Semiconductor automatic water replenishing chemical nickel tank

Abstract

The utility model relates to the technical field of automatic water replenishing, in particular to a semiconductor automatic water replenishing chemical nickel tank which comprises a chemical nickel tank, a heating tank is arranged at the bottom end in the chemical nickel tank, a baffle is fixedly connected to the top end of the heating tank, heating rods are symmetrically arranged in the heating tank, and the baffle is fixedly connected to the top end of the heating tank. The end, away from the chemical nickel tank, of the heating rod is fixedly connected with a heating pump, the bottom end of the chemical nickel tank is connected with a U-shaped pipe in a penetrating mode, the end, away from the chemical nickel tank, of the U-shaped pipe is fixedly connected with a water adding tank, and the interior of the water adding tank is connected with a water inlet pipe through an automatic water adding structure. According to the utility model, through the matching of the automatic water adding structure and the U-shaped pipe, the water level between the chemical nickel tank and the water adding tank can be kept horizontal through the communicating vessel principle while the water adding tank can automatically add water, so that the problem that liquid is not uniform due to the fact that the water quantity is not easy to control manually is solved, the nickel plating effect of a semiconductor is improved, and the production efficiency is improved. And the factory cost is also saved.

Description

Technical Field

[0001] The utility model relates to the technical field of automatic water replenishment, in particular to a semiconductor automatic water replenishment chemical nickel tank. Background Art

[0002] Semiconductor chemical nickel plating is a technology that uses electrolytic chemical reactions to deposit nickel on the surface of semiconductors. Its principle is to chemically modify the metal flash layer on the surface of the semiconductor so that the nickel layer can be firmly attached to the semiconductor surface. In the process of semiconductor chemical nickel plating, a metal flash layer is first formed on the surface of the semiconductor, and then nickel ions in the nickel salt solution undergo an oxidation-reduction reaction to deposit nickel on the surface of the flash layer until the predetermined thickness is reached.

[0003] During chemical nickel plating of semiconductors, a hot water pump is used to heat the liquid to a temperature of 75 to 85 degrees to circulate the heat inside the nickel tank. However, after heating to 75 degrees, the water in the liquid will evaporate. If water is not replenished, the nickel plating will be incomplete. However, manual water replenishment is difficult to control the water volume, which can easily lead to uneven liquid, greatly reducing the nickel plating effect of the semiconductor and causing great waste of factory costs. Utility Model Content

[0004] The utility model aims to solve the shortcomings of the existing manual water filling, that is, it is difficult to control the water volume and it is easy to cause liquid unevenness, and proposes a semiconductor automatic water filling chemical nickel tank.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A semiconductor automatic water replenishment chemical nickel tank comprises a chemical nickel tank, a heating tank is arranged at the bottom end thereof, a baffle is fixedly connected to the top end of the heating tank, symmetrically arranged heating rods are arranged inside the heating tank, a heating pump is fixedly connected to one end of the heating rod away from the chemical nickel tank, a U-shaped tube is connected through the bottom end of the chemical nickel tank, a water adding tank is fixedly connected to one end of the U-shaped tube away from the chemical nickel tank, and a water inlet pipe is connected to the inside of the water adding tank via an automatic water adding structure.

[0007] Preferably, the automatic water-adding structure includes a water storage pipe, a movable valve, symmetrically distributed limit blocks, a connecting rod, a float, and a water outlet pipe. The water storage pipe is connected to the water inlet pipe, the movable valve is slidably connected to the top inner wall of the water storage pipe, the limit block is fixedly connected to the top of the water storage pipe, the connecting rod is rotatably connected to the limit block, the float is fixedly connected to one end of the connecting rod away from the water storage pipe, and the water outlet pipe is connected to the outer wall of the water storage pipe.

[0008] Preferably, a water outlet hole is provided at the bottom end of the chemical nickel tank, and the water outlet hole is arranged at the middle end of the bottom of the heating tank.

[0009] Preferably, a check valve is provided at the middle end of the U-shaped tube.

[0010] Preferably, the connecting rod is fixedly connected to the top of the movable valve, a limiting block is provided on the inner wall of the top of the water storage pipe, the movable valve is provided with a notch matched with the limiting block, the float is hollow, and a rubber pad is provided on the outer wall of the movable valve.

