Semiconductor device substrate positioning assembly

Abstract

The utility model provides a semiconductor device substrate positioning assembly, and relates to the field of circuit substrate installation and positioning, the semiconductor device substrate positioning assembly comprises two long sideboards which are symmetrically arranged front and back, four short sideboards are slidably installed in four sliding chutes in a bilateral symmetry manner, and the four short sideboards are of L-shaped structures; the two long sideboards and the four short sideboards jointly form a fence frame of a rectangular structure, and the two semiconductor circuit substrates lean against each other back to back and are inserted into the fence frame to be fixedly connected through screw screwing. Two adjusting lead screws supporting forwards are symmetrically and rotationally installed at the left end and the right end of a long sideboard on the rear side, the whole substrate positioning assembly and an operation platform or a table top can be fixed together through a positioning base, and it is avoided that when two semiconductor circuit substrates are screwed and locked in a threaded mode, the two semiconductor circuit substrates cannot be fixed; the substrate positioning assembly integrally swings and shifts on the platform or the table top along with the twisting force, the trouble that normal tightening can be carried out only when the substrate positioning assembly is extruded and positioned manually additionally is avoided, and operation and use are convenient and fast.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit substrate installation and positioning, in particular to a semiconductor device substrate positioning component. Background Art

[0002] In some application instances, two or more circuit substrates with semiconductor devices need to be overlapped and installed together with screws, and the existing installation method is to manually align the circuit substrates, visually check whether the mounting holes on the circuit substrates are aligned, and then fix the screws on the mounting holes one by one. However, in the process of fixing the screws, especially when fixing the first few screws, it is difficult to avoid that the aligned circuit substrates move relative to each other. Then, the position of the circuit board needs to be readjusted. Such installation work is time-consuming and laborious, which requires a semiconductor device substrate positioning component to conveniently and accurately align the circuit substrate.

[0003] For example, patent number CN201220183357.4 discloses a circuit substrate assembly positioning jig, including: a base for placing and fixing the circuit substrate, a cover plate arranged above the aforementioned base and rotatably connected with the aforementioned base, the aforementioned base is provided with a support column for supporting the aforementioned cover plate, the aforementioned cover plate is formed with positioning guide holes corresponding to the arrangement positions of the mounting holes of the circuit substrate, and a calibration groove for accommodating the aforementioned support column is formed at a position corresponding to the aforementioned support column. The benefit of the utility model is that the circuit substrate can be positioned and installed quickly and accurately, which greatly improves work efficiency and work quality.

[0004] The substrate positioning assembly in the above prior art is directly and simply supported and placed on an operating platform or a desktop when in use, lacking necessary positioning, resulting in that when the two substrates are screwed and locked, the substrate positioning assembly as a whole is easily driven by the torsional force to swing and shift on the platform or the desktop, requiring additional manual squeezing and positioning. In addition, when the two circuits are basically locked together, the entirety is embedded in a standard cavity, which is inconvenient to directly remove. If it is difficult to remove, the substrate positioning assembly must be turned upside down as a whole to successfully remove the circuit substrate, which is relatively troublesome and inconvenient to operate. Utility Model Content

[0005] In view of this, the utility model provides a substrate positioning assembly to solve the problem that when the entire assembly is directly and simply supported and placed on an operating platform or a desktop during use, the necessary positioning is lacking, resulting in the entire substrate positioning assembly being easily driven by the torsional force to swing and shift on the platform or the desktop when the two substrates are threadedly screwed and locked, requiring additional manual squeezing and positioning.

[0006] The utility model provides a semiconductor device substrate positioning component, specifically comprising: a long baffle, wherein the long baffle is symmetrically arranged at two locations, and a long strip structure slide groove is opened on the left and right end sections of the two long baffles, and four short baffles are symmetrically slidably installed in the four slide grooves, and the four short baffles are all L-shaped structures; the two long baffles and the four short baffles together form a fence frame of a rectangular structure, and two semiconductor circuit substrates are back to back and inserted into the fence frame to be screwed and fixedly connected; two forward-supporting adjustment screws are symmetrically rotatably installed at the left and right ends of the long baffle on the rear side, and the two adjustment screws penetrate and screw with the left and right ends of the long baffle on the front side; a swing plate is welded and supported backward on the middle section of the long baffle on the rear side, and a positioning seat is rotatably installed at the tail end of the swing plate; the positioning seat as a whole is composed of two convex mounting blocks at left and right locations and a connecting shaft welded between the top sections of the two convex mounting blocks, wherein the connecting shaft penetrates and rotates with the swing plate, and the two convex mounting blocks are fixed to the operating platform or the desktop by screw locking.

