Packaging module of semiconductor diode

Abstract

The utility model discloses a packaging module of a semiconductor diode, which relates to the field of packaging production of semiconductor diodes, aims to solve the problem of low packaging efficiency in the prior art, and adopts the technical scheme that the packaging module comprises a base, a feeding guide block is fixed in the base, a pin material slides in the feeding guide block, a support rod is fixed on the base, and the support rod is fixed on the base. The end, away from the base, of the supporting rod is fixedly provided with a connecting pipe, the end, away from the supporting rod, of the connecting pipe is rotationally connected with an operation disc, the operation disc is provided with a plurality of containing grooves, the containing grooves are formed in the circumferential direction of the operation disc at equal angles, a diode shell clamping piece is arranged above each containing groove, and an abutting piece is arranged above one containing groove. The ends, back to the containing grooves, of the abutting pieces are connected with driving pieces, a cutting blade is arranged on the side face of one containing groove, the ends, away from the containing grooves, of the cutting blade are connected with the driving pieces, and the technical effects of automatic packaging and machining efficiency improvement are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor diode packaging production, in particular to a semiconductor diode packaging module. Background Art

[0002] Side-emitting diodes refer to LED lamps that emit light on the side of the lamp housing. The bottom is soldered to the circuit board through a SMD pad or a plug-in PIN pin. The traditional packaging method of the diode housing and the PIN pin is manual plug-in, and the packaging efficiency is low.

[0003] In response to the above technical problems, Chinese patent CN202321586666.0 provides a semiconductor diode packaging module for the field of diode packaging. The buffer seat and the stripping block cooperate with each other. When in use, the diode shell is placed on the stamping seat, so that the PIN pin provided in the feed conduit passes through the through hole of the diode shell. At this time, the stamping cylinder is used to drive the upper seat to move up, so that the diode shell is squeezed by the top column, and the top of the PIN pin is stamped and deformed. At this time, the rotation of the rotating shaft drives the stripping block and the buffer seat to deflect, and the cutter is driven by the rotation of the stripping block to press and punch the PIN pin on the guide hole, thereby completing the PIN pin packaging operation of the diode shell. After the punching is completed, the stripping block and the buffer seat are rotated to the stripping groove, and the diode shell is added to the vacant stamping seat to form a cyclic packaging operation. The utility model has a simple structure, high packaging efficiency, market prospects, and is suitable for popularization and application.

[0004] However, the inventor believes that although the above structure replaces the manual plug-in mode with mechanical automatic plug-in and unloading, only one diode shell can be placed for packaging at a time, so there is still an operable time gap between unloading and unloading, so it can be further improved to improve the packaging efficiency. Utility Model Content

[0005] The utility model aims to provide a semiconductor diode packaging module which can automatically complete the entire packaging process.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A semiconductor diode packaging module comprises a base, a feed guide block is fixed inside the base, pin material slides inside the feed guide block, the pin material is connected to an external feeding device, a support rod is fixed on the base, a connecting tube is fixed to the end of the support rod away from the base, the connecting tube is rotatably connected to an operating disk away from the end of the support rod, a placement groove is provided on the operating disk, a plurality of placement grooves are provided at equal angles along the circumferential direction of the operating disk, a diode housing clamp is provided above each placement groove, a resistance member is provided above one of the placement grooves, a driving member is connected to the resistance member facing away from the placement groove end, a cutting blade is provided on the side of one of the placement grooves, and the cutting blade is connected to the driving member away from the placement groove end.

[0008] Furthermore, the diode housing clamp includes a fixed block, which is fixed on the working disk and is symmetrically arranged with two blocks about the center of the placement slot. A cross bar is slidably connected inside each placement slot, and both ends of the cross bar pass through the fixed block. A clamping plate is fixed to the end of the cross bar facing the placement slot, and a fixed plate is fixed to the other end. A first spring is arranged between the fixed plate and the fixed block, and the first spring is sleeved on the outside of the cross bar.

