Integrated phase change liquid cooling heat dissipation device and liquid cooling heat dissipation system

Abstract

The utility model relates to a heat dissipation device, in particular to an integrated phase change liquid cooling heat dissipation device and a liquid cooling heat dissipation system, which comprise a heat dissipation base, a heat dissipation bottom plate and an upper cover plate which are overlapped in sequence, an opening is formed in the heat dissipation base; a liquid cooling groove is formed in the heat dissipation bottom plate, the outer wall of a bottom plate of the liquid cooling groove penetrates through the opening and is flush with the bottom surface of the heat dissipation base, and a plurality of tiny structures are arranged on the inner wall of the bottom plate of the liquid cooling groove; the upper cover plate is provided with a pair of working medium inlets and outlets communicated with the liquid cooling groove, and the working medium inlets and outlets are used for inputting or outputting the phase change type heat exchange working medium into or out of the liquid cooling groove. Compared with the prior art, the utility model overcomes the defects of larger heat exchange loss and lower heat exchange efficiency in the prior art, and realizes efficient heat dissipation of chips such as CPU / GPU (Central Processing Unit / Graphics Processing Unit) and the like.

Description

Technical Field

[0001] The utility model relates to a heat dissipation device, in particular to an integrated phase-change liquid cooling heat dissipation device and a liquid cooling heat dissipation system. Background Art

[0002] With the continuous development of information technology, the performance requirements of computers and other electronic equipment are getting higher and higher, which also poses higher challenges to the heat dissipation requirements of the equipment. Generally, high-performance electronic devices such as CPUs and GPUs generate a lot of heat when working. If the heat cannot be effectively dissipated, it will lead to a decline in equipment performance, shortened lifespan, and even equipment damage. Traditional air cooling methods can no longer meet the heat dissipation needs of high-performance electronic equipment. Therefore, phase change liquid cooling technology has come into being. Phase change liquid cooling technology uses the phase change characteristics of liquids (such as absorbing a lot of heat when liquids change into gases) to effectively reduce the temperature of electronic devices and improve heat dissipation efficiency.

[0003] In phase-change liquid cooling devices, liquid with high thermal conductivity is usually used as the cooling medium. When the liquid is heated and turns into gas, it absorbs a large amount of heat and takes away the heat generated by the equipment. Subsequently, the gas condenses back into liquid, releasing heat and completing the heat dissipation cycle. This phase change characteristic enables phase-change liquid cooling devices to quickly reduce the temperature of the equipment in a short period of time and improve heat dissipation efficiency.

[0004] The development of phase-change liquid cooling devices can not only meet the heat dissipation needs of high-performance electronic devices, but also has the advantages of obvious heat dissipation effect, small size, and low noise, and has gradually become a hot spot for research and application. Through continuous innovation and technological improvement, phase-change liquid cooling technology will provide a more efficient and reliable heat dissipation solution for the development of electronic equipment.

[0005] Prior art CN220341213U discloses a phase-change liquid-cooled coupled heat dissipation structure and an electronic chip heat dissipation device, wherein the phase-change liquid-cooled coupled heat dissipation structure comprises: a phase-change plate, an intermediate plate and a liquid-cooled plate arranged in layers, a groove is arranged on the side of the phase-change plate facing the intermediate plate, a refrigerant flow channel is arranged on the side of the liquid-cooled plate facing the intermediate plate, and the electronic chip is arranged in affixed relation with the phase-change plate. Prior art CN220341216U discloses a phase-change liquid-cooled coupled heat dissipation structure and an electronic chip heat dissipation device, wherein the phase-change liquid-cooled coupled heat dissipation structure comprises: a sintered capillary phase-change plate, an intermediate heat transfer plate and a liquid-cooled heat conduction plate, the sintered capillary phase-change plate, the intermediate heat transfer plate and the liquid-cooled heat conduction plate are arranged in layers in sequence, a sintered capillary structure is arranged on the side of the sintered capillary phase-change plate facing the intermediate heat transfer plate, a refrigerant flow channel is arranged on the side of the liquid-cooled heat conduction plate facing the intermediate heat transfer plate, and the electronic chip is arranged in affixed relation with the sintered capillary phase-change plate.

