Multilayer PCB with waterproof performance
By designing support structure and threaded connections on the multi-layer PCB circuit board, the fracture problem caused by excessive tightening force during installation is solved, extending the service life and ensuring normal use.
Patent Information
- Application Number
- CN202421206494.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-30
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-05-30
AI Technical Summary
During the installation of multi-layer PCB circuit board, excessive tightening force of downward pressure can easily cause the connection to be broken, shortened the service life and affected normal use.
A multi-layer PCB circuit board with waterproof performance is designed. By fixing the outer wall of the straight barrel at its front four corners and processing threads on the inner wall, combining the support structure and the heat dissipation structure, including the horizontal plate, the first bolt, the vertical plate, the fin plate, the straight plate and the curved plate, the support is avoided by thread connection and reinforcement.
By reinforcing the support structure, deformation and breaking of the multi-layer PCB circuit board during installation is avoided, and the service life is extended and its normal use is ensured.
Smart Images

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Abstract
Description
Technical Field
[0001] The utility model relates to a multi-layer PCB circuit board with waterproof performance, in particular to a multi-layer PCB circuit board with waterproof performance. Background Art
[0002] A multi-layer PCB circuit board refers to a printed circuit board with more than two layers. It is composed of connecting wires on several layers of insulating substrates and pads for assembling and soldering electronic components. It has the function of conducting the circuits of each layer and insulating them from each other.
[0003] For example, a circuit board with a waterproof protection structure with the authorization announcement number "CN211047440U" has a first conductive bump covered with a first waterproof adhesive layer, a first solder groove is provided on the first conductive bump, a first wiring hole is provided at the end face of the first conductive bump away from the first circuit layer, the first wiring hole is connected to the first solder groove, the solder mask without a gap can realize all-round protection for the circuit layer, and has good waterproof performance, the conductive bump at the end face of the PCB body can be connected to the conductive wire, and the connected solder groove and wiring hole structure can effectively improve the firmness of the welded connection structure with the conductive wire, but in the use of the multi-layer PCB circuit board, there is a large space in the middle connection part, which reduces the strength of the connection of the multi-layer PCB circuit board. In the process of installing the multi-layer PCB circuit board, excessive downward tightening force can easily cause the connection of the multi-layer PCB circuit board to break, causing damage to the multi-layer PCB circuit board, shortening the service life of the multi-layer PCB circuit board, and affecting the normal use of the multi-layer PCB circuit board. Summary of the invention
[0004] The utility model aims to solve the problems existing in the above-mentioned prior art and provide a multi-layer PCB circuit board with waterproof performance, thereby ensuring the service life of the multi-layer PCB circuit board and ensuring the normal use of the multi-layer PCB circuit board.
[0005] The utility model adopts a technical solution to solve its technical problems: this multi-layer PCB circuit board with waterproof performance includes a multi-layer PCB circuit board and a straight tube, the four corners of the front side of the multi-layer PCB circuit board are respectively fixedly connected to the outer wall of the straight tube, multiple inner walls of the straight tubes are respectively processed with threads, the outer wall of the multi-layer PCB circuit board is fixedly connected with a film, the front side of the multi-layer PCB circuit board is connected with a supporting structure, the left and right sides of the front side of the multi-layer PCB circuit board are respectively processed with multiple notches, and the inner walls of the multiple notches are all connected with heat dissipation structures.
[0006] For further improvement, the support structure includes a horizontal plate and a first bolt. The outer side of the rear end face of the horizontal plate is in contact with the front side of the multi-layer PCB circuit board. The left and right sides of the front side of the horizontal plate are respectively threadedly connected to the outer wall of the first bolt. The rear end face of the horizontal plate is fixedly connected to a vertical plate.
[0007] Further improvement, the rear of the outer wall of the first bolt is threadedly connected to the front side of the multi-layer PCB circuit board.
[0008] To be further improved, the heat dissipation structure includes fin plates and straight plates, the rear of the outer walls of the multiple fin plates are respectively plugged into the inner walls of the multiple slots, the ends of the outer walls of the multiple fin plates are respectively fixedly connected to the two ends of the straight plates, a curved plate is fixedly connected to the rear of the outer wall of the fin plate located on the outside, and the inner wall of the curved plate is threadedly connected with a second bolt.
[0009] For further improvement, the rear end faces of the plurality of fin plates are all fitted with the front face of the multi-layer PCB circuit board, and the rear end face of the curved plate is fitted with the front face of the multi-layer PCB circuit board.
[0010] Further improvement, the rear of the outer wall of the second bolt is threadedly connected to the front side of the multi-layer PCB circuit board.
