Insoluble anode pulse electroplating device and electroplating equipment

Abstract

The utility model relates to the technical field of electroplating, and discloses an insoluble anode pulse electroplating device and electroplating equipment, and the insoluble anode pulse electroplating device comprises a pulse power supply which is provided with a first electrode and a second electrode; the first anode structure is coated with a catalytic coating and electrically connected with the first electrode, a first unilateral diode is electrically connected between the first anode structure and the first electrode, an anode of the first unilateral diode is electrically connected with the first electrode, and a cathode of the first unilateral diode is electrically connected with the first anode structure; the second anode structure is electrically connected with the first electrode; according to the utility model, the problems that the service life of the anode is affected and the electroplating cost is increased due to the fact that hydrogen evolution corrosion occurs at the anode with the catalytic coating and the catalytic coating falls off are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating, in particular to an insoluble anode pulse electroplating device and electroplating equipment. Background Art

[0002] Electroplating is the process of coating a thin film of other metals or alloys on the surface of certain metals using the principle of electrolysis. In ordinary electroplating processing, the plated metal is used as the anode. During the electroplating process, the plated metal gradually dissolves in the electroplating solution to become metal cations, and is reduced at the cathode to form a plated metal film. In this process, the plated metal anode is constantly consumed, causing the power lines in the electroplating tank to constantly change, affecting the plating effect. In addition, since the plated metal contains impurities, it will form anode mud during the dissolution process, which is difficult to clean.

[0003] In the related art, some electroplating processes use an insoluble anode structure as the anode part of the electroplating. During the electroplating process, since the insoluble anode does not dissolve, its structure and area are stable, so that the electric lines in the electroplating tank remain stable, and thus the electroplating effect remains stable, and at the same time, no anode mud is generated at the anode.

[0004] However, the surface of the insoluble anode is usually coated with a catalytic coating. However, during the electroplating process, the insoluble anode is affected by the pulse current, and hydrogen evolution corrosion will occur on the surface, causing the catalytic coating to fall off, seriously affecting the life of the anode and increasing the electroplating cost. Utility Model Content

[0005] In view of this, the utility model provides an insoluble anode pulse electroplating device and electroplating equipment to solve the problem of hydrogen evolution corrosion occurring at the anode with a catalytic coating, causing the catalytic coating to fall off, affecting the life of the anode and increasing the electroplating cost.

[0006] In the first aspect, the utility model provides an insoluble anode pulse electroplating device, comprising: a pulse power supply having a first electrode and a second electrode; a first anode structure coated with a catalytic coating and electrically connected to the first electrode, a first unidirectional diode electrically connected between the first anode structure and the first electrode, an anode of the first unidirectional diode electrically connected to the first electrode, and a cathode of the first unidirectional diode electrically connected to the first anode structure; a second anode structure electrically connected to the first electrode; and a plating cathode structure electrically connected to the second electrode.

[0007] Beneficial effects: During use, the positive and negative poles of the pulse power supply are alternately changed as the time period changes, thereby outputting currents in both positive and negative directions to its load circuit. When the pulse power supply outputs a forward current, the current of the first anode structure and the second anode structure flows to the electroplating cathode structure, and when the pulse power supply outputs a reverse current, the current flows from the electroplating cathode structure to the first anode structure and the second anode structure. If the second anode structure is not provided, when the first anode structure bears a reverse current, hydroxides are easily formed between the catalytic coating of the first anode structure and the substrate, causing the anode passivation to fail, seriously affecting the life of the anode. In addition, the metal cations in the electrolyte are precipitated at the first anode structure to produce a metal coating. When the pulse power supply outputs a forward current, the metal coating at the anode is peeled off, which will damage the catalytic coating and also affect the service life of the first anode structure. By setting the second anode structure in parallel with the first anode structure, an oxidized metal film is formed on the surface of the second anode structure when it is subjected to a forward current, and when it is subjected to a reverse current, it can attract most of the reverse current, and at the same time, the surface oxidized metal film is reduced, effectively protecting the first anode structure. However, in actual operation, it was found that in some electroplating processes with long reverse current pulse time or high reverse current density, part of the reverse current will still pass through the first anode structure, causing consumption of the first anode structure. Therefore, a unidirectional conductive unit is set to prevent the reverse current from passing through the first anode structure, while the second anode structure completely bears the reverse current, thereby protecting the first anode structure, extending the service life of the first anode structure, reducing costs, and improving the electroplating quality.

[0008] In an optional embodiment, a second unidirectional diode is electrically connected between the second anode structure and the first electrode, the anode of the second unidirectional diode is electrically connected to the second anode structure, the cathode of the first unidirectional diode is electrically connected to the second electrode, and a third unidirectional diode is also included, the anode of the third unidirectional diode is electrically connected to the anode of the first unidirectional diode, and the cathode of the third unidirectional diode is electrically connected to the anode of the second unidirectional diode.

