Wafer accommodating device

Abstract

The utility model relates to the technical field of wafer accommodating or transporting, in particular to a wafer accommodating device. The wafer containing device comprises the first box body, the second box body and the wafer supporting unit, when the wafer containing device is used for containing the wafer, the wafer supporting unit supports the wafer, and the wafer is prevented from being damaged in the wafer carrying process; the end face of the first box body is provided with a buckle structure, the outer wall of the second box body is provided with a spring bolt structure, the opening end face of the second box body is provided with a flanging structure, the outermost end of the spring bolt structure in the horizontal direction does not protrude from the hole to the outermost end face of the buckle structure, or the outermost end of the spring bolt structure in the horizontal direction does not protrude from the hole to the outermost end face of the buckle structure. The distance that the outermost end portion of the spring bolt structure protrudes out of the buckle structure in the horizontal direction is 0-1 mm, through the wafer containing device, faster separation can be achieved when the spring bolt structure is separated from the buckle structure, and the use convenience of the wafer containing device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer accommodation or transportation, in particular to a wafer accommodation device. Background Art

[0002] Existing semiconductor wafers need to go through multiple steps during the production process. In different steps, the wafers need to be transported to different equipment, so the wafer transportation, storage and holding devices also play a relatively important role.

[0003] Among different production processes, some involve transportation, some involve storage, and some involve cooling. After placing the wafer in the container, the upper and lower boxes of the container need to be locked. The existing snap-on locking device is not very convenient to open and close. Utility Model Content

[0004] In order to optimize the above-mentioned existing wafer accommodation device, the present application proposes a wafer accommodation device for accommodating a plurality of wafers placed in parallel, comprising:

[0005] A first box body, which is located at the upper part of the wafer accommodating device, the first box body has a downward opening, an end surface of the opening is provided with a protruding buckle structure downward in a vertical direction, and a hole is provided on the buckle structure;

[0006] A second box body, which is located at the lower part of the wafer accommodating device, and a locking tongue structure is arranged on the outer wall of the second box body, and the locking tongue structure is suitable for being inserted into the hole to match with the buckle structure;

[0007] The outermost end of the locking tongue structure in the horizontal direction does not protrude from the hole to the outermost end surface of the buckle structure, or the outermost end of the locking tongue structure in the horizontal direction protrudes from the hole to the buckle structure by a distance of 0-1 mm.

[0008] Specifically, in the above-mentioned wafer accommodating device, a first annular groove is arranged on the circumference of the end surface of the opening, and a second annular groove is arranged on the circumference of the end surface of the opening of the second box body, wherein the first annular groove cooperates with the second annular groove to form a placement space, and the placement space is suitable for placing a sealing ring.

[0009] Optionally, the above-mentioned wafer accommodating device also includes a wafer supporting unit, wherein the wafer supporting unit includes a top supporting frame and a side supporting frame, wherein the top supporting frame is clamped on the inner wall of the top of the first box body, and the top supporting frame is provided with a first supporting groove matching the shape of the wafer, and the inner wall of the side supporting frame is provided with a second supporting groove corresponding to the first supporting groove, and the first supporting groove and the second supporting groove support the multiple wafers simultaneously.

[0010] Optionally, in the above-mentioned wafer accommodating device, two groups of the snap-fit ​​structures are provided, and the two groups of the snap-fit ​​structures are symmetrically arranged on two sides of the first box body.

[0011] Optionally, in the above-mentioned wafer accommodating device, when the snap structure cooperates with the locking tongue structure, the lowermost end face of the locking tongue structure is the first end face, the end face opposite to the first end face in the snap structure is the second end face, and the angle between the first end face and the second end face is an acute angle.

[0012] Optionally, in the above-mentioned wafer accommodating device, a plurality of drainage openings are symmetrically arranged on the flange structure, and the top of the flange structure extends toward the side wall of the second box body to form a groove, and ribs connecting the flange structure and the second box body are arranged in the groove, and the top ends of the plurality of drainage openings are flush with the top ends of the grooves.

