group of hinge seats;

[0008] The outer surface of each articulated seat is hinged with a driving connecting rod, the driving connecting rod is hinged with the Z-shaped connecting rod, the outer surface of the connecting sleeve is rotatably connected with a threaded handle, and the threaded handle is threadedly connected to the outer surface of the first screw rod;

[0009] A positioning mechanism is arranged inside the outer housing, and the positioning mechanism has a function of fixing semiconductor components.

[0010] Specifically, the positioning mechanism includes a supporting truncated table, the inner wall of which is rotatably connected to four second screw rods, the outer surfaces of the four second screw rods are fixedly connected to a bevel gear 1, the outer surfaces of the four second screw rods are threadedly connected to a drive frame, and four reserved cavities are provided on the upper surface of the supporting truncated table. The second screw rod can rotate on the inner wall of the supporting truncated table, and as the second screw rod rotates, it can drive the movement of the drive frame.

[0011] Specifically, the four driving frames all extend to the top of the carrying table and are slidably connected to the carrying table, the outer surfaces of the four driving frames are fixedly connected with positioning plates, the bottom surface of the carrying table is installed with a forward and reverse motor, the output end of the forward and reverse motor extends to the inside of the carrying table and is rotatably connected to the carrying table, the output end of the forward and reverse motor is fixedly connected with bevel gear 2, and bevel gear 2 is meshed with bevel gear 1. The forward and reverse motor belongs to the prior art, and the rotation of bevel gear 2 can be driven by starting the forward and reverse motor, and the rotation of bevel gear 2 can drive the rotation of bevel gear 1, and the rotation of bevel gear 1 can drive the second screw rod to rotate.

[0012] Furthermore, a grinding shaft is arranged inside the outer housing, and a semiconductor component body is arranged inside the outer housing. Both the grinding shaft and the semiconductor component body belong to the prior art. Since the grinding shaft and the semiconductor component body do not belong to the main innovation direction of the present application, the specific details of the grinding shaft and the semiconductor component body are not shown in the accompanying drawings. The semiconductor component body can be fixed by the contact between the positioning plate and the outer surface of the semiconductor component body, and the grinding shaft can be fixed by the contact between the arc plate and the outer surface of the grinding shaft.

[0013] Furthermore, a support plate is provided inside the outer casing, and a group of fixed legs are fixedly connected to the upper surface of the support plate, each of the fixed legs is fixedly connected to the bottom surface of the supporting truncated table, and the bottom surface of the support plate is fixedly connected to a support shaft, and the support shaft is rotatably connected to the inner bottom wall of the outer casing. The rotation of the support shaft can drive the rotation of the support plate, and the rotation of the support plate and the connection action of the fixed legs can drive the rotation of the supporting truncated table.

[0014] Specifically, the outer surface of the support shaft is fixedly connected with pulley 1, the inner bottom wall of the outer housing is installed with a servo motor, the output end of the servo motor is fixedly connected with pulley 2, and the pulley 2 is connected to the pulley 1 through a belt. The servo motor belongs to the prior art, and the specific model of the servo motor is not further limited in this application. By starting the servo motor, the pulley 2 can be driven to rotate, and under the action of the belt, the pulley 1 can be driven to rotate, thereby driving the rotation of the support shaft.

[0015] Furthermore, the outer surface of the outer casing is slidably connected to symmetrical cabinet doors, the outer surfaces of the two cabinet doors are provided with observation windows, the outer surfaces of the two cabinet doors are fixedly connected to handles, and the outer surface of the outer casing is connected to a duct. By closing the cabinet doors, the spread of powder generated during grinding can be reduced. The duct can be connected to an external vacuum cleaner to eliminate the powder generated during grinding.

[0016] Compared with the related art, the utility model has the following beneficial effects:

[0017] 1. The utility model enables the staff to replace the grinding shaft more easily through the outer casing, the mechanical arm, the installation mechanism and the grinding shaft, so that the staff no longer need to use tools such as screwdrivers to screw multiple screws one by one, and effectively improves the staff's replacement rate of the grinding shaft.

[0018] 2. The utility model can make it easier for workers to fix semiconductor components by carrying a round table, a second screw rod, bevel gear one, a drive frame, a positioning plate, a forward and reverse motor and bevel gear two. As the forward and reverse motor is started, the bevel gear two can be driven to rotate. As the bevel gear two rotates, the bevel gear one can be driven to rotate, and then the second screw rod can be driven to rotate. As the second screw rod rotates, the four drive frames can be driven to move. As the four drive frames move, the positioning plates can be driven to move until the outer surfaces of the four positioning plates contact the outer surfaces of the semiconductor components, thereby achieving more comprehensive fixation of the semiconductor components and further improving the stability of the semiconductor components after fixation.

