Carrier plate

Abstract

The utility model relates to the technical field of silicon wafer batteries, and particularly discloses a carrier plate, which comprises a first support table; the first supporting table is provided with a supporting area for placing a silicon wafer; friction lines are arranged on the supporting area. According to the scheme, the friction lines are arranged on the supporting area, so that the friction force between the silicon wafer and the first supporting table can be increased, the movement of the silicon wafer relative to the first supporting table is reduced or avoided, and the degree that the silicon wafer is scratched due to contact with the inner wall of the carrier plate is reduced, so that the influence on the coating effect and the battery performance is reduced; the problem that the battery performance is reduced due to contact between the silicon wafer and the carrier plate in the carrier plate moving process is effectively solved.

Description

Technical Field

[0001] The present application relates to the technical field of silicon wafer batteries, and in particular to a carrier board. Background Art

[0002] In the production process of silicon wafer batteries, the carrier needs to carry the silicon wafer, and the carrier moves to send the silicon wafer into the chamber for heating and coating. During the movement of the carrier, especially during the acceleration or deceleration of the carrier, the silicon wafer will move relative to the carrier, causing the surrounding of the silicon wafer to contact the inner wall of the carrier, causing the silicon wafer to be scratched, thereby affecting the coating effect of the silicon wafer and the battery performance. Utility Model Content

[0003] In view of this, the purpose of the present application is to provide a carrier for solving the problem of reduced battery performance caused by contact between the silicon wafer and the carrier during the movement of the carrier.

[0004] In order to achieve the above technical objectives, the present application provides a carrier plate, comprising: a first support platform;

[0005] The first supporting platform is provided with a supporting area for placing the silicon wafer;

[0006] The support area is provided with friction lines.

[0007] Furthermore, the friction lines are stripe lines or mesh lines.

[0008] Further, the support area is frame-shaped;

[0009] The first supporting platform is provided with a hollow groove in the area surrounded by the supporting area.

[0010] Furthermore, the edge of the support area is arranged with an arc transition.

[0011] Furthermore, a plurality of through holes are provided in the hollow groove;

[0012] The through hole communicates the outside of the first support platform with the inside of the hollow groove.

[0013] Further, it also includes: a second support platform;

[0014] The second support platform is disposed in the hollow groove;

[0015] The second supporting platform is used to support the silicon wafer.

[0016] Furthermore, the contact surface between the second supporting platform and the silicon wafer is a polished surface.

[0017] Furthermore, the second support platform includes a plurality of columns;

[0018] The columnar body includes one or more of a rectangular frame column, a rectangular column, a rhombus column, a triangular column and a circular column.

[0019] Further, the first support platform is provided with an inner groove;

[0020] The supporting area is arranged in the inner groove.

[0021] Further, the first support platform includes a tray and a vertical plate;

[0022] The tray is detachably and hermetically connected to the vertical plate;

[0023] The supporting area is arranged on the vertical plate.

[0024] It can be seen from the above technical solutions that the present application provides a carrier, comprising: a first support platform; a support area for placing a silicon wafer is provided on the first support platform; and friction patterns are provided on the support area.

[0025] In this solution, by providing friction patterns on the supporting area, the friction between the silicon wafer and the first supporting platform can be increased, thereby reducing or avoiding the movement of the silicon wafer relative to the first supporting platform, thereby reducing the degree to which the silicon wafer is scratched by contact with the inner wall of the carrier, thereby reducing the impact on the coating effect and battery performance, and effectively solving the problem of reduced battery performance due to contact between the silicon wafer and the carrier during the movement of the carrier. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0027] Figure 1 A side view of a carrier provided in an embodiment of the present application;

[0028] Figure 2 A top view of a first support platform in a carrier plate provided in an embodiment of the present application, wherein the friction pattern is a mesh pattern;

[0029] Figure 3 A top view of a first support platform having a strip-shaped friction pattern in a carrier provided in an embodiment of the present application;

[0030] Figure 4 A top view of a carrier provided with a second support platform according to an embodiment of the present application;

[0031] Figure 5A side view of a carrier provided with a second support platform according to an embodiment of the present application. DETAILED DESCRIPTION

[0032] The technical solutions of the embodiments of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the specification of the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection requested by the present application.

