Heat dissipation structure combining uniform temperature plate and heat pipe

By making the temperature equalization plate and the heat pipe separately, and directly plugging the heat pipe to the temperature equalization plate, the production process is simplified, the problems of low production efficiency and low yield in the existing technology are solved, and efficient heat dissipation effect is achieved and Structural strength.

CN222532034UActive Publication Date: 2025-02-25MICROLOOPS HUIZHOU CORP +1
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Patent Information

Application Number
CN202420515064.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-03-15
Publication Date
2025-02-25
Estimated Expiration
2034-03-15

AI Technical Summary

Technical Problem

The existing heat dissipation structure combining heat pipes and temperature uniform plates is complicated in the production process, resulting in low production efficiency and low yield. In particular, the core rod is difficult to extract after sintering, which is easy to damage the capillary tissue.

Method used

The heat pipe is directly plugged into the temperature uniform plate and the heat pipe to the temperature uniform plate, which simplifies the production process and is embedded in the air-transmitting groove and attached to the exposed section through the first capillary tissue to ensure that the gaseous working fluid can effectively dissipate heat. .

Benefits of technology

It improves the production ease and yield of the heat dissipation structure, is suitable for large-scale rapid production, and at the same time achieves excellent heat dissipation efficiency and structural strength.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a heat dissipation structure combining a uniform temperature plate and a heat pipe, the heat dissipation structure comprises the uniform temperature plate, the heat pipe and working fluid, the uniform temperature plate comprises an upper shell, a lower shell and a first capillary structure, the lower shell is hermetically connected and sealed corresponding to the upper shell, the first capillary structure is laid on the inner surface of the upper shell, and a containing cavity is formed between the upper shell and the lower shell. The upper shell is provided with a through hole communicated with the accommodating cavity, and the first capillary tissue is provided with a through hole corresponding to the through hole; the heat pipe comprises a pipe body penetrating through the through hole in a sealing mode and a second capillary structure laid on the inner surface of the pipe body, a through groove is formed in the position, corresponding to the through hole, of the pipe body, and the second capillary structure is provided with an exposed section exposed out of the through groove; the working fluid is filled in the accommodating cavity; wherein the diameter of the inner edge of the through hole is smaller than that of the inner edge of the through hole, and the first capillary structure is embedded into the through groove to be attached to the exposed section. According to the utility model, the manufacturing easiness can be improved, and the device is suitable for large-scale rapid production.
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Description

Technical Field

[0001] The utility model relates to a heat dissipation structure, and in particular to a heat dissipation structure combining a temperature homogenizing plate and a heat pipe. Background Art

[0002] As the computing speed of electronic components continues to increase, the heat generated is also increasing. In order to effectively solve this high heat problem, the industry has widely used heat pipes and vapor chambers with good thermal conductivity. Although heat pipes can make the flow direction of the internal gaseous working fluid consistent, the amount of heat they can conduct is quite limited due to the limitation of volume. Although vapor chambers have a spacious heating area to provide direct attachment and conduction to the heat source, the flow direction of the gaseous working fluid is quite chaotic, which will limit their heat conduction performance.

[0003] In order to solve the above-mentioned problems, the industry has assembled heat pipes and temperature averaging plates to form a heat-conducting structure. The process steps are as follows: first, a shell plate of the temperature averaging plate is welded to the heat pipe, then a core rod is inserted and filled with metal powder, and then sent to a heating device for sintering. Then, the core rod is pulled out of the heat pipe, and finally, it is sealed with the other shell plate of the temperature averaging plate and other subsequent processes to complete a heat-conducting structure.

[0004] However, although the existing heat-conducting structure has the heat-dissipating performance, it has the following problems. Because its manufacturing process is quite complicated, it is not conducive to mass production. In addition, because its core rod is inserted into the bottom end (closed end) of the heat pipe, it is not easy to pull out of the heat pipe after the sintering process is completed. Moreover, the core rod is adhered to the capillary structure over a large area, and it is very easy to cause damage or cracking to the capillary structure during the process of pulling out the core rod, which leads to a low production yield of the product, which needs to be improved urgently. Utility Model Content

[0005] The purpose of the utility model is to provide a heat dissipation structure combining a temperature averaging plate and a heat pipe, which utilizes the separate manufacturing of the temperature averaging plate and the heat pipe, and then directly plugs the heat pipe into the temperature averaging plate, thereby improving the ease of manufacturing and being suitable for large-scale rapid production.

