Octahedral AOI detection equipment

Abstract

The invention relates to the technical field of wafer detection, in particular to octahedral AOI detection equipment which comprises a machine table, a wafer feeding mechanism is installed at one end of the surface of the machine table, and a rotating disc mechanism is installed on the surface of the machine table. A product correction CCD guiding assembly, an automatic correction assembly, a Die surface and gold thread AOI detection assembly, a steering correction module, a bottom long edge AOI detection assembly and a bottom short edge AOI detection assembly are sequentially installed on the surface of the machine table and located on the outer side of the rotating disc mechanism in the anticlockwise direction. According to the wafer detection device, the automation degree is improved, manual auxiliary operation is not needed in the detection process, and wafer taking work is facilitated, so that the labor intensity during wafer detection is reduced, and the working efficiency is improved; and the whole detection process is automatically completed by a machine, and manual operation does not exist in the process, so that missed detection work is avoided, detected defective products are directly discharged, the phenomenon that the defective products flow into the next process in a mixed line manner is avoided, and the yield during wafer detection is increased.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer inspection, and in particular to an eight-sided AOI inspection device. Background Art

[0002] Wafer refers to the silicon chip used to make silicon semiconductor integrated circuits. Various circuit component structures can be processed on the silicon wafer to become IC products with specific electrical functions. Wafers need to be tested during production and processing.

[0003] Usually, wafers are placed on the bottom film of the wafer tray during storage, and are manually removed when they need to be inspected. Therefore, the degree of automation in the inspection process is low, which increases labor intensity and reduces work efficiency during inspection. Moreover, since the entire inspection process needs to be manually operated, it is easy for missed inspections to occur during inspection, and defective products detected are easy to be mixed up, thereby reducing the yield rate during inspection. Summary of the invention

[0004] The purpose of the present invention is to provide an eight-sided AOI inspection device to solve the problems raised in the above background technology that manual inspection has high labor intensity, low work efficiency, and is prone to missed inspections or mixed defective products during inspection, resulting in low yield rate.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an eight-sided AOI inspection equipment, comprising a machine platform, a wafer feeding mechanism is installed at one end of the machine platform surface, and the wafer feeding mechanism is used for feeding and loading wafer products; a turntable mechanism is installed on the surface of the machine platform, and the turntable mechanism is used to receive the wafer products transported by the wafer feeding mechanism and transport them between various stations; a product correction CCD guide component, an automatic correction component, a Die correction component, and a product correction CCD guide component are installed on the surface of the machine platform and located on the outer side of the turntable mechanism in a counterclockwise direction. Surface and gold wire AOI detection components, steering correction module, bottom long side AOI detection components and bottom short side AOI detection components; a waste sorting component is installed on the surface of the machine, and the waste sorting component is used to sort the waste of wafer products; an NG swing plate mechanism is installed on the surface of the machine and at one end away from the wafer feeding mechanism, and the NG swing plate mechanism is used to unload the defective wafer products from the plate after inspection; a tray loading mechanism is installed on the surface of the machine, and the tray loading mechanism is used to unload the good wafer products from the tray after inspection.

[0006] Preferably, the wafer feeding mechanism includes a feeding rack, a basket lifting assembly, a barcode scanning gun, a wafer expansion workbench and a transplanting robot. The feeding rack is fixedly connected to the surface of the machine, and a basket lifting assembly is installed on the surface of the machine and on one side of the feeding rack. The basket lifting assembly is used for storing and lifting wafer products.

[0007] Preferably, a wafer expansion workbench is installed inside the feed rack, and the wafer expansion workbench is used to load the scanned wafer products onto the turntable mechanism. A barcode scanner is fixed to the surface of the feed rack, and the barcode scanner is used to scan the wafer products entering the wafer expansion workbench; a transfer robot is also fixed to the surface of the feed rack, and the transfer robot is used to transport the wafer products on the basket lifting assembly to the surface of the wafer expansion workbench.

[0008] Preferably, the wafer expansion workbench includes a three-axis motion module, a wafer positioning table and a pin lifting assembly. The surface of the three-axis motion module is installed with a wafer positioning table, and the surface of the feed rack is fixed with a pin lifting assembly. When lifting, the pin lifting assembly will pierce the film of the wafer disk and lift the wafer inside it to facilitate material retrieval. The rotating manipulator is fixedly connected to the surface of the feed rack, and the rotating manipulator is used to suck the wafer lifted by the pin lifting assembly and load it onto the turntable mechanism.

