Coating equipment

Abstract

The utility model discloses coating equipment, which relates to the technical field of solar cell manufacturing, is used for drying a support plate in the process of continuously conveying the support plate, and solves the technical problems of slow coating production rhythm and influence on product productivity in the prior art, so as to improve the coating efficiency of semiconductor chips and improve the productivity of the semiconductor chips. The coating equipment comprises a coating chamber, a first transmission mechanism and a drying mechanism, the coating chamber is provided with an inlet end and an outlet end, and the coating chamber is used for coating a semiconductor wafer borne by a carrier plate. The first conveying mechanism is arranged outside the film coating cavity and used for conveying the unloaded carrier plate from the outlet end to the inlet end. And the drying mechanism is arranged outside the coating chamber, is positioned on a transmission path of the first transmission mechanism, and is used for drying the carrier plate in the process of transmitting the carrier plate by the first transmission mechanism.

Description

Technical Field

[0001] The utility model relates to the technical field of solar cell manufacturing, in particular to a coating device. Background Art

[0002] In some solar cell manufacturing processes, transparent conductive oxide (TCO) thin films need to be prepared. Currently, a carrier is usually used to carry a silicon wafer into a coating chamber to coat the TCO thin film on the surface of the silicon wafer.

[0003] After the carrier is used multiple times, a TCO film will be deposited on the carrier. The TCO film is prone to absorb moisture. If the absorbed moisture is not removed, the subsequent coating quality will be affected.

[0004] In order to remove the moisture adsorbed by the carrier, in the prior art, before the carrier is transported into the coating chamber through the transmission mechanism, the carrier needs to be stopped and vacuum-sucked or placed in an oven for drying before entering the coating chamber. The above methods slow down the production rhythm of coating and affect the product capacity. Utility Model Content

[0005] The purpose of the utility model is to provide a coating equipment, which is used for directly drying the carrier during the process of uninterrupted transmission of the carrier to the coating chamber. The carrier drying process is carried out during the carrier transmission process, and there is no need to set a separate drying time after the transmission is completed. The technical problems of slow coating production rhythm and affecting product production capacity in the prior art are solved, so as to improve the coating efficiency of semiconductor wafers and increase the semiconductor wafer production capacity.

[0006] In order to achieve the above-mentioned purpose, the utility model provides a coating device, including a coating chamber, a first transmission mechanism and a drying mechanism, wherein the coating chamber has an inlet end and an outlet end, and the coating chamber is used to coat a semiconductor wafer carried by a carrier. The first transmission mechanism is arranged outside the coating chamber, and the first transmission mechanism is used to transmit an empty carrier from the outlet end to the inlet end. The drying mechanism is arranged outside the coating chamber and is located on the transmission path of the first transmission mechanism, and the drying mechanism is used to dry the carrier during the process of the first transmission mechanism transmitting the carrier.

[0007] When the above technical solution is adopted, the drying mechanism is arranged outside the coating chamber, and the carrier is dried while the first conveying mechanism continuously conveys the empty carrier from the outlet end to the inlet end. The carrier is dried during the uninterrupted conveying process, which can not only remove the moisture adsorbed on the carrier due to the deposited TCO film, but also will not affect the continuous use of the carrier. Compared with the prior art in which the carrier is first conveyed from the outlet end to the inlet end of the coating chamber by a conveying mechanism, and then a separate residence time is set before the carrier enters the coating chamber to dry the carrier, the present application directly dries the carrier during the uninterrupted conveying of the carrier to the coating chamber, and integrates the carrier drying process into the carrier conveying process. There is no need to set a separate drying time after the conveying is completed, thereby omitting the extra carrier drying time, thereby speeding up the entire carrier drying and the coating rhythm of the semiconductor wafer, and improving the production capacity of the semiconductor wafer.

[0008] In a possible implementation, the drying mechanism includes a fan, which is disposed above the first transmission mechanism and is used to blow air to dry the carrier plate.

[0009] When the above technical solution is adopted, the fan can generate airflow to accelerate the air flow when in use, and take away the moisture on the carrier plate, thereby drying the carrier plate.

