Colorful LED (light-emitting diode) bracket

Abstract

The utility model discloses a multicolor LED support comprising a support main body, the support main body comprises a plurality of unit bodies, lamp cups are arranged in the unit bodies, the bottom of each lamp cup is provided with a copper-clad area A, a copper-clad area B and a copper-clad area C, and the bottom of each unit body is provided with a first bonding pad, a second bonding pad, a third bonding pad and a fourth bonding pad. And the first bonding pad, the second bonding pad and the third bonding pad are correspondingly communicated with the copper-clad region A, the copper-clad region B and the copper-clad region C through copper deposition via holes. Compared with a common surface-mounted LED support, the surface-mounted LED support has the advantages that the red wafer, the green wafer, the blue wafer and the control wafer are integrated together, extremely-small-size packaging can be achieved, the influence of thermal expansion of LED colloid is greatly reduced, the waterproof performance, the moisture-proof performance and the temperature impact resistance performance of an LED are improved, and the service life of the LED support is prolonged. And the method can be applied to different contexts.

Description

Technical Field

[0001] The utility model belongs to the technical field of LED brackets, and in particular relates to a colorful LED bracket. Background Art

[0002] With the increasing popularity of LED displays and the continuous advancement of technology, LED crystal film displays and holographic displays are favored by the majority of users for their unique playback performance. As the market promotion becomes more and more in-depth, the pixel density requirements for displays are also getting higher and higher. Currently, this type of display mainly uses top-emitting SMD LEDs as light-emitting elements. Due to the limitations of the bracket structure, products with a size of less than 2.0 mm cannot be packaged, and the thermal expansion coefficients of the plastic shell and the epoxy resin packaging glue are different, which easily leads to failure due to moisture in the lamp body. Utility Model Content

[0003] In view of the problems raised by the above background technology, the purpose of the present utility model is to provide a colorful LED bracket.

[0004] In order to achieve the above technical purpose, the technical solution adopted by the utility model is as follows:

[0005] A colorful LED bracket includes a bracket body, the bracket body includes a plurality of unit bodies, a lamp cup is arranged in the unit body, a copper-clad area A, a copper-clad area B and a copper-clad area C are arranged at the bottom of the lamp cup, a first soldering pad, a second soldering pad, a third soldering pad and a fourth soldering pad are arranged at the bottom of the unit body, and the first soldering pad, the second soldering pad and the third soldering pad are connected to the copper-clad area A, the copper-clad area B and the copper-clad area C correspondingly through copper-plated vias.

[0006] It is further defined that a plurality of the unit bodies are arranged and combined in a vertical and horizontal matrix to form a support body.

[0007] It is further defined that the unit body includes a base layer and a surface layer, and the base layer and the surface layer are formed by hot pressing and bonding using an epoxy resin film.

[0008] It is further defined that the base layer is formed by etching epoxy glass fiber copper clad plate, and the surface layer is formed by drilling epoxy glass fiber board.

[0009] It is further defined that the copper-clad area A, copper-clad area B and copper-clad area C encapsulate three red, green and blue chips and one control chip.

[0010] The beneficial effects of the utility model are as follows: compared with the common SMD LED bracket, the beneficial effects of the utility model are that the three red, green and blue chips and a control chip are integrated together, which can realize extremely small size packaging, thereby greatly reducing the influence of thermal expansion of LED colloid, improving the waterproof, moisture-proof and temperature shock resistance of LED, and can be suitable for use in different scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The present invention can be further described by the non-limiting embodiments given in the accompanying drawings;

[0012] Figure 1 This is a schematic diagram of the main structure of a colorful LED bracket according to an embodiment of the utility model;

[0013] Figure 2 This is a schematic diagram of a unit body of a colorful LED bracket according to an embodiment of the utility model from a top view;

[0014] Figure 3 This is a schematic diagram of the back structure of a unit body of a colorful LED bracket according to an embodiment of the utility model;

[0015] Figure 4 This is a schematic diagram of the cross-sectional structure of a unit body of a colorful LED bracket according to an embodiment of the utility model;

[0016] The main component symbols are described as follows:

