High-heat-dissipation photovoltaic optimizer

Abstract

The utility model relates to a high-heat-dissipation photovoltaic optimizer, and relates to the technical field of photovoltaic power generation, the high-heat-dissipation photovoltaic optimizer comprises an inner base, a circuit board located in the inner base and an inner shell cover covering the inner base, and an outer bottom plate and an outer shell cover are arranged outside the inner base and the inner shell cover respectively; heat dissipation fins are arranged on the outer side face of the outer shell cover, and a heat conduction ceramic piece located on the side face, facing the inner shell cover, of the circuit board and a soaking block arranged on the side face, away from the circuit board, of the heat conduction ceramic piece are arranged in the inner base. A positioning boss is arranged on the side face, away from the heat conduction ceramic piece, of the soaking block, and an installation through hole for the positioning boss to be placed in is formed in the inner shell cover. According to the photovoltaic optimizer, due to the cooperative arrangement of the heat dissipation fins, the heat conduction ceramic chip and the heat dissipation fins, the temperature on the circuit board is conducted to the soaking block through the heat conduction ceramic chip, and the heat on the soaking block is finally dissipated to the outside through the heat dissipation fins, so that the heat dissipation performance of the photovoltaic optimizer is improved.

Description

Technical Field

[0001] The present application relates to the technical field of photovoltaic power generation, and in particular to a high heat dissipation photovoltaic optimizer. Background Art

[0002] Solar energy is a green energy source, and improving the efficiency of converting solar energy into electrical energy is the goal we all pursue. Photovoltaic optimizers can increase the power generation of photovoltaic systems and reduce unit power generation costs. They are important electronic components in photovoltaic power generation systems.

[0003] In the related art, the photovoltaic optimizer includes a metal shell, a printed circuit board module, an end cover, and a cable. The metal shell has an open hollow structure for accommodating and protecting the printed circuit board module inside; the end cover is used to cover the opening of the metal shell to form a closed accommodating cavity, and includes at least one through hole for the access of the cable; the printed circuit board module includes a printed circuit board and various electronic devices installed on the printed circuit board, which is responsible for performing the core functions of the photovoltaic optimizer; the cable is responsible for connecting the printed circuit board with external devices to realize data transmission and power supply.

[0004] The electronic devices inside the photovoltaic optimizer will perform energy conversion during operation, but this will also be accompanied by a certain amount of energy loss. Most of this lost energy will be converted into heat and accumulate inside the photovoltaic optimizer. Since photovoltaic optimizers usually adopt a compact packaging design, although this design effectively protects the internal electronic devices from the influence of the external environment, it also limits the heat dissipation channel and heat dissipation area, making it difficult to effectively dissipate the heat.

[0005] If the heat cannot be dissipated effectively, the internal temperature of the photovoltaic optimizer will rise. However, the temperature that the electronic devices on the circuit board can withstand is limited. If the heat generated by the power devices cannot be dissipated in time, their working ability and performance will deteriorate, seriously affecting their working stability and reducing their working efficiency. There is room for improvement. Summary of the invention

[0006] The purpose of this application is to provide a high heat dissipation photovoltaic optimizer to solve the problem of poor heat dissipation performance of the photovoltaic optimizer in the above-mentioned related technologies.

[0007] The high heat dissipation photovoltaic optimizer provided in this application adopts the following technical solution:

[0008] A high heat dissipation photovoltaic optimizer comprises an inner base, a circuit board located in the inner base, and an inner shell cover arranged on the inner base, wherein the outer sides of the inner base and the inner shell cover are respectively provided with an outer bottom plate and an outer shell cover; the outer side surface of the outer shell cover is provided with heat dissipation fins, and the inner base is provided with a heat-conducting ceramic sheet located on the side of the circuit board facing the inner shell cover, and a heat-spreading block arranged on the side of the heat-conducting ceramic sheet away from the circuit board; a positioning boss is provided on the side of the heat-spreading block away from the heat-conducting ceramic sheet, and the inner shell cover is provided with a mounting through hole for the positioning boss to be placed.