[0010] In a possible implementation, the drying mechanism further includes a resistance wire heating tube, which is arranged between the first transmission mechanism and the fan.

[0011] When the above technical solution is adopted, the setting of the resistance wire heating tube increases the temperature of the air. When the fan blows, the generated airflow conducts the heat generated by the resistance wire heating tube to the carrier, so that the carrier and the hot air exchange heat, so that the water vapor adsorbed on the carrier evaporates, thereby improving the drying efficiency of the carrier.

[0012] In a possible implementation, the coating device further includes a controller, which is electrically connected to the resistance wire heating tube and is used to adjust the working temperature of the resistance wire heating tube. The controller is also electrically connected to the fan and is used to adjust the power of the fan.

[0013] When the above technical solution is adopted, it can be adjusted according to the amount of moisture adsorbed on the carrier, thereby saving energy and ensuring that the carrier is fully dried.

[0014] In a possible implementation, the drying mechanism further includes an isolation plate disposed between the resistance wire heating tube and the first transmission mechanism, and a plurality of hot air outlets facing the first transmission mechanism are formed on the isolation plate.

[0015] When the above technical solution is adopted, hot air is transmitted from the hot air outlet to the carrier, ensuring the uniformity of hot air radiation on the carrier and improving the uniformity of the carrier drying.

[0016] In a possible implementation, there are multiple fans, and the multiple fans are arranged in sequence along the transmission direction of the first transmission mechanism.

[0017] When the above technical solution is adopted, the carrier board is always in a hot air environment during the transmission process, ensuring that the carrier board is fully dried.

[0018] In a possible implementation, there are multiple resistance wire heating tubes, and the multiple resistance wire heating tubes are arranged in sequence along the transmission direction of the first transmission mechanism.

[0019] When adopting the above technical solution, ensure that the carrier plate is fully dried.

[0020] In a possible implementation, the first transmission mechanism includes a plurality of transmission rollers, the plurality of transmission rollers are arranged in sequence along a transmission direction of the first transmission mechanism, and axes of the plurality of transmission rollers are parallel to each other.

[0021] When the above technical solution is adopted, there is a gap between the conveying rollers, and air can flow between the gaps to ensure the fluidity of the air, so as to dry the side of the carrier that contacts the first transmission mechanism. At the same time, the contact area between the conveying roller and the carrier is small, so as to ensure that the carrier is fully in contact with the air and fully dry the carrier.

[0022] In a possible implementation, in the direction from the inlet end to the outlet end, the coating chamber includes a loading chamber, a first buffer chamber, a second buffer chamber, a first coating chamber, a second coating chamber, a third coating chamber, a third buffer chamber, a fourth buffer chamber and a discharge chamber arranged in sequence. The coating equipment also includes a second transmission mechanism, which is used to receive the carrier plate transmitted by the first transmission mechanism in the loading chamber, and carry the carrier plate through the first buffer chamber, the second buffer chamber, the first coating chamber, the second coating chamber, the third coating chamber, the third buffer chamber and the fourth buffer chamber in sequence, and transmit the carrier plate to the first transmission mechanism in the discharge chamber.

[0023] In a possible implementation, the coating device further includes an ascending mechanism and a descending mechanism, wherein the ascending mechanism is arranged at the inlet end, and is used to receive the carrier plate transmitted by the first transmission mechanism, and drive the carrier plate to ascend, so as to transmit the carrier plate to the second transmission mechanism. The descending mechanism is arranged at the outlet end, and is used to receive the carrier plate transmitted by the second transmission mechanism, and drive the carrier plate to descend, so as to transmit the carrier plate to the first transmission mechanism. The drying mechanism is arranged between the first transmission mechanism and the coating chamber.

[0024] When the above technical solution is adopted, the structural compactness of the coating equipment is improved, and the occupied ground area and space can be saved. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0026] Figure 1 A schematic diagram of a coating device provided by an embodiment of the utility model;

[0027] Figure 2 A schematic diagram of a carrier board provided in an embodiment of the utility model.