[0009] Beneficial effect: By setting the second unidirectional diode and the third unidirectional diode, the direction of the current on the first anode structure and the second anode structure is further controlled during the change of the current direction of the pulse power supply, so that the second anode structure is subjected to forward current and reverse current, while the first anode structure is subjected to only forward current, thereby improving the reliability of the circuit structure.

[0010] In the second aspect, the utility model also provides an electroplating equipment, including: an electroplating tank body; the above-mentioned insoluble anode pulse electroplating device, the first anode structure and the second anode structure are both located in the electroplating tank body, the first anode structure includes a plurality of coated titanium meshes, the second anode structure includes a plurality of protective titanium meshes, the plurality of coated titanium meshes and the plurality of protective titanium meshes are arranged one by one opposite to each other and fixedly connected, the electroplating cathode structure includes a plurality of plated part hangers and is located in the electroplating tank body, and the protective titanium mesh is located on the side of the coated titanium mesh facing the plated part hanger.

[0011] Beneficial effects: Since the first anode structure includes a coated titanium mesh and the second anode structure includes a protective titanium mesh, the titanium mesh can be used as an anode to apply uniform electric lines in the area corresponding to the mesh surface, making the metal coating in the coating area more uniform. At the same time, since the electroplating equipment adopts the above-mentioned insoluble anode pulse electroplating device, it can not only reduce the generation of anode mud, but also effectively extend the life of the first anode structure, reduce the cost of electroplating processing, and since the volume of the first anode structure and the conductive properties of various parts are stable, the stability of the distribution of electric lines is improved, thereby improving the quality of electroplating.

[0012] In an optional embodiment, a plurality of the coated titanium meshes are arranged opposite to each other in pairs and are respectively arranged at both ends of the width direction of the electroplating tank body, a plurality of the protective titanium meshes are arranged opposite to each other in pairs and are respectively arranged at both ends of the width direction of the electroplating tank body, and a plurality of the plated part hangers are arranged in the middle area of ​​the width direction of the electroplating tank body.

[0013] Beneficial effect: By arranging a plurality of coated titanium meshes and a plurality of protective titanium meshes at both ends of the electroplating tank in pairs opposite to each other in the width direction, it is convenient to electroplate both sides of the plated parts on the plated parts hanger at the same time, thereby shortening the electroplating processing time.

[0014] In an optional embodiment, it also includes a plurality of anode isolation boxes, which are connected to the tank wall of the electroplating tank body, and the plurality of anode isolation boxes are arranged on both sides of the width direction of the electroplating tank body in pairs, one of the coated titanium mesh and one of the protective titanium mesh are correspondingly arranged in one of the anode isolation boxes, and an ion exchange membrane is provided on the side of the anode isolation box facing the plated component hanger.

[0015] Beneficial effect: By providing an anode isolation box and an ion exchange membrane on the anode isolation box, a small amount of anode impurities and bubbles such as plating metal powder generated at the anode are isolated from the plated workpiece, thereby preventing the bubbles and impurities from contacting the plated workpiece and causing the appearance of electroplating-resistant areas on the surface of the plated workpiece.

[0016] In an optional embodiment, anode connecting rods are provided on the top of the slot walls at both ends in the width direction of the electroplating tank body, and the anode connecting rods extend along the length direction of the electroplating tank. The anode connecting rods are connected to a plurality of anode support rods extending along the depth direction of the electroplating tank body, and the plurality of anode support rods extend into the corresponding anode isolation boxes respectively. The coated titanium mesh and the protective titanium mesh are respectively connected to the anode support rods, and an isolation pad is provided between the coated titanium mesh and the protective titanium mesh, so that the coated titanium mesh and the protective titanium mesh are spaced apart.

[0017] Beneficial effects: By providing an anode connecting rod and connecting multiple anode support rods to the anode connecting rod, it is convenient to uniformly install multiple coated titanium meshes and multiple protective titanium meshes located on the same side of the width direction of the electroplating tank body, and it is also convenient to uniformly connect multiple coated titanium meshes and multiple protective titanium meshes to the circuit. By providing an anode support rod extending along the depth direction of the electroplating tank body, it is convenient to install and support the coated titanium mesh and the protective titanium mesh.

[0018] In an optional embodiment, two anode connecting rods are provided on the top of the tank wall at both ends in the width direction of the electroplating tank body, and the anode connecting rods extend along the length direction of the electroplating tank body. The anode connecting rods are connected to a plurality of anode support rods extending along the depth direction of the electroplating tank body, and the plurality of anode support rods extend into corresponding anode isolation boxes respectively, the coated titanium mesh is connected to the anode support rod provided on one of the anode connecting rods, and the protective titanium mesh is connected to the anode support rod provided on the other anode connecting rod.