[0033] In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0034] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a replaceable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0035] See also Figures 1 to 3 A carrier provided in an embodiment of the present application includes: a first support platform 10; a support area 11 for placing a silicon wafer 20 is provided on the first support platform 10; and friction lines 12 are provided on the support area 11.

[0036] Specifically, the support area 11 serves as a contact surface between the first support platform 10 and the silicon wafer 20 , and can be disposed on the top of the first support platform 10 . The silicon wafer 20 can be placed on the support area 11 .

[0037] The friction pattern 12 may cover the entire support area 11 or only part of the support area 11. The friction pattern 12 can increase the roughness of the support area 11, thereby increasing the friction between the first support platform 10 and the surface of the silicon wafer 20 during the movement of the carrier, thereby reducing the movement of the silicon wafer 20 during the movement of the carrier.

[0038] As an implementation method, Figure 1 As shown, the first support platform 10 may be provided with an inner groove 14; the support area 11 is provided in the inner groove 14. The inner groove 14 provided on the first support platform 10 makes the top surface of the first support platform 10 in a step shape; the silicon wafer 20 is placed in the inner groove 14, which can prevent the silicon wafer 20 from sliding out of the first support platform 10 when the silicon wafer 20 and the first support platform 10 slide relative to each other. Among them, the inner groove 14 can be set to have a single side length that is 1 cm to 2 cm longer than the single side length of the silicon wafer 20, so that after the silicon wafer 20 is placed in the inner groove 14, there is a distance of 0.5 cm to 1 cm between the silicon wafer 20 and the groove edge of the inner groove 14, further reducing the possibility of the silicon wafer 20 contacting the groove edge of the inner groove 13 on all sides.

[0039] In another embodiment, the top surface of the first support platform 10 can be set as a plane except the support area 11. That is, in this embodiment, since the friction pattern 12 increases the friction between the first support platform 10 and the silicon wafer 20, the inner groove 14 may not be set on the first support platform 10.

[0040] In a more specific embodiment, Figure 2 and Figure 3 As shown, the friction pattern 12 can be a stripe pattern or a mesh pattern.

[0041] Specifically, the friction pattern 12 may be a strip-shaped concave pattern or a mesh-shaped concave pattern arranged on the first support platform 10 , so that the friction force between the first support platform 10 and the silicon wafer 20 is increased.

[0042] In one embodiment, the supporting area 11 is frame-shaped; the first supporting platform 10 is provided with a hollow groove 13 in the area surrounded by the supporting area 11 .

[0043] In this embodiment, the support area 11 may be in a rectangular frame shape or a circular frame shape, and is used to support the periphery of the silicon wafer 20. By providing a hollow groove 13 in the area enclosed by the middle of the support area 11, the middle of the silicon wafer 20 may be suspended, so as to prevent the middle of the silicon wafer 20 from being scratched by touching the carrier.

[0044] like Figure 1 As shown, the edge arc transition setting of the support area 11; specifically, the support area 11 serves as the contact surface between the first support platform 10 and the silicon wafer 20, and its edge arc transition setting can avoid scratching the silicon wafer 20 due to the existence of sharp corners.

[0045] In one embodiment, Figure 2 and Figure 3 As shown, a plurality of through holes 15 are provided in the hollow groove 13 ; the through holes 15 connect the outside of the first support platform 10 with the inside of the hollow groove 13 , so that the upper and lower pressures of the silicon wafer 20 are consistent, making it easier for the suction cup to absorb the silicon wafer 20 .

[0046] The through hole 15 can be disposed at any position in the hollow groove 13 . In this embodiment, two through holes 15 can be provided, and they are disposed at diagonal positions of the hollow groove 13 .

[0047] In a further improved embodiment, see Figure 4 and Figure 5 The carrier provided in this embodiment further includes: a second support platform 30 ; the second support platform 30 is disposed in the hollow groove 13 ; the second support platform 30 is used to support the silicon wafer 20 .

[0048] Specifically, in practical applications, due to the hollow setting of the carrier, the middle of the silicon wafer 20 is easily sunken and deformed during the coating process, resulting in uneven coating and affecting the subsequent process effects.