[0028] Reference numerals:

[0029] 1- coating chamber, 11- loading chamber, 12- first buffer chamber, 13- second buffer chamber,

[0030] 14-first coating chamber, 15-second coating chamber, 16-third coating chamber, 17-third buffer chamber,

[0031] 18-the fourth buffer chamber, 19-the unloading chamber, 2-the first transmission mechanism, 21-the conveying roller, 3-the drying mechanism, 31-the fan, 32-the resistance wire heating tube, 4-the isolation plate, 41-the hot air outlet, 5-the carrier plate. DETAILED DESCRIPTION

[0032] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0033] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0034] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined. The meaning of "several" is one or more, unless otherwise clearly and specifically defined.

[0035] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0036] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0037] With the development of the photovoltaic market, people's demand for high-efficiency crystalline silicon cells is becoming more and more urgent. As a crystalline silicon cell, the preparation of transparent conductive oxide (TCO) film is crucial in the preparation process of heterojunction (HJT) cells. Usually, there are two main methods for TCO film deposition: magnetron sputtering (Physical Vapor Deposition, PVD) and reactive plasma deposition (Reactive Plasma Deposition, RPD). PAR (PVD And RPD) equipment combines the advantages of the two coating methods to bring efficiency gains to high-efficiency heterojunction cells.

[0038] The deposition of TCO thin films requires both excellent electrical properties and good optical properties. TCO thin films usually use indium trioxide thin films. The preparation of indium trioxide thin films generally uses indium trioxide targets. The sputtering gases include oxygen, argon, hydrogen and water vapor. The proportion of water vapor is crucial in the film deposition process and usually affects the electrical and optical properties of indium trioxide films.

[0039] During the production process, since the carrier of the PAR equipment is easily deposited with a thicker TCO film after being recycled many times, the TCO film easily absorbs water vapor, making the water vapor content in the coating process unstable, and causing problems with the optical and electrical properties of the deposited indium trioxide film.

[0040] In the prior art, before the carrier is transported into the coating chamber via a transport mechanism, the carrier needs to be stopped for vacuum suction or placed in an oven for drying before entering the coating chamber to remove moisture adsorbed by the carrier, thereby reducing the coating efficiency of the battery cell.

[0041] In order to solve the technical problems existing in the above-mentioned prior art, see Figure 1 As shown, the embodiment of the utility model provides a coating device, including a coating chamber 1, a first conveying mechanism 2 and a drying mechanism 3. The coating chamber 1 has an inlet end and an outlet end. The coating chamber 1 is used to coat the semiconductor wafer carried by the carrier 5. The first conveying mechanism 2 is arranged outside the coating chamber 1, and the first conveying mechanism 2 is used to convey the empty carrier 5 from the outlet end to the inlet end. The drying mechanism 3 is arranged outside the coating chamber 1 and is located on the conveying path of the first conveying mechanism 2. The drying mechanism 3 is used to dry the carrier 5 during the process of the first conveying mechanism 2 conveying the carrier 5.

[0042] When the above technical solution is adopted, the drying mechanism 3 is arranged outside the coating chamber 1. The drying mechanism 3 dries the carrier 5 while the first conveying mechanism 2 continuously conveys the empty carrier 5 from the outlet end to the inlet end. The carrier 5 is dried during the uninterrupted conveying process, which can not only remove the moisture adsorbed on the carrier 5 due to the deposited TCO film, but also will not affect the continuous use of the carrier 5. Compared with the prior art in which the carrier is first conveyed from the outlet end to the inlet end of the coating chamber by a conveying mechanism, and then a separate residence time is set before the carrier 5 enters the coating chamber 1 to dry the carrier 5, the present application directly dries the carrier 5 during the uninterrupted conveying of the carrier 5 to the coating chamber 1, and integrates the drying process of the carrier 5 into the conveying process of the carrier 5. There is no need to set a separate drying time after the conveying is completed, thereby omitting the extra drying time of the carrier 5, thereby speeding up the entire carrier drying and the coating rhythm of the semiconductor wafer, and improving the production capacity of the semiconductor wafer. At the same time, since the moisture adsorbed on the carrier 5 is dried and removed before the carrier 5 enters the coating chamber 1, the moisture on the carrier 5 is prevented from affecting the preparation of the TCO film, thereby ensuring the preparation of high-quality TCO film and stabilizing the efficiency of the high-efficiency heterojunction batteries in the production line.