[0019] Beneficial effect: A different installation method for the coated titanium mesh and the protective titanium mesh is provided. The coated titanium mesh and the protective titanium mesh are supported and fixed respectively by setting different anode connecting rods and anode supporting rods, and then connected to the power supply through different copper bars.

[0020] In an optional embodiment, it also includes a plurality of plating liquid nozzles arranged in the plating tank body, the plating liquid nozzles are suitable for spraying plating liquid, the plurality of plating liquid nozzles are arranged on both sides of the plated part hanger in the width direction of the plating tank body, and the plating liquid nozzles are located on the side of the protective titanium mesh facing the plated part hanger, and the plating liquid nozzles are provided with a plurality of plating liquid nozzles, and the plating liquid nozzles are arranged toward the plated part.

[0021] Beneficial effect: By setting up the plating liquid nozzle, during the electroplating process, each nozzle of the plating liquid nozzle is located below the liquid surface of the plating liquid, and the plating liquid sprayed out of the plating liquid nozzle and the original plating liquid in the plating tank driven by the jet of the plating liquid nozzle move toward the plated workpiece together, which is convenient for the enrichment of the plated metal ions near the plated workpiece, and at the same time, the metal ion concentration of the plated workpiece is kept full, and the holes of the deep-hole plated workpiece can also be fully in contact with the plating liquid, thereby improving the electroplating quality.

[0022] In an optional embodiment, the plating liquid nozzle extends along the depth direction of the plating tank body, a plurality of the plating liquid nozzles are spaced apart along the length direction of the plating tank body, and a plurality of the plating liquid nozzles are evenly spaced apart along the length direction of the plating liquid nozzle.

[0023] Beneficial effect: Since the plated workpiece moves along the length direction of the electroplating tank, the electroplating liquid nozzle is extended along the depth direction of the electroplating tank, so that the electroplating liquid can flow fully and comprehensively to the plated workpiece, avoiding the uneven distribution of the plated metal ions leading to a decrease in the uniformity of electroplating.

[0024] In an optional embodiment, it also includes a lower tank body, in which a plating liquid pump is provided, the input end of the plating liquid pump is connected to the lower tank body, and the output end is connected to the plurality of plating liquid nozzles, and the plating tank body is provided with a reflux pipe connected to the lower tank body.

[0025] Beneficial effects: The lower tank body can be used to supplement metal ion raw materials, other chemicals, etc. By setting up a plating liquid pump and a reflux pipe, the plating liquid can circulate between the upper tank body and the lower tank body, which can not only provide a driving force for the plating liquid in the plating liquid nozzle to spray, but also reduce the situation where the added chemicals, raw materials, etc. are directly put into the plating tank body, affecting the electroplating quality.

[0026] In an optional embodiment, an air supply pipe is provided in the lower tank body, and an isolation net is provided between the pipe mouth of the air supply pipe and the input end of the electroplating liquid pump.

[0027] Beneficial effect: By setting an air supply pipe in the lower tank body, the oxygen content in the plating solution is supplemented to ensure the redox reaction efficiency of the light agent in the plating solution. At the same time, the air supply pipe is set in the lower tank body and an isolation net is set to better isolate the bubbles from the plated parts, reducing the situation where bubbles enter the plating tank body and contact the plated parts to cause plating defects in the anti-plating area. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 This is a circuit diagram of an insoluble anode pulse electroplating device according to an embodiment of the utility model;

[0030] Figure 2 This is a circuit diagram of an insoluble anode pulse electroplating device according to an embodiment of the utility model after adding a second unidirectional diode and a third unidirectional diode;

[0031] Figure 3 This is a schematic diagram of the overall structure of an electroplating device according to an embodiment of the utility model;

[0032] Figure 4 It is a schematic diagram of the overall structure of an electroplating device having another coating titanium mesh and a protective titanium mesh installation structure according to an embodiment of the utility model;

[0033] Figure 5 This is a schematic diagram of the installation structure of the coating titanium mesh and the protection titanium mesh in an electroplating device according to an embodiment of the utility model;

[0034] Figure 6 It is a schematic diagram of another coating titanium mesh and a protective titanium mesh installation structure in an electroplating device according to an embodiment of the utility model;

[0035] Figure 7 A schematic diagram of an anode isolation box structure in an electroplating device according to an embodiment of the utility model;

[0036] Figure 8 for Figure 7 Schematic diagram of the other direction;

[0037] Fig. 9 This is a schematic diagram of the structure of an anode connecting rod and an anode supporting rod in an electroplating device according to an embodiment of the utility model;

[0038] Fig.10 This is a schematic diagram of the structure of a nozzle mounting frame in an electroplating device according to an embodiment of the utility model;

[0039] Fig.11 The present invention is a schematic structural diagram of a nozzle fixing seat in an electroplating device according to an embodiment of the present invention.