[0006] In an embodiment of the utility model, the utility model provides a heat dissipation structure combining a temperature equalizing plate and a heat pipe, comprising: a temperature equalizing plate, comprising an upper shell, a lower shell tightly sealed to the upper shell, and a first capillary structure laid on the inner surface of the upper shell, a cavity is formed between the upper shell and the lower shell, the upper shell is provided with a through hole connected to the cavity, and the first capillary structure has a through hole at a position corresponding to the through hole; a heat pipe, comprising a tube body penetrated and sealed to the through hole and a second capillary structure laid on the inner surface of the tube body, the tube body is provided with a hollow groove at a position corresponding to the through hole, and the second capillary structure has an exposed section exposed to the hollow groove; and a working fluid, filled in the cavity; wherein the inner edge diameter of the through hole is smaller than the inner edge diameter of the through hole, and the first capillary structure is embedded in the hollow groove and in contact with the exposed section.

[0007] In the embodiment of the utility model, the hollow groove is formed by peeling or scraping the skin of the tube body.

[0008] In the embodiment of the present invention, the first capillary structure and the second capillary structure are respectively a metal woven mesh or a combination of a metal woven mesh and a powder sintered body.

[0009] In the embodiment of the utility model, the tube body has a bottom edge, and there is a distance between the lower edge of the opening of the hollow slot and the bottom edge.

[0010] In an embodiment of the present invention, the lower shell has a plurality of protrusions extending toward the cavity, and the tube body has a bottom edge, which abuts against the tops of the plurality of protrusions.

[0011] In the embodiment of the utility model, the hollow groove is an annular hollow groove arranged along the entire circumference of the tube body.

[0012] In the embodiment of the utility model, the hollow groove is a C-shaped hollow groove arranged along the partial circumference of the tube body.

[0013] Based on the above, the first capillary structure can be embedded in the hollow groove and attached to the exposed section, allowing the gaseous working fluid to enter the tube body for heat dissipation. The cooled liquid working fluid then flows through the second capillary structure and the exposed section to the first capillary structure for recycling, so as to achieve a heat dissipation structure with excellent heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 The present invention is a flow chart of a method for manufacturing a heat dissipation structure of the present invention.

[0015] Figure 2 It is a three-dimensional exploded view of the heat dissipation structure of the utility model.

[0016] Figure 3 It is a cross-sectional exploded view of the heat dissipation structure of the utility model.

[0017] Figure 4 It is a three-dimensional combination diagram of the heat dissipation structure of the utility model.

[0018] Figure 5 It is a cross-sectional assembly diagram of the heat dissipation structure of the utility model.

[0019] Figure 6 It is a three-dimensional exploded view of another embodiment of the heat dissipation structure of the utility model.

[0020] In the figure:

[0021] 10: heat dissipation structure; 1: temperature equalizing plate; 11: upper shell; 111: perforation; 12: lower shell; 121: convex column; 13: first capillary structure; 131: through hole; 2: heat pipe; 21: tube body; 211: hollow groove; 212: bottom edge; 213: annular hollow groove; 214: C-shaped hollow groove; 22: second capillary structure; 221: exposed section; 3: third capillary structure; H: spacing; S: cavity; steps A to G. DETAILED DESCRIPTION

[0022] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0023] Please refer to Figures 1 to 5 As shown, the utility model provides a heat dissipation structure combining a temperature averaging plate and a heat pipe. The heat dissipation structure 10 mainly includes a temperature averaging plate 1, a heat pipe 2 and a working fluid.

[0024] like Figure 1 As shown, the steps of the manufacturing method of the heat dissipation structure 10 of the utility model are as follows: first, Figure 1 Step A and Figures 2 to 3 As shown, an upper housing 11 is provided, and one or more through holes 111 are formed on the upper housing 11. The number of through holes 111 can be selected according to actual needs, and a single through hole 111 can also be used for a micro heat sink.