[0009] By adopting the above technical solution, the clamping plate can move automatically when the cross bar moves, and the diode housing can be firmly clamped through the rebound of the first spring. At the same time, the spacing of the clamping plates can be automatically adjusted according to the different sizes of diode housings, which is convenient for processing and suitable for diode packages of different sizes.

[0010] Furthermore, the driving member includes a bracket on the side of the feed guide block, the bracket is screwed with a first motor away from the end of the feed guide block, a first cam is fixed to the output end of the first motor, and also includes a connecting rod fixed on the bracket, a sleeve is fixed inside the connecting rod, a driving rod is slidably connected inside the sleeve, a driving plate is fixed to the end of the driving rod away from the sleeve, one side of the driving plate is in contact with the protruding part of the first cam, and a second spring is fixed on the other side, the second spring is fixed to the side of the sleeve away from the end of the driving plate, and the second spring is sleeved on the outside of the driving rod.

[0011] By adopting the above technical solution, utilizing the rotation of the first cam and driven by the first motor, the driving rod can be reciprocated to achieve reciprocating cutting and reciprocating unloading.

[0012] Furthermore, the driving rod is fixedly connected to the cutting blade or to the abutment member.

[0013] By adopting the above technical solution, the driving rod is used to push out the cutting blade or the abutment member to complete the cutting or diode unloading.

[0014] Furthermore, the resistance member includes a connecting column fixed on the driving rod, the connecting column is screwed with a cross connecting seat away from the driving rod end, a resistance rod is fixed on the cross connecting seat, and the resistance rod is arranged in an arc shape away from the cross connecting seat end.

[0015] By adopting the above technical solution, the resistance rod can move downward under the drive of the driving member to push out and collect the diodes, providing unloading conditions for automatic packaging. At the same time, the bottom of the resistance rod is set as an arc to avoid damage to the diodes.

[0016] Furthermore, the connecting tube is rotatably connected to an end away from the working disk, and a second motor is connected to the other end of the rotating shaft. The second motor is screwed on the base, a second cam is fixed to the outside of the rotating shaft, and a trigger rod is fixed at the bottom of the working disk, which contacts the protrusion of the second cam.

[0017] By adopting the above technical solution, when the second motor drives the second cam to rotate, it abuts against the trigger rod to achieve intermittent rotation of the operating disk, thereby providing intermittent supply of diode shells for automated packaging.

[0018] Furthermore, a collecting cylinder is fixedly placed on the base, and the collecting cylinder is in the same straight line with one of the placement grooves and the abutment member at the upper and lower positions.

[0019] By adopting the above technical solution, the collecting cylinder is used to collect the finished products ejected by the resistance rod, which is convenient for collection.

[0020] A photoelectric induction switch is fixed on the feeding guide block, and the photoelectric induction switch is electrically connected to the feeding equipment.

[0021] By adopting the above technical solution, through the photoelectric induction switch, automatic feeding can be achieved after the diode housing is placed, and then combined with the above-mentioned driving component, automatic packaging can be achieved.

[0022] In summary, the beneficial technical effects of the utility model are:

[0023] 1. By utilizing the rotation of the first cam, the driving rod can be driven by the first motor to reciprocate, and the cutting blade and the abutment rod can be installed to achieve reciprocating cutting and reciprocating unloading. The second motor can further drive the second cam to achieve intermittent rotation of the working disc, thereby realizing the automatic operation of packaging and improving processing efficiency.

[0024] 2. A freely movable clamping plate is used, which can automatically move when the crossbar moves. The diode housing can be firmly clamped by the rebound of the first spring. At the same time, the spacing of the clamping plate can be automatically adjusted according to the different sizes of diode housings, which is convenient for processing and suitable for diode packaging of different sizes;

[0025] 3. Set up multiple placement slots on the work tray. During the packaging process, new diode shells can be continuously added to further improve the diode packaging efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification, but do not constitute a limitation of the present invention. In the accompanying drawings:

[0027] Figure 1 is a schematic structural diagram of a semiconductor diode packaging module of this embodiment;

[0028] Figure 2 This is a semiconductor diode packaging module of this embodiment. Figure 1 Another perspective structural diagram of;

[0029] Figure 3 This is a semiconductor diode packaging module of this embodiment. Figure 1 Schematic side view of

[0030] Figure 4 This is a semiconductor diode packaging module of this embodiment. Figure 1 An enlarged schematic diagram of point A.