[0049] In this embodiment, the middle portion of the silicon wafer 20 can be supported by the second supporting platform 30 , thereby avoiding the problem of collapse of the middle portion of the silicon wafer 20 .

[0050] The contact surface between the second support platform 30 and the silicon wafer 20 may be provided with second friction patterns to increase the friction force between the second support platform 30 and the silicon wafer 20 .

[0051] In this embodiment, the contact surface between the second support platform 30 and the silicon wafer 20 is a polished surface, which can support the silicon wafer 20 while avoiding scratching the bottom surface of the silicon wafer 20 .

[0052] Furthermore, the second support platform 30 includes a plurality of columns; the columns include one or more of rectangular frame columns, rectangular columns, diamond columns, triangular columns and circular columns.

[0053] Specifically, the second support platform 30 can be a rectangular frame column, that is, the second support platform 30 is a square-shaped column, and forms a U-shaped structure with the first support platform 10. The rectangular frame column-shaped second support platform 30 can provide uniform support for the bottom of the silicon wafer 20, distribute stress, and avoid excessive local stress on the silicon wafer 20.

[0054] In application, the second support platform 30 can also be composed of a plurality of columns in a rectangular column, a diamond column, a triangular column or a cylindrical shape. The second support platform 30 can be arranged in the middle of the hollow groove 13, or a plurality of columns can be distributed in the hollow groove 13 at intervals.

[0055] In one embodiment, the first support platform 10 includes a tray 101 and a vertical plate 102 ; the tray 101 and the vertical plate 102 are detachably and sealedly connected; and the support area 11 is disposed on the vertical plate 102 .

[0056] Specifically, the vertical plate 102 may include a plurality of vertical plates 102, which enclose the aforementioned hollow groove 13; the support area 11 is disposed on the vertical plate 102. The top of the vertical plate 102 may be provided with a step, so that the plurality of vertical plates 102 enclose the aforementioned inner groove 14.

[0057] In this embodiment, the tray 101 and the vertical plate 102 are sealed and connected to each other, which can prevent gas from penetrating the gap and affecting the coating effect; wherein, the tray 101 and the vertical plate 102 can be detachably connected in a manner such as a mortise and tenon connection, which is not specifically limited.

[0058] The above are only preferred embodiments of the present application and are not intended to limit the present utility model. Although the present application has been described in detail with reference to the examples, those skilled in the art can still modify the technical solutions recorded in the aforementioned examples or make equivalent substitutions for some of the technical features therein. However, any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A carrier board, characterized in that: include: A first support platform (10); The first support platform (10) is provided with a support area (11) for placing the silicon wafer (20); The support area (11) is provided with friction patterns (12).

2. The carrier board according to claim 1, characterized in that: The friction lines (12) are stripe lines or mesh lines.

3. The carrier board according to claim 1, characterized in that: The support area (11) is frame-shaped; The first support platform (10) is provided with a hollow groove (13) within the area surrounded by the support area (11).

4. The carrier board according to claim 3, characterized in that: The edge of the support area (11) is arranged in a circular arc transition.

5. The carrier board according to claim 3, characterized in that: A plurality of through holes (15) are arranged in the hollow groove (13); The through hole (15) communicates the outside of the first support platform (10) with the inside of the hollow groove (13).

6. The carrier board according to claim 3, characterized in that: Also includes: A second support platform (30); The second support platform (30) is arranged in the hollow groove (13); The second supporting platform (30) is used to support the silicon wafer (20).

7. The carrier board according to claim 6, characterized in that: The contact surface between the second supporting platform (30) and the silicon wafer (20) is a polished surface.

8. The carrier board according to claim 6, characterized in that: The second support platform (30) comprises a plurality of columns; The columnar body includes one or more of a rectangular frame column, a rectangular column, a rhombus column, a triangular column and a circular column.

9. The carrier board according to claim 1, characterized in that: The first support platform (10) is provided with an inner groove (14); The supporting area (11) is arranged in the inner groove (14).

10. The carrier board according to any one of claims 1 to 9, characterized in that: The first support platform (10) comprises a tray (101) and a vertical plate (102); The tray (101) is detachably and hermetically connected to the vertical plate (102); The supporting area (11) is arranged on the vertical plate (102).

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