Laser emission module and laser radar

Abstract

The embodiment of the utility model provides a laser emission module and a laser radar, and relates to the technical field of laser radars. The laser emission module comprises a circuit board, a laser device and a bottom filling layer, the laser device is electrically connected with the circuit board, the bottom filling layer is arranged between the circuit board and the laser device and makes contact with the circuit board and the laser device at the same time, the heat conduction area between the circuit board and the laser device is increased through the bottom filling layer, and the heat dissipation effect of the laser emission module is improved; and good performance of the laser is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of laser radars, and in particular to a laser emission module and a laser radar. Background Art

[0002] The laser emission module is one of the core components of the lidar device. It emits an active laser beam for ranging or detecting objects. Usually based on electrical, structural and reliability requirements, the laser is placed inside the radar device.

[0003] In the prior art, the heat dissipation effect of the laser emission module is not good, which leads to an increase in the temperature of the laser and a decrease in its performance. Utility Model Content

[0004] The utility model provides a laser emission module and a laser radar, which can improve the heat dissipation effect of the laser emission module and ensure good performance of the laser.

[0005] The embodiments of the present invention can be implemented as follows:

[0006] In a first aspect, the utility model provides a laser emission module, comprising:

[0007] Circuit boards;

[0008] a laser, the laser being electrically connected to the circuit board; and

[0009] A bottom filling layer is disposed between the circuit board and the laser and contacts the circuit board and the laser at the same time.

[0010] In an optional embodiment, the bottom filling layer is made by using a bottom filling dispensing process.

[0011] In an optional embodiment, the laser is welded to the circuit board to form a welding layer, the circuit board and the laser are electrically connected via the welding layer, and the welding layer is formed by a reflow soldering process.

[0012] In an optional embodiment, the laser emission module further includes a heat sink, and the heat sink is embedded in the circuit board.

[0013] In an optional embodiment, the circuit board has a first surface layer and a second surface layer, the laser is arranged on the first surface layer, the circuit board is provided with a first thermal via, one end of the first thermal via extends to the first surface layer, the other end of the first thermal via extends to the heat sink, the second surface layer and the first surface layer are arranged back to back, and the circuit board is also provided with a second thermal via, one end of the second thermal via extends to the second surface layer, and the other end of the second thermal via extends to the heat sink.

[0014] In an optional embodiment, the laser emission module further includes a module housing and a first heat-conducting layer, the circuit board and the first heat-conducting layer are both arranged in the module housing, and the first heat-conducting layer is used to contact the radar housing.

[0015] In an optional embodiment, a partial area of ​​the module housing is opened to form an opening, and the opening is used to expose the circuit board and the laser.

[0016] In an optional embodiment, the module housing includes a first side plate and a second side plate, the first side plate and the second side plate are connected at an angle, the circuit board is arranged on one side of the second side plate, and the first heat conductive layer is arranged on the other side of the second side plate;

[0017] The edge of the second side panel is connected to the edge of the first side panel at a right angle, the circuit board is parallel to the first side panel, and the module housing further comprises a second heat conducting layer, which simultaneously connects the side of the circuit board away from the laser and the first side panel.

[0018] In a second aspect, the utility model provides a laser radar, comprising a radar housing and a laser emission module as described in any one of the aforementioned embodiments, wherein the laser emission module is arranged in the radar housing.

[0019] In a third aspect, the utility model provides a laser radar, comprising a radar housing and a laser emission module according to any one of the aforementioned embodiments, wherein the radar housing has a front side wall and a rear side wall opposite to each other, the first heat conductive layer contacts the rear side wall of the radar housing, and the laser emitted by the laser is used to pass through the front side wall;

[0020] The laser radar further includes an optical machine, which is disposed on the radar housing. The laser emitted by the laser is used to pass through the optical machine and then be emitted out of the front side wall.

[0021] The beneficial effects of the laser emission module and laser radar of the embodiment of the utility model include, for example:

[0022] The utility model provides a laser emission module, which includes a circuit board, a laser and a bottom filling layer. The laser is electrically connected to the circuit board, and the bottom filling layer is arranged between the circuit board and the laser, and contacts the circuit board and the laser at the same time. The bottom filling layer increases the heat conduction area between the circuit board and the laser, improves the heat dissipation effect of the laser emission module, and ensures good performance of the laser.