[0031] In the figure, 1, base; 2, feed guide block; 3, pin material; 4, support rod; 5, connecting pipe; 6, working plate; 7, placement groove; 8, cutting blade; 9, fixing block; 10, cross bar; 11, fixing plate; 12, first spring; 13, bracket; 14, first motor; 15, first cam; 16, connecting rod; 17, sleeve; 18, driving rod; 19, driving plate; 20, second spring; 21, connecting column; 22, cross connecting seat; 23, resistance rod; 24, rotating shaft; 25, second motor; 26, second cam; 27, trigger rod; 28, collecting tube; 29, photoelectric sensor switch; 30, clamping plate. DETAILED DESCRIPTION

[0032] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0033] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0034] See also Figure 1-4The utility model provides a technical solution: a semiconductor diode packaging module, including a base 1, a feed guide block 2 is fixed inside the base 1, a pin material 3 is slid inside the feed guide block 2, the pin material 3 is externally connected to a feeding device, a support rod 4 is fixed on the base 1, a connecting tube 5 is fixed to the end of the support rod 4 away from the base 1, and a working disk 6 is rotatably connected to the end of the connecting tube 5 away from the support rod 4, a placement groove 7 is provided on the working disk 6, and a plurality of placement grooves 7 are provided at equal angles along the circumferential direction of the working disk 6, a diode housing clamp is provided above each placement groove 7, a resistance member is provided above one of the placement grooves 7, and a driving member is connected to the resistance member at the end facing away from the placement groove 7, a cutting blade 8 is provided on the side of one of the placement grooves 7, and the cutting blade 8 is connected to the driving member at the end away from the placement groove 7.

[0035] As an embodiment, the diode housing clamp includes a fixing block 9, which is fixed on the working disk 6 and is symmetrically arranged with two blocks about the center of the placement slot 7. A cross bar 10 is slidably connected inside each placement slot 7, and both ends of the cross bar 10 pass through the fixing block 9. A clamping plate 30 is fixed to the end of the cross bar 10 facing the placement slot 7, and a fixing plate 11 is fixed to the other end. A first spring 12 is arranged between the fixing plate 11 and the fixing block 9. The first spring 12 is sleeved on the outside of the cross bar 10. The cross bar 10 can slide along the fixing block 9. Therefore, when the diode housing is placed between the two clamping plates 30, it can contact the clamping plates 30 on both sides, so that the two clamping plates 30 move toward the end of the fixing block 9. At the same time, after the diode housing is placed, the diode housing can be stably clamped between the two clamping plates 30 by the rebound of the first spring 12.

[0036] After the diode housing is fixed, the pin material 3 is slidably supplied inside the feeding guide block located below it. At this time, due to the fixation of the diode housing, the photoelectric sensor switch 29 is blocked, so the reflected light is rapidly reduced. At this time, the photoelectric sensor switch 29 excites an electrical signal to control the feeding equipment to feed, and the pin material 3 is driven to slide through the feeding guide block to be inserted into the diode housing. The feeding equipment is a feeding device with a cylinder structure used in existing diode packaging.

[0037] After the pins are inserted, the cutting blade 8 is driven by the driving member to move and cut the pins. At the same time, the working disk 6 rotates, and the next packaging is carried out after the rotation. After the packaging is completed, the driving member drives the resistance member to move downward to push the diode out of the clamping plate 30.