[0009] By adopting the above technical solution, due to the coordinated arrangement of the heat sink fins, the thermally conductive ceramic sheet and the heat sink fins, the temperature on the circuit board is transferred to the heat equalizing block through the thermally conductive ceramic sheet, and the heat on the heat equalizing block is finally dissipated to the outside through the heat sink fins, thereby reducing the problem of the circuit board temperature being too high and affecting its performance, and improving the heat dissipation performance of the photovoltaic optimizer.

[0010] Optionally, a first heat-conducting layer is provided between the circuit board and the heat-conducting ceramic sheet.

[0011] By adopting the above technical solution, due to the provision of the first heat-conducting layer, the heat on the circuit board can be transferred to the heat-conducting ceramic sheet through the first heat-conducting layer, thereby improving its thermal conductivity and further improving the heat dissipation performance of the photovoltaic optimizer.

[0012] Optionally, a second heat conducting layer is provided on the side of the positioning boss facing the outer shell cover, an insulating layer is provided on the outer side of the second heat conducting layer of the positioning boss, and a gap is reserved between the positioning boss and the outer shell cover for inserting the second heat conducting layer and the insulating layer.

[0013] By adopting the above technical solution, the second heat-conducting layer is provided to facilitate the conduction of heat on the heat-matching block to the outer shell cover, and at the same time, the second heat-conducting layer and the insulating layer form double insulation, which can improve the product's ability to resist external high voltage; and a gap is reserved between the positioning boss on the heat-matching block and the outer shell cover for the second heat-conducting layer and the insulating layer to be placed, which facilitates the installation of the second heat-conducting layer and the insulating layer.

[0014] Optionally, a plurality of limit hooks and a plurality of support blocks are fixedly provided on the inner wall of the inner shell cover, and a support groove for inserting the edge of the circuit board is opened on the support block, and the limit hooks are used to clamp the edge of the circuit board inserted into the support groove.

[0015] By adopting the above technical solution, during the installation process of the circuit board, the circuit board is placed in the support groove on the support block, and then the edge of the circuit board is clamped and fixed using a limiting hook, thereby achieving the installation and fixation of the circuit board and reducing the possibility of the circuit board loosening inside the inner base.

[0016] Optionally, a limiting barb is fixedly provided on the inner side wall of the inner base, and a limiting plate extending into the inner base is provided on the inner shell cover, and a limiting slot for inserting the limiting barb is provided on the limiting plate.

[0017] By adopting the above technical solution, due to the coordinated setting of the limiting hook and the limiting slot, when the inner base and the inner shell cover are assembled and fixed, the limiting hook on the inner base is inserted into the limiting slot on the limiting plate, thereby realizing the assembly and fixation of the inner base and the inner shell cover.

[0018] Optionally, a positioning convex strip is provided on the side edge of the inner base facing the inner shell cover, and a positioning groove for the positioning convex strip to be inserted into is provided on the inner shell cover.

[0019] By adopting the above technical solution, when the inner shell cover and the inner base are assembled, the positioning convex strip is simultaneously inserted into the positioning groove, thereby improving the assembly stability of the inner shell cover and the inner base.

[0020] Optionally, a first baffle and a second baffle are respectively provided on opposite sides of the inner shell cover, and the outer shell cover is arranged outside the inner shell cover and between the first baffle and the second baffle; a guide slot for inserting the inner bottom plate is provided on the inner edge of the opening of the outer shell cover facing the outer bottom plate, and a plurality of abutment blocks for tightening the outer bottom plate are provided on the side of the inner base facing the outer bottom plate.

