Pressure-sensitive switching device

Abstract

The utility model provides a pressure-sensitive switch device, which comprises a first film, a first lead, a second lead, a second film, a pressure sensing layer, a support plate and an elastic body, the first lead is arranged on the first film, the second lead is arranged on the first film and is separated from the first lead, the second film is arranged above the first film, and the pressure sensing layer is arranged on the second film. The pressure sensing layer is arranged on the second film and makes contact with the first wire and the second wire, the first wire is electrically connected with the second wire through the pressure sensing layer, the supporting plate is located below the first film and provided with a groove, and the elastic body is located above the pressure sensing layer and comprises a deformation part and a protruding part. The deformation part is configured to generate deformation to drive the protruding part to move, the pressure sensing layer receives pressure from the protruding part to generate a switching signal corresponding to the pressure, the switching signal is associated with the variation of the pressure, and the pressure sensing type switching device can generate a switching signal between a pressed state and a non-pressed state.

Description

Technical Field

[0001] The utility model relates to the technical field of pressure-sensitive switches, in particular to a pressure-sensitive switch device. Background Art

[0002] The keys of the keyboard can be formed by Hall-effect switches, optical switches or mechanical switches. However, the mechanical switches cannot provide switch signals of other states between the pressed state and the unpressed state.

[0003] Therefore, how to propose a pressure-sensitive switch device that can solve the above problems is one of the problems that the industry is eager to invest research and development resources to solve. Utility Model Content

[0004] In view of this, an object of the present invention is to provide a pressure-sensitive switch device that can solve the above-mentioned problem.

[0005] In order to achieve the above-mentioned purpose, according to an embodiment disclosed by the utility model, a pressure-sensitive switch device includes a first film, a first wire, a second wire, a second film, a pressure-sensitive layer, a support plate and an elastic body, the first wire is arranged on the first film, the second wire is arranged on the first film and separated from the first wire, the second film is located above the first film, the pressure-sensitive layer is arranged on the second film and contacts the first wire and the second wire, the first wire is electrically connected to the second wire through the pressure-sensitive layer, the support plate is located below the first film, the top surface of the support plate has a groove, the pressure-sensitive layer is located within the range of the groove, the elastic body is located above the pressure-sensitive layer, the elastic body includes a deformation part and a protrusion part, the deformation part is located on the second film, the deformation part and the second film form a accommodating space, the protrusion part extends from the deformation part and protrudes toward the pressure-sensitive layer, the deformation part is configured to generate deformation to drive the protrusion part to move, the pressure-sensitive layer receives pressure from the protrusion part to generate a switch signal corresponding to the pressure, and the switch signal is associated with the change in pressure.

[0006] In one or more embodiments disclosed in the present invention, the first conductive line and the second conductive line are in the same layer.

[0007] In one or more embodiments disclosed in the present invention, the first conductive line, the second conductive line and the pressure sensing layer are disposed between the first film and the second film.

[0008] In one or more embodiments disclosed in the present invention, the pressure sensing layer is separated from the first film by a first conductive line and a second conductive line.

[0009] In one or more embodiments disclosed in the present invention, the elastomer further includes a fixing portion and an annular convex wall, wherein the fixing portion is disposed on the top surface of the second film and connected to the deformation portion, the fixing portion surrounds an end of the deformation portion close to the second film, the annular convex wall is disposed on the deformation portion and located at an end of the deformation portion away from the second film, and the annular convex wall extends away from the second film.

[0010] In order to achieve the above-mentioned purpose, according to an embodiment disclosed in the utility model, a pressure-sensitive switch device includes a film, a first wire, a second wire, a pressure-sensitive layer and an elastic body, the first wire is arranged on the bottom surface of the film, the second wire is arranged on the bottom surface of the film and is separated from the first wire, the pressure-sensitive layer is arranged on the bottom surface of the film and is located between the first wire and the second wire, the pressure-sensitive layer contacts the first wire and the second wire, the first wire is electrically connected to the second wire through the pressure-sensitive layer, the elastic body is located above the pressure-sensitive layer, the elastic body includes a deformation part and a protruding part, the deformation part is located on the film, the deformation part and the film form a containing space, the protruding part extends from the deformation part and protrudes toward the pressure-sensitive layer, the deformation part is configured to generate deformation to drive the protruding part to move in the containing space, the pressure-sensitive layer receives pressure from the protruding part to generate a switch signal corresponding to the pressure, and the switch signal is associated with the change in pressure.

[0011] In one or more embodiments disclosed in the present invention, the first conductive line and the second conductive line are in the same layer.

[0012] In one or more embodiments disclosed in the present invention, the pressure-sensitive switch device further includes a support plate located below the film, and a first wire and a second wire are disposed between the film and the support plate.

[0013] In one or more embodiments disclosed in the present invention, the first conductive line, the second conductive line and the pressure sensing layer are in the same layer.

[0014] In one or more embodiments disclosed in the present invention, the pressure-sensitive switch device further includes a support plate located below the film, the top surface of the support plate has a groove, and the groove is located below the first wire, the second wire and the pressure-sensitive layer.

[0015] In one or more embodiments disclosed in the present invention, the elastomer further includes a fixing portion and an annular convex wall, wherein the fixing portion is disposed on the top surface of the film and connected to the deformation portion, the fixing portion surrounds an end of the deformation portion close to the film, the annular convex wall is disposed on the deformation portion and located at an end of the deformation portion away from the film, and the annular convex wall extends away from the film.

[0016] In one or more embodiments disclosed in the present invention, the pressure-sensitive switch device further includes another film located below the film, and the other film has a through hole located directly below the pressure-sensitive layer.

[0017] In one or more embodiments disclosed in the present invention, the pressure-sensitive switch device further comprises another film and a support plate, the support plate is located below the film and the other film is disposed between the film and the support plate, the top surface of the support plate has a groove, and the other film has a perforation located directly below the pressure-sensitive layer, and the perforation is located within the range of the groove.

[0018] In one or more embodiments disclosed in the present invention, the pressure-sensitive switch device further includes another film located below the film, and the first wire, the second wire and the pressure-sensitive layer are disposed between the film and the other film.

[0019] In one or more embodiments disclosed in the present invention, the pressure-sensitive switch device further includes an insulating layer and a support plate, wherein the support plate is located below the film and the insulating layer is disposed between the film and the support plate, the top surface of the support plate has a groove and the insulating layer covers the first wire, the second wire and the pressure sensing layer.

[0020] In order to achieve the above-mentioned purpose, according to an embodiment disclosed in the utility model, a pressure-sensitive switch device includes a film, a pressure-sensitive layer, a first wire, a second wire and an elastomer, the pressure-sensitive layer is arranged on the top surface of the film, the first wire is arranged above the film, the second wire is arranged above the film and separated from the first wire, the elastomer is located above the pressure-sensitive layer, the elastomer includes a deformation part and a protruding part, the deformation part is located on the film, the deformation part and the film form a accommodating space, the protruding part extends from the deformation part and protrudes toward the pressure-sensitive layer, the deformation part is configured to generate deformation to drive the protruding part to move in the accommodating space, the pressure-sensitive layer receives pressure from the protruding part to generate a switch signal corresponding to the pressure, and the switch signal is related to the change in pressure.

[0021] In one or more embodiments disclosed in the present invention, the pressure sensing layer is located between the first conductive line and the second conductive line and contacts the first conductive line and the second conductive line.

[0022] In one or more embodiments disclosed in the present invention, the pressure-sensitive switch device further includes a support plate located below the film, and the film is disposed between the pressure-sensitive layer and the support plate.

[0023] In one or more embodiments disclosed in the present invention, the pressure sensing layer covers the first conductive line and the second conductive line.

[0024] In one or more embodiments disclosed in the present invention, the first conductive line and the second conductive line are disposed on the pressure sensing layer.

[0025] In one or more embodiments disclosed in the present invention, the first conductive line, the second conductive line and the pressure sensing layer are in the same layer.

[0026] In one or more embodiments disclosed in the present invention, the pressure-sensitive switch device further includes a support plate located below the film, and the support plate has a groove located below the pressure-sensitive layer.

