Semiconductor wafer cutting device

Abstract

The utility model relates to the technical field of semiconductor wafers, and discloses a semiconductor wafer cutting device which comprises a workbench and further comprises two sets of supporting plates arranged at the top of the workbench, one side of each supporting plate is fixedly connected with a fixed plate, and one side of each fixed plate is provided with a plurality of sets of movable plates. The adjusting mechanism is arranged on one side of the fixed plate and used for adjusting the angle of the cutting instrument, and the adjusting mechanism comprises a rotating head rotating at the bottom of the movable plate. The problem that the cutting depth or speed is wrong in the cutting process possibly is solved, meanwhile, multi-angle cutting can be conveniently conducted on the laser cutting machine through the adjusting mechanism, the conditions that the production efficiency is reduced and the product quality is damaged due to the poor cutting effect are avoided, and meanwhile normal operation of the whole production line can be guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafers, in particular to a semiconductor wafer cutting device. Background Art

[0002] A semiconductor wafer is a material that can conduct electricity under certain conditions. It is usually made of pure silicon or other semiconductor materials. In the electronics field, semiconductor wafers are often used to manufacture computer chips, sensors, and other types of electronic devices. A cutting device is a tool used to cut semiconductor materials such as silicon into thin slices, which can be used to make integrated circuits and other semiconductor products.

[0003] In order to obtain chips of different sizes and shapes according to different needs to make integrated circuits and other semiconductor products, a semiconductor wafer cutting device is needed. However, the traditional semiconductor wafer cutting device has a relatively simple design structure and a relatively simple working principle, which causes the cutting equipment to be unable to move at multiple angles and is not convenient for positioning the semiconductor wafer, resulting in poor cutting results, which may lead to reduced production efficiency and damaged product quality, and may even affect the normal operation of the entire production line. The cutting head angle cannot be adjusted, which may increase the risk of worker injury, and it will not be able to accurately cut with the correct size and position, which will result in poor cutting quality and may waste raw materials, which need to be processed in a highly precise environment. If the cutting device cannot correctly position the material, it may produce the wrong cutting depth or speed during the cutting process, resulting in damage or inconsistency of the semiconductor wafer. Utility Model Content

[0004] The purpose of the utility model is to provide a semiconductor wafer cutting device to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a semiconductor wafer cutting device, comprising a workbench, and further comprising:

[0006] Two groups of support plates are arranged on the top of the workbench, one side of the support plates is fixedly connected with a fixed plate, and one side of the fixed plate is provided with multiple groups of movable plates;

[0007] An adjustment mechanism is provided on one side of the fixed plate for adjusting the angle of the cutting instrument, the adjustment mechanism comprises a rotating head rotating at the bottom of the movable plate, a connecting rod is fixedly connected to the outer side of the rotating head, a sleeve rod is rotatably connected to one end of the connecting rod, and a sliding rod is slidably connected to the inner wall of the sleeve rod;

[0008] A positioning mechanism is arranged above a workbench to facilitate positioning of a semiconductor wafer, the positioning mechanism includes a horizontal plate arranged above the workbench, one side of the horizontal plate is slidably connected to a slider, the top of the slider is fixedly connected to a positioning block for positioning the semiconductor wafer, and the inner wall of the slider is slidably connected to a mounting rod.

[0009] Preferably, a driving mechanism for conveniently moving the horizontal plate is provided above the workbench.

[0010] Preferably, a notch is provided on one side of the fixing plate, and a fixing disk is fixedly connected to the inner wall of the notch.

[0011] Preferably, a fixing column is fixedly connected to one side of the fixing plate, and the outer side of the fixing column is slidably connected to the inner wall of the movable plate.

[0012] Preferably, a laser cutting machine for conveniently cutting semiconductor wafers is provided at one end of the sliding rod.

[0013] Preferably, a drawer box is slidably connected to the inner wall of the workbench, and a partition for classifying crystals is clamped on the inner wall of the drawer box.

[0014] Preferably, a mounting plate is clamped on the outer side of the partition, a mounting block is clamped on one side of the partition, and one side of the mounting block is fixedly connected to the inner wall of the drawer box.