[0021] By adopting the above technical solution, after the outer shell cover is installed, the outer shell cover is sleeved on the outside of the inner shell cover and is located between the first baffle plate and the second baffle plate, and then the two opposite edges of the outer bottom plate are inserted into the corresponding guide slots, and at the same time, the abutment blocks on the inner base are pressed against the inner side surface of the outer bottom plate, thereby realizing the assembly and fixation of the outer shell cover and the outer bottom plate.

[0022] Optionally, an elastic gasket is provided on the side of the outer shell cover facing the outer bottom plate, and an annular insertion groove for inserting the elastic gasket is provided around the mounting through hole on the side of the inner shell cover facing the outer shell cover.

[0023] By adopting the above technical solution, after the outer shell cover and the outer bottom plate are assembled, due to the installation of the elastic gasket, one side of the elastic gasket is pressed against the inner wall of the outer shell cover, thereby improving the abutment stability between the outer shell cover and the inner shell cover.

[0024] Optionally, a plurality of limit blocks for pressing against the inner shell cover are provided on the inner wall of the outer shell cover.

[0025] By adopting the above technical solution, due to the installation setting of the limit block, after the outer shell cover and the outer bottom plate are assembled, the limit block on the inner base is pressed against the inner side surface of the outer bottom plate, thereby further improving the assembly stability between the outer bottom plate and the inner base.

[0026] Optionally, a plurality of fixing hooks are provided on the side of the inner base facing the outer bottom plate, and a fixing slot for inserting the fixing hooks is provided on the outer bottom plate.

[0027] By adopting the above technical solution, due to the matching setting of the fixing hook and the fixing groove, after the outer shell cover and the outer bottom plate are assembled, the fixing hook on the inner base is inserted into the fixing groove on the outer bottom plate, thereby further improving the assembly stability between the outer bottom plate and the inner base.

[0028] In summary, the present application includes at least one of the following beneficial technical effects:

[0029] 1. Due to the coordinated setting of the heat sink fins, thermally conductive ceramic sheets and heat sink fins, the temperature on the circuit board is transferred to the heat spreader through the thermally conductive ceramic sheets, and the heat on the heat spreader is finally dissipated to the outside through the heat sink fins, thereby reducing the problem of excessively high circuit board temperature affecting its performance and improving the heat dissipation performance of the photovoltaic optimizer.

[0030] 2. Due to the setting of the first thermal conductive layer, the heat on the circuit board can be transferred to the thermal conductive ceramic sheet through the first thermal conductive layer; through the setting of the second thermal conductive layer, the heat on the heat equalizing block can be transferred to the outer shell cover; through the second thermal conductive layer and the insulating layer to form double insulation, the product's ability to resist external high voltage can be improved.

[0031] 3. A gap is reserved between the positioning boss on the heat-averaging block and the outer shell cover for inserting the second heat-conducting layer and the insulating layer, so as to facilitate the installation of the second heat-conducting layer and the insulating layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0033] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application;

[0034] Figure 2 It is a schematic diagram of the explosion structure of an embodiment of the present application;

[0035] Figure 3 It is a schematic cross-sectional structure diagram of the installation and matching of the circuit board in the embodiment of the present application;

[0036] Figure 4 It is a schematic cross-sectional structure diagram of the installation and coordination of the heat dissipation assembly in the embodiment of the present application;

[0037] Figure 5 yes Figure 4A magnified schematic diagram of part A;

[0038] Figure 6 It is a partial cross-sectional structural schematic diagram of the installation and cooperation between the inner base and the inner shell cover in the embodiment of the present application;

[0039] Figure 7 This is a schematic diagram of the structure of the installation distribution of the outer bottom plate and the inner base in the embodiment of the present application;

[0040] Figure 8 It is a partial cross-sectional structural schematic diagram of the installation and matching of the inner base and the outer base plate in the embodiment of the present application;

[0041] Fig. 9 It is a partial cross-sectional structural schematic diagram of the embodiment of the present application embodying the installation and matching of the elastic gasket;

[0042] Fig.10 It is a structural schematic diagram of the installation distribution of elastic washers in an embodiment of the present application.