[0007] Furthermore, a T-shaped slider is welded to the outer end of each of the four short baffles, and a rubber positioning pad is fixed to the inner side of the vertical part of each of the four T-shaped sliders.

[0008] Furthermore, the four T-shaped sliders correspond to the four sliding grooves for sliding cooperation, and the rubber positioning pads on the four T-shaped sliders are in frictional pressing contact with the parts of the two long baffles located at the four sliding grooves.

[0009] Furthermore, an adjusting bolt supporting forward is rotatably installed on the bending parts of the two short baffles at the rear side, and a positioning shaft is welded forward at the bottom side of the two adjusting bolts on the bending parts of the two short baffles.

[0010] Furthermore, the bent parts of the two short baffles on the front side are slidably matched with two adjusting bolts and two positioning shafts.

[0011] The beneficial effects are:

[0012] 1. The utility model can fix the substrate positioning assembly as a whole to the operating platform or desktop with the positioning seat, so as to avoid the trouble of the substrate positioning assembly as a whole swinging and shifting on the platform or desktop following the torsional force when two semiconductor circuit substrates are screwed and locked, and the need for additional manual squeezing and positioning of the substrate positioning assembly to implement normal tightening. The operation and use are relatively convenient.

[0013] 2. In the utility model, the substrate positioning assembly can swing up and down by relying on the positioning seat. The substrate positioning assembly can be separated from the platform or desktop by simply flipping it upward. The semiconductor circuit substrates leaning against each other can be simply pushed out and unloaded. Compared with the prior art, the trouble of turning the substrate positioning assembly upside down as a whole to successfully remove the semiconductor circuit substrate can be eliminated. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solution of the embodiment of the utility model, the drawings of the embodiment will be briefly introduced below.

[0015] The drawings described below only relate to some embodiments of the present invention, but are not intended to limit the present invention.

[0016] In the attached picture:

[0017] Figure 1 It is a schematic diagram of the overall front structure of an embodiment of the utility model.

[0018] Figure 2 It is a schematic diagram of the overall rear structure of an embodiment of the utility model.

[0019] Figure 3 It is a schematic diagram of the short baffle structure of an embodiment of the utility model.

[0020] Figure 4 It is a schematic diagram of the long baffle structure of an embodiment of the utility model.

[0021] Reference numerals list

[0022] 1. Long baffle; 101. Adjusting screw; 102. Swing plate; 103. Slide groove; 2. Short baffle; 201. Adjusting bolt; 202. Positioning shaft; 203. T-shaped slider; 3. Positioning seat. DETAILED DESCRIPTION

[0023] In order to make the purpose, scheme and advantages of the technical solution of the utility model clearer, the technical solution of the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings of the specific embodiments of the utility model.

[0024] Example: Please refer to Figures 1 to 4 As shown:

[0025] The utility model provides a semiconductor device substrate positioning component, including a long baffle 1, the long baffle 1 is symmetrically arranged at two locations, a long strip structure slide groove 103 is opened on the left and right end sections of the two long baffles 1, four short baffles 2 are symmetrically slidably installed in the four slide grooves 103, and the four short baffles 2 are all L-shaped structures; the two long baffles 1 and the four short baffles 2 together form a rectangular structure fence frame, and two semiconductor circuit substrates are back to back inserted into the fence frame to be screwed and fixedly connected; two forward-supporting adjustment screws 101 are symmetrically rotatably installed at the left and right ends of the rear long baffle 1, and the two adjustment screws 101 penetrate the left and right ends of the front long baffle 1 and are screwed together; a swing plate 102 is welded and supported backward on the middle section of the rear long baffle 1, and a positioning seat 3 is rotatably installed at the tail end of the swing plate 102; the positioning seat 3 is composed of two convex mounting blocks at the left and right The cam 102 is a block 104 that is mounted on a work platform or a desktop, and the ...

[0026] Among them, a T-shaped slider 203 is welded to the outer end of each of the four short baffles 2, and a rubber positioning pad is fixed to the inner side of the vertical part of each of the four T-shaped sliders 203.