[0040] Description of reference numerals:

[0041] 100, first anode structure; 101, coated titanium mesh; 200, second anode structure; 201, protective titanium mesh; 300, electroplating cathode structure; 301, plated component hanger; 400, pulse power supply; 401, first unidirectional diode; 402, second unidirectional diode; 403, third unidirectional diode; 404, first electrode; 405, second electrode; 500, electroplating tank; 501, anode connecting rod; 501 1. Anode support rod; 5012. Isolation pad; 600. Anode isolation box; 601. Ion membrane fixing frame; 700. Plating liquid nozzle; 701. Plating liquid nozzle; 702. Nozzle mounting frame; 7021. Arc limit groove; 7022. Plug-in block; 703. Nozzle fixing seat; 7031. Plug-in groove; 7032. Limit clamp; 704. Main pipe; 800. Lower tank body; 801. Air supply pipe; 900. Copper busbar. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0043] Combine the following Figures 1 to 11 , describing an embodiment of the utility model.

[0044] According to an embodiment of the present invention, on the one hand, an insoluble anode pulse electroplating device is provided, see Figure 1 and Figure 2 , including: a pulse power supply 400, having a first electrode 404 and a second electrode 405; a first anode structure 100, coated with a catalytic coating, electrically connected to the first electrode 404, a first unidirectional diode 401 electrically connected between the first anode structure 100 and the first electrode 404, an anode of the first unidirectional diode 401 electrically connected to the first electrode 404, and a cathode of the first unidirectional diode 401 electrically connected to the first anode structure 100; a second anode structure 200, electrically connected to the first electrode 404; and a plating cathode structure 300, electrically connected to the second electrode 405.

[0045] In this embodiment, the positive and negative poles of the pulse power supply 400 are alternately changed with the time period during use, so as to output current in both positive and negative directions to its load circuit. When the pulse power supply 400 outputs a forward current, the current flows from the first anode structure 100 and the second anode structure 200 to the electroplating cathode structure 300, and when the pulse power supply 400 outputs a reverse current, the current flows from the electroplating cathode structure 300 to the first anode structure 100 and the second anode structure 200. If the second anode structure 200 is not provided, when the first anode structure 100 bears a reverse current, hydroxides, such as titanium hydroxide, are easily formed between the catalytic coating of the first anode structure 100 and the substrate, which makes the anode passivation ineffective and seriously affects the life of the anode. In addition, the metal cations in the electrolyte are precipitated at the first anode structure 100 to produce a metal coating. When the pulse power supply 400 outputs a forward current, the metal coating at the anode is peeled off, which will damage the catalytic coating, and also affect the service life of the first anode structure 100. By setting the second anode structure 200 in parallel with the first anode structure 100, an oxidized metal film is formed on the surface of the second anode structure 200 when it is subjected to a forward current, and when it is subjected to a reverse current, it can attract most of the reverse current, and at the same time, the surface oxidized metal film is reduced, effectively protecting the first anode structure 100. However, in actual operation, it is found that in some electroplating processes with a long reverse current pulse time or a large reverse current density, part of the reverse current will still pass through the first anode structure 100, causing the consumption of the first anode structure 100. Therefore, by setting a unidirectional conductive unit to prevent the reverse current from passing through the first anode structure 100, the second anode structure 200 can completely withstand the reverse current, thereby protecting the first anode structure 100, extending the service life of the first anode structure 100, reducing costs, and improving the quality of electroplating.

[0046] Specifically, in the above embodiment, the catalytic coating may be an iridium dioxide coating, or may be other iridium dioxide coatings having similar catalytic functions.

[0047] In addition, specifically, the first unidirectional diode 401 may be a diode, or may be other circuit structures capable of achieving a unidirectional conductive function.

[0048] It should be noted that, in order to make the first anode structure 100 bear the forward current and the second anode structure 200 mainly bear the reverse current, an improvement in the design process is to set a unidirectional conductive unit that only allows the reverse current to pass between the second anode structure 200 and the pulse power supply 400 when the first unidirectional diode 401 is set. However, it is found in actual use that when the reverse current is large or the reverse current pulse time is long, an obvious plated metal coating will appear on the second anode structure 200, which will seriously affect the electroplating conditions such as the distribution of electric lines in the electroplating tank 500. Therefore, in the above embodiment, the first unidirectional diode 401 is retained and the second unidirectional diode 402 is cancelled, which not only simplifies the circuit, but also makes the second anode structure 200 be affected by the forward current and the reverse current at the same time, effectively avoiding the appearance of a plated metal coating on the surface of the second anode structure 200.