[0011] Preferably, the heating pump is fixedly connected to the outer wall of the chemical nickel tank, and the baffle is provided with evenly distributed holes.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. When the utility model is in use, the automatic water adding structure and the U-shaped tube cooperate to enable the water adding tank to automatically add water, and at the same time, the water level between the chemical nickel tank and the water adding tank is kept horizontal through the connecting vessel principle, thereby solving the problem of uneven liquid caused by manual control of water volume, improving the nickel plating effect of semiconductors, and saving factory costs.

[0014] 2. When the utility model is in use, the baffle plate provided at the bottom of the chemical nickel tank can be used to separate the heating rod from the semiconductor, so as to prevent the two from being entangled with each other and causing damage when being taken out, and also making it easier to clean the chemical nickel tank afterwards. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the appearance of a semiconductor automatic water replenishment chemical nickel tank proposed by the utility model;

[0016] Figure 2 This is a schematic diagram of the internal three-dimensional structure of a semiconductor automatic water replenishment chemical nickel tank proposed by the utility model;

[0017] Figure 3 This is a schematic diagram of the bottom three-dimensional structure of a semiconductor automatic water replenishment chemical nickel tank proposed by the utility model;

[0018] Figure 4 This is a schematic diagram of a semi-cut three-dimensional structure of a semiconductor automatic water replenishment chemical nickel tank proposed by the utility model;

[0019] Figure 5 The utility model is a three-dimensional structural schematic diagram of an automatic water replenishment structure of a semiconductor automatic water replenishment chemical nickel tank.

[0020] In the figure: 1 chemical nickel tank, 2 heating tank, 3 baffle, 4 heating rod, 5 heating pump, 6 U-shaped pipe, 7 water adding tank, 8 water storage pipe, 9 movable valve, 10 limit block, 11 connecting rod, 12 float, 13 water outlet pipe, 14 water inlet pipe, 15 water outlet hole, 16 check valve. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0022] Reference Figure 1-Figure 5 A semiconductor automatic water replenishment chemical nickel tank comprises a chemical nickel tank 1, a heating tank 2 is arranged at the bottom end of the interior of the chemical nickel tank 1, a baffle 3 is fixedly connected to the top of the heating tank 2, symmetrically arranged heating rods 4 are arranged inside the heating tank 2, a heating pump 5 is fixedly connected to the end of the heating rod 4 away from the chemical nickel tank 1, a U-shaped tube 6 is connected through the bottom end of the chemical nickel tank 1, a water adding tank 7 is fixedly connected to the end of the U-shaped tube 6 away from the chemical nickel tank 1, and a water inlet pipe 14 is connected to the interior of the water adding tank 7 through an automatic water adding structure.

[0023] It should be noted that the specific model and specifications of the heating pump 5 need to be selected and determined based on the actual specifications of the device, and the specific selection calculation method adopts the existing technology in the field, so it is not repeated here.

[0024] Furthermore, the automatic water-adding structure includes a water storage pipe 8, a movable valve 9, a symmetrically distributed limit block 10, a connecting rod 11, a float 12, and a water outlet pipe 13. The water storage pipe 8 is connected to the water inlet pipe 14 through a through connection. The movable valve 9 is slidably connected to the top inner wall of the water storage pipe 8. The limit block 10 is fixedly connected to the top of the water storage pipe 8. The connecting rod 11 is rotatably connected to the limit block 10. The float 12 is fixedly connected to one end of the connecting rod 11 away from the water storage pipe 8. The water outlet pipe 13 is connected to the outer wall of the water storage pipe 8 through a through connection.

[0025] Among them, the automatic water adding structure mainly relies on the water pressure when the water inlet pipe 14 adds water to the water storage pipe 8, and pours water into the water adding tank 7 through the water storage pipe 13. When the water volume is added to a certain extent, the float 12 floats up, and the movable valve 9 is pressed down to block the outlet of the water outlet pipe 13, thereby realizing automatic water adding.

[0026] Furthermore, a water outlet 15 is provided at the bottom of the chemical nickel tank 1 , and the water outlet 15 is arranged at the middle end of the bottom of the heating tank 2 .

[0027] The water outlet 15 is mainly used to discharge waste water after use to avoid direct contact between people and waste water and causing harm.

[0028] Furthermore, a check valve 16 is provided at the middle end of the U-shaped tube 6 .

[0029] The check valve 16 is used to limit the water from the chemical nickel tank 1 to flow into the water supply tank 7, and the check valve 16 can be closed to ensure that no water will flow into the chemical nickel tank when the water is drained.