[0038] The driving member includes a bracket 13 on the side of the feeding guide block 2, a first motor 14 is screwedly mounted at the end of the bracket 13 away from the feeding guide block 2, a first cam 15 is fixed to the output end of the first motor 14, and also includes a connecting rod 16 fixed to the bracket 13, a sleeve 17 is fixed inside the connecting rod 16, a driving rod 18 is slidably connected inside the sleeve 17, a driving plate 19 is fixed to the end of the driving rod 18 away from the sleeve 17, one side of the driving plate 19 is in contact with the raised part of the first cam 15, and a second spring 20 is fixed to the other side, the end of the second spring 20 away from the driving plate 19 is fixed to the side of the sleeve 17, and the second spring 20 is sleeved on the outside of the driving rod 18.

[0039] In this embodiment, the driving rod 18 is fixedly connected to the cutting blade 8 or to the abutment, and both the cutting blade 8 and the abutment are driven to move by the driving rod 18 .

[0040] The specific resistance part includes a connecting column 21 fixed on the driving rod 18, and a cross connecting seat 22 is screwed fixed to the connecting column 21 away from the driving rod 18. A resistance rod 23 is fixed on the cross connecting seat 22. The resistance rod 23 is set in an arc at the end away from the cross connecting seat 22. The resistance rod 23 can directly resist the surface of the diode housing. As the resistance rod 23 continues to move downward, the diode can be pushed out of the clamping plate 30.

[0041] When the driving member is working, the first cam 15 is driven to rotate by the first motor 14. When the raised part of the first cam 15 rotates and conflicts with the driving plate 19, the driving plate 19 moves toward the end of the sleeve 17 under the rotation of the first cam 15, thereby driving the driving rod 18 to move. The driving rod 18 pushes out the cutting blade 8 or the connecting column 21. At this time, the second spring 20 is in a compressed state. After the first cam 15 continues to rotate, the first cam 15 and the driving plate 19 no longer conflict, and the second spring 20 gradually resets to form a reciprocating movement structure.

[0042] As an implementation mode, a rotating shaft 24 is rotatably connected to the end of the connecting tube 5 away from the working disk 6, and a second motor 25 is connected to the other end of the rotating shaft 24. The second motor 25 is screwed on the base 1. A second cam 26 is fixed to the outside of the rotating shaft 24, and a trigger rod 27 is fixed at the bottom of the working disk 6. The trigger rod 27 contacts with the protrusion of the second cam 26. The second cam 26 is driven to rotate by the second motor 25. The second cam 26 can be in gap contact with the trigger rod 27. When in contact, the trigger rod 27 can be driven to rotate along the axis of the rotating shaft 24, thereby driving the working piece to rotate.

[0043] A collecting cylinder 28 is fixedly placed on the base 1 , and the collecting cylinder 28 is located in the same straight line as one of the placement grooves 7 and the abutment member at the upper and lower positions.

[0044] The travel of the second cam 26 during one rotation corresponds to the angle between the two placement slots 7. At the same time, the moving distance of the cutting blade 8 or the connecting column 21 driven by the first cam 15 after one rotation corresponds to the rotation time of the placement slot 7 to the next placement slot 7 position.

[0045] The working principle of the utility model is as follows: the diode housing is placed between all the clamping plates 30 on the working disk 6, and the operation is started. Any one of the placement slots 7 is driven to rotate above the feed guide block. At this time, the feeding device is turned on by the photoelectric sensing switch 29, and the pin is driven to be inserted into the inside of the diode housing. The first motor 14 is turned on, and the cutting blade 8 is driven to cut off the excess pins. At this time, the cutting blade 8 completes a movement. While completing the movement, the second cam 26 starts to contact the trigger rod 27 under the drive of the second motor 25, and then the working disk 6 starts to rotate. When rotating to the position of the next placement slot 7, the placement slot 7 that has completed the package on the previous one is below the connecting column 21, and the first cam 15 starts to contact the driving plate 19 for the second time, so the driving contact rod 23 pushes the completed packaged diode out to the inside of the collecting tube 28 below for collection. This reciprocating process can continuously place diode housings in the empty clamping plates 30 to achieve automatic packaging.