[0009] Preferably, the turntable mechanism includes a support arm, a multi-station turntable and a DD motor. The support arm is fixedly connected to the surface of the machine platform, and the top end of the support arm is mounted with a DD motor via a bracket.

[0010] Preferably, the surface of the machine is rotatably connected to a multi-station turntable located directly below the DD motor. The multi-station turntable is used for adsorption, fixation and transportation of wafer products, and the output end of the DD motor is fixedly connected to the surface of the multi-station turntable.

[0011] Preferably, the pallet loading mechanism is composed of a good product pallet rack, a pallet restraint assembly and a transplanting and lifting module. The good product pallet rack is fixedly connected to the surface of the machine, and two sets of pallet restraint assemblies are installed on the top of the good product pallet rack, and the pallet restraint assemblies are used to limit the placement of the pallet; the bottom of the good product pallet rack is installed with a transplanting and lifting module, and the transplanting and lifting module is used to lift the pallets in the two sets of pallet restraint assemblies.

[0012] Preferably, the NG swing plate mechanism includes a swing plate frame, a swing plate linear module, a defective product swing plate, a material picking robot and a defective material unloading rotary module. The swing plate frame is fixedly connected to the surface of the machine platform, and the swing plate linear module is installed at the bottom end of the swing plate frame, and a defective product swing plate is fixed on the sliding seat of the swing plate linear module, and the defective product swing plate is used to carry defective products.

[0013] Preferably, a defective material removal rotating module for driving defective products to rotate is installed on the surface of the swing plate frame, and a material picking robot is installed on the top of the swing plate frame. The material picking robot is used to grab the defective products on the multi-station turntable and transport them to the defective material removal rotating module, and can transport the defective products rotated by the defective material removal rotating module to the defective product swing plate for swinging.

[0014] Preferably, a hood is installed on the top of the machine, and a control panel is fixed on the surface of the hood, which is used to control the entire equipment; a waste box and a cleaning assembly are also installed on the surface of the machine, which is used to collect scattered waste materials, and the cleaning assembly is used to clean the empty material station after unloading.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: the eight-sided AOI inspection equipment loads the wafer product through the wafer feeding mechanism, and after loading, the wafer product is driven by the turntable mechanism to pass through the product correction CCD guide component, and the CCD camera therein is used to guide the position of the product, and then the product is fine-tuned and corrected in conjunction with the automatic correction component, and then AOI inspection is performed through the Die surface and gold wire AOI inspection component, and after the inspection, it is turned and corrected by the steering correction module, and then AOI inspection is performed by the bottom long side AOI inspection component and the bottom short side AOI inspection component, and after the inspection, waste is sorted by the waste sorting component, and defective products are placed on the NG plate. The mechanism unloads the materials from the tray, and the good products enter the tray loading mechanism to realize tray unloading, while the scattered waste materials are collected through the waste box, and finally the cleaning component is used to clean the empty material station after unloading. The present invention improves the degree of automation, does not require manual auxiliary operation during the detection process, and is convenient for wafer retrieval, thereby reducing the labor intensity during wafer detection and improving work efficiency. Moreover, since the entire detection process is automatically completed by the machine without manual operation in the middle, there will be no missed detection work, and the defective products detected will be directly discharged, and the phenomenon of defective products mixing into the next process will not occur, thereby increasing the yield rate during wafer detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional appearance structure of the present invention;

[0017] Figure 2 It is a schematic diagram of the internal structure of the present invention;

[0018] Figure 3 It is a schematic diagram of the top view structure of the present invention;

[0019] Figure 4 It is a schematic diagram of the explosion structure of the present invention;

[0020] Figure 5 It is a partial enlarged structural schematic diagram of the present invention;

[0021] Figure 6 It is a schematic structural diagram of the wafer feeding mechanism of the present invention;

[0022] Figure 7 It is a schematic diagram of the structure of the turntable mechanism of the present invention;

[0023] Figure 8 It is a structural schematic diagram of the tray loading mechanism of the present invention;

[0024] Fig. 9 It is a schematic diagram of the structure of the NG pan mechanism of the present invention;

[0025] Fig.10 It is a schematic diagram of the structure of the wafer expansion workbench of the present invention;

[0026] Fig.11 It is a schematic structural diagram of the ejector pin lifting assembly of the present invention.