[0011] The beneficial effect of the utility model is as follows: the utility model makes the left and right sides of the rear of the horizontal plate fit with the front of the multi-layer PCB circuit board in the supporting structure, and then makes the first bolt pass through the horizontal plate from the right front to the rear to fix it with the front thread of the multi-layer PCB circuit board, and multiple horizontal plates cooperate with the vertical plates to reinforce and support the gaps of the multi-layer PCB circuit board, thereby avoiding deformation of the multi-layer PCB circuit board, ensuring the service life of the multi-layer PCB circuit board, and ensuring the normal use of the multi-layer PCB circuit board. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 It is a schematic diagram of the structure of the utility model;
[0013] Figure 2 for Figure 1 Schematic diagram of the connection relationship between the multi-layer PCB circuit board and the film straight tube;
[0014] Figure 3 for Figure 2 The structural diagram of A in the figure;
[0015] Figure 4 for Figure 2 Schematic diagram of the structure of B;
[0016] Figure 5 for Figure 1 Schematic diagram of the structure of C.
[0017] Explanation of the accompanying drawings: 1. Multi-layer PCB circuit board, 2. Support structure, 201. Horizontal plate, 202. First bolt, 203. Vertical plate, 3. Heat dissipation structure, 301. Fin plate, 302. Straight plate, 303. Curved plate, 304. Second bolt, 4. Film, 5. Notch, 6. Straight tube, 7. Arc plate. DETAILED DESCRIPTION
[0018] The utility model is further described below in conjunction with the accompanying drawings:
[0019] Embodiment 1:
[0020] Refer to the attached Figure 1-5 In the present embodiment, a multi-layer PCB circuit board with waterproof performance includes a multi-layer PCB circuit board 1 and a straight tube 6. The four corners of the front side of the multi-layer PCB circuit board 1 are respectively fixedly connected to the outer wall of the straight tube 6. How to operate and use the multi-layer PCB circuit board 1 is already the prior art and will not be elaborated on in detail. The inner walls of the multiple straight tubes 6 are respectively processed with threads, and the outer wall of the multi-layer PCB circuit board 1 is fixedly connected with a film 4, and the material of the film 4 is acrylic. The front side of the multi-layer PCB circuit board 1 is connected to a support structure 2, and the left and right sides of the front side of the multi-layer PCB circuit board 1 are respectively processed with multiple notches 5, and the inner walls of the multiple notches 5 are all connected with a heat dissipation structure 3.
[0021] The supporting structure 2 includes a horizontal plate 201 and a first bolt 202. The outer side of the rear end surface of the horizontal plate 201 is in contact with the front side of the multi-layer PCB circuit board 1. The left and right sides of the front side of the horizontal plate 201 are respectively threadedly connected to the outer wall of the first bolt 202. The first bolt 202 plays a role in fixing the multi-layer PCB circuit board 1 and the horizontal plate 201. The rear end surface of the horizontal plate 201 is fixedly connected to a vertical plate 203. The rear side of the outer wall of the first bolt 202 is threadedly connected to the front side of the multi-layer PCB circuit board 1.
[0022] By making the rear left and right sides of the horizontal plate 201 in the supporting structure 2 fit with the front side of the multi-layer PCB circuit board 1, and then making the first bolt 202 thread through the horizontal plate 201 from the right front to the rear and fix it with the front thread of the multi-layer PCB circuit board 1, multiple horizontal plates 201 cooperate with the vertical plates 203 to reinforce and support the gaps of the multi-layer PCB circuit board 1, avoiding deformation of the multi-layer PCB circuit board 1, ensuring the service life of the multi-layer PCB circuit board, and ensuring the normal use of the multi-layer PCB circuit board.
[0023] The heat dissipation structure 3 includes a fin plate 301 and a straight plate 302. The rear ends of the outer walls of the multiple fin plates 301 are respectively plugged into the inner walls of the multiple slots 5. The fin plates 301 are made of copper and have good thermal conductivity. The outer wall ends of the multiple fin plates 301 are respectively fixedly connected to the two ends of the straight plate 302. A curved plate 303 is fixedly connected to the rear end of the outer wall of the outer fin plate 301. The inner wall of the curved plate 303 is threadedly connected with a second bolt 304. The second bolt 304 fixes the multi-layer PCB circuit board 1 and the curved plate 303. The rear end faces of the multiple fin plates 301 are all in contact with the front face of the multi-layer PCB circuit board 1. The rear end face of the curved plate 303 is in contact with the front face of the multi-layer PCB circuit board 1. The outer wall rear of the second bolt 304 is threadedly connected to the front face of the multi-layer PCB circuit board 1.
[0024] Working principle:
[0025] The film 4 on the surface of the multi-layer PCB circuit board 1 is a vacuum varnishing layer. The circuit board is placed in a vacuum varnishing machine, and the varnishing material is evenly coated on the surface of the circuit board using vacuum and pressure to form a waterproof protective film, thereby forming a waterproof structure on the surface of the multi-layer PCB circuit board 1.