[0027] In one or more embodiments disclosed in the present invention, the pressure-sensitive switch device further includes another film located on the film, and the film has a through hole located directly below the pressure-sensitive layer.

[0028] In one or more embodiments disclosed in the present invention, the pressure-sensitive switch device further includes another film and a support plate, wherein the support plate is located below the other film and the film is arranged between the other film and the support plate, the top surface of the support plate has a groove, and the film has a perforation located directly below the pressure-sensitive layer, and the perforation is located within the range of the groove.

[0029] In one or more embodiments disclosed in the present invention, the pressure-sensitive switch device further includes another film located above the film, and the first wire, the second wire and the pressure-sensitive layer are disposed between the film and the other film.

[0030] In one or more embodiments disclosed in the present invention, the pressure-sensitive switch device further includes an insulating layer and a support plate, wherein the support plate is located below the film and the insulating layer is disposed above the film, the top surface of the support plate has a groove and the insulating layer covers the first wire, the second wire and the pressure-sensitive layer.

[0031] To summarize, in the pressure-sensitive switch device disclosed in the present invention, since the deformation portion of the elastic body can be deformed in one direction by the user's pressure to drive the protruding portion to move, and the elastic body elastically recovers when the user no longer presses, the user can repeatedly press the pressure-sensitive switch device that serves as a keyboard key.

[0032] In the pressure-sensitive switch device disclosed in the present invention, since the pressure-sensitive layer contains piezoelectric material, when the protruding portion of the elastic body is pressed toward the pressure-sensitive layer, the resistance value of the pressure-sensitive layer will change with the pressure of the pressure, so that when the user presses the pressure-sensitive switch device, a switch signal associated with the change in pressure can be generated.

[0033] In the pressure-sensitive switch device disclosed in the present invention, since the pressure-sensitive switch device may include only two layers or even one layer of film, the pressure-sensitive switch device may utilize a minimum number of films to simultaneously achieve the effects of saving materials and protecting wires.

[0034] In the pressure-sensitive switch device disclosed in the present invention, since the first conductive wire and the second conductive wire are in the same layer, the overall thickness of the pressure-sensitive switch device can be reduced, thereby reducing the volume of the pressure-sensitive switch device.

[0035] In the pressure-sensitive switch device disclosed in the utility model, since the support plate can have a groove and the pressure-sensitive layer is located above the groove, the pressure-sensitive layer can have more room for change when pressed by the user, thereby enhancing the user's experience when pressing the keyboard keys. In this way, compared with the traditional mechanical switch that can only generate an all-or-nothing switch signal of a pressed state and a non-pressed state, the pressure-sensitive switch device disclosed in the utility model can generate a switch signal between a pressed state and a non-pressed state, thereby increasing the flexibility and possibility of keyboard keys in the field of e-sports.

[0036] The above description is only used to illustrate the problem to be solved by the present disclosure, the technical means to solve the problem, and the effects produced, etc. The specific details of the present disclosure will be described in detail in the following implementation methods and related drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to make the above and other purposes, features, advantages and embodiments disclosed by the present invention more clearly understood, the attached drawings are described as follows:

[0038] Figure 1 is a three-dimensional diagram of a pressure-sensitive switch device according to an embodiment of the present invention;

[0039] Figure 2 According to an embodiment of the present invention, Figure 1 A schematic cross-sectional view of a pressure-sensitive switch device along a cutting line AA';

[0040] Figure 3 is a cross-sectional view of a pressure-sensitive switch device according to an embodiment of the present invention;

[0041] Figure 4 is a cross-sectional view of a pressure-sensitive switch device according to an embodiment of the present invention;

[0042] Figure 5 is a top view of a conductor layer according to an embodiment of the present invention;

[0043] Figure 6 is a three-dimensional diagram of a pressure-sensitive switch device according to an embodiment of the present invention;

[0044] Figure 7 According to an embodiment of the present invention, Figure 6 A schematic cross-sectional view of a pressure-sensitive switch device along a cutting line BB';

[0045] Figure 8 is a cross-sectional view of a pressure-sensitive switch device according to an embodiment of the present invention;

[0046] Fig. 9 is a cross-sectional view of a pressure-sensitive switch device according to an embodiment of the present invention;

[0047] Fig.10 is a cross-sectional view of a pressure-sensitive switch device according to an embodiment of the present invention;

[0048] Fig.11 is a cross-sectional view of a pressure-sensitive switch device according to an embodiment of the present invention;

[0049] Fig.12 is a cross-sectional view of a pressure-sensitive switch device according to an embodiment of the present invention;

[0050] Fig.13 is a cross-sectional view of a pressure-sensitive switch device according to an embodiment of the present invention;

[0051] Fig.14 is a cross-sectional view of a pressure-sensitive switch device according to an embodiment of the present invention;

[0052] Fig.15 is a cross-sectional view of a pressure-sensitive switch device according to an embodiment of the present invention;

[0053] Fig.16 is a cross-sectional view of a pressure-sensitive switch device according to an embodiment of the present invention;

[0054] Fig.17 is a cross-sectional view of a pressure-sensitive switch device according to an embodiment of the present invention;

[0055] Fig.18 is a cross-sectional view of a pressure-sensitive switch device according to an embodiment of the present invention;

[0056] Fig.19 is a cross-sectional view of a pressure-sensitive switch device according to an embodiment of the present invention;

[0057] Fig. 20 is a cross-sectional view of a pressure-sensitive switch device according to an embodiment of the present invention;

[0058] Fig.21 is a cross-sectional view of a pressure-sensitive switch device according to an embodiment of the present invention;

[0059] Fig. 22 is a cross-sectional view of a pressure-sensitive switch device according to an embodiment of the present invention;

[0060] Fig.23 is a cross-sectional view of a pressure-sensitive switch device according to an embodiment of the present invention;

[0061] Fig.24 is a cross-sectional view of a pressure-sensitive switch device according to an embodiment of the present invention;

[0062] Fig.25 is a cross-sectional view of a pressure-sensitive switch device according to an embodiment of the present invention;

[0063] Fig.26 is a cross-sectional view of a pressure-sensitive switch device according to an embodiment of the present invention;

[0064] Fig. 27 is a cross-sectional view of a pressure-sensitive switch device according to an embodiment of the present invention;

[0065] Fig.28 is a cross-sectional view of a pressure-sensitive switch device according to an embodiment of the present invention;

[0066] Fig.29 is a cross-sectional view of a pressure-sensitive switch device according to an embodiment of the present invention;

[0067] Fig.30 is a top view of a conductor layer according to an embodiment of the present invention;

[0068]

Main component symbol description

[0069] 100,200: switch device;

[0070] 110,210: first film;

[0071] 110a, 130a, 210a, 230a, SPa: top surface;

[0072] 120,220: conductor layer;

[0073] 121,221: first wire;

[0074] 1211, 1212, 1213, 1214, 2211, 2212, 2213, 2214: first sub-conductor;

[0075] 122, 222: second wire;

[0076] 1221, 1222, 1223, 1224, 2221, 2222, 2223, 2224: second sub-conductor;

[0077] 130, 230: second film;

[0078] 130b, 210b, 230b: bottom surface;

[0079] 140,240: Elastomer;

[0080] 142,242: fixed part;

[0081] 144,244: deformation part;

[0082] 146,246:Protrusion;

[0083] 148,248: Annular convex wall;

[0084] A-A', B-B': secant line;

[0085] AS: Accommodation space;

[0086] IL: insulation layer;

[0087] PSL: Pressure Sensing Layer;

[0088] R: groove;

[0089] ROW1: first row;

[0090] ROW2: the second row;

[0091] ROW3: the third row;

[0092] ROW4: the fourth row;

[0093] SP: support plate;

[0094] TH: perforation;

[0095] X,Y,Z: direction. DETAILED DESCRIPTION

[0096] The following will disclose multiple embodiments of the utility model with the accompanying drawings. For the purpose of clear description, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present disclosure. That is, in some embodiments of the present disclosure, these practical details are not necessary. In addition, in order to simplify the drawings, some conventional structures and components will be depicted in a simple schematic manner in the drawings. The same reference numerals will be used to represent the same or similar components in all drawings.