[0043] In a specific implementation, the semiconductor wafer may be a silicon wafer, which is carried by a carrier plate 5 and is coated with a TCO film in the coating chamber 1. The first transmission mechanism 2 may be a belt transmission, a chain transmission, etc., which is not specifically limited here. Figure 2 As shown, the carrier plate 5 is a hollow plate having a plurality of rectangular hollow holes arranged in an array. When the drying mechanism 3 dries the carrier plate 5 , the upper and lower surfaces of the carrier plate 5 can be dried to remove moisture on the carrier plate 5 as much as possible.

[0044] In one possible implementation, see Figure 1 As shown, the drying mechanism 3 includes a fan 31, which is arranged above the first conveying mechanism 2 and is used to blow air to dry the carrier 5. When in use, the fan 31 can generate airflow to accelerate air flow, take away moisture on the carrier 5, and thus dry the carrier 5.

[0045] Further, see Figure 1 As shown, the drying mechanism 3 further includes a resistance wire heating tube 32, which is arranged between the first transmission mechanism 2 and the fan 31. In this way, the setting of the resistance wire heating tube 32 increases the temperature of the air. When the fan 31 blows, the generated airflow guides the heat generated by the resistance wire heating tube 32 to the carrier plate 5, so that the carrier plate 5 and the hot air exchange heat, so that the water vapor adsorbed on the carrier plate 5 evaporates, thereby improving the drying efficiency of the carrier plate 5.

[0046] In some embodiments, the coating device further includes a controller, which is electrically connected to the resistance wire heating tube 32 and is used to adjust the working temperature of the resistance wire heating tube 32. The controller is also electrically connected to the fan 31 and is used to adjust the power of the fan 31.

[0047] When the above technical solution is adopted, it can be adjusted according to the amount of water vapor adsorbed on the carrier 5, and while saving energy, it is ensured that the carrier 5 is fully dried, so as to perform differentiated water vapor control on the carrier 5 with different times of use, so that the efficiency of the heterojunction battery of the production line can be stabilized. In actual situations, the more times the carrier 5 is recycled, the thicker the thickness of the TCO film deposited on the carrier 5, and accordingly, the more water vapor adsorbed by the carrier 5. When the carrier 5 is used less times, the thickness of the TCO film deposited on the carrier 5 is thinner, and the carrier 5 adsorbs less water vapor. The controller can be used to control the operating temperature of the resistance wire heating tube 32 to be in a relatively low state, or the controller can control the speed of the impeller of the fan 31 to be relatively low, so as to save energy. When the carrier 5 is used more times, the thickness of the TCO film deposited on the carrier 5 is thicker, and the carrier 5 adsorbs more water vapor. The controller can be used to control the operating temperature of the resistance wire heating tube 32 to be in a relatively high state, or the controller can be controlled to increase the speed of the impeller of the fan 31 to ensure that the carrier 5 is fully dried.

[0048] In an alternative approach, Figure 1 As shown, the drying mechanism 3 also includes an isolation plate 4, which is arranged between the resistance wire heating tube 32 and the first transmission mechanism 2, and a plurality of hot air outlets 41 facing the first transmission mechanism 2 are opened on the isolation plate 4. In this way, the hot air is transmitted from the hot air outlet 41 to the carrier 5, ensuring the uniformity of the hot air radiation on the carrier 5 and improving the uniformity of the drying of the carrier 5. In actual situations, the plurality of hot air outlets 41 can be divided into a plurality of hot air outlet groups, and the plurality of hot air outlets 41 included in each hot air outlet group are arranged in sequence in a direction perpendicular to the transmission direction of the first transmission mechanism 2, and the plurality of hot air outlet groups can be arranged in sequence along the transmission direction of the first transmission mechanism 2 to improve the uniformity of drying.