[0043] In the figure, 1, inner base; 11, make way groove; 12, limit barb; 13, positioning convex strip; 14, abutment block; 15, fixing hook; 2, inner shell cover; 21, limit hook; 22, support block; 221, support groove; 23, installation through hole; 24, limit plate; 241, limit slot; 25, positioning groove; 26, first baffle plate; 27, second baffle plate; 28, annular insertion groove; 3, circuit board; 4, outer bottom plate; 41, fixing slot; 5, outer shell cover; 51, heat dissipation fin; 52, guide slot; 521, avoidance groove; 53, limit strip; 6, heat dissipation component; 61, thermal conductive ceramic sheet; 62, heat balancing block; 621, positioning boss; 63, first thermal conductive layer; 64, second thermal conductive layer; 65, insulation layer; 7, elastic gasket. DETAILED DESCRIPTION

[0044] The present application is further described in detail below in conjunction with all the accompanying drawings.

[0045] Example:

[0046] Reference Figure 1 and Figure 2 A high heat dissipation photovoltaic optimizer includes an inner base 1, a circuit board 3 installed in the inner base 1, and an inner shell cover 2 covered on the inner base 1. The inner base 1 and the inner shell cover 2 are respectively provided with an outer bottom plate 4 and an outer shell cover 5 on their outer sides; corresponding clearance grooves 11 are opened on the sides of the inner base 1 and the inner shell cover 2 that are close to each other, and the external cable passes through the clearance groove 11 and is electrically connected to the circuit board 3.

[0047] Reference Figure 2 and Figure 3Two limiting hooks 21 and a plurality of supporting blocks 22 are formed on the inner wall of the inner shell cover 2, wherein the supporting block 22 is provided with a supporting groove 221 for the edge of the circuit board 3 to be placed in. The two limiting hooks 21 are arranged opposite to each other and are used to clamp the edge of the circuit board 3 placed in the supporting groove 221, and then the circuit board 3 is penetrated by bolts and fixed to the inner shell cover 2, so as to realize the installation and fixation of the circuit board 3.

[0048] Reference Figure 4 and Figure 5 , a plurality of heat dissipation fins 51 are uniformly formed on the outer surface of the outer shell cover 5, and the heat dissipation fins 51 are integrally formed with the outer shell cover 5. A heat dissipation assembly 6 is arranged in the inner base 1, wherein the heat dissipation assembly 6 comprises a heat-conducting ceramic sheet 61 mounted on the side of the circuit board 3 facing the inner shell cover 2, and a heat-scaling block 62 mounted on the side of the heat-conducting ceramic sheet 61 away from the circuit board 3; a positioning boss 621 is formed on the side of the heat-scaling block 62 away from the heat-conducting ceramic sheet 61, and both the heat-scaling block 62 and the positioning boss 621 are made of aluminum alloy, and a mounting through hole 23 for the positioning boss 621 to be placed is opened on the inner shell cover 2.

[0049] Reference Figure 4 and Figure 5 A first heat-conducting layer 63 is provided between the circuit board 3 and the heat-conducting ceramic sheet 61, wherein the first heat-conducting layer 63 is a heat-conducting mud attached to the surface of the circuit board 3. A second heat-conducting layer 64 is provided on the side of the positioning boss 621 facing the housing cover 5, and an insulating layer 65 is provided on the outer side of the positioning boss 621 on the second heat-conducting layer 64, wherein the second heat-conducting layer 64 is a heat-conducting mud attached to the surface of the positioning boss 621, and the insulating layer 65 is an insulating paper bonded to one side of the second heat-conducting layer 64;

[0050] A gap is reserved between the positioning boss 621 and the outer shell cover 5 for the second heat-conducting layer 64 and the insulating layer 65 to be placed; the thermal conductive mud is a conventional heat dissipation material, and the insulating paper is a conventional electrical insulating paper, which will not be repeated here; the second heat-conducting layer 64 and the insulating layer 65 form double insulation, which can improve the product's ability to resist external high voltage.

