Special tool for cutting seed crystal in Y direction

Abstract

The utility model belongs to the field of seed crystal cutting, and particularly relates to a special tool for seed crystal Y-direction cutting processing, which comprises a bottom plate for placing a seed crystal, a top end jacking plate and a middle jacking plate are arranged on one side of the bottom plate, a plurality of threaded holes are arranged on the top end jacking plate, a datum plate is fixedly arranged on the other side of the bottom plate, and the middle jacking plate is arranged on the datum plate. A cutting positioning groove is formed in the portion, between the top end jacking plate and the middle jacking plate, of the datum plate in the vertical direction. According to the tool, the cutting efficiency is greatly improved, 1100 wafers can be machined in eight hours originally, one person can machine 1100 wafers in two hours, the machining period is shortened, the machining cost is reduced, the tool is further provided with a top end jacking plate and a datum plate, the top end jacking plate is further provided with a threaded hole, a jackscrew is inserted into the threaded hole to tightly jack the seed wafers, and the machining efficiency is greatly improved. And the cut part of the seed wafer can be effectively prevented from falling off, so that the wafer is prevented from being damaged.

Description

Technical Field

[0001] The utility model belongs to the field of seed crystal cutting, in particular to a special tool for seed crystal Y-direction cutting processing. Background Art

[0002] Seed crystal refers to a seed crystal formed by adding a small amount of single crystal silicon into silicon melt in a high-temperature molten state through a specific process. Simply put, it is a seed for growing single crystal silicon and a precursor for preparing single crystal silicon.

[0003] When the factory cuts the seed wafer, it uses a glass cutting machine to cut the Y-axis size of the seed wafer. Only one seed wafer can be cut each time, and only 1,100 wafers can be processed in eight hours, resulting in low processing efficiency, long processing cycle, and high processing cost. In order to improve the cutting efficiency, it is necessary to provide a special tooling for seed wafer cutting processing. Utility Model Content

[0004] The utility model aims to provide a special tool for seed crystal Y-direction cutting processing to solve the problems raised in the above-mentioned background technology.

[0005] The purpose of this utility model is to adopt the following technical solutions to achieve:

[0006] A special tooling for Y-direction cutting processing of seed crystals proposed in the utility model comprises a base plate for placing seed crystal pieces, a top tightening plate and a middle tightening plate are provided on one side of the base plate, a plurality of threaded holes are provided on the top tightening plate, a reference plate is fixedly provided on the other side of the base plate, and a cutting positioning groove is provided on the reference plate located between the top tightening plate and the middle tightening plate in the vertical direction.

[0007] By means of the above technical solution, the utility model has the following advantages:

[0008] (1) The utility model greatly improves the cutting efficiency. It originally took eight hours to process 1,100 pieces, but now it takes one person two hours to process 1,100 pieces, thus shortening the processing cycle and reducing the processing cost.

[0009] (2) The utility model is provided with a top tightening plate and a reference plate. The top tightening plate is also provided with a threaded hole. The seed chip is tightened by inserting a screw into the threaded hole, which can effectively prevent the cut-off part of the seed chip from falling off and causing chip damage.

[0010] Furthermore, the cutting positioning groove divides the reference plate into two parts, wherein the part at the top is the top reference plate, and the wall surface of the top tightening plate facing the middle tightening plate is flush with the wall surface of the top reference plate close to the through groove.

[0011] Furthermore, a plurality of threaded holes are formed on the middle tightening plate.

[0012] Advantages: When the number of seed chips to be cut is small, the top screw is inserted into the threaded hole to apply pressure to the seed chips so that the seed chips can be placed vertically.

[0013] Furthermore, a plurality of threaded holes are formed on the top reference plate.

[0014] Advantages: The top clamping plate and the top reference plate are inserted into the threaded holes through the top screws to clamp the seed wafer, which can more effectively prevent the cut part of the seed wafer from falling off.

[0015] Furthermore, a soft rubber layer is provided on the wall surface of the middle tightening plate facing the reference plate, and a soft rubber layer is provided on the wall surface of the reference plate facing the middle tightening plate.

[0016] Advantages: The contact between the soft rubber layer and the seed chip can prevent the seed chips on both sides from being damaged by friction.

[0017] Furthermore, the middle top plate and the reference plate are both made of stainless steel.

[0018] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented according to the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 The utility model is a structural schematic diagram of a special tooling for seed crystal Y-direction cutting processing.

[0020] [Reference Signs]

[0021] 1. Middle tightening plate; 2. Top tightening plate; 3. Bottom plate; 4. Reference plate; 41. Top reference plate. DETAILED DESCRIPTION

[0022] The features and exemplary embodiments of various aspects of the utility model will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the utility model. However, it is obvious to those skilled in the art that the utility model can be implemented without the need for some of these specific details. The following description of the embodiment is only to provide a better understanding of the utility model by showing an example of the utility model. In the accompanying drawings and the following description, at least part of the known and prior art is not shown to avoid unnecessary ambiguity to the utility model; and, for clarity, the size and shape of the part may be exaggerated. The features or characteristics described below can be combined in one or more embodiments in any suitable manner. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or quantity.

[0023] See also Figure 1 The utility model defines the end where the top tightening plate 2 and the top reference plate 41 are located as the top.