[0006] However, in the existing technical solution, heat exchange between the refrigerant and the phase change material needs to be carried out through an intermediate plate, and then heat exchange between the phase change material and the chip is carried out through the phase change material, resulting in large heat exchange losses on the intermediate plate during the secondary heat exchange process, thereby greatly affecting the heat exchange efficiency.

[0007] Therefore, it is necessary to propose an integrated phase change liquid cooling device with a more reasonable structure to give full play to the high heat exchange efficiency of phase change liquid cooling. Utility Model Content

[0008] The purpose of the present invention is to provide an integrated phase change liquid cooling device and a liquid cooling system in order to solve at least one of the above problems, so as to address the shortcomings of large heat exchange losses and low heat exchange efficiency in the prior art. This solution achieves efficient heat dissipation of CPU / GPU waiting for heat dissipation chips.

[0009] The purpose of the utility model is achieved through the following technical solutions:

[0010] The first aspect of the utility model discloses an integrated phase-change liquid cooling device, comprising a heat dissipation base, a heat dissipation bottom plate and an upper cover plate stacked in sequence;

[0011] The heat dissipation base is provided with an opening;

[0012] The heat dissipation base plate is provided with a liquid cooling tank, the outer wall of the base plate of the liquid cooling tank is provided through the opening and is flush with the bottom surface of the heat dissipation base, and the inner wall of the base plate of the liquid cooling tank is provided with a plurality of micro structures;

[0013] The upper cover plate is provided with a pair of working medium inlets and outlets connected to the liquid cooling tank, which are respectively used to input or output phase change heat exchange working medium to the liquid cooling tank.

[0014] Preferably, the heat dissipation base is provided with a step groove, and the opening is located in the step groove; a boss is formed on the outer bottom surface of the heat dissipation base plate, and the outer wall of the base plate is located on the boss; the step groove is arranged in coordination with the boss.

[0015] Preferably, a pair of communication grooves are provided on a surface of the upper cover plate facing the liquid cooling tank, and the communication grooves are respectively connected to the inlet and outlet of the working medium.

[0016] Preferably, the heat dissipation base, the heat dissipation bottom plate and the upper cover plate are connected by brazing.

[0017] Preferably, the heat dissipation base, heat dissipation bottom plate and upper cover plate are made of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, silicon and the like.

[0018] Preferably, the microstructures are arranged in the liquid cooling tank in a sequential or staggered manner.

[0019] Preferably, the shapes of the microstructures include prism, triangular pyramid, cube, cuboid, mushroom, hemisphere, cone, cylinder, S-shape and raindrop shape.

[0020] Preferably, when the microstructure is a cuboid, its length parallel to the inner wall of the bottom plate is between 5 microns and 10 mm, its width is between 5 microns and 10 mm, and its height perpendicular to the inner wall of the bottom plate is between 5 microns and 10 mm; when the microstructure is a prism: its length parallel to the inner wall of the bottom plate is between 5 microns and 10 mm, its width is between 5 microns and 10 mm, and its height perpendicular to the inner wall of the bottom plate is between 5 microns and 10 mm; when the microstructure is a cylinder or a cone: its diameter parallel to the inner wall of the bottom plate is between 5 microns and 10 mm, and its height perpendicular to the inner wall of the bottom plate is between 5 microns and 10 mm; when the microstructure is a hemisphere: the radius of the hemisphere is between 2 microns and 5 mm; when the microstructure is mushroom-shaped, raindrop-shaped or S-shaped: any length, maximum diameter or width parallel to the inner wall of the bottom plate is between 2 microns and 10 mm, the height perpendicular to the inner wall of the bottom plate is between 2 microns and 10 mm, and the spacing between microstructures is between 2 microns and 10 microns.

[0021] Preferably, the ratio of the vertical distance from the top of the microstructure to the inner wall of the bottom plate to the vertical distance from the top of the microstructure to the upper cover plate is between 1-10.

[0022] Preferably, the microstructure and the inner wall surface of the bottom plate are provided with a hydrophilic modification layer or a hydrophobic modification layer.