[0027] In the figure: 1. Machine; 101. Machine cover; 102. Control panel; 2. Wafer feeding mechanism; 21. Feeding rack; 22. Basket lifting assembly; 23. Barcode scanner; 24. Wafer expansion workbench; 241. Three-axis motion module; 242. Wafer positioning table; 243. Ejector lifting assembly; 244. Rotary manipulator; 25. Transplanting manipulator; 3. Turntable mechanism; 31. Support arm; 32. Multi-station turntable; 33. DD motor; 4. Tray loading mechanism; 41. Good product tray rack; 42. Tray restraint group Parts; 43. Transplanting and lifting module; 5. Product correction CCD guide component; 6. Automatic correction component; 7. Die surface and gold wire AOI detection component; 8. Steering correction module; 9. Bottom long side AOI detection component; 10. Bottom short side AOI detection component; 11. NG swing plate mechanism; 111. Swing plate rack; 112. Swing plate linear module; 113. Defective product swing plate; 114. Material picking robot; 115. Defective unloading rotating module; 12. Waste sorting component; 13. Waste box; 14. Cleaning component. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. In addition, the terms "first", "second", "third", "upper, lower, left, right", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. At the same time, in the description of the present invention, unless otherwise clearly specified and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0029] The structure of an eight-sided AOI inspection device provided by the present invention is as follows: Figure 1 as well as Figure 6As shown, it includes a machine 1, and a wafer feeding mechanism 2 is installed at one end of the surface of the machine 1. The wafer feeding mechanism 2 is used for feeding and loading wafer products. The wafer feeding mechanism 2 includes a feeding rack 21, a basket lifting assembly 22, a barcode scanning gun 23, a wafer expansion workbench 24 and a transplanting robot 25. The feeding rack 21 is fixedly connected to the surface of the machine 1. A basket lifting assembly 22 is installed on the surface of the machine 1 and located on one side of the feeding rack 21. The basket lifting assembly 22 includes a basket feeding bin and a screw motor lifting platform. The basket lifting assembly 2 2 is used for the storage and lifting of wafer products. A wafer expansion workbench 24 is installed inside the feed rack 21. The wafer expansion workbench 24 is used to load the scanned wafer products onto the turntable mechanism 3. A barcode scanner 23 is fixed on the surface of the feed rack 21. The barcode scanner 23 is used to scan the wafer products entering the wafer expansion workbench 24. A transfer robot 25 is also fixed on the surface of the feed rack 21. The transfer robot 25 is used to transport the wafer products on the basket lifting assembly 22 to the surface of the wafer expansion workbench 24.

[0030] During implementation, the wafer product is placed in the basket lifting assembly 22, and the wafer in the basket lifting assembly 22 is moved to the wafer expansion workbench 24 by the transfer robot 25. After being moved, the barcode is scanned by the barcode scanning gun 23, and then the wafer product is loaded onto the multi-station turntable 32 in the turntable mechanism 3 through the wafer expansion workbench 24.

[0031] Specifically, Figure 6 as well as Fig.10 As shown, the wafer expansion workbench 24 includes a three-axis motion module 241, a wafer positioning table 242, a pin lifting assembly 243 and a rotating manipulator 244. The surface of the feed rack 21 is fixedly connected with the three-axis motion module 241, the surface of the three-axis motion module 241 is installed with the wafer positioning table 242, and the surface of the feed rack 21 is fixed with a pin lifting assembly 243, which will pierce the film of the wafer disk and lift the wafer inside it to facilitate the material retrieval work when lifting; the rotating manipulator 244 is fixedly connected to the surface of the feed rack 21, and the rotating manipulator 244 is used to absorb the wafer lifted by the pin lifting assembly 243 and load it onto the turntable mechanism 3.

[0032] Among them, the three-axis motion module 241 includes a lifting screw module installed on the surface of the feeding rack 21, a Y-axis screw module fixed on the lifting plate of the lifting screw module, and an X-axis screw module installed on the sliding plate of the Y-axis screw module, and the wafer positioning table 242 is installed on the sliding plate of the X-axis screw module; the rotating manipulator 244 includes a servo motor installed on the surface of the feeding rack 21, a rotating arm fixed on the output end of the servo motor, and suction nozzles installed at both ends of the rotating arm; Fig.11As shown, the ejector lifting assembly 243 includes an ejector seat installed on a lifting linear module and a sliding plate of the lifting linear module, and an ejector head fixed to the ejector seat, which can pierce the film and will not cause damage when lifting the wafer chip.