[0024] The utility model provides Figure 1 The shown special tooling for seed crystal Y-direction cutting processing comprises a base plate 3 for placing seed crystal chips, a top tightening plate 2 and an intermediate tightening plate 1 are provided on one side of the base plate 3, the intermediate tightening plate 1 is located in the middle of the base plate 3, the top tightening plate 2 is located at the top of the base plate 3, a plurality of threaded holes are provided on the top tightening plate 2, and the seed crystal chips are tightened by inserting screws into the threaded holes to prevent the cut-off part of the seed crystal chips from falling off and causing chip damage; a reference plate 4 is fixedly provided on the other side of the base plate 3, a cutting positioning groove is provided in the vertical direction on the reference plate 4 located between the top tightening plate 2 and the intermediate tightening plate 1, and the cutting positioning groove is used to locate the cutting position of the seed crystal chip to be cut, and the cutting positioning groove divides the reference plate 4 into two parts, wherein the part located at the top is the top reference plate 41, and further, the optimal position of the cutting positioning groove is that the wall surface of the top tightening plate 2 facing the intermediate tightening plate 1 is flush with the wall surface of the top reference plate 41 close to the through groove.

[0025] Furthermore, in this embodiment, a threaded hole is provided on the middle clamping plate 1. The advantage of this arrangement is that when the thickness of the multiple seed chips to be cut is smaller than the distance between the middle clamping plate 1 and the reference plate 4, a top screw is inserted into the threaded hole to apply pressure to the seed chips, so that the seed chips can be placed vertically, and the quality of the seed chips obtained after cutting is better.

[0026] Furthermore, in this embodiment, a threaded hole is also provided on the top reference plate 41. The advantage of this arrangement is that both the top clamping plate 2 and the top reference plate 41 are inserted into the threaded holes through the top screws to clamp the seed chip, applying two forces to the seed chip. Under the action of the two squeezing forces, the cut part of the seed chip can be more effectively prevented from falling off.

[0027] Furthermore, in the present embodiment, the intermediate clamping plate 1 and the reference plate 4 are both made of stainless steel. In other embodiments of the present invention, a soft rubber layer is provided on the wall surface of the intermediate clamping plate 1 facing the reference plate 4, and a soft rubber layer is provided on the wall surface of the reference plate 4 facing the intermediate clamping plate 1. The soft rubber layer is in contact with the seed chip, thereby preventing the seed chips on the edges of both sides from being damaged due to friction.

[0028] The following is a specific description of the use of this utility model:

[0029] Stack multiple seed chips placed in the vertical direction and place them in the space between the middle tightening plate 1 and the reference plate 4. If the processing tool can cut a maximum of 500 seed chips at a time, when the number of seed chips to be cut reaches 500, it is only necessary to insert screws on the top tightening plate 2 and the top reference plate 41 so that the screws tighten the ends of the seed chips, and then operate the cutting equipment to complete the cutting along the cutting positioning groove; when the number of seed chips to be cut is less than 500, it is necessary not only to insert screws on the top tightening plate 2 and the top reference plate 41, but also to insert screws on the middle tightening plate 1. The screws inserted on the middle tightening plate 1 can tighten the middle part of the seed chip, so that the seed chip is in a vertical state, and then operate the cutting equipment to complete the cutting along the cutting positioning groove.

[0030] The above is only a preferred embodiment of the present invention. Any technician familiar with the profession, without departing from the scope of the technical solution of the present invention, makes any simple modifications, equivalent changes and modifications to the above embodiments based on the technical essence of the present invention, which still fall within the scope of the technical solution of the present invention.

Claims

1. A special tool for seed crystal Y-cutting, characterized by: The invention comprises a bottom plate (3) for placing a seed crystal sheet, wherein a top tightening plate (2) and a middle tightening plate (1) are provided on one side of the bottom plate (3), a plurality of threaded holes are provided on the top tightening plate (2), and a reference plate (4) is fixedly provided on the other side of the bottom plate (3), and a cutting positioning groove is provided on the reference plate (4) located between the top tightening plate (2) and the middle tightening plate (1) in a vertical direction.

2. The special tooling for seed crystal Y-direction cutting according to claim 1, characterized in that: The cutting positioning groove divides the reference plate (4) into two parts, wherein the part located at the top is the top reference plate (41), and the wall surface of the top tightening plate (2) facing the middle tightening plate (1) is flush with the wall surface of the top reference plate (41) close to the through groove.

3. The special tooling for seed crystal Y-direction cutting according to claim 1, characterized in that: The middle tightening plate (1) is provided with a plurality of threaded holes.

4. The special tooling for seed crystal Y-direction cutting according to claim 2, characterized in that: The top reference plate (41) is provided with a plurality of threaded holes.

5. The special tooling for seed crystal Y-direction cutting according to claim 1, characterized in that: A soft rubber layer is provided on the wall surface of the middle top tightening plate (1) facing the reference plate (4), and a soft rubber layer is provided on the wall surface of the reference plate (4) facing the middle top tightening plate (1).

6. A tooling for seed crystal Y-direction cutting according to any one of claims 1 to 5, characterized in that: The intermediate tightening plate (1) and the reference plate (4) are both made of stainless steel.

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