[0049] In one embodiment, a second unidirectional diode 402 is electrically connected between the second anode structure 200 and the first electrode 404, the anode of the second unidirectional diode 402 is electrically connected to the second anode structure 200, the cathode of the first unidirectional diode 401 is electrically connected to the second electrode 405, and also includes a third unidirectional diode 403, the anode of the third unidirectional diode 403 is electrically connected to the anode of the first unidirectional diode 401, and the cathode of the third unidirectional diode 403 is electrically connected to the anode of the second unidirectional diode 402.

[0050] In this embodiment, by setting a second unidirectional diode 402 and a third unidirectional diode 403, during the change of the current direction of the pulse power supply 400, the flow direction of the current on the first anode structure 100 and the second anode structure 200 is further controlled, so that the second anode structure 200 is subjected to forward current and reverse current, while the first anode structure 100 is subjected to only forward current, thereby improving the reliability of the circuit structure.

[0051] According to an embodiment of the present invention, on the other hand, an electroplating device is also provided. Figures 3 to 6 , electroplating tank body 500; the above-mentioned insoluble anode pulse electroplating device, the first anode structure 100 and the second anode structure 200 are both located in the electroplating tank body 500, the first anode structure 100 includes a plurality of coated titanium meshes 101, the second anode structure 200 includes a plurality of protective titanium meshes 201, the plurality of coated titanium meshes 101 and the plurality of protective titanium meshes 201 are arranged opposite to each other and fixedly connected, the electroplating cathode structure 300 includes a plurality of plated component hangers 301 and is located in the electroplating tank body 500, and the protective titanium mesh 201 is located on the side of the coated titanium mesh 101 facing the plated component hanger 301.

[0052] Specifically, the coated titanium mesh 101 is a titanium mesh coated with an iridium dioxide coating on the surface, while the surface of the protective titanium mesh 201 is not coated. The coated titanium mesh 101 and the protective titanium mesh 201 are arranged parallel to each other and opposite to each other to form a rectangular anode module. The anode module is arranged opposite to the plated object, so that a stable electric field is formed in the space opposite to the plate surface, with uniform distribution of electric lines. The plated object hanger 301 is located in the electroplating tank 500 and moves along the length direction of the electroplating tank 500.

[0053] In this embodiment, since the first anode structure 100 includes the coated titanium mesh 101 and the second anode structure 200 includes the protective titanium mesh 201, the titanium mesh can be used as an anode to apply uniform electric lines in the area corresponding to the mesh surface, so that the metal coating in the coating area is more uniform. At the same time, since the electroplating equipment adopts the above-mentioned insoluble anode pulse electroplating device, it can not only reduce the generation of anode mud, but also effectively extend the life of the first anode structure 100, reduce the cost of electroplating processing, and since the volume of the first anode structure 100 and the conductive properties of each part are stable, the stability of the distribution of electric lines is improved, thereby improving the quality of electroplating.

[0054] In one embodiment, multiple coated titanium meshes 101 are arranged opposite to each other in pairs and are respectively arranged at both ends of the width direction of the electroplating tank 500, multiple protective titanium meshes 201 are arranged opposite to each other in pairs and are respectively arranged at both ends of the width direction of the electroplating tank 500, and multiple plated part hangers 301 are arranged in the middle area of ​​the electroplating tank 500 in the width direction.

[0055] In this embodiment, by arranging multiple coated titanium meshes 101 and multiple protective titanium meshes 201 at both ends of the electroplating tank 500 in pairs in the width direction, it is convenient to electroplate both sides of the workpiece on the workpiece hanger 301 at the same time, thereby shortening the electroplating processing time.

[0056] In one embodiment, see Figures 6 to 8 , and also includes a plurality of anode isolation boxes 600, the anode isolation boxes 600 are connected to the tank wall of the electroplating tank body 500, and the plurality of anode isolation boxes 600 are arranged on both sides of the width direction of the electroplating tank body 500 in pairs, a coated titanium mesh 101 and a protective titanium mesh 201 are correspondingly arranged in an anode isolation box 600, and an ion exchange membrane is provided on the side of the anode isolation box 600 facing the plated component hanger 301.

[0057] Specifically, the anode isolation box 600 is a box body with an open top, and the side wall of the anode isolation box 600 facing the plated workpiece is an open frame. The side wall of the anode isolation box 600 facing the plated workpiece is connected to the ion membrane fixing frame 601 through fasteners, and the ion exchange (not shown in the figure) membrane is pressed onto the side wall of the anode isolation box 600 through the ion membrane fixing frame 601.

[0058] In this embodiment, an anode isolation box 600 is provided, and an ion exchange membrane is provided on the anode isolation box 600, so that a small amount of anode impurities such as plating metal powder and bubbles generated at the anode are isolated from the plated workpiece, thereby preventing the bubbles and impurities from contacting the plated workpiece and causing the appearance of electroplating-resistant areas on the surface of the plated workpiece.