[0033] During implementation, the lifting screw module in the three-axis motion module 241 lifts the wafer positioning table 242 to be flush with the wafer disks placed on each layer in the basket lifting assembly 22, and then the Y-axis screw module and the X-axis screw module of the three-axis motion module 241 drive the wafer positioning table 242 to dock with the basket lifting assembly 22, and then the transfer robot 25 moves the wafer disk in the basket lifting assembly 22 horizontally to the wafer positioning table 242, and the three-axis motion module 241 drives the wafer positioning table 242 to dock with the basket lifting assembly 22. The positioning platform 242 is reset, and then the lifting linear module in the ejector lifting assembly 243 drives the ejector seat and the ejector head to move upward. The ejector head will pierce the film at the bottom of the wafer disk and lift the wafer chip inside it. The wafer chip will not be damaged when the ejector head lifts it. When the top of the ejector seat is pressed against the film, the code is scanned by the barcode scanning gun 23. After scanning, the wafer is loaded onto the multi-station turntable 32 by the rotating manipulator 244, so it is more convenient to take the material.

[0034] Furthermore, if Figure 2 as well as Figure 7 As shown, a turntable mechanism 3 is installed on the surface of the machine 1, and the turntable mechanism 3 is used to receive the wafer products transported by the wafer feeding mechanism 2 and transport them between various stations. The turntable mechanism 3 includes a support arm 31, a multi-station turntable 32 and a DD motor 33. The support arm 31 is fixedly connected to the surface of the machine 1, and the DD motor 33 is installed on the top of the support arm 31 through a bracket. The multi-station turntable 32 is rotatably connected to the surface of the machine 1 and located directly below the DD motor 33. The multi-station turntable 32 has twenty stations, and each station is equipped with a suction nozzle to adsorb and fix the wafer products. The multi-station turntable 32 is used for adsorbing, fixing and transporting the wafer products, and the output end of the DD motor 33 is fixedly connected to the surface of the multi-station turntable 32.

[0035] During implementation, the DD motor 33 on the surface of the support arm 31 drives the multi-station turntable 32 to rotate, thereby transporting the wafer products between the stations.

[0036] Furthermore, if Figure 1 , Figure 3 as well as Figure 5As shown, the surface of the machine 1 and located on the outer side of the turntable mechanism 3 are successively installed along the counterclockwise direction with a product correction CCD guide component 5, an automatic correction component 6, a die surface and gold wire AOI detection component 7, a steering correction module 8, a bottom long side AOI detection component 9 and a bottom short side AOI detection component 10. AOI detection uses a visual camera to achieve appearance inspection. A hood 101 is installed on the top of the machine 1, and a control panel 102 is fixed on the surface of the hood 101. The control panel 102 is used for controlling the entire equipment; a waste sorting component 12 is installed on the surface of the machine 1, and the waste sorting component 12 is used for sorting waste for wafer products; a waste box 13 and a cleaning component 14 are also installed on the surface of the machine 1. The waste box 13 is used for collecting scattered waste materials, and the cleaning component 14 is used for cleaning empty material stations after unloading.

[0037] During implementation, the wafer product is driven by the turntable mechanism 3 to pass through the product correction CCD guide component 5 and the automatic correction component 6, and the position of the product is fine-tuned and corrected under guidance. Subsequently, AOI inspection is performed through the Die surface and gold wire AOI inspection component 7. After the inspection, it is turned and corrected by the steering correction module 8, and then AOI inspection is performed by the bottom long side AOI inspection component 9 and the bottom short side AOI inspection component 10.

[0038] Furthermore, if Figure 4 as well as Fig. 9 As shown, an NG swing plate mechanism 11 is installed on the surface of the machine 1 and at one end away from the wafer feeding mechanism 2. The NG swing plate mechanism 11 is used for swinging and unloading defective products after wafer product inspection. The NG swing plate mechanism 11 includes a swing plate frame 111, a swing plate linear module 112, a defective product swing plate 113, a material picking robot 114 and a defective unloading rotary module 115. The swing plate frame 111 is fixedly connected to the surface of the machine 1, and the swing plate linear module 112 is installed at the bottom of the swing plate frame 111, and the sliding of the swing plate linear module 112 A defective product plate 113 is fixed on the seat, and the defective product plate 113 is used to carry defective products. A defective material unloading rotating module 115 for driving defective products to rotate is installed on the surface of the plate frame 111. A material picking robot 114 is installed on the top of the plate frame 111. The material picking robot 114 is used to grab the defective products on the multi-station turntable 32 and transport them to the defective material unloading rotating module 115, and can transport the defective products that are rotating with full material on the defective material unloading rotating module 115 to the defective product plate 113 for plate placement.