[0019] In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a front view schematic diagram of the three-dimensional structure of the utility model;

[0022] Figure 2 It is a schematic diagram of the internal structure of the outer casing of the utility model;

[0023] Figure 3 It is a three-dimensional structural schematic diagram of the installation mechanism of the utility model;

[0024] Figure 4 It is a three-dimensional structural schematic diagram of the positioning mechanism of the utility model.

[0025] Numbers in the figure:

[0026] 1. External casing;

[0027] 2. Robotic arm;

[0028] 3. Installation mechanism; 301. First screw rod; 302. Fixed column; 303. Fixed plate; 304. Z-shaped connecting rod; 305. Arc plate; 306. Connecting sleeve; 307. Articulated seat; 308. Driving connecting rod; 309. Threaded handle;

[0029] 4. Positioning mechanism; 401. Carrying round table; 402. Second screw rod; 403. Bevel gear 1; 404. Driving frame; 405. Positioning plate; 406. Forward and reverse motor; 407. Bevel gear 2;

[0030] 5. Grinding shaft; 6. Semiconductor component body; 7. Support plate; 8. Fixed leg; 9. Support shaft; 10. Pulley 1;

[0031] 11. Servo motor; 12. Pulley 2; 13. Cabinet door; 14. Conduit. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] See also Figure 1 to Figure 4 , a surface treatment mechanism for semiconductor component processing, comprising an outer housing 1, a controller is installed on the outer surface of the outer housing 1, and the outer housing 1 can reduce the flying of powder generated during the grinding process;

[0034] A mechanical arm 2 is installed on the inner top wall of the outer housing 1, and the mechanical arm 2 is electrically connected to a controller installed on the outer surface of the outer housing 1. A mounting mechanism 3 is provided inside the outer housing 1, and the mounting mechanism 3 is installed on the outer surface of the mechanical arm 2;

[0035] A positioning mechanism 4 is disposed inside the outer housing 1 and has a fixing function.

[0036] Please pay attention to Figure 3 The mounting mechanism 3 includes a first screw rod 301, which is fixedly connected to the outer surface of the robot arm 2. A fixing column 302 is fixedly connected to the outer surface of the first screw rod 301. A fixing plate 303 is fixedly connected to the outer surface of the fixing column 302. A positioning hole is provided on the outer surface of the fixing plate 303. The length of the fixing column 302 is greater than the length of the fixing plate 303. The fixing plate 303 and the fixing column 302 are both circular.

[0037] Please pay attention to Figure 3 A group of Z-shaped connecting rods 304 are hinged on the outer surface of the fixed plate 303, and the outer surface of each Z-shaped connecting rod 304 is fixedly connected to an arc plate 305. The outer surface of the first screw rod 301 is sleeved with a connecting sleeve 306, and the outer surface of the connecting sleeve 306 is fixedly connected to a group of hinge seats 307. The Z-shaped connecting rod 304 can be flipped on the outer surface of the fixed plate 303. With the flipping of the Z-shaped connecting rod 304, the flipping of the arc plate 305 can be driven. The connecting sleeve 306 can slide on the outer surface of the first screw rod 301, and with the movement of the connecting sleeve 306, the movement of the hinge seat 307 can be driven.

[0038] Please refer to Figure 3The outer surface of each articulated seat 307 is hinged with a driving link 308, and the driving link 308 is hinged with the Z-shaped link 304. The outer surface of the connecting sleeve 306 is rotatably connected with a threaded handle 309, and the threaded handle 309 is threadedly connected to the outer surface of the first screw rod 301. It can move with the rotation of the threaded handle 309. The movement of the threaded handle 309 can drive the movement of the connecting sleeve 306. The movement of the articulated seat 307 can drive the rotation of the driving link 308, and then drive the driving link 308 to flip.

[0039] Please refer to Figure 4 The positioning mechanism 4 includes a supporting truncated table 401, the inner wall of which is rotatably connected to four second screw rods 402, the outer surfaces of which are fixedly connected to bevel gears 403, the outer surfaces of which are threadedly connected to a drive frame 404, and four reserved cavities are provided on the upper surface of the supporting truncated table 401. The second screw rods 402 can rotate on the inner wall of the supporting truncated table 401, and the rotation of the second screw rods 402 can drive the movement of the drive frame 404.

[0040] Please refer to Figure 4 , the four driving frames 404 all extend to the top of the supporting table 401 and are slidably connected to the supporting table 401, the outer surfaces of the four driving frames 404 are fixedly connected with positioning plates 405, and the bottom surface of the supporting table 401 is installed with a forward and reverse motor 406, the output end of the forward and reverse motor 406 extends to the inside of the supporting table 401 and is rotatably connected to the supporting table 401, and the output end of the forward and reverse motor 406 is fixedly connected with a bevel gear 2 407, and the bevel gear 2 407 is meshed with the bevel gear 1 403. The forward and reverse motor 406 belongs to the prior art, and the model of the forward and reverse motor 406 is not further limited in this application. By starting the forward and reverse motor 406, the rotation of the bevel gear 2 407 can be driven, and the rotation of the bevel gear 2 407 can drive the rotation of the bevel gear 1 403, and the rotation of the bevel gear 1 403 can drive the second screw rod 402 to rotate.