[0059] In addition, specifically, the coated titanium mesh 101 and the protective titanium mesh 201 are both covered with an anode filter bag made of PP material 1, thereby isolating the bubbles generated on the coated titanium mesh 101 and the protective titanium mesh 201 from the plated workpiece, avoiding the situation where the bubbles come into contact with the plated workpiece to produce anti-plating areas and affect the quality of the coating.

[0060] In one embodiment, see Figure 3 , Figure 5 and Fig. 9 Anode connecting rods 501 are provided on the top of the groove walls at both ends of the electroplating tank body 500 in the width direction. The anode connecting rods 501 extend along the length direction of the electroplating tank. The anode connecting rods 501 are connected to multiple anode support rods 5011 extending along the depth direction of the electroplating tank body 500. The multiple anode support rods 5011 extend into the corresponding anode isolation boxes 600 respectively. The coated titanium mesh 101 and the protective titanium mesh 201 are respectively connected to the anode support rods 5011. An isolation pad 5012 is provided between the coated titanium mesh 101 and the protective titanium mesh 201, so that the coated titanium mesh 101 and the protective titanium mesh 201 are spaced apart.

[0061] Specifically, the protective titanium mesh 201 and the coated titanium mesh 101 are installed on the anode support rod 5011 by the same set of fasteners, and the coated titanium mesh 101 faces the side close to the anode support rod 5011. The isolation pad 5012 is an insulating spacer that is partially set between the fasteners of the protective titanium mesh 201 and the coated titanium mesh 101. The coated titanium mesh 101 and the protective titanium mesh 201 are spaced apart by a plurality of isolation pads 5012.

[0062] In this embodiment, by providing an anode connecting rod 501 and connecting a plurality of anode support rods 5011 to the anode connecting rod 501, it is convenient to uniformly install a plurality of coated titanium meshes 101 and a plurality of protective titanium meshes 201 located on the same side in the width direction of the electroplating tank body 500, and it is also convenient to uniformly connect the plurality of coated titanium meshes 101 and a plurality of protective titanium meshes 201 to the circuit. By providing the anode support rods 5011 extending in the depth direction of the electroplating tank body 500, it is convenient to install and support the coated titanium meshes 101 and the protective titanium meshes 201.

[0063] In one embodiment, see Figure 4 , Figure 6 and Fig. 9Two anode connecting rods 501 are provided on the top of the tank wall at both ends of the width direction of the electroplating tank body 500, and the anode connecting rods 501 extend along the length direction of the electroplating tank body 500. The anode connecting rods 501 are connected to a plurality of anode support rods 5011 extending along the depth direction of the electroplating tank body 500, and the plurality of anode support rods 5011 extend into corresponding anode isolation boxes 600 respectively. The coated titanium mesh 101 is connected to the anode support rod 5011 provided on one of the anode connecting rods 501, and the protective titanium mesh 201 is connected to the anode support rod 5011 provided on the other anode connecting rod 501.

[0064] Specifically, the electroplating tank 500 is installed on the frame of the electroplating equipment, and the pulse power supply 400 is installed on the top of the frame. The anode connecting rod 501 is fixedly installed on the top of the electroplating tank 500, and a copper bar 900 is also arranged on the top of the electroplating tank 500. The coating titanium mesh 101 and the protective titanium mesh 201 are electrically connected to the copper bar 900 respectively, so as to be connected to the pulse power supply 400.

[0065] In this embodiment, a different installation method for the coated titanium mesh 101 and the protective titanium mesh 201 is provided, and the coated titanium mesh 101 and the protective titanium mesh 201 are supported and fixed respectively by setting different anode connecting rods 501 and anode support rods 5011, and then connected to the power supply through different copper busbars 900.

[0066] In one embodiment, see Figure 3 , Fig.10 and Fig.11 , and also includes a plurality of plating liquid nozzles 700 arranged in the plating tank body 500, the plating liquid nozzles 700 are suitable for spraying plating liquid, and the plurality of plating liquid nozzles 700 are arranged on both sides of the plated component hanger 301 in the width direction of the plating tank body 500, and the plating liquid nozzles 700 are located on the side of the protective titanium mesh 201 facing the plated component hanger 301, and a plurality of plating liquid nozzles 701 are arranged on the plating liquid nozzle 700, and the plating liquid nozzles 701 are arranged toward the plated component.

