Novel repair equipment integrating hot air, infrared and laser

Abstract

The utility model discloses novel hot air, infrared and laser integrated repair equipment which comprises a first mounting box, and a lower preheating mechanism and a lower heating mechanism are mounted in the first mounting box. The top of the first mounting box is further connected with a carrier in a sliding mode. The repair device comprises a first X-axis translation mechanism, a first Y-axis translation mechanism and a galvanometer laser heater which are connected with the first X-axis translation mechanism, a first translation frame connected with the first Y-axis translation mechanism, and a desoldering mounting mechanism mounted on the first translation frame; and an upper visual mechanism and a tin removing mechanism are further mounted on the first translation frame. According to the utility model, a series of procedures such as automatic desoldering, tin removal, mounting, welding and curing of the BGA chip can be realized, the automation degree is high, the working efficiency is high, three heating modes of hot air heating, infrared heating and laser heating are arranged, a user can freely select according to actual use requirements, and the universality is strong.

Description

Technical Field

[0001] The utility model relates to the technical field of BGA chip repair, in particular to a novel repair device integrating hot air, infrared and laser. Background Art

[0002] With the advancement of science and technology, the electronic information industry has brought more and more convenience to human life and promoted the rapid development of all walks of life in the social economy. At the same time, electronic information products are becoming more and more complex and with higher and higher added value. For example, mobile phones, chips, micro components and other products are high value-added products. Due to the value of the products themselves, improving the utilization rate of products has become a development trend, and repair and reuse is one of the main means.

[0003] For the BGA chip rework industry, the requirements for rework processes are becoming increasingly higher. The most important thing is to improve the rework yield of high value-added products. However, the existing traditional rework methods are not only cumbersome and inefficient, but also unable to guarantee the consistency of rework. There is also a risk of product damage. Specifically:

[0004] 1) The traditional method of BGA chip detinning is to manually clean the pads with an electric soldering iron and a tin-absorbing wire. However, at present, the pads of many BGAs have reached less than 0.2mm, which greatly reduces the adhesion of the metal pads on the circuit board. When using a traditional electric soldering iron to clean the solder balls, the surface of the tin-absorbing wire is very rough, and the pads will be removed with a little carelessness, which will cause the product to be damaged and scrapped. The same is true for the traditional BGA disassembly and placement process, which is difficult to meet the rework requirements of high-value products;

[0005] 2) The manual operation method cannot guarantee the completion quality of each process, the quality is unstable, the probability of scrap is high, and the rework process is cumbersome, the consistency is poor, and the rework efficiency is low;

[0006] 3) Manual detinning greatly increases the probability of product damage and increases production costs. In addition, both the detinning and welding curing processes are performed at high temperatures exceeding 200°C, which increases the risk of burns from manual operation. Utility Model Content

[0007] The purpose of the utility model is to provide a new type of rework equipment integrating hot air, infrared and laser. The equipment can realize a series of processes such as automatic desoldering, tin removal, mounting, welding and curing of BGA chips. It has a high degree of automation and high work efficiency. It is equipped with three heating modes: hot air heating, infrared heating and laser heating. Users can freely choose according to actual use needs, and it has strong versatility.

[0008] In order to achieve the above purpose, the following technical solutions are adopted:

[0009] A new type of repair equipment integrating hot air, infrared and laser, including

[0010] A first installation box, wherein a lower preheating mechanism and a lower heating mechanism are installed in the first installation box; a loading rack is also slidably connected to the top of the first installation box;

[0011] A rework device, the rework device comprising a first X-axis translation mechanism, a first Y-axis translation mechanism and a galvanometer laser heater connected to the first X-axis translation mechanism, a first translation frame connected to the first Y-axis translation mechanism, and a desoldering and mounting mechanism installed on the first translation frame; the first translation frame is also equipped with an upper visual mechanism and a detinning mechanism;

[0012] An external temperature measuring mechanism, the external temperature measuring mechanism being arranged close to one end of the first installation box;

[0013] The first installation box is also equipped with a lower visual mechanism and a feeding table; and a heat dissipation and cooling mechanism is arranged on both sides of the first installation box.

[0014] Furthermore, the external temperature measuring mechanism includes a first fixed seat arranged at one end of the first installation box, a translational drive mechanism installed in the first fixed seat, a linear slide rail installed on one side of the first fixed seat, a first sliding plate slidably arranged on the linear slide rail, and a temperature measuring probe installed on the first sliding plate.

[0015] Furthermore, the external temperature measuring mechanism also includes a first rotating plate and a second rotating plate; a first connecting column is also installed on the first sliding plate, and one end of the first rotating plate is rotatably connected to the first connecting column; one end of the second rotating plate is rotatably connected to the other end of the first rotating plate, and the top of the other end of the second rotating plate is also connected to a first fixed block; the temperature measuring probe is rotatably connected to the first fixed block.