[0023] The utility model provides a laser radar, which comprises a radar shell and the above-mentioned laser emission module, wherein the laser emission module is arranged in the radar shell, and the laser radar has all the functions of the above-mentioned laser emission module.

[0024] The utility model provides a laser radar, which includes a radar shell and the above-mentioned laser emission module, the radar shell has opposite front side walls and rear side walls, the first heat-conducting layer contacts the rear side wall of the radar shell, the laser emitted by the laser is used to pass through the front side wall, the laser radar also includes an optical machine, the optical machine is arranged in the radar shell, the laser emitted by the laser is used to pass through the optical machine and then emit out of the front side wall, and the laser radar has all the functions of the above-mentioned laser emission module. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 A first schematic diagram of a laser emission module provided in an embodiment of the present utility model;

[0027] Figure 2 A second schematic diagram of a laser emission module provided in an embodiment of the present utility model;

[0028] Figure 3 This is a schematic diagram of the laser emission module provided in the embodiment of the utility model before the bottom filling dispensing process is performed;

[0029] Figure 4 This is a schematic diagram of a laser emission module provided in an embodiment of the utility model without the laser;

[0030] Figure 5 A schematic diagram of a laser emission module provided in an embodiment of the present utility model;

[0031] Figure 6 A cross-sectional view of a laser emission module provided in an embodiment of the present utility model;

[0032] Figure 7 A schematic diagram of a laser emission module provided in an embodiment of the present utility model;

[0033] Figure 8 This is a schematic diagram of the laser emission module and the optical machine provided in the embodiment of the utility model being located in the radar housing.

[0034] Icons: 100-circuit board; 101-first surface layer; 102-first thermal via; 103-second surface layer; 104-second thermal via; 200-laser; 310-bottom filling layer; 320-solder layer; 410-heat sink; 510-module housing; 501-opening; 511-first side panel; 512-second side panel; 513-third side panel; 5131-laser through hole; 514-fourth side panel; 520-first thermal conductive layer; 530-second thermal conductive layer; 1100-radar housing; 1110-front side wall; 1120-rear side wall; 1200-optical machine; 10-laser. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0036] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0038] In the description of the present utility model, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the utility model product is usually placed when used. It is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present utility model.

[0039] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0040] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0041] As mentioned in the background technology, the laser emission module is one of the core components of the lidar device. It emits an active laser beam for ranging or detecting objects. Usually, based on electrical, structural and reliability requirements, the laser is placed inside the radar device.

[0042] Specifically, the laser emission module consists of an EEL laser and a PCB board. The EEL laser is mounted on the PCB board and generates a lot of heat in a very small area. The entire laser emission module is placed in the radar casing. The laser emitted by the EEL laser is emitted from the front window of the radar casing after being subjected to the whole beam action of the optical machine (i.e., the laser is corrected and focused).

[0043] In the prior art, the heat dissipation effect of the laser emission module is not good, which leads to an increase in the temperature of the laser 200 and a decrease in its performance.

[0044] For example, the EEL laser is mounted on the PCB board. The transfer of heat from the laser to the PCB board will be hindered by the presence of the solder layer. In addition, the PCB board usually uses FR-4 epoxy resin laminate. The biggest problem of this board is its poor heat dissipation performance. The thermal conductivity of FR-4 board is only about 0.35W / mK, which will seriously restrict the heat dissipation capacity of the laser emission module with high power consumption density, causing the temperature of the laser to be too high, affecting performance and life. In addition, since the laser emission module is placed inside the laser housing, the heat of the emission module must be dissipated inside the radar first, which hinders the rapid transfer of heat to the external environment and increases the thermal resistance of the radar system.

[0045] Therefore, effective heat dissipation of the laser is a key factor in maintaining the performance of lidar.

[0046] In view of this, please refer to Figure 1-Figure 7 The laser emission module and laser radar provided in the embodiments of the utility model can solve this problem, which will be described in detail below.

[0047] Please refer to Figure 1-Figure 4 In an embodiment of the utility model, a laser radar is provided, which includes a radar housing 1100 and a laser emission module. The laser emission module is arranged in the radar housing 1100. The laser radar can improve the heat dissipation effect of the laser 200 of the laser emission module and maintain the performance of the laser radar.