[0039] During implementation, the defective products on the multi-station turntable 32 are grabbed and transported to the defective material unloading rotating module 115 through the material picking robot 114. When one side is full of materials, the defective products are rotated by the defective material unloading rotating module 115, and the defective product unloading rotating module 115 transports the defective products on the full side to the defective product swing plate 113. During transportation, the defective product swing plate 113 is driven to move by the swing plate linear module 112 to realize the swing plate unloading work of the defective products.

[0040] Furthermore, if Figure 3 as well as Figure 8 As shown, a tray loading mechanism 4 is installed on the surface of the machine 1, and the tray loading mechanism 4 is used for unloading the trays of qualified wafer products after inspection. The tray loading mechanism 4 is composed of a qualified tray rack 41, a tray constraint assembly 42 and a transplanting and lifting module 43. The qualified tray rack 41 is fixedly connected to the surface of the machine 1, and two groups of tray constraint assemblies 42 are installed on the top of the qualified tray rack 41, and the tray constraint assembly 42 is used for limiting the placement of the tray; a transplanting and lifting module 43 is installed on the bottom of the qualified tray rack 41, and the transplanting and lifting module 43 includes a linear module and a screw motor lifting platform, and the transplanting and lifting module 43 is used for lifting the trays in the two groups of tray constraint assemblies 42.

[0041] During implementation, the pallet is placed inside the pallet restraint assembly 42, and then the good products are moved to the pallet by the robot. When one layer of the pallet is full, the material is taken out, and then the transfer and lifting module 43 drives the lower pallet to rise to the receiving position for receiving the material.

[0042] Working principle: When in use, the wafer product is loaded through the wafer feeding mechanism 2. After loading, the turntable mechanism 3 drives the wafer product through the product correction CCD guide component 5, and uses the CCD camera therein to guide the position of the product, and then cooperates with the automatic correction component 6 to fine-tune the product, and then the Die surface and gold wire AOI detection component 7 is used for AOI detection. After the detection, it is turned and corrected by the steering correction module 8, and then the bottom long side AOI detection component 9 and the bottom short side AOI detection component 10 are used for AOI detection. The AOI detection uses a visual camera to realize appearance inspection. After the inspection, the waste is sorted by the waste sorting component 12, and the defective products are unloaded by the NG swinging mechanism 11. The good products enter the tray loading mechanism 4 to realize tray unloading, and the scattered waste is collected by the waste box 13. Finally, the cleaning component 14 is used to clean the empty material station after unloading, and finally the use of the eight-sided AOI detection equipment is completed.

[0043] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. An eight-sided AOI inspection device, comprising a machine platform (1), characterized in that: A wafer feeding mechanism (2) is installed at one end of the surface of the machine (1), and the wafer feeding mechanism (2) is used for feeding and loading wafer products; a turntable mechanism (3) is installed on the surface of the machine (1), and the turntable mechanism (3) is used for receiving wafer products transported by the wafer feeding mechanism (2) and transporting them between various workstations; a product correction CCD guide component (5), an automatic correction component (6), a die surface and gold wire AOI detection component (7), a steering correction module (8), and a product correction CCD guide component (5) are installed on the surface of the machine (1) and located on the outer side of the turntable mechanism (3) in a counterclockwise direction. The bottom long side AOI detection component (9) and the bottom short side AOI detection component (10); a waste sorting component (12) is installed on the surface of the machine (1), and the waste sorting component (12) is used to sort the waste of wafer products; an NG swing plate mechanism (11) is installed on the surface of the machine (1) and at one end away from the wafer feeding mechanism (2), and the NG swing plate mechanism (11) is used to unload the defective wafer products after the wafer products are inspected; a tray loading mechanism (4) is installed on the surface of the machine (1), and the tray loading mechanism (4) is used to unload the good wafer products after the wafer products are inspected.