[0016] Furthermore, the external temperature measuring mechanism also includes a second connecting column installed on the first sliding plate, a second fixed block connected to the upper part of the second connecting column, a rotating bracket rotatably connected to the second fixed block, and a monitoring camera installed on the rotating bracket.

[0017] Furthermore, the upper visual mechanism is also connected to a height measuring sensor and a positioning laser light.

[0018] Furthermore, the heat dissipation and cooling mechanism includes a cross-flow fan.

[0019] By adopting the above scheme, the beneficial effects of the utility model are:

[0020] The equipment can realize a series of processes such as automatic desoldering, tin removal, mounting, welding and curing of BGA chips. It has high automation and work efficiency. It is equipped with three heating methods: hot air heating, infrared heating and laser heating. Users can freely choose according to actual needs. It has strong versatility. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structure of the utility model;

[0022] Figure 2 for Figure 1 A partial enlarged view of

[0023] Figure 3 It is a structural schematic diagram of the external temperature measuring mechanism of the utility model;

[0024] Figure 4 It is a structural schematic diagram of the repair device of the utility model;

[0025] The accompanying drawings illustrate:

[0026] 1. First installation box; 2. Lower preheating mechanism; 3. Lower heating mechanism; 4. Loading rack; 5. Rework device; 6. External temperature measuring mechanism; 7. Lower visual mechanism; 8. Feeding table; 9. Heat dissipation and cooling mechanism; 10. Height measuring sensor; 51. First X-axis translation mechanism; 52. First Y-axis translation mechanism; 53. Desoldering and mounting mechanism; 54. Upper visual mechanism; 55. Tin removal mechanism; 56. Galvanometer laser heater; 61. First fixed seat; 62. Translation drive mechanism; 63. Linear guide rail; 64. First sliding plate; 65. Temperature measuring probe; 66. First rotating plate; 67. Second rotating plate; 68. First connecting column; 69. First fixed block; 601. Second connecting column; 602. Second fixed block; 603. Rotating bracket; 604. Monitoring camera. DETAILED DESCRIPTION

[0027] The present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0028] Reference Figures 1 to 4 As shown, the utility model provides a new type of repair equipment integrating hot air, infrared and laser. In one embodiment, it includes

[0029] A first installation box 1, in which a lower preheating mechanism 2 and a lower heating mechanism 3 are installed; a loading rack 4 is also slidably connected to the top of the first installation box 1;

[0030] A rework device 5, the rework device 5 comprising a first X-axis translation mechanism 51, a first Y-axis translation mechanism 52 and a galvanometer laser heater 56 connected to the first X-axis translation mechanism 51, a first translation frame connected to the first Y-axis translation mechanism 52, and a desoldering and mounting mechanism 53 mounted on the first translation frame; an upper visual mechanism 54 and a detinning mechanism 55 are also mounted on the first translation frame;

[0031] An external temperature measuring mechanism 6, wherein the external temperature measuring mechanism 6 is arranged close to one end of the first installation box 1;

[0032] A lower visual mechanism 7 and a feeding table 8 are also installed in the first installation box 1; a heat dissipation and cooling mechanism 9 is also arranged on both sides of the first installation box 1.

[0033] Continue to refer to Figures 1 to 4 As shown, in this embodiment, it also includes a chassis, a first installation box 1, a rework device 5, an external temperature measuring mechanism 6 and a heat dissipation and cooling mechanism 9 are all arranged on the chassis; the lower preheating mechanism 2 includes a plurality of infrared heating bricks arranged in a square array, which are mainly used to preheat the product to a temperature close to the melting point of the solder ball, so that the subsequent detinning mechanism 55 can remove the solder well and quickly remove the BGA; the lower heating mechanism 3 includes a first lifting mechanism (a motor screw can be used for transmission), a lower heating tube connected to the first lifting mechanism, and a first air nozzle installed on the top of the lower heating tube; the lower heating mechanism 3 is used to perform local fixed-point heating on the PCB board to facilitate the removal of the BGA; the carrier 4 is slidably connected to the top of the first installation box 1, and is a drawer-type push-pull method, which is convenient for the staff to take and place the PCB board. At the same time, a clamp and a support bar are also installed on the carrier 4, which can facilitate the support of the PCB board and clamp it.