[0049] In a specific implementation, there are multiple fans 31, which are sequentially arranged along the transmission direction of the first transmission mechanism 2, and there are multiple resistance wire heating tubes 32, which are sequentially arranged along the transmission direction of the first transmission mechanism 2, so that the carrier 5 is always in a hot air environment during the transmission process, ensuring that the carrier 5 is fully dried. The number of fans 31 and the number of resistance wire heating tubes 32 can be two, three, four or more, and the fans 31 and the resistance wire heating tubes 32 can correspond one to one, which is not specifically limited here.

[0050] In one possible implementation, see Figure 1 The first transmission mechanism 2 includes a plurality of transmission rollers 21, which are arranged in sequence along the transmission direction of the first transmission mechanism 2, and the axes of the plurality of transmission rollers 21 are parallel to each other. In this case, there are gaps between the transmission rollers 21, and air can flow between the gaps to ensure the fluidity of the air, so as to dry the side of the carrier 5 that contacts the first transmission mechanism 2. At the same time, the contact area between the transmission rollers 21 and the carrier 5 is small, so as to ensure that the carrier 5 is fully in contact with the air and the carrier 5 is fully dried.

[0051] In some embodiments, the direction from the inlet end to the outlet end, such as Figure 1 As shown, the coating chamber 1 includes a loading chamber 11, a first buffer chamber 12, a second buffer chamber 13, a first coating chamber 14, a second coating chamber 15, a third coating chamber 16, a third buffer chamber 17, a fourth buffer chamber 18 and a discharge chamber 19 which are arranged in sequence. The coating device also includes a second conveying mechanism, which is used to receive the carrier 5 conveyed by the first conveying mechanism 2 in the loading chamber 11, and carry the carrier 5 to pass through the first buffer chamber 12, the second buffer chamber 13, the first coating chamber 14, the second coating chamber 15, the third coating chamber 16, the third buffer chamber 17 and the fourth buffer chamber 18 in sequence, and convey the carrier 5 to the first conveying mechanism 2 in the discharge chamber 19.

[0052] In a specific implementation, the second conveying mechanism can have the same structure as the first conveying mechanism 2. In the loading chamber 11, the second conveying mechanism is docked with the first conveying mechanism 2. The first conveying mechanism 2 transfers the empty carrier 5 to the second conveying mechanism. At the same time, the semiconductor wafer can be placed on the carrier 5. Driven by the second conveying mechanism, the carrier 5 carrying the semiconductor wafer passes through the first buffer chamber 12, the second buffer chamber 13, the first coating chamber 14, the second coating chamber 15, the third coating chamber 16, the third buffer chamber 17, and the fourth buffer chamber 18 in sequence. The first buffer chamber 12 and the second buffer chamber 13 are vacuum chambers, so that the semiconductor wafer can be placed on the carrier 5. The vacuum degree of the environment in which the conductor sheet is located reaches the vacuum degree required by the first coating chamber 14, the semiconductor sheet is coated by magnetron sputtering (PVD) in the first coating chamber 14 and the second coating chamber 15, and the semiconductor sheet is coated by plasma deposition (RPD) in the third coating chamber 16. After the semiconductor sheet passes through the third buffer chamber 17 and the fourth buffer chamber 18, the environment in which the semiconductor is located reaches the atmospheric standard. Thereafter, the semiconductor sheet can be removed from the carrier 5 in the unloading chamber 19, and the second conveying mechanism conveys the carrier 5 to the first conveying mechanism 2, and the first conveying mechanism 2 conveys the empty carrier 5 from the outlet end to the inlet end.