[0051] Reference Figure 6 A limiting barb 12 is formed on the inner side wall of the inner base 1, and a limiting plate 24 extending into the inner base 1 is provided on the inner shell cover 2, and a limiting card groove 241 for inserting the limiting barb 12 is opened on the limiting plate 24; a positioning convex strip 13 is formed on the side edge of the inner base 1 facing the inner shell cover 2, and a positioning groove 25 for inserting the positioning convex strip 13 is opened on the inner shell cover 2; when the inner shell cover 2 and the inner base 1 are assembled, the positioning convex strip 13 is inserted into the positioning groove 25, and the limiting barb 12 is inserted into the limiting card groove 241, so as to realize the assembly and fixation of the inner base 1 and the inner shell cover 2.

[0052] Reference Figure 6 and Figure 7A first baffle 26 and a second baffle 27 are respectively formed on the opposite side surfaces of the inner shell cover 2. After the outer shell cover 5 is installed, the outer shell cover 5 is sleeved on the outside of the inner shell cover 2 and is located between the first baffle 26 and the second baffle 27; a guide slot 52 for inserting the inner bottom plate is opened on the inner edge of the opening of the outer shell cover 5 facing the outer bottom plate 4, and a plurality of abutting blocks 14 for abutting the outer bottom plate 4 are formed on the side of the inner base 1 facing the outer bottom plate 4; thereby, the outer shell cover 5 and the outer bottom plate 4 are assembled and fixed.

[0053] Reference Figure 6 and Figure 7 A clearance groove 521 with an arc cross-section is opened at the corner of the inner wall of the guide slot 52; a limiting clamping strip 53 for pressing against the inner shell cover 2 is formed on the inner walls of the opposite sides of the outer shell cover 5, thereby improving the installation stability of the inner shell cover 2 inside the outer shell cover 5.

[0054] Reference Figure 7 and Figure 8 Three fixing hooks 15 are formed on the side of the inner base 1 facing the outer bottom plate 4, and a fixing slot 41 for inserting the fixing hooks 15 is opened on the outer bottom plate 4, so as to further improve the assembly stability between the outer bottom plate 4 and the inner base 1.

[0055] Reference Fig. 9 and Fig.10 An elastic gasket 7 is provided on the side of the outer shell cover 5 facing the outer bottom plate 4. The elastic gasket 7 is made of rubber. At the same time, an annular insertion groove 28 for inserting the elastic gasket 7 is opened around the mounting through hole 23 on the inner shell cover 2 to improve the abutment stability between the outer shell cover 5 and the inner shell cover 2.

[0056] The implementation principle of the embodiment of the present application is:

[0057] During the application of the photovoltaic radiator, the heat dissipation performance of the photovoltaic radiator is improved due to the coordinated arrangement of the thermally conductive ceramic sheet 61, the first thermally conductive layer 63, the heat equalizing block 62, the second thermally conductive layer 64, the insulating layer 65 and the heat dissipating fins 51. At the same time, double insulation is formed by the second thermally conductive layer 64 and the insulating layer 65, which can improve the product's ability to resist external high voltage.