[0067] Specifically, the bottoms of the electroplating liquid nozzles 700 located on the same side of the plated component hanger 301 are all connected to a main pipe 704, and nozzle mounting frames 702 are provided on the side walls at both ends of the width direction of the electroplating tank body 500. The bottom of the nozzle mounting frame 702 is provided with an arc-shaped limiting groove 7021, and the main pipe 704 is located in the arc-shaped limiting groove 7021. A nozzle fixing seat 703 is fixedly connected to the top of the nozzle mounting frame 702, and a plug-in block 7022 is provided on the top of the nozzle mounting frame 702, and a plug-in groove 7031 adapted to the plug-in block 7022 is provided on the nozzle fixing seat 703, so that the nozzle fixing seat 703 is positioned and installed on the top of the nozzle mounting frame 702. A plurality of limiting clamps 7032 are provided on the nozzle fixing seat 703 facing the nozzle side, and the limiting clamps 7032 are respectively adapted to the corresponding electroplating liquid nozzles 700.

[0068] In this embodiment, by setting up the plating liquid nozzle 700, during the electroplating process, each nozzle of the plating liquid nozzle 700 is located below the liquid surface of the plating liquid, and the plating liquid sprayed out from the plating liquid nozzle 701 and the original plating liquid in the plating tank 500 driven by the jet of the plating liquid nozzle 701 move toward the plated workpiece together, which is convenient for the enrichment of the plated metal ions near the plated workpiece, and also keeps the metal ion concentration of the plated workpiece full, and enables the holes of the deep-hole plated workpiece to fully contact with the plating liquid, thereby improving the electroplating quality.

[0069] In one embodiment, the plating liquid nozzle 700 extends along the depth direction of the plating tank body 500 , a plurality of plating liquid nozzles 700 are spaced apart along the length direction of the plating tank body 500 , and a plurality of plating liquid nozzles 701 are evenly spaced apart along the length direction of the plating liquid nozzle 700 .

[0070] In this embodiment, since the plated workpiece moves along the length direction of the electroplating tank 500, the electroplating liquid nozzle 700 is extended along the depth direction of the electroplating tank 500, so that the electroplating liquid can flow fully and comprehensively to the plated workpiece, thereby avoiding the uneven distribution of the metal ions to be plated, which leads to a decrease in the uniformity of electroplating.

[0071] In one embodiment, a lower tank body 800 is further included, in which a plating liquid pump (not shown in the figure) is provided, the input end of the plating liquid pump is connected to the lower tank body 800, and the output end is connected to a plurality of plating liquid nozzles 700, and a reflux pipe (not shown in the figure) connected to the lower tank body 800 is provided on the plating tank body 500.

[0072] In this embodiment, the lower tank body 800 can be used to supplement metal ion raw materials, other chemicals, etc., and by setting a plating liquid pump and a reflux pipe, the plating liquid circulates between the upper tank body and the lower tank body 800, which can not only provide a driving force for the plating liquid in the plating liquid nozzle 700 to spray, but also reduce the situation where the added chemicals, raw materials, etc. are directly put into the plating tank body 500, affecting the electroplating quality.

[0073] In one embodiment, see Figure 3 An air supply pipe 801 (not shown in the figure) is provided in the lower tank body 800, and an isolation net (not shown in the figure) is provided between the air supply pipe 801 and the input end of the plating liquid pump.

[0074] In this embodiment, an air supply pipe 801 is set in the lower tank body 800 to supplement the oxygen content in the plating solution and ensure the redox reaction efficiency of the light agent in the plating solution. At the same time, the air supply pipe 801 is set in the lower tank body 800 and an isolation net is set to better isolate the bubbles from the plated workpiece, thereby reducing the situation where bubbles enter the plating tank body 500 and contact the plated workpiece to cause plating defects in the anti-plating area.

[0075] Although the embodiments of the present invention are described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. An insoluble anode pulse electroplating device, characterized in that: include: A pulse power supply (400) having a first electrode (404) and a second electrode (405); a first anode structure (100) coated with a catalytic coating and electrically connected to the first electrode (404); a first unidirectional diode (401) electrically connected between the first anode structure (100) and the first electrode (404); an anode of the first unidirectional diode (401) electrically connected to the first electrode (404); and a cathode of the first unidirectional diode (401) electrically connected to the first anode structure (100); A second anode structure (200), electrically connected to the first electrode (404); The electroplating cathode structure (300) is electrically connected to the second electrode (405).

2. The insoluble anode pulse electroplating device according to claim 1, characterized in that: A second unidirectional diode (402) is electrically connected between the second anode structure (200) and the first electrode (404), the anode of the second unidirectional diode (402) is electrically connected to the second anode structure (200), the cathode of the first unidirectional diode (401) is connected to the second electrode (405), and a third unidirectional diode (403) is also included, the anode of the third unidirectional diode (403) is electrically connected to the anode of the first unidirectional diode (401), and the cathode of the third unidirectional diode (403) is electrically connected to the anode of the second unidirectional diode (402).