[0048] The laser emission module can also solve the problem of poor heat dissipation due to the presence of the welding layer in the prior art.

[0049] Specifically, to solve this problem, the laser emission module includes a circuit board 100, a laser 200 and a bottom filling layer 310. The laser 200 and the circuit board 100 are electrically connected. The bottom filling layer 310 is arranged between the circuit board 100 and the laser 200, and contacts the circuit board 100 and the laser 200 at the same time. The circuit board 100 can be a PCB board, and the base material of the circuit board 100 can be FR-4 material.

[0050] It is easy to understand that the bottom filling layer 310 increases the heat conduction area between the circuit board 100 and the laser 200, thereby improving the heat dissipation effect of the laser emission module. In other words, the heat dissipation effect of the laser 200 is improved. The laser 200 can use an EEL laser 200 to ensure the good performance of the laser 200.

[0051] The laser 200 is welded to the circuit board 100 and a welding layer 320 is formed. The circuit board 100 and the laser 200 are electrically connected through the welding layer 320. However, because the area of ​​the welding layer 320 is smaller than the area of ​​the bottom side of the laser 200, when the heat flow is conducted from the laser 200 to the circuit board 100, there will be a thermal resistance effect in the process of passing through these welding layers 320, which increases the thermal resistance.

[0052] On the other hand, when the laser 200 is working, the temperature of the laser 200 and the surrounding area is high, and the thermal expansion coefficients of the laser 200, the circuit board 100, and the solder layer 320 are inconsistent, which will produce large thermal stress, making it easy for them to be pulled and broken, resulting in connection failure.

[0053] However, since the laser emission module in this embodiment has a bottom filling layer 310, this problem can be improved. Specifically, the bottom filling layer 310 is made by a bottom filling dispensing process, wherein the solder layer 320 is formed by a reflow soldering process, that is, when the laser 200 is mounted on the circuit board 100, a reflow soldering process is used to electrically connect the laser 200 pins and the circuit board 100 by melting the solder SAC305 to form the solder layer 320. The thickness of the solder layer 320 is 0.05 to 0.09 mm, for example, the thickness of the solder layer 320 can be 0.05 mm, 0.09 mm, or 0.07 mm.

[0054] After welding is completed, the bottom filling layer 310 can be formed by the bottom filling dispensing process. Specifically, epoxy resin glue is applied to the edge of the laser 200 in an "L" shape or a "U" shape at the bottom of the laser 200. This will produce a "capillary effect" to absorb the epoxy resin glue to the opposite side of the laser 200, and then the epoxy resin glue is cured by heating and baking to form the bottom filling layer 310, thereby completing the bottom filling dispensing process.

[0055] The bottom filling dispensing process forms the bottom filling layer 310 which can not only increase the heat conduction area between the circuit board 100 and the laser 200, thereby reducing the thermal resistance of the solder layer 320 by 10% to 20%, but also disperse the thermal stress in the solder layer 320, which can greatly improve its impact resistance, thereby improving the reliability of the entire laser emission module.

[0056] That is to say, this embodiment provides a bottom filling SMT (surface mount technology) mounting process for the laser 200, which can reduce the thermal resistance of the solder layer 320 and improve its impact resistance.

[0057] Please refer to Figure 5 and Figure 6 A laser emission module is also provided in the embodiment of the utility model. The laser emission module can solve the problem that the PCB board usually adopts FR-4 epoxy resin laminate, which has poor heat dissipation performance (the thermal conductivity of FR-4 board is only about 0.35W / mK), which seriously restricts the heat dissipation capacity of the laser emission module with high power consumption density, thereby causing the temperature of the laser to be too high, affecting its performance and life.

[0058] Specifically, to solve this problem, the laser emission module includes a circuit board 100, a laser 200 and a heat sink 410. The laser 200 can be an EEL laser 200. The circuit board 100 can be a PCB board, and the base material of the circuit board 100 is FR-4 material.

[0059] Among them, the laser 200 is electrically connected to the circuit board 100, and the circuit board 100 has a heat sink 410 embedded therein. Since the circuit board 100 has a heat sink 410 embedded therein, the heat dissipation of the laser 200 can be accelerated, thereby improving the heat dissipation effect of the laser emission module, ensuring the good performance of the laser 200, and can be used for the heat dissipation of the semiconductor laser 200 (or other high-power devices).