[0097] The structure and function of each component included in the pressure-sensitive switch device 100 of this embodiment and the connection relationship between the components will be described in detail below.

[0098] Please refer to Figure 1 . Figure 1 FIG. 1 is a perspective view of a pressure-sensitive switch device 100 according to an embodiment of the present disclosure. Figure 1As shown, in this embodiment, the pressure-sensitive switch device 100 includes a first film 110, a wire layer 120, a second film 130, and an elastomer 140. The first film 110, the wire layer 120, the second film 130, and the elastomer 140 are arranged substantially along a bottom-up direction (e.g., direction Z). In some embodiments, the second film 130 is located above the first film 110. The wire layer 120 is disposed between the first film 110 and the second film 130. The elastomer 140 is disposed above the wire layer 120, and the elastomer 140 is configured to receive pressure to energize the wire layer 120 and generate a switch signal (Switch Signal). As shown in FIG. Figure 1 As shown, the pressure-sensitive switch device 100 is illustrated as including sixteen elastic bodies 140 , but the present disclosure is not intended to limit the number of the elastic bodies 140 .

[0099] In some embodiments, the pressure-sensitive switch device 100 is configured to constitute a key of a keyboard and is configured to generate switch signals corresponding to two states of unpressed and pressed. In some embodiments, the pressure-sensitive switch device 100 can be applied to, for example, a membrane keyboard or other suitable types of keyboards.

[0100] In some embodiments, the elastic body 140 is configured to receive a pressing operation from a user.

[0101] In some embodiments, the materials of the first film 110 and the second film 130 may include, for example, plastic or other suitable insulating materials.

[0102] In some embodiments, the material of the wire layer 120 may include, for example, metal or other suitable conductive materials.

[0103] In some embodiments, the material of the elastic body 140 may include, for example, rubber, plastic, or other suitable insulating materials.

[0104] In some embodiments, the elastic body 140 may be, for example, rubber, a spring, an elastic sheet, foam, plastic, or other suitable elastic materials.

[0105] Please refer to Figure 2 . Figure 2 According to one embodiment of the present disclosure, Figure 1 A schematic cross-sectional view of the pressure-sensitive switch device 100 along the cutting line AA'. Figure 2 As shown in FIG. 1 , in this embodiment, the wire layer 120 includes a first wire 121 and a second wire 122. The first wire 121 and the second wire 122 are disposed on the first film 110, and the second wire 122 is separated from the first wire 121. Figure 2 As shown, in this embodiment, the pressure-sensitive switch device 100 further includes a pressure-sensitive layer PSL. The pressure-sensitive layer PSL is disposed on the second film 130. In some embodiments, the pressure-sensitive layer PSL contacts the first wire 121 and the second wire 122 that are separated from each other, so that the first wire 121 can be electrically connected to the second wire 122 through the pressure-sensitive layer PSL. Figure 2 As shown, the first wire 121, the second wire 122 and the pressure sensing layer PSL are disposed between the first film 110 and the second film 130. This allows the first wire 121, the second wire 122 and the pressure sensing layer PSL to be protected by the first film 110 and the second film 130, thereby extending the service life of the wire layer 120 and the pressure sensing layer PSL.

[0106] like Figure 2 As shown in the embodiment, the elastic body 140 includes a fixing portion 142, a deforming portion 144, a protruding portion 146 and an annular convex wall 148. The fixing portion 142 is disposed on the second film 130. The deforming portion 144 is connected to the fixing portion 142 and is located on the second film 130. Figure 2 As shown, the deformation portion 144 and the second film 130 form an accommodation space AS. In some embodiments, the deformation portion 144 has a dome shape. Figure 2 As shown, the fixing portion 142 surrounds one end of the deformation portion 144 close to the second film 130. The protrusion 146 extends from the deformation portion 144. The protrusion 146 protrudes toward the pressure sensing layer PSL. The deformation portion 144 is configured to generate deformation (Deformation) to drive the protrusion 146 to move in the accommodating space AS. The annular convex wall 148 is disposed on the deformation portion 144. The annular convex wall 148 is located at one end of the deformation portion 144 away from the second film 130. The annular convex wall 148 extends away from the second film 130. In other words, the protrusion 146 and the annular convex wall 148 are disposed on opposite sides of the top of the deformation portion 144. In some embodiments, a key cap of a keyboard key may be disposed on the annular convex wall 148. This allows the user to drive the annular convex wall 148 to move toward the direction of the pressure sensing layer PSL by pressing the key cap, and at the same time cause the deformation portion 144 to deform.

[0107] like Figure 2 As shown, in some embodiments, the protrusion 146 is elongated and extends in a direction (eg, direction Z) from an end close to the annular convex wall 148 to an end close to the second film 130 .

[0108] like Figure 2 As shown, in some embodiments, the pressure sensing layer PSL is separated from the first film 110 by a first conductive line 121 and a second conductive line 122 .

[0109] Please refer to Figure 3 . Figure 3 FIG. 1 is a cross-sectional view of a pressure-sensitive switch device 100 according to an embodiment of the present disclosure. Figure 3 As shown, in this embodiment, the first film 110 has a top surface 110a. The second film 130 has a top surface 130a and a bottom surface 130b. The first wire 121 and the second wire 122 are disposed on the top surface 110a of the first film 110. In some embodiments, the manufacturer may print the first wire 121 and the second wire 122 on the top surface 110a of the first film 110. The pressure sensing layer PSL is disposed on the bottom surface 130b of the second film 130. The fixing portion 142 of the elastic body 140 is disposed on the top surface 130a of the second film 130. Figure 3 As shown, in some embodiments, the first wire 121 and the second wire 122 are in the same layer. In other words, the first wire 121, the second wire 122 and the pressure sensing layer PSL are stacked up and down. This allows the thickness of the pressure sensing switch device 100 to be reduced.

[0110] The following will describe in detail how the pressure-sensitive switch device 100 generates a switch signal.

[0111] Please continue to refer to Figure 3 . In a usage scenario, when the pressure-sensitive switch device 100 is in a first state where it is not pressed by a user, the protrusion 146 does not contact the second film 130, and the protrusion 146 does not apply pressure to the pressure-sensitive layer PSL. In the first state, the pressure-sensitive layer PSL that contacts the first wire 121 and the second wire 122 at the same time forms a circuit with current flowing through the first wire 121 and the second wire 122. Next, when the pressure-sensitive switch device 100 is in a second state where it is pressed by a user, the deformation portion 144 deforms to drive the protrusion 146 to move in the accommodating space AS, and the protrusion 146 contacts the second film 130 and applies pressure to the pressure-sensitive layer PSL. In the second state, the pressure-sensitive layer PSL that contacts the first wire 121 and the second wire 122 at the same time receives the above-mentioned pressure from the protrusion 146, causing the resistance value of the pressure-sensitive layer PSL to change. The pressure change caused by the above-mentioned pressure on the pressure-sensitive layer PSL causes the current to change to generate a switch signal. In other words, the switch signal is associated with the change in the pressure. Then, when the user stops pressing the pressure-sensitive switch device 100 and returns from the second state to the first state, the elastic body 140 is elastic, so the elastic body 140 elastically recovers to the same state. Figure 3 The state shown.

[0112] In a usage scenario, when the user applies a larger pressure to the pressure sensing layer PSL through the elastic body 140, the pressure sensing switch device 100 can generate a switch signal corresponding to the larger pressure. When the user applies a smaller pressure to the pressure sensing layer PSL through the elastic body 140, the pressure sensing switch device 100 can generate a switch signal corresponding to the smaller pressure. Therefore, the pressure sensing switch device 100 disclosed in the present invention can generate a switch signal between all and nothing.

[0113] In some embodiments, the material of the pressure sensing layer PSL may include, for example, a piezoelectric material or other materials that may trigger a piezoelectric effect. In some embodiments, the pressure sensing layer PSL may include, for example, barium titanate (BaTiO3), lead titanate (PbTiO3), lead zirconate titanate (PZT), lithium niobate (LiNbO3), potassium niobate (KNbO3), quartz (SiO2), tourmaline, potassium sodium tartrate, zinc oxide (ZnO), or other suitable piezoelectric materials.

