Vehicle-mounted mainboard convenient for heat dissipation

Abstract

The utility model discloses a vehicle-mounted mainboard convenient to dissipate heat, and relates to the technical field of mainboard heat dissipation. The vehicle-mounted mainboard facilitating heat dissipation comprises a substrate, a plurality of cooling fins are arranged on the upper surface of the substrate, spaces are reserved among the cooling fins, the upper surface of the substrate is connected with a cooling fan through fixing rods, supporting rods are arranged at the four corners of the upper surface of the substrate, and components are arranged on the lower surface of the substrate. The radiating fins absorb heat generated by components, the radiating fan rotates to absorb the heat on the radiating fins to dissipate heat of the substrate, the radiating fan and the radiating fins are arranged on the surface of the substrate, so that the substrate, the radiating fan and the radiating fins are compact in integral structure, small in size and convenient for follow-up mounting of a vehicle-mounted mainboard, and space is reserved among the plurality of radiating fins, so that the radiating fins can be conveniently mounted on the vehicle-mounted mainboard. Air can flow among the cooling fins, heat generated by the components can be absorbed by the cooling fan, and the cooling effect is good.

Description

Technical Field

[0001] The utility model relates to the technical field of mainboard heat dissipation, in particular to a vehicle-mounted mainboard which is convenient for heat dissipation. Background Art

[0002] The vehicle motherboard is one of the indispensable components in modern cars. It can control various electronic devices in the car. The vehicle motherboard is the control unit of the system, responsible for processing the data collected by various sensors and performing corresponding calculations and control operations.

[0003] The existing vehicle mainboard can dissipate heat from the mainboard through a heat dissipation structure. For example, Chinese patent application number CN202021555221.2 discloses a heat dissipation structure of an intelligent connected vehicle mainboard, including a shell. The shell is a hollow structure, and a fan cavity and a heat dissipation cavity are provided in the shell. A plurality of heat dissipation fins are vertically spaced in the heat dissipation cavity. Two axial-flow fans are arranged side by side in the fan cavity. A plurality of air outlets are provided on the side wall where the shell and the heat dissipation fins are abutted. A heat dissipation cavity cover is rotatably connected to the side wall of the heat dissipation cavity through a rotating shaft.

[0004] This heat dissipation structure blows air to the heat dissipation fins through a fan, thereby removing heat. Since a fan cavity is provided on one side of the shell and the fan is arranged in the fan cavity, the overall volume of the heat dissipation structure is large, making it inconvenient to install the vehicle mainboard to the corresponding position. Utility Model Content

[0005] Technical issues solved

[0006] In view of the deficiencies in the prior art, the utility model provides a vehicle-mounted mainboard that is convenient for heat dissipation, thereby solving the problem that the heat dissipation structure occupies a large space.

[0007] Technical Solution

[0008] To achieve the above objectives, the utility model is implemented through the following technical solutions: a vehicle-mounted mainboard with convenient heat dissipation, including a substrate, a plurality of heat sinks are provided on the upper surface of the substrate, spaces are left between the plurality of heat sinks, a heat dissipation fan is connected to the upper surface of the substrate through a fixing rod, support rods are provided at the four corners of the upper surface of the substrate, and components are provided on the lower surface of the substrate.

[0009] Preferably, the surfaces of the four support rods are connected to a same fixing plate, and the fixing plate is in contact with the upper surface of the heat sink.

[0010] Preferably, the plurality of heat sinks are connected via connecting rods.

[0011] Preferably, the height of the upper end of the support rod is higher than the height of the upper surface of the heat dissipation fan.

[0012] Preferably, the connecting rod is made of aluminum.

[0013] Preferably, holes are formed through the four corners of the base plate, and screw holes are formed on the lower surface of the support rod.

[0014] Preferably, the heat sink located on the outside is connected to the corresponding support rod.

[0015] Beneficial Effects

[0016] The utility model provides a vehicle-mounted mainboard that is convenient for heat dissipation and has the following beneficial effects:

[0017] Through the heat sink, cooling fan and other structures, the heat sink absorbs the heat generated by the components, and the cooling fan rotates to absorb the heat on the heat sink, thereby dissipating the heat of the substrate. Since the cooling fan and the heat sink are arranged on the surface of the substrate, the overall structure of the substrate, the cooling fan and the heat sink is relatively compact and small in size, which is convenient for the subsequent installation of the vehicle mainboard. Since there is space between the multiple heat sinks, it is conducive to the flow of air between the multiple heat sinks, and the heat generated by the components is facilitated to be absorbed by the cooling fan, and the heat dissipation effect is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the connecting rod structure of the utility model;

[0020] Figure 3 This is a schematic diagram of the heat sink structure of the utility model;

[0021] Figure 4 This is a schematic diagram of the hole structure of the utility model.