[0041] Please refer to Figure 2 A grinding shaft 5 is arranged inside the outer casing 1, and a semiconductor component body 6 is arranged inside the outer casing 1. Both the grinding shaft 5 and the semiconductor component body 6 belong to the prior art. Since the grinding shaft 5 and the semiconductor component body 6 do not belong to the main innovation direction of the present application, the specific details of the grinding shaft 5 and the semiconductor component body 6 are not shown in the accompanying drawings. The semiconductor component body 6 can be fixed by the contact between the positioning plate 405 and the outer surface of the semiconductor component body 6, and the grinding shaft 5 can be fixed by the contact between the arc plate 305 and the outer surface of the grinding shaft 5.

[0042] Please refer to Figure 2A support plate 7 is provided inside the outer casing 1, and a group of fixed legs 8 are fixedly connected to the upper surface of the support plate 7, each fixed leg 8 is fixedly connected to the bottom surface of the supporting truncated table 401, and a support shaft 9 is fixedly connected to the bottom surface of the supporting plate 7, and the support shaft 9 is rotatably connected to the inner bottom wall of the outer casing 1. The rotation of the support shaft 9 can drive the rotation of the support plate 7, and the rotation of the supporting plate 7 and the connection action of the fixed legs 8 can drive the rotation of the supporting truncated table 401.

[0043] Please refer to Figure 2 The outer surface of the support shaft 9 is fixedly connected with a pulley 10, and the inner bottom wall of the outer casing 1 is installed with a servo motor 11. The output end of the servo motor 11 is fixedly connected with a pulley 2 12. The pulley 2 12 is connected to the pulley 10 through a belt. The servo motor 11 belongs to the prior art, and the specific model of the servo motor 11 is not further limited in this application. By starting the servo motor 11, the pulley 2 12 can be driven to rotate, and under the action of the belt, the pulley 10 can be driven to rotate, and then the support shaft 9 can be driven to rotate.

[0044] Please refer to Figure 1 The outer surface of the outer casing 1 is slidably connected with symmetrical cabinet doors 13, the outer surfaces of the two cabinet doors 13 are provided with observation windows, the outer surfaces of the two cabinet doors 13 are fixedly connected with handles, and the outer surface of the outer casing 1 is connected with a duct 14. By closing the cabinet doors 13, the powder dispersion generated during grinding can be reduced. The duct 14 can be connected to an external vacuum cleaner to eliminate the powder generated during grinding.

[0045] The specific implementation process of the utility model is as follows: when the device is used, the semiconductor component body 6 is first placed on the upper surface of the supporting truncated table 401, and then the forward and reverse motors 406 are started to drive the rotation of the bevel gear 2 407. With the rotation of the bevel gear 2 407, the bevel gear 1 403 can be driven to rotate, and then the second screw rod 402 can be driven to rotate. With the rotation of the second screw rod 402, the driving frame 404 can be driven to move. With the movement of the driving frame 404, the positioning plate 405 can be driven to move until the outer surface of the positioning plate 405 contacts the semiconductor component body 6, so as to achieve the positioning of the semiconductor component. The semiconductor component body 6 is more fully fixed, which further improves the stability of the semiconductor component body 6 after being fixed, and then the angle of the robot arm 2 is adjusted by the controller until the outer surface of the grinding shaft 5 contacts the surface of the semiconductor component body 6 of the grinding shaft 5, and then the servo motor 11 is started to drive the pulley 2 12 to rotate. As the pulley 2 12 rotates, the pulley 10 can be driven to rotate, and then the support shaft 9 is driven to rotate. As the support shaft 9 rotates, the support plate 7 can be driven to rotate. As the support plate 7 rotates, under the connection action of the fixed leg 8, the bearing round table 401 can be driven to rotate, thereby realizing the belt The semiconductor component body 6 fixed on the upper surface of the dynamic bearing truncated table 401 rotates. As the semiconductor component body 6 rotates, the surface of the semiconductor component body 6 is polished under the action of the polishing shaft 5. After polishing for a period of time, when the polishing shaft 5 needs to be replaced for fine grinding, the staff only needs to rotate the threaded handle 309. As the threaded handle 309 rotates, the connecting sleeve 306 can be driven to move, and then the hinge seat 307 can be driven to move. As the hinge seat 307 moves, the driving connecting rod 308 can be driven to rotate, and then the Z-shaped connecting rod 304 can be turned over. As the Z-shaped connecting rod 30 4 is flipped, thereby driving the flip of the arc plate 305 until the arc plate 305 is disengaged from the grinding shaft 5, thereby releasing the limit of the grinding shaft 5, so that the grinding shaft 5 can be removed, and then the grinding shaft 5 to be used is brought into contact with the outer surface of the fixed plate 303. At this time, the threaded handle 309 is reversed until the arc plate 305 is in contact with the outer surface of the grinding shaft 5 to be used, so as to achieve the installation of the grinding shaft 5, thereby completing a relatively simple replacement of the grinding shaft 5, so that the staff no longer needs to use tools such as screwdrivers to tighten multiple screws one by one, and effectively improves the staff's replacement rate of the grinding shaft 5.