[0025] Second, if Figure 1 Step B and Figures 2 to 3 As shown, a first capillary structure 13 is prepared, and a forming mold (not shown) is used to punch the first capillary structure 13, so that the first capillary structure 13 is provided with one or more through holes 131, each through hole 131 corresponds to the position of each through hole 111, and the inner diameter of each through hole 131 is smaller than the inner diameter of each through hole 111. The first capillary structure 13 is a metal woven mesh or a combination of a metal woven mesh and a powder sintered body.

[0026] Third, if Figure 1 Step C and Figures 2 to 3 As shown, the first capillary structure 13 is laid on the surface of the upper shell 11, and the through hole 131 is aligned with the through hole 111. The detailed description is as follows. This step is to align the through hole 131 of the first capillary structure 13 with the through hole 111 of the upper shell 11 for laying, and by welding or fixing, the first capillary structure 13 is firmly combined with the inner surface of the upper shell 11.

[0027] Fourth, if Figure 1 Step D and Figures 2 to 5 As shown, a lower shell 12 is prepared, which is tightly sealed to the upper shell 11 and punched with a plurality of protrusions 121, that is, the lower shell 12 extends toward the cavity S with a plurality of protrusions 121, and a cavity S is formed between the upper shell 11 and the lower shell 12, and each through hole 111 connects the cavity S.

[0028] In addition, the upper shell 11 and the lower shell 12 are tightly sealed by, for example, welding to form a vapor chamber 1. In addition to the upper shell 11 and the lower shell 12, the vapor chamber 1 further includes a first capillary structure 13 laid on the inner surface of the upper shell 11 and a third capillary structure 3 laid on the inner surface of the lower shell 12. The third capillary structure 3 can be a powder sintered body, a metal woven mesh, a groove or any combination of the foregoing. The top edge of the third capillary structure 3 will be in contact with the first capillary structure 13.

[0029] Fifth, if Figure 1 Step E and Figures 2 to 5 As shown, one or more heat pipes 2 are provided. The heat pipe 2 has a tube body 21 and a second capillary structure 22 laid on the inner surface of the tube body 21. The tube body 21 is peeled or scraped to open a hollow groove 211. The second capillary structure 22 has an exposed section 221 exposed in the hollow groove 211. The second capillary structure 22 is a metal woven mesh or a combination of a metal woven mesh and a powder sintered body.

[0030] The tube body 21 has a bottom edge 212 , and there is a distance H between the bottom edge of the opening of the hollow groove 211 and the bottom edge 212 . The hollow groove 211 of this embodiment is an annular hollow groove 213 arranged along the entire circumference of the tube body 21 , but this is not limited thereto.

[0031] Sixth, if Figure 1 Step F and Figures 2 to 5As shown, each heat pipe 2 is connected and sealed corresponding to each through hole 111, and the intersection of each heat pipe 2 and the temperature equalizing plate 1 is sealed by, for example, welding, and the bottom edge 212 of each tube body 21 is made to abut against the top of the plurality of protrusions 121. Since each hollow groove 211 is opened at a position corresponding to each through hole 131, each exposed section 221 is arranged corresponding to each through hole 131, and the inner edge diameter of each through hole 131 is smaller than the inner edge diameter of each through hole. When the exposed section 221 of each heat pipe 2 penetrates into each through hole 131, since the first capillary structure 13 has a metal woven mesh, the edge of the through hole 131 will be bent and deformed first and then reset, so that the first capillary structure 13 can be embedded in each hollow groove 211 and bonded to each exposed section 221.

[0032] In addition, in this embodiment, the step of punching out a plurality of protrusions 121 on the lower shell 12 is performed before the step of tightly sealing the upper shell 11 and the lower shell 12, but this is not limiting. The step of punching out a plurality of protrusions 121 on the lower shell 12 may be performed after the step of tightly sealing the upper shell 11 and the lower shell 12, and it may also be performed after the step of penetrating and sealing the corresponding through holes 111 of the heat pipe 2.