[0053] In actual situations, the coating equipment provided by the embodiment of the utility model also includes a rising mechanism and a descending mechanism. The rising mechanism is arranged at the inlet end, and the rising mechanism is used to receive the carrier 5 transmitted by the first transmission mechanism 2, and drive the carrier 5 to rise, so as to transmit the carrier 5 to the second transmission mechanism. The descending mechanism is arranged at the outlet end, and the descending mechanism is used to receive the carrier 5 transmitted by the second transmission mechanism, and drive the carrier 5 to descend, so as to transmit the carrier 5 to the first transmission mechanism 2. The drying mechanism 3 is arranged between the first transmission mechanism 2 and the coating chamber 1. In this way, the first transmission mechanism 2 can be installed on the ground, and the coating chamber 1 is at a high place, which improves the compactness of the structure of the coating equipment, can save the occupied ground area, and save space. The rising mechanism and the descending mechanism can be a robotic arm or a linear module. Of course, this is just an example and is not a specific limitation. The actual situation shall prevail.

[0054] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0055] The above are only specific implementations of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A coating device, characterized in that: include: A coating chamber, having an inlet end and an outlet end, wherein the coating chamber is used to coat a semiconductor wafer carried by a carrier; A first transmission mechanism, disposed outside the coating chamber, and used for transmitting the empty carrier from the outlet to the inlet; The drying mechanism is arranged outside the coating chamber and located on the transmission path of the first transmission mechanism. The drying mechanism is used to dry the carrier during the process of the carrier being transmitted by the first transmission mechanism.

2. The coating device according to claim 1, characterized in that: The drying mechanism comprises a fan, which is arranged above the first transmission mechanism and is used for blowing air to dry the carrier plate.

3. The coating device according to claim 2, characterized in that: The drying mechanism also includes a resistance wire heating tube, which is arranged between the first transmission mechanism and the fan.

4. The coating device according to claim 3, characterized in that: The coating equipment also includes a controller, which is electrically connected to the resistance wire heating tube and is used to adjust the working temperature of the resistance wire heating tube; the controller is also electrically connected to the fan and is used to adjust the power of the fan.

5. The coating device according to claim 3, characterized in that: The drying mechanism further comprises an isolation plate, which is arranged between the resistance wire heating tube and the first transmission mechanism, and the isolation plate is provided with a plurality of hot air outlets facing the first transmission mechanism.

6. The coating device according to claim 2, characterized in that: There are multiple fans, and the multiple fans are arranged in sequence along the transmission direction of the first transmission mechanism.

7. The coating device according to claim 3, characterized in that: There are multiple resistance wire heating tubes, and the multiple resistance wire heating tubes are arranged in sequence along the transmission direction of the first transmission mechanism.

8. The coating device according to claim 1, characterized in that: The first transmission mechanism includes a plurality of transmission rollers, the plurality of transmission rollers are arranged in sequence along a transmission direction of the first transmission mechanism, and the axes of the plurality of transmission rollers are parallel to each other.

9. The coating device according to claim 1, characterized in that: In the direction from the inlet end to the outlet end, the coating chamber includes a loading chamber, a first buffer chamber, a second buffer chamber, a first coating chamber, a second coating chamber, a third coating chamber, a third buffer chamber, a fourth buffer chamber and a unloading chamber which are arranged in sequence; the coating equipment also includes a second conveying mechanism, which is used to receive the carrier transmitted by the first conveying mechanism in the loading chamber, and carry the carrier through the first buffer chamber, the second buffer chamber, the first coating chamber, the second coating chamber, the third coating chamber, the third buffer chamber and the fourth buffer chamber in sequence, and transmit the carrier to the first conveying mechanism in the unloading chamber.

10. The coating device according to claim 9, characterized in that: The coating equipment also includes: A lifting mechanism, disposed at the inlet end, for receiving the carrier plate transmitted by the first transmission mechanism and driving the carrier plate to rise, so as to transmit the carrier plate to the second transmission mechanism; A descending mechanism is arranged at the outlet end, and is used to receive the carrier plate transmitted by the second transmission mechanism, and drive the carrier plate to descend, and transmit the carrier plate to the first transmission mechanism; the drying mechanism is arranged between the first transmission mechanism and the coating chamber.

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