[0026] Multilayer PCB circuit board installation:
[0027] Make the rear of the multi-layer PCB circuit board 1 fit with the connection, then make the external bolt thread through the straight tube 6 from the right front to the rear and fix it to the connection, and complete the installation of the multi-layer PCB circuit board 1, then make the left and right sides of the rear of the cross plate 201 fit with the front of the multi-layer PCB circuit board 1, and then make the first bolt 202 thread through the cross plate 201 from the right front to the rear and fix it with the front thread of the multi-layer PCB circuit board 1, and multiple cross plates 201 cooperate with the vertical plates 203 to reinforce and support the gaps of the multi-layer PCB circuit board 1 to prevent the multi-layer PCB circuit board 1 from deformation.
[0028] Multilayer PCB circuit board heat dissipation installation:
[0029] The rear of the outer wall of the multiple fin plates 301 is inserted into the inner wall of the slot 5. At this time, the rear of the fin plate 301 fits with the front of the multi-layer PCB circuit board 1. At the same time, the curved plate 303 of the outer wall of the outer fin plate 301 fits with the film 4. Then the second bolt 304 is threaded from the front right to the rear and passes through the curved plate 303 and then passes through the film 4 and is threadedly fixed to the front of the multi-layer PCB circuit board 1. The fin plate 301 can dissipate the heat generated by the multi-layer PCB circuit board 1 during operation through its own copper material.
[0030] Embodiment 2:
[0031] Refer to the attached Figure 1-5 : In this embodiment, a multi-layer PCB circuit board with waterproof performance also includes an arc plate 7, and the inner walls of the multiple arc plates 7 are respectively fixedly connected to the four corners of the outer wall of the multi-layer PCB circuit board 1.
[0032] Working principle:
[0033] The plurality of arc plates 7 play a protective role at the four corners of the multi-layer PCB circuit board 1 to prevent the four corners of the multi-layer PCB circuit board 1 from being damaged by collision.
[0034] Although the present invention has been shown and described with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein within the scope of the claims.
Claims
1. A multi-layer PCB circuit board with waterproof performance, comprising a multi-layer PCB circuit board (1) and a straight tube (6), characterized in that: The four corners of the front face of the multi-layer PCB circuit board (1) are respectively fixedly connected to the outer wall of the straight tube (6); the inner walls of the plurality of straight tubes (6) are respectively processed with threads; the outer wall of the multi-layer PCB circuit board (1) is fixedly connected with a film (4); the front face of the multi-layer PCB circuit board (1) is connected to a support structure (2); the left and right sides of the front face of the multi-layer PCB circuit board (1) are respectively processed with a plurality of notches (5); the inner walls of the plurality of notches (5) are all connected to a heat dissipation structure (3).
2. The multi-layer PCB circuit board with waterproof performance according to claim 1 is characterized in that: The support structure (2) comprises a horizontal plate (201) and a first bolt (202); the outer side of the rear end face of the horizontal plate (201) is in contact with the front side of the multi-layer PCB circuit board (1); the left and right sides of the front side of the horizontal plate (201) are respectively threadedly connected to the outer wall of the first bolt (202); and the rear end face of the horizontal plate (201) is fixedly connected to a vertical plate (203).
3. The multi-layer PCB circuit board with waterproof performance according to claim 2 is characterized in that: The rear side of the outer wall of the first bolt (202) is threadedly connected to the front side of the multi-layer PCB circuit board (1).
4. The multi-layer PCB circuit board with waterproof performance according to claim 1 is characterized in that: The heat dissipation structure (3) comprises a fin plate (301) and a straight plate (302); the rear of the outer walls of the plurality of fin plates (301) are respectively plugged into the inner walls of the plurality of notches (5); the ends of the outer walls of the plurality of fin plates (301) are respectively fixedly connected to the two ends of the straight plate (302); a curved plate (303) is fixedly connected to the rear of the outer wall of the fin plate (301) located on the outside; and the inner wall of the curved plate (303) is threadedly connected to a second bolt (304).
5. The multi-layer PCB circuit board with waterproof performance according to claim 4 is characterized in that: The rear end surfaces of the plurality of fin plates (301) are all in contact with the front surface of the multi-layer PCB circuit board (1), and the rear end surface of the curved plate (303) is in contact with the front surface of the multi-layer PCB circuit board (1).
6. The multi-layer PCB circuit board with waterproof performance according to claim 4 is characterized in that: The rear side of the outer wall of the second bolt (304) is threadedly connected to the front side of the multi-layer PCB circuit board (1).
Citation Information
Patent Citations
Circuit board with waterproof protection structure
CN211047440U