[0034] The first X-axis translation mechanism 51 and the first Y-axis translation mechanism 52 of the rework device 5 can both directly adopt linear lead screw modules, which are mainly used to drive the desoldering and mounting mechanism 53, the detinning mechanism 55, etc. to move to appropriate positions; the desoldering and mounting mechanism 53 can adopt existing mechanisms, and in a feasible embodiment, include a spline shaft, an R-axis motor, a lead screw lifting motor, a heating wire, a galvanometer, a laser lamp, and a lifting shaft, which are mainly used to perform hot air heating on the disassembled and welded BGA, and to absorb and transport the disassembled BGA, as well as to position and correct the BGA to be mounted and to solidify the welding; the detinning mechanism 55, in a feasible embodiment, includes a detinning head, a heating tube, a detinning chamber, a weighing sensor, a vacuum generator, and a filter, which are mainly used to heat and melt the residual tin slag, and to absorb the melted tin slag through the vacuum detinning head and collect it in the detinning chamber. cavity, and the detection function of the weighing sensor can protect the detinning head from damaging the pad; the upper visual mechanism 54 and the lower visual mechanism 7 include a camera and a light source. The upper visual mechanism 54 is mainly used to provide positioning information for the detinning mechanism 55 and the desoldering and mounting mechanism 53, and the lower visual mechanism 7 is mainly used to locate and take pictures of the mounted BGA; the galvanometer laser heater 56 can directly use existing devices, and is mainly used for local laser heating, disassembly, welding, etc. of the PCB board; the external temperature measuring mechanism 6 is mainly used to monitor the operating status of the equipment and temperature monitoring during the debugging stage. The heat dissipation and cooling mechanism 9 (including a cross-flow fan) is mainly used for heat dissipation and cooling of the product after the BGA is mounted, and the feeding table 8 is mainly used to carry the BGA to be mounted; in addition, in this embodiment, the upper visual mechanism 54 is also connected with a height measuring sensor 10 and a positioning laser light.

[0035] This device has six working modes, as follows:

[0036] 1) Conventional hot air disassembly mode: The PCB board is preheated to about 180°C by using the infrared temperature zone preheating method, and then the hot air is used to heat the desoldering and mounting mechanism 53 to heat the BGA to be disassembled. The solder on the BGA is melted by the high-temperature breeze on the desoldering head, and the product is sucked by the suction rod axis in the center of the desoldering head, and the removed BGA is placed on the storage table through the XYZ axis, and the disassembly is completed;

[0037] 2) Detinning mode: Move the upper visual mechanism 54 to take a picture of the area that needs to be detinned. After taking the picture, the detinning head moves to the position where the detinning is needed according to the set detinning path. The detinning head uses a precision flow meter to control the high-temperature breeze flow to melt the residual tin on the PCB board, and absorbs the tin slag through the detinning nozzle in the center of the detinning head, and the detinning is completed;

[0038] 3) Mounting mode: Place the BGA that needs to be remounted and soldered on the feeding table 8, move the upper visual mechanism 54 to take pictures of the area on the PCB that needs to be mounted, and after completion, the desoldering head automatically moves to the material taking position, sucks the product on the feeding table 8 through the suction rod shaft and moves it to the lower visual mechanism 7 for photo positioning. After the lower visual mechanism 7 completes the photo taking, the desoldering head corrects the posture according to the visual result, and moves to the final mounting position to mount the product on the PCB;

[0039] 4) Conventional hot air welding mode: After the mounting is completed, the upper and lower hot air heating is turned on to start curing and welding the newly mounted BGA products. After the curing is completed, the heat dissipation and cooling mechanism 9 is started to cool the products;

[0040] 5) Laser local disassembly mode: The lower heating brick, upper hot air and lower hot air preheat the BGA to be disassembled together, preheat to about 160°C, switch the galvanometer laser heater 56 to perform the second stage of local chip heating to reduce the damage of peripheral components due to excessive temperature. The laser heating can be divided into multiple sections of parameter configuration heating to make the temperature rise more stable and uniform. When the chip reaches the set temperature, the product is sucked by the suction rod axis in the center of the desoldering head, and the removed BGA is placed on the storage table through the XYZ axis, and the disassembly is completed;

[0041] 6) Laser local welding mode: After the mounting is completed, the lower heating brick, upper hot air and lower hot air are used to preheat the BGA to be welded. The preheating temperature is about 160°C, and the galvanometer laser heater 56 is switched to perform the second stage of local chip heating to reduce the damage of peripheral components due to excessive temperature. The laser heating can be divided into multiple parameter configuration heating to make the temperature rise more stable and uniform. When the chip reaches the set temperature, the newly mounted BGA product is cured and welded. After the curing is completed, the heat dissipation and cooling mechanism 9 is started to cool the product.