3. An electroplating device, characterized in that: include: Electroplating tank (500); The insoluble anode pulse electroplating device according to claim 1 or 2, wherein the first anode structure (100) and the second anode structure (200) are both located in the electroplating tank body (500), the first anode structure (100) includes a plurality of coated titanium meshes (101), the second anode structure (200) includes a plurality of protective titanium meshes (201), the plurality of coated titanium meshes (101) and the plurality of protective titanium meshes (201) are arranged opposite to each other and fixedly connected, the electroplating cathode structure (300) includes a plurality of plated component hangers (301) and is located in the electroplating tank body (500), the protective titanium mesh (201) is located on the side of the coated titanium mesh (101) facing the plated component hanger (301).

4. An electroplating device according to claim 3, characterized in that: The plurality of coated titanium meshes (101) are arranged opposite to each other in pairs and are arranged at both ends of the width direction of the electroplating tank (500); the plurality of protective titanium meshes (201) are arranged opposite to each other in pairs and are arranged at both ends of the width direction of the electroplating tank (500); and the plurality of plated part hangers (301) are arranged in the middle area of ​​the electroplating tank (500) in the width direction.

5. An electroplating device according to claim 4, characterized in that: It also comprises a plurality of anode isolation boxes (600), wherein the anode isolation boxes (600) are connected to the tank wall of the electroplating tank body (500), and the plurality of anode isolation boxes (600) are arranged opposite to each other on both sides of the width direction of the electroplating tank body (500), one of the coating titanium mesh (101) and one of the protective titanium mesh (201) are arranged in one of the anode isolation boxes (600) respectively, and an ion exchange membrane is provided on the side of the anode isolation box (600) facing the plated component hanger (301).

6. An electroplating device according to claim 5, characterized in that: Anode connecting rods (501) are provided at the top of the tank wall at both ends in the width direction of the electroplating tank body (500). The anode connecting rods (501) extend along the length direction of the electroplating tank body (500). The anode connecting rods (501) are connected to a plurality of anode support rods (5011) extending along the depth direction of the electroplating tank body (500). The plurality of anode support rods (5011) extend into corresponding anode isolation boxes (600) respectively. The coated titanium mesh (101) and the protective titanium mesh (201) are respectively connected to the anode support rods (5011). An isolation pad (5012) is provided between the coated titanium mesh (101) and the protective titanium mesh (201), so that the coated titanium mesh (101) and the protective titanium mesh (201) are arranged at intervals.

7. The electroplating equipment according to claim 5, characterized in that: Two anode connecting rods (501) are provided on the top of the tank wall at both ends of the electroplating tank body (500) in the width direction. The anode connecting rods (501) extend along the length direction of the electroplating tank body (500). The anode connecting rods (501) are connected to a plurality of anode support rods (5011) extending along the depth direction of the electroplating tank body (500). The plurality of anode support rods (5011) extend into corresponding anode isolation boxes (600) respectively. The coated titanium mesh (101) is connected to the anode support rod (5011) provided on one of the anode connecting rods (501), and the protective titanium mesh (201) is connected to the anode support rod (5011) provided on another of the anode connecting rods (501).

8. An electroplating device according to any one of claims 3 to 7, characterized in that: The invention also comprises a plurality of electroplating liquid spray pipes (700) arranged in the electroplating tank body (500), wherein the electroplating liquid spray pipes (700) are suitable for spraying electroplating liquid, and the plurality of electroplating liquid spray pipes (700) are arranged on both sides of the plated component hanger (301) in the width direction of the electroplating tank body (500), and the electroplating liquid spray pipes (700) are located on the side of the protective titanium mesh (201) facing the plated component hanger (301), and the electroplating liquid spray pipes (700) are provided with a plurality of electroplating liquid nozzles (701), and the electroplating liquid nozzles (701) are arranged in the direction of the plated component.

9. An electroplating device according to claim 8, characterized in that: The electroplating liquid spray pipe (700) extends along the depth direction of the electroplating tank body (500), a plurality of the electroplating liquid spray pipes (700) are distributed at intervals along the length direction of the electroplating tank body (500), and a plurality of the electroplating liquid nozzles (701) are evenly distributed at intervals along the length direction of the electroplating liquid spray pipe (700).

10. The electroplating equipment according to claim 8, characterized in that: The electroplating tank (500) further comprises a lower tank body (800), wherein a plating liquid pump is arranged in the lower tank body (800), wherein the input end of the plating liquid pump is connected to the lower tank body (800), and the output end is connected to the plurality of plating liquid nozzles (700), and the electroplating tank body (500) is provided with a reflux pipe connected to the lower tank body (800).

11. An electroplating device according to claim 10, characterized in that: An air supply pipe (801) is provided in the lower tank body (800), and an isolation net is provided between the pipe opening of the air supply pipe (801) and the input end of the electroplating liquid pump.

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