[0114] Please refer to Figure 4 . Figure 4 FIG. 1 is a cross-sectional view of a pressure-sensitive switch device 100 according to an embodiment of the present disclosure. Figure 4 As shown, in this embodiment, the pressure-sensitive switch device 100 further includes a support plate SP. The top surface SPa of the support plate SP has a groove R. In some embodiments, the pressure-sensitive layer PSL is located within the range of the groove R. This allows the pressure-sensitive layer PSL to have more room for change when pressed by the user, thereby enhancing the user's experience when pressing the keyboard keys.

[0115] Please refer to Figure 5 . Figure 5 FIG. 1 is a top view of the conductive line layer 120 according to an embodiment of the present disclosure. Figure 5 As shown, in this embodiment, the first conductive line 121 and the second conductive line 122 have circuit patterns, and the circuit patterns are distributed on a plane defined by the direction X and the direction Y (ie, the XY plane). Figure 5 As shown, the circuit pattern formed by the first conductive line 121 and the second conductive line 122 is divided into a first row ROW1, a second row ROW2, a third row ROW3 and a fourth row ROW4. Figure 5As shown, in some embodiments, the first wire 121 further includes a first sub-wire 1211, a first sub-wire 1212, a first sub-wire 1213, and a first sub-wire 1214. The second wire 122 further includes a second sub-wire 1221, a second sub-wire 1222, a second sub-wire 1223, and a second sub-wire 1224. In some embodiments, the portion of the circuit pattern of the first wire 121 is C-shaped. Specifically, the distribution range of a C-shaped portion of the first wire 121 is configured to control a switch signal of a keyboard key. However, the present disclosure is not intended to limit the shape of the circuit pattern of the wire layer 120.

[0116] like Figure 5 As shown, in this embodiment, the first sub-conductor 1211 and the second sub-conductor 1221 control the switch signal of the first row ROW1. The first sub-conductor 1212 and the second sub-conductor 1222 control the switch signal of the second row ROW2. The first sub-conductor 1213 and the second sub-conductor 1223 control the switch signal of the third row ROW3. The first sub-conductor 1214 and the second sub-conductor 1224 control the switch signal of the fourth row ROW4.

[0117] Through the aforementioned structural configuration, the pressure-sensitive switch device 100 can apply different degrees of pressure to the pressure-sensitive layer PSL by pressing the elastic body 140 to generate a switch signal associated with the change in the different degrees of pressure.

[0118] The structure and function of each component included in the pressure-sensitive switch device 200 according to an embodiment of the present disclosure and the connection relationship between the components are described in detail below.

[0119] Please refer to Figure 6 . Figure 6 FIG. 2 is a perspective view of a pressure-sensitive switch device 200 according to an embodiment of the present disclosure. Figure 6 As shown in FIG. 6 , in this embodiment, the pressure-sensitive switch device 200 includes a first film 210, a wire layer 220, a second film 230, and an elastic body 240. Since the structure of the pressure-sensitive switch device 200 in FIG. 6 is similar to the structure of the pressure-sensitive switch device 100 in FIG. 1 , it will not be described in detail here. Figure 6 As shown, the pressure-sensitive switch device 200 is illustrated as including sixteen elastic bodies 240 , but the present disclosure is not intended to limit the number of the elastic bodies 240 .

[0120] Please refer to Figure 7 . Figure 7 According to one embodiment of the present disclosure, Figure 6 A cross-sectional diagram of the pressure-sensitive switch device 200 along the cutting line BB'. Figure 7As shown, in this embodiment, the pressure-sensitive switch device 200 includes a support plate SP, a first film 210 and a wire layer 220. In some embodiments, the support plate SP is distributed over the entire surface. The first film 210 is disposed above the support plate SP. The wire layer 220 is disposed above the support plate SP. Figure 7 As shown, the wire layer 220 includes a first wire 221 and a second wire 222. The first wire 221 and the second wire 222 are disposed on the first film 210. In some embodiments, the first wire 221 and the second wire 222 are disposed on the bottom surface 210b of the first film 210. Figure 7 As shown, in this embodiment, the pressure-sensitive switch device 200 further includes a pressure-sensitive layer PSL. The pressure-sensitive layer PSL is disposed on the first film 210. In some embodiments, the pressure-sensitive layer PSL is disposed on the bottom surface 210b of the first film 210. The pressure-sensitive layer PSL is located between the first wire 221 and the second wire 222. The second wire 222 is separated from the first wire 221 by the pressure-sensitive layer PSL. In some embodiments, the pressure-sensitive layer PSL contacts the first wire 221 and the second wire 222 that are separated from each other, so that the first wire 221 can be electrically connected to the second wire 222 through the pressure-sensitive layer PSL. Figure 2 As shown, the first wire 221, the second wire 222 and the pressure sensing layer PSL are disposed between the first film 210 and the support plate SP. This allows the first wire 221, the second wire 222 and the pressure sensing layer PSL to be protected by the first film 210 and the support plate SP, thereby extending the service life of the wire layer 220 and the pressure sensing layer PSL. Figure 7 As shown, in this embodiment, the support plate SP has a groove R. The groove R is located below the first wire 221, the second wire 222 and the pressure sensing layer PSL. In some embodiments, the pressure sensing layer PSL is located within the range of the groove R. This allows the pressure sensing layer PSL to have more room for change when pressed by the user, thereby enhancing the user experience when pressing the keyboard keys.

[0121] like Figure 7 As shown, in this embodiment, the elastic body 240 includes a fixing portion 242, a deforming portion 244, a protruding portion 246 and an annular convex wall 248. Since the structural configuration of the elastic body 240 is similar to that of the elastic body 140, it will not be described again here.

[0122] like Figure 7 As shown, in some embodiments, the protrusion 246 is elongated in a direction (eg, direction Z) from an end close to the annular convex wall 248 to an end close to the second film 230 .

[0123] like Figure 7As shown, in some embodiments, the pressure sensing layer PSL is separated from the support plate SP by a groove R.

[0124] Please refer to Figure 8 . Figure 8 FIG. 2 is a cross-sectional view of a pressure-sensitive switch device 200 according to an embodiment of the present disclosure. Figure 8 As shown in FIG. 1 , in this embodiment, the support plate SP has a top surface SPa. The first film 210 has a top surface 210a and a bottom surface 210b. Figure 8 As shown, the groove R of the support plate SP is located on the top surface SPa of the support plate SP. The first wire 221 and the second wire 222 are disposed on the bottom surface 210b of the first film 210. In some embodiments, the manufacturer may print the first wire 221 and the second wire 222 on the bottom surface 210b of the first film 210. The pressure sensing layer PSL is disposed on the bottom surface 210b of the first film 210. The fixing portion 242 of the elastic body 240 is disposed on the top surface 210a of the first film 210. Figure 8 As shown, in some embodiments, the first wire 221, the second wire 222 and the pressure sensing layer PSL are in the same layer. In other words, the first wire 221, the second wire 222 and the pressure sensing layer PSL are arranged side by side. This allows the thickness of the pressure sensing switch device 200 to be reduced.

[0125] The following will describe in detail how the pressure-sensitive switch device 200 generates a switch signal.

[0126] Please continue to refer to Figure 8 . In a usage scenario, when the pressure-sensitive switch device 200 is in a first state where it is not pressed by a user, the protrusion 246 does not contact the first film 210, and the protrusion 246 does not apply pressure to the pressure-sensitive layer PSL. In the first state, the pressure-sensitive layer PSL that contacts the first wire 221 and the second wire 222 at the same time forms a circuit with current flowing through the first wire 221 and the second wire 222. Next, when the pressure-sensitive switch device 200 is in a second state where it is pressed by a user, the deformation portion 244 deforms to drive the protrusion 246 to move in the accommodating space AS, and the protrusion 246 contacts the first film 210 and applies pressure to the pressure-sensitive layer PSL. In the second state, the pressure-sensitive layer PSL that contacts the first wire 221 and the second wire 222 at the same time receives the above-mentioned pressure from the protrusion 246, causing the resistance value of the pressure-sensitive layer PSL to change. The pressure change caused by the above-mentioned pressure on the pressure-sensitive layer PSL causes the current to change to generate a switch signal. In other words, the switch signal is associated with the change in the pressure. Then, when the user stops pressing the pressure-sensitive switch device 200 and returns from the second state to the first state, the elastic body 240 is elastic, so the elastic body 240 elastically recovers to the same state. Figure 8 The state shown.