[0023] Preferably, the free end of the working fluid inlet and outlet is provided with a threaded structure, a quick connector structure or a pagoda structure.

[0024] The second aspect of the utility model discloses a liquid cooling and heat dissipation system, including a mainboard, a chip to be cooled and a working medium heat dissipation device, and also includes any one of the above-mentioned integrated phase change liquid cooling and heat dissipation devices;

[0025] The chip to be cooled is welded on the mainboard;

[0026] The integrated phase-change liquid cooling device is mounted on the mainboard, and / or the integrated phase-change liquid cooling device is mounted on the mainboard via a fastener;

[0027] The integrated phase-change liquid cooling device is pressed onto the chip to be cooled, and a heat-conducting medium is filled between the outer wall of the bottom plate and the cooling surface of the chip to be cooled;

[0028] The working fluid circulating in the heat dissipation system is a phase change material, including water, alcohols, hydrocarbons, refrigerants, mineral oils, transformer oils, fluorinated liquids, etc.;

[0029] The working medium inlet and outlet are connected to the hot working medium inlet or the cold working medium outlet of the working medium heat dissipation device through the working medium flow pipeline to form a heat exchange cycle.

[0030] The working principle of the utility model is:

[0031] The working fluid inlet and outlet, connecting groove, liquid cooling groove, and heat dissipation base plate together constitute the working fluid flow channel of the phase change liquid cooling radiator. Specifically: the cold working fluid is input into the radiator from the working fluid flow inlet, passes through the connecting groove on the same side, and then exchanges heat with the CPU / GPU through the microstructure and the base plate in the closed space formed by the upper cover plate and the heat dissipation base plate; the heat is transferred to the liquid working fluid through the base plate and the microstructure, causing the liquid working fluid to change from liquid to gas. After the heat exchange, the gas-liquid mixed working fluid passes through the connecting groove from the through hole on the other side and is discharged from the heat dissipation device through the working fluid flow outlet.

[0032] Compared with the prior art, the utility model has the following beneficial effects:

[0033] Through the structural design of the upper cover, the heat dissipation base and the heat dissipation base, as well as the design and assembly of the micro-structure on the inner side of the heat dissipation base, the contact area between the heat dissipation device and the CPU / GPU and the contact area between the working fluid and the base are increased, thereby improving the heat exchange rate and heat dissipation efficiency of the heat dissipation device as well as the working efficiency and life of the CPU / GPU.

[0034] 1. Introducing tiny structures greatly increases the contact area between the working fluid and the surface, thereby increasing the heat dissipation effect;

[0035] 2. Adding hydrophilic or hydrophobic treatment to the surface of microstructures can greatly improve the heat transfer performance of the heat sink;

[0036] 3. This heat dissipation device uses liquid phase change heat dissipation material. When the liquid phase change material changes into gas, it absorbs a lot of heat, greatly improving the heat dissipation effect;

[0037] 4. The components of the heat dissipation device are easy to process and assemble, and are convenient for promotion and application;

[0038] 5. The heat dissipation device also has the advantages of high heat dissipation efficiency, small size, low noise and convenient maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 is a schematic diagram of the structure of the heat dissipation device;

[0040] Figure 2 It is a schematic diagram of the structure of the heat dissipation base;

[0041] Figure 3 It is a schematic diagram of the structure inside the heat dissipation base plate;

[0042] Figure 4It is a schematic diagram of the structure of the outer side of the heat dissipation base plate;

[0043] Figure 5 It is a structural schematic diagram of the outer side of the upper cover plate (threaded joint);

[0044] Figure 6 It is a schematic diagram of the structure on the inner side of the upper cover;

[0045] Figure 7 It is a structural schematic diagram of the outer side of the upper cover plate (pagoda joint);

[0046] Figure 8 It is a schematic diagram of the structure of a tiny structure;

[0047] Fig. 9 Schematic diagram of the structure of microstructures being arranged in sequence (left) or in cross-order (right);

[0048] In the figure: 1-heat dissipation base; 2-heat dissipation bottom plate; 3-upper cover plate; 11-first fixing hole; 12-second fixing hole; 13-step groove; 14-opening; 21-liquid cooling groove; 22-micro structure; 23-boss; 24-bottom plate outer wall; 25-bottom plate inner wall; 31-working fluid inlet and outlet; 32-connecting groove. DETAILED DESCRIPTION

[0049] The utility model is described in detail below with reference to the accompanying drawings and specific embodiments.