[0033] Seventh, such as Figure 1 As shown in step G, the semi-finished product obtained through step F is subjected to a liquid filling and a degassing and sealing process, that is, the working fluid is filled into the cavity S through a liquid infusion and degassing pipe (not shown in the figure), and degassing, sealing and other processing steps are performed to complete the finished product of the heat dissipation structure 10 of the utility model.

[0034] Thus, the temperature vapor chamber 1 and the heat pipe 2 are manufactured separately, and then the heat pipe 2 is directly plugged into the temperature vapor chamber 1, thereby avoiding the problems of complicated manufacturing process and poor yield in the prior art, thereby improving the ease and yield of manufacturing the heat dissipation structure 10 and being suitable for mass rapid production.

[0035] In addition, the first capillary structure 13 can be embedded in the hollow groove 211 and attached to the exposed section 221, so that the gaseous working fluid can enter the tube body 21 for heat dissipation. The cooled liquid working fluid then flows to the third capillary structure 3 in sequence through the second capillary structure 22, the exposed section 221, and the first capillary structure 13 for recycling, so that the heat dissipation structure 10 has excellent heat dissipation efficiency.

[0036] Furthermore, the lower shell 12 extends with a plurality of protrusions 121 against the bottom edge 212 of the tube 21 , thereby increasing the structural strength of the temperature vapor chamber 1 and eliminating the problem of the temperature vapor chamber 1 being easily deformed under pressure, thereby enhancing the structural strength of the heat dissipation structure 10 .

[0037] like Figure 6 As shown, another embodiment of the heat dissipation structure 10 of the utility model, Figure 6 Examples and Figures 1 to 5 The embodiments are roughly the same. Figure 6 Examples and Figures 1 to 5 The embodiment of the present invention is different in that the hollow groove 211 is a C-shaped hollow groove 214 arranged along the circumference of the tube body 21, so as to achieve the same Figures 1 to 5 The functions and effects of the embodiments.

[0038] The above-described embodiments are only preferred embodiments for fully illustrating the present utility model, and the protection scope of the present utility model is not limited thereto. Equivalent substitutions or changes made by technicians in the technical field on the basis of the present utility model are all within the protection scope of the present utility model. The protection scope of the present utility model shall be subject to the claims.

Claims

1. A heat dissipation structure combining a temperature homogenizing plate and a heat pipe, characterized in that: include: A temperature equalizing plate, comprising an upper shell, a lower shell tightly sealed to the upper shell, and a first capillary structure laid on the inner surface of the upper shell, a cavity is formed between the upper shell and the lower shell, the upper shell is provided with a through hole connected to the cavity, and the first capillary structure is provided with a through hole at a position corresponding to the through hole; A heat pipe, comprising a tube body penetrating and sealing the through hole and a second capillary structure laid on the inner surface of the tube body, wherein the tube body has a hollow groove at a position corresponding to the through hole, and the second capillary structure has an exposed section exposed in the hollow groove; and A working fluid is filled in the cavity; The tube body has a bottom edge, and there is a distance between the lower edge of the opening of the hollow groove and the bottom edge so that the hollow groove and the exposed section are located above the bottom edge. The lower shell body has a plurality of protrusions extending toward the cavity, and the bottom edge abuts against the top of the plurality of protrusions. The inner edge diameter of the through hole is smaller than the inner edge diameter of the through hole, and the first capillary tissue is embedded in the hollow groove and adheres to the exposed section.

2. The heat dissipation structure combining a temperature vapor chamber and a heat pipe according to claim 1, characterized in that: The hollow groove is formed by peeling or scraping the skin of the tube body.

3. The heat dissipation structure combining a temperature vapor chamber and a heat pipe according to claim 1, characterized in that: The first capillary structure and the second capillary structure are respectively a metal woven mesh or a combination of a metal woven mesh and a powder sintered body.

4. The heat dissipation structure combining a temperature vapor chamber and a heat pipe according to claim 1, characterized in that: The hollow groove is an annular hollow groove arranged along the entire circumference of the tube body.

5. The heat dissipation structure combining a temperature vapor chamber and a heat pipe as claimed in claim 1, characterized in that: The hollow groove is a C-shaped hollow groove arranged along the local circumference of the tube body.