[0022] In the figure: 1, base plate; 2, heat sink; 3, fixing rod; 4, cooling fan; 5, support rod; 6, fixing plate; 7, connecting rod; 8, hole. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-4The utility model provides a technical solution: a vehicle-mounted mainboard with convenient heat dissipation, including a substrate 1, a plurality of heat sinks 2 are arranged on the upper surface of the substrate 1, spaces are left between the plurality of heat sinks 2, a heat dissipation fan 4 is connected to the upper surface of the substrate 1 through a fixing rod 3, support rods 5 are arranged at the four corners of the upper surface of the substrate 1, components are arranged on the lower surface of the substrate 1, and the heat dissipation fan 4 is located at the center of the upper surface of the substrate 1.

[0025] During operation, the base plate 1 is installed at the corresponding position, the fixing rod 3 can play a supporting role, the heat generated by the components is conducted to the heat sink 2, the cooling fan 4 is started, the air circulates and passes through the heat sink 2, and the air carrying the heat is sucked away by the cooling fan 4, thereby achieving the effect of cooling.

[0026] See also Figure 1-4 The utility model provides a technical solution: the surfaces of the four support rods 5 are connected to the same fixing plate 6, the fixing plate 6 is fitted with the upper surface of the heat sink 2, an opening is penetrated through the surface of the fixing plate 6, and the heat dissipation fan 4 passes through the opening.

[0027] During operation, the setting of the fixing plate 6 can limit the circulation space of the air, so that the air can flow between the fixing plate 6 and the base plate 1 and be sucked into the heat dissipation fan 4, which is beneficial for the air to contact with the heat sink 2.

[0028] See also Figure 1-4 The utility model provides a technical solution: a plurality of heat sinks 2 are connected by connecting rods 7 .

[0029] During operation, the plurality of heat sinks 2 are formed into a whole by the arrangement of the connecting rod 7 , which facilitates the installation of the heat sink 2 .

[0030] See also Figure 1-4 The utility model provides a technical solution: the upper end height of the support rod 5 is higher than the upper surface height of the cooling fan 4.

[0031] During operation, the support rod 5 is set to be longer so that when the support rod 5 plays a supporting role, a gap can be left between the heat dissipation fan 4 and the installation position, which is beneficial to the circulation of air.

[0032] See also Figure 1-4 The utility model provides a technical solution: the connecting rod 7 is made of aluminum.

[0033] During operation, the connecting rod 7 made of aluminum has better thermal conductivity, which is beneficial for the heat sink 2 with higher heat to transfer heat to the heat sink 2 with lower heat, so that the heat distribution is more uniform and beneficial for heat dissipation.

[0034] See also Figure 1-4 The utility model provides a technical solution: holes 8 are provided through the four corners of the base plate 1, screw holes are provided on the lower surface of the support rod 5, and threads are provided on the inner wall of the hole 8.

[0035] During operation, the support rod 5 can be fixed on the base plate 1 by setting the hole 8 and the screw hole and using a bolt to pass through the hole 8 and connect with the screw hole.

[0036] See also Figure 1-4 The utility model provides a technical solution: the heat sink 2 located on the outside is connected to the corresponding support rod 5.

[0037] During operation, the heat sink 2 is connected to the support rod 5 so that the heat sink 2 and the support rod 5 form a whole. After the support rod 5 is fixed, the heat sink 2 is also fixed, so that the heat sink 2 is easy to install.

[0038] In summary, align the screw holes on the lower surface of the support rod 5 with the holes 8 and fix them with bolts to fix the heat sink 2 and the support rod 5 on the substrate 1. Install the substrate 1 at the corresponding position. The fixing rod 3 can play a supporting role. The heat generated by the components is conducted to the heat sink 2. The cooling fan 4 is started to allow air to circulate and pass through the heat sink 2. The air carrying the heat is sucked away by the cooling fan 4, thereby achieving the effect of cooling.

[0039] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0040] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A vehicle-mounted mainboard for convenient heat dissipation, comprising a substrate (1), characterized in that: The upper surface of the substrate (1) is provided with a plurality of heat sinks (2), with spaces left between the plurality of heat sinks (2); the upper surface of the substrate (1) is connected to a heat dissipation fan (4) via a fixing rod (3); support rods (5) are provided at the four corners of the upper surface of the substrate (1); and components are provided on the lower surface of the substrate (1).

2. The vehicle-mounted motherboard with convenient heat dissipation according to claim 1, characterized in that: The surfaces of the four support rods (5) are connected to a same fixing plate (6), and the fixing plate (6) is in contact with the upper surface of the heat sink (2).

3. The vehicle-mounted mainboard with convenient heat dissipation according to claim 1, characterized in that: The plurality of heat sinks (2) are connected via connecting rods (7).

4. The vehicle-mounted mainboard with convenient heat dissipation according to claim 1, characterized in that: The height of the upper end of the support rod (5) is higher than the height of the upper surface of the heat dissipation fan (4).

5. The vehicle-mounted mainboard with convenient heat dissipation according to claim 3, characterized in that: The connecting rod (7) is made of aluminum.

6. The vehicle-mounted mainboard with convenient heat dissipation according to claim 1, characterized in that: Holes (8) are provided through the four corners of the base plate (1), and screw holes are provided on the lower surface of the support rod (5).

7. The vehicle-mounted mainboard with convenient heat dissipation according to claim 1, characterized in that: The heat sink (2) located on the outside is connected to the corresponding support rod (5).

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