[0050] Example 1

[0051] An integrated phase change liquid cooling device, such as Figure 1-9 As shown, it includes a heat dissipation base 1, a heat dissipation bottom plate 2 and an upper cover plate 3 which are stacked in sequence;

[0052] The heat dissipation base 1 is provided with an opening 14;

[0053] The heat dissipation base plate 2 is provided with a liquid cooling tank 21, the base plate outer wall 24 of the liquid cooling tank 21 is arranged through the opening 14 and is flush with the bottom surface of the heat dissipation base 1, and the base plate inner wall 25 of the liquid cooling tank 21 is provided with a plurality of micro structures 22;

[0054] The upper cover plate 3 is provided with a pair of working medium inlets and outlets 31 communicating with the liquid cooling tank 21 , which are used to input or output phase change heat exchange working medium to the liquid cooling tank 21 .

[0055] More specifically, in this embodiment:

[0056] An integrated phase change liquid cooling device, such as Figure 1-9 As shown, it includes a heat dissipation base 1, a heat dissipation bottom plate 2, and an upper cover plate 3, wherein the heat dissipation bottom plate 2 is pressed between the upper cover plate 3 and the heat dissipation base 1.

[0057] Four first fixing holes 11 and eight second fixing holes 12 are provided at the four corners of the heat dissipation base 1, all of which are used to assemble the heat dissipation device as a whole on the mainboard (directly assembled or assembled through clips); a step groove 13 is provided in the middle of the heat dissipation base 1, and an opening 14 is provided in the middle of the step groove 13. The heat dissipation base 1 is used for matching and installing the heat dissipation base plate 2.

[0058] A liquid cooling groove 21 is provided in the middle of the heat dissipation base plate 2, and a plurality of tiny structures 22 are arranged on the inner wall 25 of the base plate in the groove; a boss 23 is formed on the outer bottom surface of the heat dissipation base plate 2, and a base plate outer wall 24 (as a heat exchange surface) of the liquid cooling groove 21 is formed on the boss 23. The boss 23 and the base plate outer wall 24 of the heat dissipation base plate 2 are provided for installation and cooperation with the step groove 13 and the opening 14 of the heat dissipation base 1. The base plate outer wall 24 of the heat dissipation base plate 2 is provided in a shape that fits the heat dissipation surface of the CPU / GPU, and the bottom surface of the base plate outer wall 24 is flush with the bottom surface of the heat dissipation base plate 2.

[0059] The upper surface of the upper cover plate 3 is provided with two working medium inlets and outlets 31, which serve as the inlet and outlet of the phase change liquid working medium respectively. The lower surface of the upper cover plate 3 is provided with two connecting grooves 32, which respectively connect the liquid cooling groove 21 with the working medium inlets and outlets 31 on the same side of the connecting groove 32.

[0060] Furthermore,

[0061] like Figure 1 As shown, the heat dissipation device body includes a heat dissipation base 1, a heat dissipation bottom plate 2 and an upper cover plate 3, wherein the heat dissipation bottom plate 2 is installed between the heat dissipation base 1 and the upper cover plate 3, and the working fluid inlet and outlet 31 on the upper cover plate 3 are respectively used as the working fluid flow inlet and the working fluid flow outlet, so that the working fluid passes through the designated path to avoid conflicts between input and output; the heat dissipation bottom plate 2 is in contact with the CPU / GPU heat dissipation surface by applying heat dissipation silicone grease, heat dissipation glue or heat dissipation belt to generate heat exchange.