[0042] In one embodiment, the external temperature measuring mechanism 6 includes a first fixed seat 61 arranged at one end of the first installation box 1, a translation driving mechanism 62 installed in the first fixed seat 61, a linear slide rail 63 installed on one side of the first fixed seat 61, a first sliding plate 64 slidably arranged on the linear slide rail 63, and a temperature measuring probe 65 installed on the first sliding plate 64. The translation driving mechanism 62 can directly adopt a manual sliding mode, and the temperature measuring probe 65 can be slid to translate so as to monitor the temperature of the device. To ensure the accuracy of temperature measurement, the temperature measuring probe 65 can adopt a contact probe.

[0043] Meanwhile, the external temperature measuring mechanism 6 further comprises a first rotating plate 66 and a second rotating plate 67; a first connecting column 68 is further mounted on the first sliding plate 64, and one end of the first rotating plate 66 is rotatably connected to the first connecting column 68; one end of the second rotating plate 67 is rotatably connected to the other end of the first rotating plate 66, and a first fixing block 69 is further connected to the top of the other end of the second rotating plate 67; the temperature measuring probe 65 is rotatably connected to the first fixing block 69. The angle of the temperature measuring probe 65 can be adjusted by the first rotating plate 66 and the second rotating plate 67 to adapt to different use environments. Meanwhile, in this embodiment, a locking knob is mounted at the connection between the first rotating plate 66 and the first connecting column 68, and at the connection between the first rotating plate 66 and the second rotating plate 67. After the angle of the temperature measuring probe 65 is adjusted, it can be locked and fixed by the locking knob.

[0044] In addition, the external temperature measuring mechanism 6 also includes a second connecting column 601 installed on the first sliding plate 64, a second fixed block 602 connected to the upper part of the second connecting column 601, a rotating bracket 603 rotatably connected to the second fixed block 602, and a monitoring camera 604 installed on the rotating bracket 603. The monitoring camera 604 can be used to monitor the operating status of the equipment and improve the safety of the equipment operation. At the same time, the angle of the monitoring camera 604 can be adjusted by rotating the bracket 603 to adapt to different usage scenarios. A locking knob is also installed at the connection between the rotating bracket 603 and the second fixed block 602. After adjusting the angle of the monitoring camera 604, it can be locked and fixed by the locking knob to ensure the stability of its installation.

[0045] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A new type of repair equipment integrating hot air, infrared and laser, characterized in that: It comprises a first installation box, in which a lower preheating mechanism and a lower heating mechanism are installed; the top of the first installation box is also slidably connected with a loading rack; A rework device, the rework device comprising a first X-axis translation mechanism, a first Y-axis translation mechanism and a galvanometer laser heater connected to the first X-axis translation mechanism, a first translation frame connected to the first Y-axis translation mechanism, and a desoldering and mounting mechanism installed on the first translation frame; the first translation frame is also equipped with an upper visual mechanism and a detinning mechanism; An external temperature measuring mechanism, the external temperature measuring mechanism being arranged close to one end of the first installation box; The first installation box is also equipped with a lower visual mechanism and a feeding table; and a heat dissipation and cooling mechanism is arranged on both sides of the first installation box.

2. The new hot air infrared laser triple-in-one repair equipment according to claim 1 is characterized in that: The external temperature measuring mechanism includes a first fixed seat arranged at one end of the first installation box, a translation drive mechanism installed in the first fixed seat, a linear slide rail installed on one side of the first fixed seat, a first sliding plate slidably arranged on the linear slide rail, and a temperature measuring probe installed on the first sliding plate.

3. The new hot air infrared laser triple-in-one repair equipment according to claim 2 is characterized in that: The external temperature measuring mechanism also includes a first rotating plate and a second rotating plate; a first connecting column is also installed on the first sliding plate, and one end of the first rotating plate is rotatably connected to the first connecting column; one end of the second rotating plate is rotatably connected to the other end of the first rotating plate, and the top of the other end of the second rotating plate is also connected to a first fixed block; the temperature measuring probe is rotatably connected to the first fixed block.

4. The new hot air infrared laser triple-in-one repair equipment according to claim 3 is characterized in that: The external temperature measuring mechanism also includes a second connecting column installed on the first sliding plate, a second fixed block connected to the upper part of the second connecting column, a rotating bracket rotatably connected to the second fixed block, and a monitoring camera installed on the rotating bracket.

5. The new hot air infrared laser triple-in-one repair equipment according to claim 1 is characterized in that: The upper visual mechanism is also connected with a height measuring sensor and a positioning laser light.

6. The new hot air infrared laser triple-in-one repair equipment according to claim 1 is characterized in that: The heat dissipation and cooling mechanism comprises a cross-flow fan.

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