[0060] Of course, it should be noted that the laser emission module can also simultaneously adopt the above-mentioned method of setting the bottom filling layer 310 between the circuit board 100 and the laser 200 to improve the heat dissipation effect of the laser 200.

[0061] In this embodiment, the heat dissipation plate 410 is a copper block heat sink, and the copper block heat sink has a square plate structure.

[0062] Among them, the circuit board 100 has a first surface layer 101, the laser 200 is arranged on the first surface layer 101, the circuit board 100 is provided with a first thermal via 102, one end of the first thermal via 102 extends to the first surface layer 101, and the other end of the first thermal via 102 extends to the heat sink 410. In this embodiment, the number of the first thermal vias 102 is multiple.

[0063] In addition, the circuit board 100 has a second surface layer 103, and the second surface layer 103 and the first surface layer 101 are arranged back to back. The circuit board 100 is also provided with a second thermal via 104, one end of the second thermal via 104 extends to the second surface layer 103, and the other end of the second thermal via 104 extends to the heat sink 410. In this embodiment, the number of the second thermal vias 104 is multiple.

[0064] The first surface layer 101 and the second surface layer 103 are both copper-clad layers, and the base material of the circuit board 100 is FR-4 material.

[0065] Specifically, the laser 200 is welded on the top copper clad layer (i.e., the first surface layer 101) of the circuit board 100. The copper block heat sink is placed inside the FR-4 substrate of the circuit board 100. To enhance the heat conduction capability, a first thermal via 102 is constructed between the top copper clad layer and the copper block heat sink, and a second thermal via 104 is constructed between the heat sink copper block and the lower copper clad layer (i.e., the second surface layer 103).

[0066] First, determine the appropriate size of the copper heat sink according to the heating power of the laser 200. For example, the larger the heating power of the laser 200, the larger the copper heat sink can be selected; the smaller the heating power of the laser 200, the smaller the copper heat sink can be selected.

[0067] Use laser 10 or mechanical processing to make grooves at the corresponding positions of the FR-4 substrate. The groove size is slightly larger than the heat sink copper block by 20 mils (for example, the groove size in the length and width direction is 20 mil larger than the length and width of the heat sink copper block respectively). After the copper block heat sink is placed, it is pressed and cured with a semi-cured sheet.

[0068] Afterwards, according to the pre-designed position and size of the thermal via, holes are drilled in the laminated FR-4 substrate, and metal is electroplated on the holes to form the first thermal via 102 and the second thermal via 104. Finally, the FR-4 substrate is laminated and cured with the second surface layer 103 and the first surface layer 101 to complete the production of the entire PCB board with embedded heat sink copper block.

[0069] The main body of the circuit board 100 in this embodiment is made of FR4 material and is compatible with mature process technology. Compared with ceramic substrates, it has high yield and low cost.

[0070] Please refer to Figure 7 and Figure 8 A laser emission module is also provided in the embodiment of the utility model. The laser emission module can solve the problem that the heat of the emission module must be dissipated inside the radar first because the laser emission module is placed inside the laser 10 housing, which hinders the rapid transfer of heat to the external environment and increases the thermal resistance of the radar system.

[0071] For example, the existing laser emission module is generally fixed on the optical machine 1200 or the internal frame of the laser radar. As mentioned above, such a design prevents the heat flow from being smoothly transmitted to the external environment.

[0072] To solve this problem, the laser emission module in this embodiment includes a circuit board 100, a laser 200, a module housing 510 and a first heat-conducting layer 520. The laser 200 and the circuit board 100 are electrically connected. The circuit board 100 and the first heat-conducting layer 520 are both arranged in the module housing 510. The first heat-conducting layer 520 is used to contact the radar housing 1100. The laser 200 can be an EEL laser 200. The base material of the circuit board 100 is FR-4 material. The circuit board 100 can be understood as a PCB board.

[0073] Since the module shell 510 is provided with a first heat-conducting layer 520 , and at the same time, the first heat-conducting layer 520 can contact the radar housing 1100 , the heat of the laser 200 is quickly transferred to the radar housing 1100 and dissipated into the external environment, thereby improving the heat dissipation effect of the laser emission module and ensuring the good performance of the laser 200 .