[0062] Heat sink 1, such as Figure 2 As shown, a first fixing hole 11 and a second fixing hole 12 are provided at the four corner edge positions of the heat dissipation base 1, which are respectively used to fully fix the heat dissipation base 1 on the mainboard (with studs) of the CPU / GPU, and to fix the heat dissipation base 1 on the mainboard of the CPU / GPU through a buckle (with nuts); a square step groove 13 and a square opening 14 are provided in the middle of the heat dissipation base 1.

[0063] Heat dissipation base plate 2, such as Figure 3 and Figure 4 As shown, a liquid cooling tank 21 is provided inside, and a plurality of micro structures 22 constituting a flow channel are provided on the bottom inner wall 25 of the liquid cooling tank 21. A square boss 23 is formed at the center of the outer bottom surface of the heat dissipation bottom plate 2, and the bottom outer wall 24 of the liquid cooling tank 21 is further formed at the center of the square boss 23. Figure 4 ) is connected to the square step groove 13 by brazing; at this time, the plane where the bottom plate outer wall 24 is located coincides with the bottom surface of the heat dissipation base 1, and the bottom plate outer wall 24 is set to a shape that completely fits the heat dissipation surface of the CPU / GPU. The heat exchange medium flows into the liquid cooling tank 21 through the medium inlet and outlet 31 through the connecting groove 32, and exchanges heat with the CPU / GPU through the heat dissipation base 2.

[0064] The plurality of inwardly protruding microstructures 22 provided on the inner wall of the heat dissipation base plate 2 can be in the shape of a prism, a triangular pyramid, a cube, a cuboid, a mushroom, a hemisphere, a cone, a cylinder, an S shape, a raindrop shape, or a combination of various shapes, such as Figure 8 The design of the special-shaped microstructure 22 makes the formed flow channel an unconventional flow channel, which effectively increases the contact area and reduces the generation of dead zones.

[0065] Further, when the microstructure 22 is a rectangular parallelepiped, its length parallel to the inner wall 25 of the bottom plate is between 5 microns and 10 mm, its width is between 5 microns and 10 mm, and its height perpendicular to the inner wall 25 of the bottom plate is between 5 microns and 10 mm; when the microstructure 22 is a prism: its length parallel to the inner wall 25 of the bottom plate is between 5 microns and 10 mm, its width is between 5 microns and 10 mm, and its height perpendicular to the inner wall 25 of the bottom plate is between 5 microns and 10 mm; when the microstructure 22 is a cylinder or a cone: its diameter parallel to the inner wall 25 of the bottom plate is between 5 microns and 10 mm, and its height perpendicular to the inner wall 25 of the bottom plate is between 5 microns and 10 mm; when the microstructure 22 is a hemisphere: the radius of the hemisphere is between 2 microns and 5 mm; when the microstructure 22 is mushroom-shaped, raindrop-shaped, or S-shaped, the length, maximum diameter or width should be between 2 microns and 10 mm, and the size perpendicular to the inner wall 25 of the bottom plate should be between 2 microns and 10 mm; the spacing between the microstructures 22 is between 2 microns and 10 mm. The ratio of the height of the microstructure 22 perpendicular to the bottom plate inner wall 25 to the distance from the top of the microstructure 22 to the bottom surface of the upper cover plate 3 is between 1 and 10.

[0066] like Fig. 9 As shown, the arrangement of the microstructures 22 can be in a sequential arrangement or a cross arrangement, and the working medium flows from right to left. The sequential arrangement has the characteristics of small disturbance and small flow resistance when the liquid working medium flows through the microstructure 22; the cross arrangement design makes the flow disturbance large and the heat transfer coefficient increased. In the case of small flow and low flow velocity, the sequential arrangement can be selected, and the cross arrangement is preferred in the case of large flow, high flow velocity and high heat transfer requirements.

[0067] The inner wall 25 of the bottom plate and the surface of the microstructure 22 can be treated to be hydrophilic or hydrophobic to accelerate the boiling of the working medium to increase the heat absorption efficiency; usually a hydrophilic layer or a hydrophobic layer can be coated, and the hydrophobic material can be trimethylsilane, polytetrafluoroethylene or polydimethylsiloxane. The inner wall 25 of the bottom plate can also be treated by, for example, laser texturing to achieve the purpose of hydrophilicity or hydrophobicity.