[0046] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0047] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A semiconductor diode packaging module, comprising a base (1), a feed guide block (2) fixed inside the base (1), a lead material (3) sliding inside the feed guide block (2), and the lead material (3) being connected to an external feed device, characterized in that: A support rod (4) is fixed on the base (1), a connecting tube (5) is fixed on the end of the support rod (4) away from the base (1), and the end of the connecting tube (5) away from the support rod (4) is rotatably connected to an operating disk (6), and a placement groove (7) is provided on the operating disk (6), and a plurality of placement grooves (7) are provided at equal angles along the circumferential direction of the operating disk (6), and a diode housing clamping part is provided above each placement groove (7), and a resistance part is provided above one of the placement grooves (7), and a driving part is connected to the resistance part at the end facing away from the placement groove (7), and a cutting blade (8) is provided on the side of one of the placement grooves (7), and the cutting blade (8) is connected to the driving part at the end away from the placement groove (7).

2. A semiconductor diode packaging module according to claim 1, characterized in that: The diode housing clamping member comprises a fixing block (9), which is fixed on the working disk (6) and is symmetrically provided with two fixing blocks (9) about the center of the placement groove (7). A cross bar (10) is slidably connected inside each placement groove (7), and both ends of the cross bar (10) pass through the fixing block (9). A clamping plate (30) is fixed on the end of the cross bar (10) facing the placement groove (7), and a fixing plate (11) is fixed on the other end. A first spring (12) is provided between the fixing plate (11) and the fixing block (9), and the first spring (12) is sleeved on the outside of the cross bar (10).

3. The semiconductor diode packaging module according to claim 1, characterized in that: The driving member comprises a bracket (13) on the side of the feeding guide block (2), a first motor (14) being screw-mounted at the end of the bracket (13) away from the feeding guide block (2), a first cam (15) being fixed at the output end of the first motor (14), and a connecting rod (16) fixed on the bracket (13), a sleeve (17) being fixed inside the connecting rod (16), a driving rod (18) being slidably connected inside the sleeve (17), a driving plate (19) being fixed at the end of the driving rod (18) away from the sleeve (17), one side of the driving plate (19) being in contact with a raised portion of the first cam (15), and a second spring (20) being fixed at the other side, the end of the second spring (20) away from the driving plate (19) being fixed to the side of the sleeve (17), and the second spring (20) being sleeved outside the driving rod (18).

4. The semiconductor diode packaging module according to claim 3, characterized in that: The driving rod (18) is fixedly connected to the cutting blade (8) or to the abutment member.

5. The semiconductor diode packaging module according to claim 4, characterized in that: The abutment member comprises a connecting column (21) fixed on the driving rod (18); a cross connecting seat (22) is screwedly fixed to the end of the connecting column (21) away from the driving rod (18); an abutment rod (23) is fixed to the cross connecting seat (22); and the end of the abutment rod (23) away from the cross connecting seat (22) is arranged in an arc shape.

6. The semiconductor diode packaging module according to claim 1, characterized in that: The connecting tube (5) is rotatably connected to an end away from the working disk (6) with a rotating shaft (24), and the other end of the rotating shaft (24) is connected to a second motor (25). The second motor (25) is screwed onto the base (1). A second cam (26) is fixed to the outside of the rotating shaft (24). A trigger rod (27) is fixed to the bottom of the working disk (6), and the trigger rod (27) is in contact with a protrusion of the second cam (26).

7. The semiconductor diode packaging module according to claim 1, characterized in that: A collecting cylinder (28) is fixedly placed on the base (1), and the collecting cylinder (28) is located in the same straight line as one of the placement grooves (7) and the abutment member at the upper and lower positions.

8. The semiconductor diode packaging module according to claim 1, characterized in that: A photoelectric induction switch (29) is fixed on the feeding guide block (2), and the photoelectric induction switch (29) is electrically connected to the feeding device.

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