[0046] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A surface treatment mechanism for semiconductor component processing, comprising an outer housing (1), characterized in that: A mechanical arm (2) is installed on the inner top wall of the outer casing (1), and the mechanical arm (2) is electrically connected to a controller installed on the outer surface of the outer casing (1); A mounting mechanism (3) is provided inside the outer housing (1), and the mounting mechanism (3) is mounted on the outer surface of the mechanical arm (2). The mounting mechanism (3) comprises a first screw rod (301), and the first screw rod (301) is fixedly connected to the outer surface of the mechanical arm (2); the outer surface of the first screw rod (301) is fixedly connected to a fixing column (302); the outer surface of the fixing column (302) is fixedly connected to a fixing plate (303); the outer surface of the fixing plate (303) is hinged with a group of Z-shaped connecting rods (304); the outer surface of each Z-shaped connecting rod (304) is fixedly connected to an arc-shaped plate (305); The outer surface of the first screw rod (301) is sleeved with a connecting sleeve (306), the outer surface of the connecting sleeve (306) is fixedly connected to a group of hinge seats (307), the outer surface of each hinge seat (307) is hinged with a driving connecting rod (308), the driving connecting rod (308) is hinged with the Z-shaped connecting rod (304), the outer surface of the connecting sleeve (306) is rotatably connected to a threaded handle (309), the threaded handle (309) is threadedly connected to the outer surface of the first screw rod (301), and a positioning mechanism (4) is arranged inside the outer housing (1).

2. A surface treatment mechanism for semiconductor component processing according to claim 1, characterized in that: The positioning mechanism (4) comprises a supporting truncated platform (401), the inner wall of the supporting truncated platform (401) is rotatably connected to four second screw rods (402), the outer surfaces of the four second screw rods (402) are fixedly connected to a bevel gear 1 (403), and the outer surfaces of the four second screw rods (402) are threadedly connected to a drive frame (404).

3. A surface treatment mechanism for semiconductor component processing according to claim 2, characterized in that: The four drive frames (404) all extend to the top of the supporting truncated platform (401) and are slidably connected to the supporting truncated platform (401); the outer surfaces of the four drive frames (404) are fixedly connected to positioning plates (405); the bottom surface of the supporting truncated platform (401) is installed with a forward and reverse motor (406); the output end of the forward and reverse motor (406) extends to the inside of the supporting truncated platform (401) and is rotatably connected to the supporting truncated platform (401); the output end of the forward and reverse motor (406) is fixedly connected to a bevel gear 2 (407); and the bevel gear 2 (407) is meshed with a bevel gear 1 (403).

4. The surface treatment mechanism for semiconductor component processing according to claim 1, characterized in that: A grinding shaft (5) is arranged inside the outer casing (1), and a semiconductor component body (6) is arranged inside the outer casing (1).

5. The surface treatment mechanism for semiconductor component processing according to claim 2, characterized in that: A support plate (7) is provided inside the outer casing (1); a group of fixed legs (8) are fixedly connected to the upper surface of the support plate (7); each of the fixed legs (8) is fixedly connected to the bottom surface of the supporting truncated table (401); a support shaft (9) is fixedly connected to the bottom surface of the support plate (7); and the support shaft (9) is rotatably connected to the inner bottom wall of the outer casing (1).

6. A surface treatment mechanism for semiconductor component processing according to claim 5, characterized in that: The outer surface of the support shaft (9) is fixedly connected to a pulley 1 (10), the inner bottom wall of the outer housing (1) is mounted with a servo motor (11), the output end of the servo motor (11) is fixedly connected to a pulley 2 (12), and the pulley 2 (12) is transmission-connected to the pulley 1 (10) via a belt.

7. The surface treatment mechanism for semiconductor component processing according to claim 1, characterized in that: The outer surface of the outer casing (1) is slidably connected to symmetrical cabinet doors (13), the outer surfaces of the two cabinet doors (13) are each provided with an observation window, the outer surfaces of the two cabinet doors (13) are each fixedly connected to a handle, and the outer surface of the outer casing (1) is connected to a conduit (14).

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