[0068] The hydrophilic and hydrophobic modification of the surface of the microstructure 22 can further increase the boiling rate of the working fluid and improve the heat removal efficiency. The choice of hydrophilic and hydrophobic modification of the microstructure 22 is selected according to the heat flux density of the specific working conditions: hydrophobic modification has a better heat transfer effect under low heat flux density, and hydrophilic modification has a better heat transfer effect under high heat flux density; this is because: generally speaking, the heat transfer coefficient obtained by selecting a hydrophilic surface under high heat flux density is large, and the heat transfer coefficient obtained by selecting a hydrophobic surface under low heat flux density is large.

[0069] In addition, the length of the inner wall 25 of the bottom plate is kept basically consistent with the length of the connecting groove 32 (the inner wall 25 of the bottom plate is arranged parallel to the connecting groove 32), so that the working fluid entering from the working fluid inlet and outlet 31 can quickly and evenly fill the internal heat exchange space formed by the radiator, maintain sufficient pressure, and timely discharge the boiling gas-liquid two-phase working fluid and replenish the liquid working fluid to enhance the heat exchange effect. The liquid working fluid is a phase change material, and water, alcohols, hydrocarbons, refrigerants, mineral oils, transformer oils, fluorinated liquids, etc. can be selected according to the working conditions.

[0070] Brazing solder is provided between the upper cover plate 3 and the heat dissipation base plate 2 and connected by brazing; the sealing of the heat dissipation device must be ensured during welding. Brazing solder is also provided between the heat dissipation base plate 2 and the heat dissipation base 1 and connected by brazing. It should be noted that when the heat dissipation base plate 2 and the heat dissipation base 1 are brazed, the parallelism between the outer wall 24 of the base plate and the bottom surface of the heat dissipation base 1 should be ensured to be good enough (the boss 23 and the step groove 13 have a high degree of fit) to avoid poor fit when the heat dissipation device is installed on the CPU / GPU.

[0071] A pair of working fluid inlets and outlets 31 are arranged at both ends of the upper cover plate 3, which can be short straight pipes, or the working fluid inlets and outlets 31 can be curved pipes, both of which are led out from the upper surface of the upper cover plate 3. Different structural shapes enable the working fluid inlets and outlets 31 to have different connection directions to adapt to different types of chassis and different chassis spaces. The connection between the working fluid inlet and outlet 31 and the upper cover plate 3 is threaded connection or welding, and the direction of the working fluid inlet and outlet 31 can be parallel or non-parallel to any direction of the upper cover plate 3, and the direction can be selected according to actual needs; the free end of the working fluid inlet and outlet 31 can be designed as a non-slip threaded structure, a quick connector structure or a pagoda head structure, which can further reduce the possibility of connection disengagement and improve safety of use.

[0072] The heat dissipation bottom plate 2, the heat dissipation base 1 and the upper cover plate 3 in the heat dissipation device can be made of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride or silicon to have sufficient strength and excellent heat exchange performance.

[0073] Taking the mainstream motherboard and mainstream CPU / GPU models currently available on the market as an example, the heat sink can be designed to have a square / rectangular cross-section, wherein the four corner edges of the heat sink base 1 can be provided with a first fixing hole 11 and a second fixing hole 12. In particular, Figure 1 The first fixing hole 11 and the second fixing hole 12 are both through holes, and the size of the holes can be designed according to the motherboard model. The heat dissipation base 1 and the heat dissipation bottom plate 2 are connected by brazing, and the heat dissipation bottom plate 2 and the upper cover plate 3 are also connected by brazing. Figure 3 The size of the working fluid inlet and outlet 31 on the upper cover plate 3 can be designed according to the flow rate of the working fluid, and a threaded structure or a pagoda structure can be provided outside the working fluid inlet and outlet 31 as needed to complete the connection with the outside. The size of the liquid cooling tank 21 of the heat dissipation base plate 2 and the arrangement and number of the microstructures 22 can be customized according to different CPU / GPU models.