[0015] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0016] The utility model can facilitate the positioning of semiconductor wafers when cutting by setting a positioning mechanism, avoiding the problem of incorrect positioning of materials, which may cause wrong cutting depth or speed during the cutting process. At the same time, by setting an adjustment mechanism, it is convenient for the laser cutting machine to perform multi-angle cutting, avoiding poor cutting effect, resulting in reduced production efficiency and damaged product quality, and at the same time ensuring the normal operation of the entire production line. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of the structure of a semiconductor wafer cutting device provided by the utility model;

[0018] Figure 2 A schematic diagram of the structure of the adjustment mechanism provided by the utility model;

[0019] Figure 3 A schematic diagram of the positioning mechanism structure provided by the utility model;

[0020] Figure 4 This is a schematic diagram of the drawer box and partition structure provided by the utility model.

[0021] In the figure: 1. workbench; 2. support plate; 3. fixed plate; 4. movable plate; 5. adjustment mechanism; 51. rotating head; 52. connecting rod; 53. sleeve rod; 54. sliding rod; 6. positioning mechanism; 61. cross plate; 62. sliding block; 63. positioning block; 64. mounting rod; 7. driving mechanism; 8. notch; 9. fixed plate; 10. fixed column; 11. laser cutting machine; 12. drawer box; 13. partition; 14. mounting plate; 15. mounting block. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-4 As shown, a semiconductor wafer cutting device comprises a workbench 1. By setting the workbench 1, it is convenient to fix a support plate 2. Two groups of support plates 2 are arranged on the top of the workbench 1. By setting the support plates 2, it is convenient to fix a fixed plate 3. One side of the support plate 2 is fixedly connected with a fixed plate 3. By setting the fixed plate 3, it is convenient to fix a fixed disk 9. One side of the fixed plate 3 is provided with multiple groups of movable plates 4. By setting the movable plate 4, it is convenient to rotate a rotary head 51. An adjusting mechanism 5 for adjusting the angle of a cutting instrument is arranged on one side of the fixed plate 3. The adjusting mechanism 5 comprises a rotary head 51 rotated at the bottom of the movable plate 4. By setting the rotary head 51, it is convenient to connect a connecting rod 52. A connecting rod 52 is fixedly connected to the outer side of the rotary head 51. By setting the connecting rod 52, it is convenient to rotate a sleeve rod 53. The connecting rod 52 A sleeve rod 53 is rotatably connected to one end. By setting the sleeve rod 53, the slide rod 54 can be easily slid. The inner wall of the sleeve rod 53 is slidably connected to the slide rod 54. By setting the slide rod 54, the laser cutting machine 11 can be easily moved. A positioning mechanism 6 is arranged above the workbench 1 for facilitating the positioning of the semiconductor wafer. The positioning mechanism 6 includes a horizontal plate 61 arranged above the workbench 1. By setting the horizontal plate 61, the slider 62 can be easily pushed. A slider 62 is slidably connected to one side of the horizontal plate 61. By setting the slider 62, the positioning block 63 can be easily fixed. The top of the slider 62 is fixedly connected to a positioning block 63 for positioning the semiconductor wafer. By setting the positioning block 63, the semiconductor wafer can be easily positioned. The inner wall of the slider 62 is slidably connected to the mounting rod 64. By setting the mounting rod 64, the slider 62 can be easily slid.

[0024] refer to Figure 1 , Figure 2and Figure 3 As shown, a driving mechanism 7 for moving the horizontal plate 61 is arranged above the workbench 1. By setting the driving mechanism 7, the horizontal plate 61 can be moved conveniently. It is explained here that the driving mechanism 7 is composed of a motor, positive and negative threaded rods and a connecting block, which is the prior art and will not be described in detail here; a notch 8 is opened on one side of the fixed plate 3, and by setting the notch 8, the fixed disk 9 can be fixed conveniently, and the inner wall of the notch 8 is fixedly connected with the fixed disk 9, and by setting the fixed disk 9, the fixed column 10 can be fixed conveniently; a fixed column 10 is fixedly connected to one side of the fixed disk 9, and by setting the fixed column 10, the movable plate 4 can be slid conveniently, and the outer side of the fixed column 10 is slidably connected to the inner wall of the movable plate 4; a laser cutting machine 11 for cutting semiconductor wafers is arranged at one end of the slide rod 54, and by setting the laser cutting machine 11, the semiconductor wafers can be cut conveniently.