[0058] Unless otherwise defined, the terms or scientific terms used in this application should be understood by people with ordinary skills in the field to which this application belongs. The "first", "second", "third" and similar words used in this application do not indicate any order, quantity or importance, but are only used to distinguish different components. "One" or "one" and other similar words do not indicate a quantitative limit, but indicate that there is at least one. "Including" or "comprising" and other similar words mean that the elements or objects appearing in front of "including" or "comprising" cover the elements or objects listed after "including" or "comprising" and their equivalents, and do not exclude other elements or objects. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0059] The embodiments of this specific implementation are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. The same components are represented by the same figure marks. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A high heat dissipation photovoltaic optimizer, comprising an inner base (1), a circuit board (3) located in the inner base (1), and an inner shell cover (2) arranged on the inner base (1), wherein the outer sides of the inner base (1) and the inner shell cover (2) are respectively provided with an outer bottom plate (4) and an outer shell cover (5); It is characterized in that The outer surface of the outer shell cover (5) is provided with heat dissipation fins (51); the inner base (1) is provided with a heat-conducting ceramic sheet (61) located on the side of the circuit board (3) facing the inner shell cover (2), and a heat-dissipating block (62) located on the side of the heat-dissipating ceramic sheet (61) away from the circuit board (3); a positioning boss (621) is provided on the side of the heat-dissipating block (62) away from the heat-dissipating ceramic sheet (61); and the inner shell cover (2) is provided with a mounting through hole (23) for the positioning boss (621) to be placed.

2. A high heat dissipation photovoltaic optimizer according to claim 1, characterized in that: A first heat-conducting layer (63) is provided between the circuit board (3) and the heat-conducting ceramic sheet (61).

3. A high heat dissipation photovoltaic optimizer according to claim 1, characterized in that: A second heat-conducting layer (64) is provided on the side of the positioning boss (621) facing the outer shell cover (5), an insulating layer (65) is provided on the outer side of the second heat-conducting layer (64), and a gap is reserved between the positioning boss (621) and the outer shell cover (5) for the second heat-conducting layer (64) and the insulating layer (65) to be placed.

4. A high heat dissipation photovoltaic optimizer according to claim 1, characterized in that: A plurality of position-limiting hooks (21) and a plurality of support blocks (22) are fixedly arranged on the inner wall of the inner shell cover (2); a support groove (221) for the edge of the circuit board (3) to be placed is provided on the support block (22); and the position-limiting hooks (21) are used to clamp the edge of the circuit board (3) placed in the support groove (221).

5. A high heat dissipation photovoltaic optimizer according to claim 1, characterized in that: A limiting hook (12) is fixedly provided on the inner side wall of the inner base (1), and a limiting plate (24) extending into the inner base (1) is provided on the inner shell cover (2), and a limiting slot (241) for inserting the limiting hook (12) is provided on the limiting plate (24).

6. A high heat dissipation photovoltaic optimizer according to claim 5, characterized in that: A positioning convex strip (13) is provided on the side edge of the inner base (1) facing the inner shell cover (2), and a positioning groove (25) for the positioning convex strip (13) to be inserted is provided on the inner shell cover (2).

7. A high heat dissipation photovoltaic optimizer according to claim 1, characterized in that: The inner shell cover (2) is provided with a first baffle (26) and a second baffle (27) on opposite sides thereof, respectively; the outer shell cover (5) is arranged outside the inner shell cover (2) and between the first baffle (26) and the second baffle (27); A guide slot (52) for inserting the inner bottom plate is provided on the inner edge of the opening of the outer shell cover (5) facing the outer bottom plate (4), and a plurality of abutment blocks (14) for abutting against the outer bottom plate (4) are provided on the side of the inner base (1) facing the outer bottom plate (4).

8. A high heat dissipation photovoltaic optimizer according to claim 7, characterized in that: The outer shell cover (5) is provided with an elastic gasket (7) on the side facing the outer bottom plate (4), and the inner shell cover (2) is provided with an annular insertion groove (28) around the mounting through hole (23) on the side facing the outer shell cover (5) for inserting the elastic gasket (7).

9. A high heat dissipation photovoltaic optimizer according to claim 7, characterized in that: A plurality of position limiting blocks for pressing against the inner shell cover (2) are provided on the inner wall of the outer shell cover (5).

10. A high heat dissipation photovoltaic optimizer according to claim 7, characterized in that: A plurality of fixing hooks (15) are arranged on the side of the inner base (1) facing the outer bottom plate (4), and a fixing slot (41) for inserting the fixing hooks (15) is provided on the outer bottom plate (4).

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