[0127] In a usage scenario, when the user applies a larger pressure to the pressure sensing layer PSL through the elastic body 240, the pressure sensing switch device 200 can generate a switch signal corresponding to the larger pressure. When the user applies a smaller pressure to the pressure sensing layer PSL through the elastic body 240, the pressure sensing switch device 200 can generate a switch signal corresponding to the smaller pressure. Therefore, the pressure sensing switch device 200 disclosed in the present disclosure can generate a switch signal between all and nothing.

[0128] Please refer to Fig. 9 . Fig. 9 is a cross-sectional view of a pressure-sensitive switch device 200 according to an embodiment of the present disclosure. Fig. 9 The structural configuration of the pressure-sensitive switch device 200 is substantially similar to the structural configuration of the pressure-sensitive switch device 200 of FIG. 8 , except that Fig. 9 The pressure-sensitive switch device 200 further includes a second film 230 but does not include a support plate SP. Fig. 9 As shown, the second film 230 has a perforation TH located directly below the pressure sensing layer PSL. This allows the pressure sensing layer PSL to have more room for change when pressed by the user, thereby enhancing the user's experience when pressing the keyboard keys. Fig. 9 The structural configuration of the pressure-sensitive switch device 200 is Figure 8 The structural configuration of the pressure-sensitive switch device 200 is roughly similar, so it will not be repeated here.

[0129] Please refer to Fig.10 . Fig.10 is a cross-sectional view of a pressure-sensitive switch device 200 according to an embodiment of the present disclosure. Fig.10 The structural configuration of the pressure-sensitive switch device 200 is Figure 8 The structure and configuration of the pressure-sensitive switch device 200 are roughly similar, and the difference is that Fig.10 The pressure-sensitive switch device 200 further comprises a second film 230. Fig.10 As shown, the support plate SP is located below the first film 210 and the second film 230 is disposed between the first film 210 and the support plate SP. The top surface SPa of the support plate SP has a groove R. Fig.10 As shown, the second film 230 has a perforation TH located directly below the pressure sensing layer PSL. The first wire 221 and the second wire 222 are disposed on the top surface 230a of the second film 230. In some embodiments, the perforation TH is located within the range of the groove R. This allows the pressure sensing layer PSL to have double the change space when pressed by the user, thereby further enhancing the user's experience when pressing the keyboard keys. Fig.10The structural configuration of the pressure-sensitive switch device 200 is Figure 8 The structural configuration of the pressure-sensitive switch device 200 is roughly similar, so it will not be repeated here.

[0130] Please refer to Fig.11 . Fig.11 is a cross-sectional view of a pressure-sensitive switch device 200 according to an embodiment of the present disclosure. Fig.11 The structural configuration of the pressure-sensitive switch device 200 is Fig. 9 The structure and configuration of the pressure-sensitive switch device 200 are roughly similar, and the difference is that Fig.11 The second film 230 of the pressure-sensitive switch device 200 does not have a perforation TH. Fig.11 The structural configuration of the pressure-sensitive switch device 200 is Fig. 9 The structural configuration of the pressure-sensitive switch device 200 is roughly similar, so it will not be repeated here.

[0131] Please refer to Fig.12 . Fig.12 is a cross-sectional view of a pressure-sensitive switch device 200 according to an embodiment of the present disclosure. Fig.12 The structural configuration of the pressure-sensitive switch device 200 is Figure 8 The structure and configuration of the pressure-sensitive switch device 200 are roughly similar, and the difference is that Fig.12 The pressure-sensitive switch device 200 further comprises an insulating layer IL. Fig.12 As shown, the insulating layer IL is disposed between the first film 210 and the support plate SP. Fig.12 As shown, the insulating layer IL covers the first wire 221, the second wire 222 and the pressure sensing layer PSL. This allows the pressure sensing layer PSL to have a larger change space when pressed by the user, thereby enhancing the user's experience when pressing the keyboard keys. In addition, the insulating layer IL can provide protection for the first wire 221, the second wire 222 and the pressure sensing layer PSL. Fig.12 The structural configuration of the pressure-sensitive switch device 200 is Figure 8 The structural configuration of the pressure-sensitive switch device 200 is roughly similar, so it will not be repeated here.

[0132] Please refer to Fig.13 . Fig.13 is a cross-sectional view of a pressure-sensitive switch device 200 according to an embodiment of the present disclosure. Fig.13 The structural configuration of the pressure-sensitive switch device 200 is Figure 8 The structure and configuration of the pressure-sensitive switch device 200 are roughly similar, and the difference is that Fig.13 The first film 210 is disposed between the pressure sensing layer PSL and the support plate SP. Fig.13As shown, in this embodiment, the first wire 221 and the second wire 222 are disposed above the first film 210. In some embodiments, the first wire 221 and the second wire 222 are disposed on the top surface 210a of the first film 210. And, Fig.13 The pressure sensing layer PSL shown covers the first wire 221 and the second wire 222. In some embodiments, the pressure sensing layer PSL is disposed on the first wire 221 and the second wire 222 and is not disposed between the first wire 221 and the second wire 222. In some embodiments, the groove R is located below the pressure sensing layer PSL.

[0133] Please refer to Fig.14 . Fig.14 is a cross-sectional view of a pressure-sensitive switch device 200 according to an embodiment of the present disclosure. Fig.14 The structural configuration of the pressure-sensitive switch device 200 is Fig.13 The structure and configuration of the pressure-sensitive switch device 200 are roughly similar, and the difference is that Fig.14 The pressure-sensitive switch device 200 further includes a second film 230 but does not include a support plate SP. In addition, the first film 210 has a through hole TH. Fig.14 As shown, the second film 230 is disposed above the first film 210. The first film 210 has a perforation TH located directly below the pressure sensing layer PSL. This allows the pressure sensing layer PSL to have more room for change when pressed by the user, thereby enhancing the user's experience when pressing the keyboard keys. Fig.14 The structural configuration of the pressure-sensitive switch device 200 is Fig.13 The structural configuration of the pressure-sensitive switch device 200 is roughly similar, so it will not be repeated here.

[0134] Please refer to Fig.15 . Fig.15 is a cross-sectional view of a pressure-sensitive switch device 200 according to an embodiment of the present disclosure. Fig.15 The structural configuration of the pressure-sensitive switch device 200 is Fig.14 The structure and configuration of the pressure-sensitive switch device 200 are roughly similar, and the difference is that Fig.15 The pressure-sensitive switch device 200 further includes a support plate SP. Fig.15 As shown, the support plate SP is located below the second film 230 and the first film 210 is disposed between the second film 230 and the support plate SP. The top surface SPa of the support plate SP has a groove R. Fig.15As shown, the first film 210 has a perforation TH located directly below the pressure sensing layer PSL. In some embodiments, the perforation TH is located within the range of the groove R. This allows the pressure sensing layer PSL to have double the change space when pressed by the user, thereby further enhancing the user's experience when pressing the keyboard keys. Fig.15 The structural configuration of the pressure-sensitive switch device 200 is Fig.14 The structural configuration of the pressure-sensitive switch device 200 is roughly similar, so it will not be repeated here.

[0135] like Fig.15 As shown, in some embodiments, the second film 230 has a bottom surface 230 b , and the pressure sensing layer PSL contacts the bottom surface 230 b of the second film 230 .