2. The eight-sided AOI inspection device according to claim 1, characterized in that: The wafer feeding mechanism (2) comprises a feeding rack (21), a basket lifting assembly (22), a barcode scanning gun (23), a wafer expansion workbench (24) and a transplanting robot (25); the feeding rack (21) is fixedly connected to the surface of the machine platform (1); a basket lifting assembly (22) is installed on the surface of the machine platform (1) and on one side of the feeding rack (21); the basket lifting assembly (22) is used for storing and lifting wafer products.

3. The eight-sided AOI inspection device according to claim 2, characterized in that: A wafer expansion workbench (24) is installed inside the feed rack (21), and the wafer expansion workbench (24) is used to load the scanned wafer products onto the turntable mechanism (3). A barcode scanning gun (23) is fixed on the surface of the feed rack (21), and the barcode scanning gun (23) is used to scan the wafer products entering the wafer expansion workbench (24); a transfer robot (25) is also fixed on the surface of the feed rack (21), and the transfer robot (25) is used to transport the wafer products on the basket lifting assembly (22) to the surface of the wafer expansion workbench (24).

4. The eight-sided AOI inspection device according to claim 3, characterized in that: The wafer expansion workbench (24) comprises a three-axis motion module (241), a wafer positioning platform (242), a pin lifting assembly (243) and a rotating manipulator (244); the surface of the three-axis motion module (241) is installed with a wafer positioning platform (242); the surface of the feed rack (21) is fixed with a pin lifting assembly (243); when lifting, the pin lifting assembly (243) will pierce the film of the wafer disk and lift up the wafer inside it to facilitate material removal; the rotating manipulator (244) is fixed to the surface of the feed rack (21); the rotating manipulator (244) is used to absorb the wafer lifted by the pin lifting assembly (243) and load it onto the turntable mechanism (3).

5. The eight-sided AOI inspection device according to claim 1, characterized in that: The turntable mechanism (3) comprises a support arm (31), a multi-station turntable (32) and a DD motor (33); the support arm (31) is fixedly connected to the surface of the machine platform (1), and the top end of the support arm (31) is equipped with a DD motor (33) via a bracket.

6. The eight-sided AOI inspection device according to claim 5, characterized in that: A multi-station turntable (32) is rotatably connected to the surface of the machine (1) and is located directly below the DD motor (33). The multi-station turntable (32) is used for adsorbing, fixing and transporting wafer products, and the output end of the DD motor (33) is fixedly connected to the surface of the multi-station turntable (32).

7. The eight-sided AOI inspection device according to claim 1, characterized in that: The pallet loading mechanism (4) is composed of a good product pallet rack (41), a pallet restraining assembly (42) and a transplanting and lifting module (43). The good product pallet rack (41) is fixedly connected to the surface of the machine platform (1), and two groups of pallet restraining assemblies (42) are installed on the top of the good product pallet rack (41). The pallet restraining assemblies (42) are used for limiting the position of the pallets when they are placed; the bottom of the good product pallet rack (41) is installed with a transplanting and lifting module (43) which is used for lifting the pallets in the two groups of pallet restraining assemblies (42).

8. The eight-sided AOI inspection device according to claim 1, characterized in that: The NG swing plate mechanism (11) comprises a swing plate frame (111), a swing plate linear module (112), a defective product swing plate (113), a material taking robot (114) and a defective material unloading rotary module (115); the swing plate frame (111) is fixedly connected to the surface of the machine platform (1), and the swing plate linear module (112) is installed at the bottom end of the swing plate frame (111), and a defective product swing plate (113) is fixed on the sliding seat of the swing plate linear module (112), and the defective product swing plate (113) is used for carrying defective products.

9. The eight-sided AOI inspection device according to claim 8, characterized in that: A defective material removal rotating module (115) for driving defective products to rotate is installed on the surface of the swing plate frame (111), and a material picking robot (114) is installed on the top of the swing plate frame (111). The material picking robot (114) is used to grab and transport defective products on the multi-station turntable (32) to the defective material removal rotating module (115), and can transport the defective products rotated by the defective material removal rotating module (115) to the defective product swing plate (113) for swinging.

10. The eight-sided AOI inspection device according to claim 1, characterized in that: A hood (101) is installed on the top of the machine platform (1), and a control panel (102) is fixed on the surface of the hood (101), and the control panel (102) is used for controlling the entire device; a waste box (13) and a cleaning component (14) are also installed on the surface of the machine platform (1), and the waste box (13) is used for collecting scattered waste materials, and the cleaning component (14) is used for cleaning empty material stations after material unloading.

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