[0074] The first heat-conducting layer 520 can be made of a high thermal conductivity thermal interface material (such as a thermally conductive gel with a thermal conductivity of 6W / (M*K)), and the module housing 510 is made of a metal material with good thermal conductivity, such as copper or aluminum alloy.

[0075] Of course, it should be noted that the laser emission module can also simultaneously adopt the above-mentioned method of setting the bottom filling layer 310 between the circuit board 100 and the laser 200 and the circuit board 100 can be embedded with a heat sink 410 to improve the heat dissipation effect of the laser 200.

[0076] Among them, a partial area of ​​the module shell 510 is opened to form an opening 501, and the opening 501 is used to expose the circuit board 100 and the laser 200. The module shell 510 includes a first side panel 511 and a second side panel 512. The first side panel 511 and the second side panel 512 are connected at an angle. The circuit board 100 is arranged on one side of the second side panel 512, and the first heat conductive layer 520 is arranged on the other side of the second side panel 512.

[0077] In this embodiment, the edge of the second side plate 512 is connected to the edge of the first side plate 511 at a right angle, and the circuit board 100 and the first side plate 511 are parallel.

[0078] In order to enhance the heat dissipation effect of the laser 200 , the module housing 510 also includes a second heat-conducting layer 530 , which can also be made of a thermal interface material with high thermal conductivity. The second heat-conducting layer 530 is simultaneously connected to the side of the circuit board 100 away from the laser 200 and the first side plate 511 .

[0079] The module shell 510 also includes a third side panel 513 and a fourth side panel 514. The third side panel 513 is connected to a side of the first side panel 511 away from the second side panel 512. The third side panel 513 is provided with a laser through hole 5131. The laser 10 emitted by the laser 200 is used to pass through the laser through hole 5131. The first side panel 511 and the third side panel 513 are parallel.

[0080] The fourth side panel 514 is connected to the second side panel 512 and the third side panel 513 at the same time. At the same time, the fourth side panel 514 can also be connected to the first side panel 511. The first side panel 511, the second side panel 512 and the third side panel 513 are all perpendicular to the fourth side panel 514. The circuit board 100 is arranged on the fourth side panel 514, and the circuit board 100 is located between the second side panel 512 and the third side panel 513.

[0081] It is easy to understand that the module housing 510 can be understood as a semi-enclosed structural member, which facilitates the installation and positioning of the overall structure of the circuit board 100 and the laser 200.

[0082] At the same time, it should be noted that since the laser 200 emits the laser 10 from the side, in this embodiment, the edge of the second side panel 512 and the edge of the first side panel 511 are connected at a right angle, and the circuit board 100 and the first side panel 511 are parallel, so that the laser 10 of the laser 200 can be directly emitted from the front side wall 1110 of the radar housing 1100 without adding an optical reflector, thereby reducing the process difficulty and ensuring the reliability of the overall structure of the circuit board 100 and the laser 200.

[0083] At the same time, the overall structure of the circuit board 100 and the laser 200 is arranged in the module housing 510, and thus does not need to be fixed on the optical machine 1200 or the internal frame of the laser radar.

[0084] In addition, the laser radar also includes an optical engine 1200 , which is disposed in the radar housing 1100 . The laser 10 emitted by the laser 200 passes through the laser through hole 5131 , and then passes through the optical engine 1200 , and then is emitted from the front side wall 1110 .

[0085] It should be noted that the radar housing 1100 has a relative front side wall 1110 (which can be understood as the front window of the radar housing 1100) and a rear side wall 1120, the first thermal conductive layer 520 contacts the rear side wall 1120 of the radar housing 1100, and the laser 10 emitted by the laser 200 is used to pass through the front side wall 1110.

[0086] That is to say, the module housing is installed at the rear of the radar housing 1100, and is closely attached to the inner wall of the rear side wall 1120 of the radar housing 1100 through the first heat-conducting layer 520, so that the heat generated by the operation of the laser 200 is transferred in the following main paths: laser 200, PCB board, second heat-conducting layer 530, module housing, first heat-conducting layer 520, rear side wall 1120 of the radar housing 1100, and then released to the external environment. This shortens the heat transfer path from the laser 200 to the external environment and reduces the thermal resistance of the radar system.