[0030] Furthermore, the connecting rod 11 is fixedly connected to the top of the movable valve 9, a limiting block is provided on the inner wall of the top of the water storage pipe 8, the movable valve 9 is provided with a notch adapted to the limiting block, the float 12 is hollow, and a rubber pad is provided on the outer wall of the movable valve 9.

[0031] The movable valve 9 can be taken out by rotating the notch to match the limiting block, and one end of the connecting rod 11 rises while the other end falls to press the movable valve 9 down.

[0032] Furthermore, the heating pump 5 is fixedly connected to the outer wall of the chemical nickel tank 1 , and the baffle 3 is provided with holes which are evenly distributed.

[0033] The holes on the baffle 3 allow the water flow to contact the heating rod 4 through the baffle 3 and also block the semiconductor.

[0034] Working principle: first open the water inlet pipe 14, water reaches the inside of the water storage pipe 8 through the water inlet pipe 14, and then flows into the water adding tank 7 through the water outlet pipe 13. When the water accumulates to a certain level in the water adding tank 7, the float 12 moves upward under the influence of the buoyancy of the water, driving one end of the connecting rod 11 to move upward. At the same time, the other end of the connecting rod 11 drives the movable valve 9 downward under the action of the lever, so that the movable valve 9 moves down to the position of the water outlet pipe 13 to block it, and then open the check valve 16. Under the action of the communicating vessel principle, the water in the water adding tank 7 can reach a parallel state with the water in the chemical nickel tank 1, and then start the heating pump 5. The heating pump 5 provides electricity to heat the heating rod 4. One end of the heating rod 4 contacts with the water for heating, thereby solving the problem of uneven liquid caused by manual control of the water volume, improving the nickel plating effect of the semiconductor, and saving factory costs.

[0035] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A semiconductor automatic water replenishment chemical nickel tank, comprising a chemical nickel tank (1), characterized in that: A heating tank (2) is arranged at the bottom end of the chemical nickel tank (1), a baffle (3) is fixedly connected to the top end of the heating tank (2), symmetrically arranged heating rods (4) are arranged inside the heating tank (2), one end of the heating rod (4) away from the chemical nickel tank (1) is fixedly connected to a heating pump (5), a U-shaped tube (6) is connected through the bottom end of the chemical nickel tank (1), one end of the U-shaped tube (6) away from the chemical nickel tank (1) is fixedly connected to a water adding tank (7), and the inside of the water adding tank (7) is connected to a water inlet pipe (14) via an automatic water adding structure.

2. A semiconductor automatic water replenishment chemical nickel tank according to claim 1, characterized in that: The automatic water-adding structure comprises a water storage pipe (8), a movable valve (9), a symmetrically distributed limit block (10), a connecting rod (11), a floating ball (12), and a water outlet pipe (13); the water storage pipe (8) is connected to a water inlet pipe (14); the movable valve (9) is slidably connected to the inner wall of the top end of the water storage pipe (8); the limit block (10) is fixedly connected to the top end of the water storage pipe (8); the connecting rod (11) is rotatably connected to the limit block (10); the floating ball (12) is fixedly connected to one end of the connecting rod (11) away from the water storage pipe (8); and the water outlet pipe (13) is connected to the outer wall of the water storage pipe (8).

3. A semiconductor automatic water replenishment chemical nickel tank according to claim 1, characterized in that: A water outlet hole (15) is provided at the bottom end of the chemical nickel tank (1), and the water outlet hole (15) is arranged at the middle end of the bottom of the heating tank (2).

4. A semiconductor automatic water replenishment chemical nickel tank according to claim 1, characterized in that: A check valve (16) is provided at the middle end of the U-shaped tube (6).

5. A semiconductor automatic water replenishment chemical nickel tank according to claim 2, characterized in that: The connecting rod (11) is fixedly connected to the top end of the movable valve (9); a limiting block is provided on the inner wall of the top end of the water storage pipe (8); the movable valve (9) is provided with a notch matched with the limiting block; the floating ball (12) is hollow; and a rubber pad is provided on the outer wall of the movable valve (9).

6. A semiconductor automatic water replenishment chemical nickel tank according to claim 1, characterized in that: The heating pump (5) is fixedly connected to the outer wall of the chemical nickel tank (1), and the baffle (3) is provided with evenly distributed holes.

Images