[0017] Bracket body 1, unit body 2, lamp cup 3, copper-clad area A4, copper-clad area B5, copper-clad area C6, first soldering pad 7, second soldering pad 8, third soldering pad 9, fourth soldering pad 10, base layer 11, and surface layer 12. DETAILED DESCRIPTION

[0018] In order to enable those skilled in the art to better understand the present invention, the technical solution of the present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0019] like Figure 1-4 As shown, the utility model is a colorful LED bracket, the bracket body 1 includes a plurality of unit bodies 2, a lamp cup 3 is arranged in the unit body 2, the bottom of the lamp cup 3 is provided with a copper-clad area A4, a copper-clad area B5 and a copper-clad area C6, the bottom of the unit body 2 is provided with a first soldering pad 7, a second soldering pad 8, a third soldering pad 9 and a fourth soldering pad 10, the first soldering pad 7, the second soldering pad 8 and the third soldering pad 9 are connected with the copper-clad area A4, the copper-clad area B5 and the copper-clad area C6 correspondingly through copper-plated vias.

[0020] Preferably, a plurality of unit bodies 2 are arranged and combined in a vertical and horizontal matrix to form the bracket body 1 .

[0021] Preferably, the unit body 2 includes a base layer 11 and a surface layer 12, and the base layer 11 and the surface layer 12 are formed by hot pressing and bonding using an epoxy resin film.

[0022] Preferably, the base layer 11 is formed by etching an epoxy glass fiber copper clad plate, and the surface layer 12 is formed by drilling an epoxy glass fiber board.

[0023] Preferably, three red, green and blue chips and one control chip are packaged in the copper-clad area A4, the copper-clad area B5 and the copper-clad area C6.

[0024] In this embodiment, the bracket body 1 is composed of multiple unit bodies 2, which are arranged in a vertical and horizontal matrix. Each unit body 2 has a lamp cup 3 for placing a chip. The copper-clad area at the bottom of the lamp cup 3 is divided into three areas: copper-clad area A4, copper-clad area B5 and copper-clad area C6. The copper-clad areas of the three areas are connected to the back pads through copper-plated vias; there are four pads on the back, namely, a first pad 7, a second pad 8, a third pad 9 and a fourth pad 10, among which the first pad 7, the second pad 8HE and the third pad 9 are connected to the corresponding copper-clad area at the bottom of the lamp cup, which can encapsulate three chips of red, green and blue and a control chip. This bracket can be used to provide a top-emitting fantasy color SMD light-emitting diode package below 2.0 mm. The fantasy color light-emitting diode encapsulated by this bracket has a small size, is waterproof, moisture-proof and temperature-shock-resistant, and can be used in different scenarios.

[0025] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the relevant technical field without departing from the spirit and technical ideas disclosed in the present invention shall still be covered by the claims of the present invention.

Claims

1. A colorful LED bracket, characterized by: The invention comprises a bracket body (1), wherein the bracket body (1) comprises a plurality of unit bodies (2), wherein a lamp cup (3) is arranged in the unit body (2), wherein the bottom of the lamp cup (3) is provided with a copper-clad area A (4), a copper-clad area B (5) and a copper-clad area C (6), wherein the bottom of the unit body (2) is provided with a first soldering pad (7), a second soldering pad (8), a third soldering pad (9) and a fourth soldering pad (10), wherein the first soldering pad (7), the second soldering pad (8) and the third soldering pad (9) are connected to the copper-clad area A (4), the copper-clad area B (5) and the copper-clad area C (6) through copper-plated vias.

2. The colorful LED bracket according to claim 1, characterized in that: A plurality of the unit bodies (2) are arranged and combined in a vertical and horizontal matrix to form a support body (1).

3. The colorful LED bracket according to claim 2, characterized in that: The unit body (2) comprises a base layer (11) and a surface layer (12), and the base layer (11) and the surface layer (12) are formed by hot pressing and bonding using an epoxy resin film.

4. The colorful LED bracket according to claim 3, characterized in that: The base layer (11) is formed by etching an epoxy glass fiber copper clad plate, and the surface layer (12) is formed by drilling an epoxy glass fiber board.

5. The colorful LED bracket according to claim 4, characterized in that: The copper-clad area A (4), the copper-clad area B (5) and the copper-clad area C (6) encapsulate three chips, namely, red, green and blue, and a control chip.

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