[0074] When installing the radiator: first, assemble and securely fix all components according to the standard, and form a thin and uniform heat-conducting layer (such as coating thermal grease or fitting a heat-conducting sheet) on the outer wall 24 of the bottom plate or the heat-dissipating surface of the CPU / GPU; then, install the clip with a nut on the four corners of the heat-dissipating base 1 through the second fixing hole 12, align the nut with the first fixing hole 11, and then the stud on the mainboard passes through the first fixing hole 11 and cooperates with the nut on the clip to firmly install the heat-dissipating device on the mainboard at the position corresponding to the CPU / GPU, so that the outer wall 24 of the bottom plate and the heat-dissipating surface of the CPU / GPU form good contact through the heat-conducting layer; then connect the working fluid connecting pipe to the working fluid inlet and outlet 31 to complete the assembly.

[0075] When the radiator is in use, the cold working medium is input into the radiator through the working medium flow inlet of the working medium inlet and outlet 31, and after flowing through the connecting groove 32, the cold working medium enters the liquid cooling groove 21 of the heat dissipation base plate 2; the microstructure 22 in the heat exchange space effectively increases the heat exchange contact area, and at the same time, hydrophilic and hydrophobic modification of the surface of the microstructure 22 under different working conditions can accelerate the boiling of the working medium to speed up the phase change heat absorption; the gas-liquid two-phase working medium after heat exchange flows from the connecting groove 32 on the other side to the working medium flow outlet and is discharged from the radiator.

[0076] Compared with the prior art, the utility model solves the problems of low heat exchange efficiency of liquid cooling radiators, unstable operation caused by poor heat dissipation, short lifespan and inability to operate at high power for a long time, and the present solution realizes efficient heat dissipation of CPU / GPU.

[0077] Example 2

[0078] A liquid cooling system, comprising a mainboard, a chip to be cooled and a working fluid cooling device, and also comprising the integrated phase change liquid cooling device as described in the above embodiment 1;

[0079] The chip to be cooled is welded on the mainboard;

[0080] The integrated phase-change liquid cooling device is mounted on the mainboard, and / or the integrated phase-change liquid cooling device is mounted on the mainboard via a fastener;

[0081] The integrated phase-change liquid cooling device is pressed onto the chip to be cooled, and a heat-conducting medium is filled between the outer wall 24 of the bottom plate and the cooling surface of the chip to be cooled;

[0082] The working medium inlet and outlet 31 is connected to the hot working medium inlet or the cold working medium outlet of the working medium heat dissipation device through a working medium flow pipeline to form a heat exchange cycle.

[0083] The above description of the embodiments is to facilitate the understanding and use of the utility model by those skilled in the art. It is obvious that those familiar with the art can easily make various modifications to these embodiments and apply the general principles described herein to other embodiments without creative work. Therefore, the utility model is not limited to the above embodiments, and improvements and modifications made by those skilled in the art based on the disclosure of the utility model without departing from the scope of the utility model should be within the scope of protection of the utility model.

Claims

1. An integrated phase-change liquid cooling device, characterized in that: It comprises a heat dissipation base (1), a heat dissipation bottom plate (2) and an upper cover plate (3) which are stacked in sequence; The heat dissipation base (1) is provided with an opening (14); The heat dissipation base plate (2) is provided with a liquid cooling groove (21), the base plate outer wall (24) of the liquid cooling groove (21) is arranged through the opening (14) and is flush with the bottom surface of the heat dissipation base (1), and the base plate inner wall (25) of the liquid cooling groove (21) is provided with a plurality of micro structures (22); The upper cover plate (3) is provided with a pair of working medium inlets and outlets (31) connected to the liquid cooling groove (21), which are respectively used to input or output phase change heat exchange working medium to the liquid cooling groove (21).

2. The integrated phase-change liquid cooling device according to claim 1, characterized in that: The heat dissipation base (1) is provided with a step groove (13), and the opening (14) is located in the step groove (13); a boss (23) is formed on the outer bottom surface of the heat dissipation base plate (2), and the base plate outer wall (24) is located on the boss (23); the step groove (13) and the boss (23) are arranged in coordination.