[0136] Please refer to Fig.16 . Fig.16 is a cross-sectional view of a pressure-sensitive switch device 200 according to an embodiment of the present disclosure. Fig.16 The structural configuration of the pressure-sensitive switch device 200 is Fig.16 The structure and configuration of the pressure-sensitive switch device 200 are roughly similar, and the difference is that Fig.16 The first film 210 of the pressure-sensitive switch device 200 does not have a perforation TH. Fig.16 The structural configuration of the pressure-sensitive switch device 200 is Fig.15 The structural configuration of the pressure-sensitive switch device 200 is roughly similar, so it will not be repeated here.

[0137] Please refer to Fig.17 . Fig.17 is a cross-sectional view of a pressure-sensitive switch device 200 according to an embodiment of the present disclosure. Fig.17 The structural configuration of the pressure-sensitive switch device 200 is Fig.13 The structure and configuration of the pressure-sensitive switch device 200 are roughly similar, and the difference is that Fig.17 The pressure-sensitive switch device 200 further comprises an insulating layer IL. Fig.17 As shown, the insulating layer IL is disposed above the first film 210. Fig.17 As shown, the insulating layer IL covers the first wire 221, the second wire 222 and the pressure sensing layer PSL. This allows the pressure sensing layer PSL to have a larger change space when pressed by the user, thereby enhancing the user's experience when pressing the keyboard keys. In addition, the insulating layer IL can provide protection for the first wire 221, the second wire 222 and the pressure sensing layer PSL. Fig.17 The structural configuration of the pressure-sensitive switch device 200 is Fig.13 The structural configuration of the pressure-sensitive switch device 200 is roughly similar, so it will not be repeated here.

[0138] Please refer to Fig.18 . Fig.18 is a cross-sectional view of a pressure-sensitive switch device 200 according to an embodiment of the present disclosure. Fig.18 The structural configuration of the pressure-sensitive switch device 200 is Fig.13 The structure and configuration of the pressure-sensitive switch device 200 are roughly similar, and the difference is that Fig.18 The pressure sensing layer PSL is located between the first film 210 and the wire layer 220. Fig.18 As shown, in this embodiment, the first wire 221 and the second wire 222 are disposed on the pressure sensing layer PSL. In some embodiments, the first wire 221 and the second wire 222 are separated, so that when the user presses the pressure sensing switch device 200, the protrusion 246 can directly apply pressure to the pressure sensing layer PSL without applying pressure to the first wire 221 and the second wire 222.

[0139] Please refer to Fig.19 . Fig.19 is a cross-sectional view of a pressure-sensitive switch device 200 according to an embodiment of the present disclosure. Fig.19 The structural configuration of the pressure-sensitive switch device 200 is Fig.18 The structure and configuration of the pressure-sensitive switch device 200 are roughly similar, and the difference is that Fig.19 The pressure-sensitive switch device 200 further includes a second film 230 but does not include a support plate SP. In addition, the first film 210 has a through hole TH. Fig.19 As shown, the second film 230 is disposed above the first film 210. The first film 210 has a perforation TH located directly below the pressure sensing layer PSL. This allows the pressure sensing layer PSL to have more room for change when pressed by the user, thereby enhancing the user's experience when pressing the keyboard keys. Fig.19 The structural configuration of the pressure-sensitive switch device 200 is Fig.18 The structural configuration of the pressure-sensitive switch device 200 is roughly similar, so it will not be repeated here.

[0140] Please refer to Fig. 20 . Fig. 20 is a cross-sectional view of a pressure-sensitive switch device 200 according to an embodiment of the present disclosure. Fig. 20 The structural configuration of the pressure-sensitive switch device 200 is Fig.19 The structure and configuration of the pressure-sensitive switch device 200 are roughly similar, and the difference is that Fig. 20 The pressure-sensitive switch device 200 further includes a support plate SP. Fig. 20As shown, the support plate SP is located below the second film 230 and the first film 210 is disposed between the second film 230 and the support plate SP. The top surface SPa of the support plate SP has a groove R. Fig. 20 As shown, the second film 230 has a perforation TH located directly below the pressure sensing layer PSL. In some embodiments, the perforation TH is located within the range of the groove R. This allows the pressure sensing layer PSL to have double the change space when pressed by the user, thereby further enhancing the user's experience when pressing the keyboard keys. Fig. 20 The structural configuration of the pressure-sensitive switch device 200 is Fig.19 The structural configuration of the pressure-sensitive switch device 200 is roughly similar, so it will not be repeated here.

[0141] like Fig. 20 As shown, in some embodiments, the second film 230 has a bottom surface 230 b , and the first conductive wire 221 and the second conductive wire 222 contact the bottom surface 230 b of the second film 230 .

[0142] Please refer to Fig.21 . Fig.21 is a cross-sectional view of a pressure-sensitive switch device 200 according to an embodiment of the present disclosure. Fig.21 The structural configuration of the pressure-sensitive switch device 200 is Fig. 20 The structure and configuration of the pressure-sensitive switch device 200 are roughly similar, and the difference is that Fig.21 The first film 210 of the pressure-sensitive switch device 200 does not have a perforation TH. Fig.21 The structural configuration of the pressure-sensitive switch device 200 is Fig. 20 The structural configuration of the pressure-sensitive switch device 200 is roughly similar, so it will not be repeated here.

[0143] Please refer to Fig. 22 . Fig. 22 is a cross-sectional view of a pressure-sensitive switch device 200 according to an embodiment of the present disclosure. Fig. 22 The structural configuration of the pressure-sensitive switch device 200 is Fig.18 The structure and configuration of the pressure-sensitive switch device 200 are roughly similar, and the difference is that Fig. 22 The pressure-sensitive switch device 200 further comprises an insulating layer IL. Fig. 22 As shown, the insulating layer IL is disposed above the first film 210. Fig. 22As shown, the insulating layer IL covers the first wire 221, the second wire 222 and the pressure sensing layer PSL. This allows the pressure sensing layer PSL to have a larger change space when pressed by the user, thereby enhancing the user's experience when pressing the keyboard keys. In addition, the insulating layer IL can provide protection for the first wire 221, the second wire 222 and the pressure sensing layer PSL. Fig. 22 The structural configuration of the pressure-sensitive switch device 200 is Fig.18 The structural configuration of the pressure-sensitive switch device 200 is roughly similar, so it will not be repeated here.

[0144] Please refer to Fig.23 . Fig.23 is a cross-sectional view of a pressure-sensitive switch device 200 according to an embodiment of the present disclosure. Fig.23 The structural configuration of the pressure-sensitive switch device 200 is Figure 8 The structure and configuration of the pressure-sensitive switch device 200 are roughly similar, and the difference is that Fig.23 The groove R shown runs through the support plate SP. Fig.23 As shown, in some embodiments, the groove R is located directly below the pressure sensing layer PSL. Fig.23 As shown, in some embodiments, the support plate SP is located directly below the first wire 221 and the second wire 222 but not directly below the pressure sensing layer PSL. Fig.23 As shown, in some embodiments, the support plate SP is not distributed over the entire surface. Alternatively, in some other embodiments, the support plate SP is distributed over the entire surface. Specifically, the support plate SP is only not distributed directly below the pressure sensing layer PSL, and the groove R is located directly below the pressure sensing layer PSL.

[0145] Please refer to Fig.24 . Fig.24 is a cross-sectional view of a pressure-sensitive switch device 200 according to an embodiment of the present disclosure. Fig.24 The structural configuration of the pressure-sensitive switch device 200 is Fig.23 The structure and configuration of the pressure-sensitive switch device 200 are roughly similar, and the difference is that Fig.24 The pressure-sensitive switch device 200 further includes a second film 230 without the support plate SP. In addition, the second film 230 has a through hole TH. The second film 230 is disposed on the first film 210. Fig.24 As shown, in some embodiments, the second film 230 is disposed below the first film 210. The second film 230 has a perforation TH located directly below the pressure sensing layer PSL. This allows the pressure sensing layer PSL to have more room for change when pressed by the user, thereby enhancing the user's experience when pressing the keyboard keys. Fig.24 The structural configuration of the pressure-sensitive switch device 200 is Fig.23 The structural configuration of the pressure-sensitive switch device 200 is roughly similar, so it will not be repeated here.