[0025] refer to Figure 4 As shown, the inner wall of the workbench 1 is slidably connected with a drawer box 12, and by setting the drawer box 12, the partition 13 can be conveniently fixed, and the inner wall of the drawer box 12 is clamped with a partition 13 for classifying crystals, and by setting the partition 13, the crystals can be conveniently separated; the outer side of the partition 13 is clamped with a mounting plate 14, and by setting the mounting plate 14, the crystals can be conveniently separated, and one side of the partition 13 is clamped with a mounting block 15, and by setting the mounting block 15, the mounting plate 14 can be conveniently fixed, and one side of the mounting block 15 is fixedly connected to the inner wall of the drawer box 12.

[0026] Working principle: When in use, first place the semiconductor wafer on the workbench 1, then the driving mechanism 7 runs to drive the horizontal plate 61 to move, the movement of the horizontal plate 61 pushes the slider 62, the movement of the slider 62 drives the positioning block 63 to move, thereby positioning the semiconductor wafer, and then the laser cutting machine 11 performs cutting, and at the same time, the rotating head 51 can rotate at the bottom of the movable plate 4, the sliding rod 54 slides in the sleeve rod 53, and the sleeve rod 53 is rotatably connected with the connecting rod 52, thereby performing multi-angle cutting on the laser cutting machine 11.

[0027] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer cutting device, comprising a workbench (1), characterized in that: Also includes: Two groups of support plates (2) are arranged on the top of the workbench (1), one side of the support plate (2) is fixedly connected to a fixed plate (3), and one side of the fixed plate (3) is provided with multiple groups of movable plates (4); An adjustment mechanism (5) is arranged on one side of the fixed plate (3) and is used for adjusting the angle of the cutting instrument. The adjustment mechanism (5) comprises a rotating head (51) which rotates at the bottom of the movable plate (4). A connecting rod (52) is fixedly connected to the outer side of the rotating head (51). A sleeve rod (53) is rotatably connected to one end of the connecting rod (52). A sliding rod (54) is slidably connected to the inner wall of the sleeve rod (53). A positioning mechanism (6) is arranged above a workbench (1) for facilitating the positioning of a semiconductor wafer, the positioning mechanism (6) comprising a horizontal plate (61) arranged above the workbench (1), a slider (62) being slidably connected to one side of the horizontal plate (61), a positioning block (63) for positioning the semiconductor wafer being fixedly connected to the top of the slider (62), and a mounting rod (64) being slidably connected to the inner wall of the slider (62).

2. A semiconductor wafer cutting device according to claim 1, characterized in that: A driving mechanism (7) for conveniently moving the horizontal plate (61) is arranged above the workbench (1).

3. A semiconductor wafer cutting device according to claim 1, characterized in that: A notch (8) is provided on one side of the fixing plate (3), and a fixing plate (9) is fixedly connected to the inner wall of the notch (8).

4. A semiconductor wafer cutting device according to claim 3, characterized in that: A fixed column (10) is fixedly connected to one side of the fixed plate (9), and the outer side of the fixed column (10) is slidably connected to the inner wall of the movable plate (4).

5. A semiconductor wafer cutting device according to claim 1, characterized in that: One end of the sliding rod (54) is provided with a laser cutting machine (11) for conveniently cutting semiconductor wafers.

6. A semiconductor wafer cutting device according to claim 1, characterized in that: The inner wall of the workbench (1) is slidably connected to a drawer box (12), and the inner wall of the drawer box (12) is clamped with a partition (13) for classifying crystals.

7. A semiconductor wafer cutting device according to claim 6, characterized in that: The outer side of the partition (13) is clamped with a mounting plate (14), one side of the partition (13) is clamped with a mounting block (15), and one side of the mounting block (15) is fixedly connected to the inner wall of the drawer box (12).

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