3. The integrated phase-change liquid cooling device according to claim 1, characterized in that: A pair of communication grooves (32) are provided on a surface of the upper cover plate (3) facing the liquid cooling groove (21), and the communication grooves (32) are respectively connected to the working medium inlet and outlet (31).

4. The integrated phase-change liquid cooling device according to claim 1, characterized in that: The heat dissipation base (1), the heat dissipation bottom plate (2) and the upper cover plate (3) are connected by brazing; The heat dissipation base (1), the heat dissipation bottom plate (2) and the upper cover plate (3) are made of one of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride and silicon.

5. The integrated phase-change liquid cooling device according to claim 1, characterized in that: The microstructures (22) are arranged in a sequential or staggered manner in the liquid cooling tank (21).

6. The integrated phase-change liquid cooling device according to claim 1, characterized in that: The shapes of the microstructure (22) include prism, triangular pyramid, cube, cuboid, mushroom, hemisphere, cone, cylinder, S-shape and raindrop shape; When the microstructure (22) is a rectangular parallelepiped, its length parallel to the inner wall (25) of the bottom plate is between 5 microns and 10 millimeters, its width is between 5 microns and 10 millimeters, and its height perpendicular to the inner wall (25) of the bottom plate is between 5 microns and 10 millimeters; when the microstructure (22) is a prism: its length parallel to the inner wall (25) of the bottom plate is between 5 microns and 10 millimeters, its width is between 5 microns and 10 millimeters, and its height perpendicular to the inner wall (25) of the bottom plate is between 5 microns and 10 millimeters; when the microstructure (22) is a cylinder or a cone: its length parallel to the inner wall (25) of the bottom plate is between 5 microns and 10 millimeters, its width is between 5 microns and 10 millimeters, and its height perpendicular to the inner wall (25) of the bottom plate is between 5 microns and 10 millimeters; The diameter of the plate inner wall (25) is between 5 microns and 10 millimeters, and the height perpendicular to the bottom plate inner wall (25) is between 5 microns and 10 millimeters; when the microstructure (22) is a hemisphere: its radius is between 2 microns and 5 millimeters; when the microstructure (22) is mushroom-shaped, raindrop-shaped or S-shaped: its arbitrary length, maximum diameter or width parallel to the bottom plate inner wall (25) is between 2 microns and 10 millimeters, and the height perpendicular to the bottom plate inner wall (25) is between 2 microns and 10 millimeters; the spacing between the microstructures (22) is between 2 microns and 10 millimeters.

7. The integrated phase-change liquid cooling device according to claim 1, characterized in that: The ratio of the vertical distance from the top of the microstructure (22) to the inner wall of the bottom plate (25) to the vertical distance from the top of the microstructure (22) to the upper cover plate (3) is between 1 and 10.

8. The integrated phase-change liquid cooling device according to claim 1, characterized in that: The microstructure (22) and the surface of the inner wall (25) of the bottom plate are provided with a hydrophilic modification layer or a hydrophobic modification layer.

9. The integrated phase-change liquid cooling device according to claim 1, characterized in that: The free end of the working medium inlet and outlet (31) is provided with a threaded structure, a quick connector structure or a pagoda structure.

10. A liquid cooling system, comprising a mainboard, a chip to be cooled and a working fluid cooling device, characterized in that: It also includes the integrated phase-change liquid cooling device as described in any one of claims 1 to 9; The chip to be cooled is welded on the mainboard; The integrated phase-change liquid cooling device is mounted on the mainboard, and / or the integrated phase-change liquid cooling device is mounted on the mainboard via a fastener; The integrated phase-change liquid cooling device is pressed onto the chip to be cooled, and a heat-conducting medium is filled between the outer wall (24) of the bottom plate and the cooling surface of the chip to be cooled; The working medium inlet and outlet (31) is connected to the hot working medium inlet or the cold working medium outlet of the working medium heat dissipation device through a working medium flow pipeline to form a heat exchange cycle; The working medium circulating in the heat dissipation system is a phase change material, including water, alcohols, hydrocarbons, refrigerants, mineral oil, transformer oil and fluorinated liquid.

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