[0146] Please refer to Fig.25 . Fig.25 is a cross-sectional view of a pressure-sensitive switch device 200 according to an embodiment of the present disclosure. Fig.25 The structural configuration of the pressure-sensitive switch device 200 is Fig.23 The structure and configuration of the pressure-sensitive switch device 200 are roughly similar, and the difference is that Fig.25 The pressure-sensitive switch device 200 further includes a second film 230 located above the support plate SP. In addition, the first film 210 has a through hole TH located directly below the pressure-sensitive layer PSL. Fig.25 As shown, the support plate SP is located below the second film 230 and the first film 210 is disposed between the second film 230 and the support plate SP. The top surface SPa of the support plate SP has a groove R. Fig.25 As shown, in some embodiments, the perforation TH is located within the range of the groove R. This allows the pressure sensing layer PSL to have double the change space when pressed by the user, thereby further enhancing the user's experience when pressing the keyboard keys. Fig.25 The structural configuration of the pressure-sensitive switch device 200 is Fig.23 The structural configuration of the pressure-sensitive switch device 200 is roughly similar, so it will not be repeated here.

[0147] like Fig.25 As shown, in some embodiments, the second film 230 has a bottom surface 230 b , and the first wire 221 , the second wire 222 , and the pressure sensing layer PSL contact the bottom surface 230 b of the second film 230 .

[0148] Please refer to Fig.26 . Fig.26 is a cross-sectional view of a pressure-sensitive switch device 200 according to an embodiment of the present disclosure. Fig.26 The structural configuration of the pressure-sensitive switch device 200 is Fig.25 The structure and configuration of the pressure-sensitive switch device 200 are roughly similar, and the difference is that Fig.26 The first film 210 of the pressure-sensitive switch device 200 does not have a perforation TH. Fig.26 The structural configuration of the pressure-sensitive switch device 200 is Fig.25 The structural configuration of the pressure-sensitive switch device 200 is roughly similar, so it will not be repeated here.

[0149] Please refer to Fig. 27 . Fig. 27 is a cross-sectional view of a pressure-sensitive switch device 200 according to an embodiment of the present disclosure. Fig. 27The structural configuration of the pressure-sensitive switch device 200 is Fig.23 The structure and configuration of the pressure-sensitive switch device 200 are roughly similar, and the difference is that Fig. 27 The pressure-sensitive switch device 200 further comprises an insulating layer IL. Fig. 27 As shown, the insulating layer IL is disposed above the first film 210. Fig. 27 As shown, the insulating layer IL covers the first wire 221, the second wire 222 and the pressure sensing layer PSL. This allows the pressure sensing layer PSL to have a larger change space when pressed by the user, thereby enhancing the user's experience when pressing the keyboard keys. In addition, the insulating layer IL can provide protection for the first wire 221, the second wire 222 and the pressure sensing layer PSL. Fig. 27 The structural configuration of the pressure-sensitive switch device 200 is Fig.23 The structural configuration of the pressure-sensitive switch device 200 is roughly similar, so it will not be repeated here.

[0150] Please refer to Fig.28 . Fig.28 is a cross-sectional view of a pressure-sensitive switch device 200 according to an embodiment of the present disclosure. Fig.28 The structural configuration of the support plate SP is Figure 8 The structural configuration of the support plate SP is similar to that of Fig.28 The top surface SPa of the support plate SP does not have the groove R. In some embodiments, due to Figure 8 The support plate SP has a groove R, and Figure 8 The support plate SP must provide support for the first wire 221, the second wire 222 and the pressure sensing layer PSL at the same time. Figure 8 The thickness of the support plate SP is usually larger. Fig.28 The support plate SP does not have a groove R, so Fig.28 The support plate SP does not need to provide a connection between the first wire 221, the second wire 222 and the pressure sensing layer PSL. Figure 8 In order to provide the same degree of support as the support plate SP of FIG. 28 , the thickness of the support plate SP is usually smaller. In other words, in some embodiments, the thickness of the support plate SP without the groove R is less than the thickness of the support plate SP with the groove R.

[0151] Please refer to Fig.29 . Fig.29 is a cross-sectional view of a pressure-sensitive switch device 200 according to an embodiment of the present disclosure. Fig.29 The structural configuration of the pressure-sensitive switch device 200 is Fig.28 The structure and configuration of the pressure-sensitive switch device 200 are roughly similar, and the difference is that Fig.29The pressure-sensitive switch device 200 further includes a second film 230 located below the first film 210. In addition, the second film 230 has a through hole TH located directly below the pressure-sensitive layer PSL. Fig.29 As shown, the second film 230 is disposed between the first film 210 and the support plate SP. This allows the pressure sensing layer PSL to have a larger change space when pressed by the user, thereby enhancing the user's experience when pressing the keyboard keys. Fig.29 The structural configuration of the pressure-sensitive switch device 200 is Fig.28 The structural configuration of the pressure-sensitive switch device 200 is roughly similar, so it will not be repeated here.

[0152] Please refer to Fig.30 . Fig.30 FIG. 2 is a top view of the conductive line layer 220 according to an embodiment of the present disclosure. Fig.30 As shown, in this embodiment, the wire layer 220 has a circuit pattern different from that of the wire layer 120. Fig.30 As shown, the circuit pattern formed by the first conductive line 221 and the second conductive line 222 is divided into a first row ROW1, a second row ROW2, a third row ROW3 and a fourth row ROW4. Fig.30 As shown, in some embodiments, the first conductive line 221 further includes a first sub-conductor 2211, a first sub-conductor 2212, a first sub-conductor 2213, and a first sub-conductor 2214. The second conductive line 222 further includes a second sub-conductor 2221, a second sub-conductor 2222, a second sub-conductor 2223, and a second sub-conductor 2224. However, the present disclosure is not intended to limit the shape of the circuit pattern of the conductive line layer 220.

[0153] like Fig.30 As shown, in this embodiment, the first sub-conductor 2211 and the second sub-conductor 2221 control the switch signal of the first row ROW1. The first sub-conductor 2212 and the second sub-conductor 2222 control the switch signal of the second row ROW2. The first sub-conductor 2213 and the second sub-conductor 2223 control the switch signal of the third row ROW3. The first sub-conductor 2214 and the second sub-conductor 2224 control the switch signal of the fourth row ROW4.

[0154] Through the aforementioned structural configuration, the pressure-sensitive switch device 200 can apply different degrees of pressure to the pressure-sensitive layer PSL by pressing the elastic body 240 to generate a switch signal associated with the change in the different degrees of pressure.

[0155] Please refer again Figures 2 to 4In some embodiments, the manufacturer may first print the first conductive line 121 and the second conductive line 122, and then print the pressure sensing layer PSL. In some other embodiments, the manufacturer may first print the pressure sensing layer PSL, and then print the first conductive line 121 and the second conductive line 122. The present disclosure is not intended to limit the order of printing the first conductive line 121, the second conductive line 122, and the pressure sensing layer PSL.

[0156] Please refer to Figures 7 to Fig.29 In some embodiments, the manufacturer may first print the first conductive line 221 and the second conductive line 222, and then print the pressure sensing layer PSL. In some other embodiments, the manufacturer may first print the pressure sensing layer PSL, and then print the first conductive line 221 and the second conductive line 222. The present disclosure is not intended to limit the order of printing the first conductive line 221, the second conductive line 222, and the pressure sensing layer PSL.