[0027] Among them, the four T-shaped sliders 203 correspond to the four slide grooves 103 for sliding cooperation, and the two adjusting bolts 201 can tighten and press the rubber positioning pads on the four T-shaped sliders 203 with the parts of the two long baffles 1 located at the four slide grooves 103 to achieve the positioning of the four short baffles 2 and the four slide grooves 103.

[0028] Among them, an adjusting bolt 201 supporting forward is rotatably installed on the bending part of the two short baffles 2 on the rear side, and a positioning shaft 202 is welded forward on the bending part of the two short baffles 2 at the bottom side of the two adjusting bolts 201. The two adjusting screws 101 can rotate forward and reverse to adjust the distance between the two long baffles 1, and the two adjusting bolts 201 can rotate forward and reverse to adjust the distance between the four short baffles 2, thereby realizing the overall adjustment of the size of the internal space of the fence frame, which is suitable for positioning semiconductor circuit substrates of different sizes and specifications and is widely used; the bending parts of the two short baffles 2 on the front side correspond to the two adjusting bolts 201 and the two positioning shafts 202 for sliding cooperation.

[0029] The specific usage and function of this embodiment: the positioning seat 3 can fix the substrate positioning assembly as a whole with the operating platform or desktop, so as to avoid the substrate positioning assembly as a whole swinging and shifting on the platform or desktop following the torsion force when the two semiconductor circuit substrates are screwed and locked, and the substrate positioning assembly can swing up and down by relying on the positioning seat 3. The substrate positioning assembly can be separated from the platform or desktop by simply flipping it upward, and the semiconductor circuit substrates that are back to back can be simply pushed off and unloaded;

[0030] The two adjusting screws 101 can rotate forward and reverse to adjust the distance between the two long baffles 1, and the two adjusting bolts 201 can rotate forward and reverse to adjust the distance between the four short baffles 2, thereby realizing the overall adjustment of the size of the internal space of the fence frame, which is suitable for positioning semiconductor circuit substrates of different sizes and specifications. In addition, the two adjusting bolts 201 can tighten and press the rubber positioning pads on the four T-shaped sliders 203 with the parts of the two long baffles 1 located at the four slide grooves 103 to achieve positioning of the four short baffles 2 and the four slide grooves 103.

Claims

1. A semiconductor device substrate positioning assembly, characterized in that: include: The long baffles (1) are symmetrically arranged at two locations, and a long strip structure slide groove (103) is opened on the left and right end sections of the two long baffles (1). Four short baffles (2) are symmetrically installed in the four slide grooves (103) in a sliding manner, and the four short baffles (2) are all L-shaped structures; the two long baffles (1) and the four short baffles (2) together form a rectangular fence frame, and the two semiconductor circuit substrates are back to back and inserted into the fence frame to be screwed and fixed; the left and right ends of the long baffles (1) on the rear side are symmetrically rotated and installed with two An adjustment screw (101) is supported forward, and two adjustment screws (101) are screwed through the left and right ends of the front long baffle (1); a swing plate (102) is welded and supported backward on the middle section of the rear long baffle (1), and a positioning seat (3) is rotatably mounted on the tail end of the swing plate (102); the positioning seat (3) is composed of two left and right convex mounting blocks and a connecting shaft welded between the top sections of the two convex mounting blocks, wherein the connecting shaft is screwed through the swing plate (102) and is rotatably mounted, and the two convex mounting blocks are fixed to the operating platform or the desktop by screws.

2. A semiconductor device substrate positioning assembly as claimed in claim 1, characterized in that: A T-shaped slider (203) is welded to the outer end of each of the four short baffles (2), and a rubber positioning pad is fixed to the inner side of the vertical portion of each of the four T-shaped sliders (203).

3. A semiconductor device substrate positioning assembly as claimed in claim 2, characterized in that: The four T-shaped sliders (203) are slidably matched with the four slide grooves (103), and the rubber positioning pads on the four T-shaped sliders (203) are in frictional pressing contact with the parts of the two long baffles (1) located at the four slide grooves (103).

4. A semiconductor device substrate positioning assembly as claimed in claim 1, characterized in that: An adjusting bolt (201) supporting forward is rotatably mounted on the bent parts of the two short baffles (2) at the rear side, and a positioning shaft (202) is welded forward at the bottom of the two adjusting bolts (201) on the bent parts of the two short baffles (2).

5. A semiconductor device substrate positioning assembly as claimed in claim 4, characterized in that: The bent portions of the two short baffles (2) at the front side are slidably matched with the two adjusting bolts (201) and the two positioning shafts (202).

Images