[0087] That is to say, the overall structure of the circuit board 100 and the laser 200 is installed in a semi-enclosed structural component, one side of which is coated with thermal conductive gel and is tightly attached to the inner side of the rear wall of the radar housing 1100, so that heat can be quickly transferred to the radar housing 1100 through the semi-enclosed structural component and then dissipated into the external environment.

[0088] In summary, the laser radar heat dissipation design provided in the embodiment of the utility model adopts a variety of means to enhance heat transfer, combined with low-cost improvements to the existing FR-4 epoxy resin laminate PCB board, supplemented by an improved structural design, so that the heat generated by the laser 200 can be easily and quickly transferred to the radar housing 1100, and further dissipated into the external environment, thereby reducing the thermal resistance of the entire radar system, lowering the junction temperature of the laser 200, and improving its performance and life.

[0089] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A laser emission module, characterized in that: include: Circuit board (100); A laser (200), the laser (200) being electrically connected to the circuit board (100); as well as A bottom filling layer (310) is provided between the circuit board (100) and the laser (200), and contacts the circuit board (100) and the laser (200) at the same time.

2. The laser emission module according to claim 1, characterized in that: The bottom filling layer (310) is made by using a bottom filling glue dispensing process.

3. The laser emission module according to claim 1, characterized in that: The laser (200) is electrically soldered to the circuit board (100) to form a solder layer (320); the circuit board (100) and the laser (200) are electrically connected via the solder layer (320); and the solder layer (320) is formed using a reflow soldering process.

4. The laser emission module according to claim 1, characterized in that: The laser emission module further comprises a heat sink (410), and the circuit board (100) is embedded with the heat sink (410).

5. The laser emission module according to claim 4, characterized in that: The circuit board (100) comprises a first surface layer (101) and a second surface layer (103); the laser (200) is arranged on the first surface layer (101); the circuit board (100) is provided with a first thermal via (102); one end of the first thermal via (102) extends to the first surface layer (101); the other end of the first thermal via (102) extends to the heat dissipation plate (410); the second surface layer (103) and the first surface layer (101) are arranged opposite to each other; the circuit board (100) is further provided with a second thermal via (104); one end of the second thermal via (104) extends to the second surface layer (103); and the other end of the second thermal via (104) extends to the heat dissipation plate (410).

6. The laser emission module according to claim 1, characterized in that: The laser emission module further comprises a module housing (510) and a first heat-conducting layer (520); the circuit board (100) and the first heat-conducting layer (520) are both arranged in the module housing (510); and the first heat-conducting layer (520) is used to contact a radar housing (1100).

7. The laser emission module according to claim 6, characterized in that: A partial area of ​​the module housing (510) is opened to form an opening (501), and the opening (501) is used to expose the circuit board (100) and the laser (200).

8. The laser emission module according to claim 6, characterized in that: The module housing (510) comprises a first side plate (511) and a second side plate (512), the first side plate (511) and the second side plate (512) being connected at an angle, the circuit board (100) being arranged on one side of the second side plate (512), and the first heat-conducting layer (520) being arranged on the other side of the second side plate (512); The edge of the second side plate (512) and the edge of the first side plate (511) are connected at a right angle, the circuit board (100) and the first side plate (511) are parallel, and the module housing (510) further comprises a second heat-conducting layer (530), wherein the second heat-conducting layer (530) is connected to a side of the circuit board (100) away from the laser (200) and the first side plate (511) at the same time.

9. A laser radar, characterized in that: It comprises a radar housing (1100) and a laser emission module according to any one of claims 1 to 8, wherein the laser emission module is arranged in the radar housing (1100).

10. A laser radar, characterized in that: The invention comprises a radar housing (1100) and the laser emission module according to any one of claims 6 to 8, wherein the radar housing (1100) has a front side wall (1110) and a rear side wall (1120) opposite to each other, the first heat conductive layer (520) contacts the rear side wall (1120) of the radar housing (1100), and the laser (10) emitted by the laser (200) is used to pass through the front side wall (1110); The laser radar further comprises an optical machine (1200), wherein the optical machine (1200) is arranged on the radar housing (1100), and the laser (10) emitted by the laser (200) is used to pass through the optical machine (1200) and then be emitted out of the front side wall (1110).

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