[0157] From the above detailed description of the specific embodiments of the present disclosure, it can be clearly seen that in the pressure-sensitive switch device disclosed in the present disclosure, since the deformation portion of the elastic body can be deformed in one direction by the user's pressure to drive the protruding portion to move, and the elastic body is elastically restored when the user no longer presses, the user can repeatedly press the pressure-sensitive switch device as a keyboard key. In the pressure-sensitive switch device disclosed in the present disclosure, since the pressure-sensitive layer contains piezoelectric material, when the protruding portion of the elastic body presses toward the pressure-sensitive layer, the resistance value of the pressure-sensitive layer will change with the pressure change of the pressing, so that when the user presses the pressure-sensitive switch device, a switch signal associated with the change in pressure can be generated. In the pressure-sensitive switch device disclosed in the present disclosure, since the pressure-sensitive switch device can only include two layers or even one layer of film, the pressure-sensitive switch device can use the least number of films to achieve the effect of saving materials and protecting wires at the same time. In the pressure-sensitive switch device disclosed in the present disclosure, since the first wire and the second wire are in the same layer, the overall thickness of the pressure-sensitive switch device can be reduced to reduce the volume of the pressure-sensitive switch device. In the pressure-sensitive switch device disclosed in the present invention, since the support plate may have a groove and the pressure-sensitive layer is located above the groove, the pressure-sensitive layer can have more room for change when pressed by the user, thereby enhancing the user's experience when pressing the keyboard keys. In this way, compared with the traditional mechanical switch that can only generate an all-or-nothing switch signal of a pressed state and a non-pressed state, the pressure-sensitive switch device disclosed in the present invention can generate a switch signal between a pressed state and a non-pressed state, thereby increasing the flexibility and possibility of keyboard keys in the field of e-sports.

[0158] Although the present disclosure has been disclosed in the above embodiments, it is not intended to limit the present disclosure. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be determined by the appended claims.

Claims

1. A pressure-sensitive switch device, characterized in that: Include: First film; A first conductive line is disposed on the first film; a second conductive line, disposed on the first film and separated from the first conductive line; A second film, located above the first film; a pressure sensing layer, disposed on the second film and contacting the first wire and the second wire, and the first wire is electrically connected to the second wire through the pressure sensing layer; A support plate, located below the first film, and having a groove on the top surface of the support plate, wherein the pressure sensing layer is located within the range of the groove; as well as An elastic body, located above the pressure sensing layer, and comprising: A deformation portion, located on the second film, and the deformation portion and the second film form an accommodating space; as well as a protruding portion extending from the deformable portion and protruding toward the pressure sensing layer, wherein the deformable portion is configured to generate deformation to drive the protruding portion to move in the accommodating space, The pressure sensing layer receives the pressure from the protruding portion to generate a switch signal corresponding to the pressure, and the switch signal is associated with the change in the pressure.

2. The pressure-sensitive switch device according to claim 1, characterized in that: The first conductive line and the second conductive line are in the same layer.

3. The pressure-sensitive switch device according to claim 1, characterized in that: The first conductive line, the second conductive line and the pressure sensing layer are arranged between the first film and the second film.

4. The pressure-sensitive switch device according to claim 1, characterized in that: The pressure sensing layer is separated from the first film by the first conductive line and the second conductive line.

5. The pressure-sensitive switch device according to claim 1, characterized in that: The elastomer further comprises: a fixing portion, which is disposed on the top surface of the second film and connected to the deformable portion, and surrounds an end of the deformable portion close to the second film; and The annular convex wall is disposed on the deformable portion and is located at an end of the deformable portion away from the second film, and the annular convex wall extends away from the second film.

6. A pressure-sensitive switch device, characterized in that: Include: film; A first conductive line is disposed on the bottom surface of the film; a second conductive line disposed on the bottom surface of the film and spaced apart from the first conductive line; a pressure sensing layer disposed on the bottom surface of the film and located between the first wire and the second wire, wherein the pressure sensing layer contacts the first wire and the second wire, and the first wire is electrically connected to the second wire through the pressure sensing layer; and An elastic body, located above the pressure sensing layer, and comprising: A deformation portion is located on the film, and the deformation portion and the film form a containing space; as well as a protruding portion extending from the deformable portion and protruding toward the pressure sensing layer, wherein the deformable portion is configured to generate deformation to drive the protruding portion to move in the accommodating space, The pressure sensing layer receives the pressure from the protruding portion to generate a switch signal corresponding to the pressure, and the switch signal is associated with the change in the pressure.

7. The pressure-sensitive switch device according to claim 6, characterized in that: The first conductive line and the second conductive line are in the same layer.

8. The pressure-sensitive switch device according to claim 6, characterized in that: The invention further comprises a support plate located below the film, and the first wire and the second wire are arranged between the film and the support plate.

9. The pressure-sensitive switch device according to claim 6, characterized in that: The first conductive line, the second conductive line and the pressure sensing layer are in the same layer.

10. The pressure-sensitive switch device according to claim 6, characterized in that: It further includes a support plate located below the film, a top surface of the support plate having a groove, and the groove is located below the first wire, the second wire and the pressure sensing layer.

11. The pressure-sensitive switch device according to claim 6, characterized in that: The elastomer further comprises: a fixing portion, which is disposed on the top surface of the film and connected to the deformable portion, and surrounds an end of the deformable portion close to the film; and The annular convex wall is arranged on the deformation part and located at an end of the deformation part away from the film, and the annular convex wall extends away from the film.

12. The pressure-sensitive switch device according to claim 6, characterized in that: It further includes another film located below the film, and the other film has a through hole located directly below the pressure sensing layer.

13. The pressure-sensitive switch device according to claim 6, characterized in that: It further includes another film and a support plate, wherein the support plate is located below the film and the other film is arranged between the film and the support plate, the top surface of the support plate has a groove, the other film has a perforation located directly below the pressure sensing layer, and the perforation is located within the range of the groove.

14. The pressure-sensitive switch device according to claim 6, characterized in that: The invention further comprises another film located below the film, and the first wire, the second wire and the pressure sensing layer are arranged between the film and the another film.

15. The pressure-sensitive switch device according to claim 6, characterized in that: It further includes an insulating layer and a support plate, wherein the support plate is located below the film and the insulating layer is arranged between the film and the support plate, the top surface of the support plate has a groove and the insulating layer covers the first wire, the second wire and the pressure sensing layer.

16. A pressure-sensitive switch device, characterized in that: Include: film; A pressure sensing layer is disposed on the top surface of the film; A first conductive line is disposed above the film; a second conductive line, disposed above the film and spaced apart from the first conductive line; as well as An elastic body, located above the pressure sensing layer, and comprising: A deformation portion is located on the film, and the deformation portion and the film form a containing space; as well as a protruding portion extending from the deformable portion and protruding toward the pressure sensing layer, wherein the deformable portion is configured to generate deformation to drive the protruding portion to move in the accommodating space, The pressure sensing layer receives the pressure from the protruding portion to generate a switch signal corresponding to the pressure, and the switch signal is associated with the change in the pressure.

17. The pressure-sensitive switch device according to claim 16, characterized in that: The pressure sensing layer is located between the first conductive line and the second conductive line and contacts the first conductive line and the second conductive line.

18. The pressure-sensitive switch device according to claim 16, characterized in that: The invention further comprises a support plate located below the film, and the film is arranged between the pressure sensing layer and the support plate.

19. The pressure-sensitive switch device according to claim 16, characterized in that: The pressure sensing layer covers the first conductive line and the second conductive line.

20. The pressure-sensitive switch device according to claim 16, characterized in that: The first conductive line and the second conductive line are disposed on the pressure sensing layer.

21. The pressure-sensitive switch device according to claim 16, characterized in that: The first conductive line, the second conductive line and the pressure sensing layer are in the same layer.

22. The pressure-sensitive switch device according to claim 16, characterized in that: The invention further comprises a support plate located below the film, and the support plate has a groove located below the pressure sensing layer.

23. The pressure-sensitive switch device according to claim 16, characterized in that: The invention further comprises another film located on the film, and the film has a through hole located directly below the pressure sensing layer.

24. The pressure-sensitive switch device according to claim 16, characterized in that: It further includes another film and a support plate, wherein the support plate is located below the other film and the film is arranged between the other film and the support plate, the top surface of the support plate has a groove, the film has a perforation located directly below the pressure sensing layer, and the perforation is located within the range of the groove.

25. The pressure-sensitive switch device according to claim 16, characterized in that: The invention further comprises another film located above the film, and the first wire, the second wire and the pressure sensing layer are arranged between the film and the another film.

26. The pressure-sensitive switch device according to claim 16, characterized in that: It further includes an insulating layer and a support plate, wherein the support plate is located below the film and the insulating layer is arranged above the film, the top surface of the support plate has a groove and the insulating layer covers the first wire, the second wire and the pressure sensing layer.

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