[0013] Optionally, in the above-mentioned wafer accommodating device, a plurality of first supporting grooves are provided, and the first supporting grooves are arc-shaped.

[0014] Optionally, in the above-mentioned wafer accommodating device, the side support frame is composed of four surfaces to form an accommodating space suitable for accommodating the wafer, and the side support frame has a relative upper opening and a lower opening, the upper opening is larger than the lower opening, and the upper opening faces the top support frame.

[0015] Optionally, in the above-mentioned wafer accommodating device, multiple groups of second support grooves are provided, and the multiple groups of second support grooves are symmetrically arranged on the inner wall of the side support frame, and the second support grooves include an arc-shaped portion and a vertical portion; the second support grooves are located in the extension direction of the arc-shaped structure where the first support groove is located, and the second support grooves occupy two opposite surfaces of the four surfaces of the side support frame, and of the other two surfaces, one is a closed surface, and the other is an H-type connection structure surface.

[0016] Optionally, in the above-mentioned wafer accommodating device, the distance between adjacent first supporting grooves is equal to the distance between adjacent second supporting grooves.

[0017] Optionally, in the above-mentioned wafer accommodating device, a protrusion component is provided on the inner wall of the top of the first box body, and the protrusion component is clamped to the top support frame.

[0018] Optionally, in the above-mentioned wafer accommodating device, a protrusion structure is provided in the second box body, and a slot structure is provided at a portion where the side support frame abuts against the second box body, and the protrusion structure limits the slot structure.

[0019] One or more technical solutions provided by the utility model produce at least the following beneficial effects:

[0020] A wafer accommodating device proposed in the present application includes a first box body, a second box body, and a wafer supporting unit. A snap-fit ​​structure is provided on the end face of the first box body, and a hole is provided on the snap-fit ​​structure. A locking tongue structure is provided on the outer wall of the second box body, and the locking tongue structure is suitable for being inserted into the hole to match the snap-fit ​​structure. The outermost end of the locking tongue structure in the horizontal direction does not protrude from the hole to the outermost end face of the snap-fit ​​structure, or the outermost end of the locking tongue structure in the horizontal direction protrudes from the hole to the snap-fit ​​structure by a distance of 0-1mm. Through the wafer accommodating device, faster separation can be achieved when the locking tongue structure is disengaged from the snap-fit ​​structure, thereby improving the convenience of using the wafer accommodating device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Further details, features and advantages of the present application are disclosed in the following description of exemplary embodiments in conjunction with the accompanying drawings, in which:

[0022] Figure 1 It is a schematic diagram of the overall structure of a wafer containing device;

[0023] Figure 2 for Figure 1 A schematic diagram of a partial A cross-section of a wafer receiving device;

[0024] Figure 3 It is a schematic diagram of the first box structure of a wafer containing device;

[0025] Figure 4 It is a schematic diagram of the structure of a second box body of a wafer containing device;

[0026] Figure 5 It is a schematic diagram of the cooperation between the second box structure and the wafer supporting unit of a wafer containing device;

[0027] Figure 6 It is a schematic diagram of the cooperation between a first box structure and a wafer supporting unit of a wafer containing device;

[0028] Figure 7 It is another structural schematic diagram of a first box body of a wafer containing device;

[0029] Figure 8 This is another structural schematic diagram of the second box body of a wafer containing device.

[0030] Description of reference numerals:

[0031] 1-first box body; 11-first annular groove; 12-buckle structure; 13-limiting structure; 14-protrusion assembly; 2-second box body; 21-second annular groove; 22-locking tongue structure; 23-flanged structure; 24-drain outlet; 25-groove; 26-rib; 27-sealing ring; 28-protrusion structure; 3-wafer support unit; 31-top support frame; 32-side support frame; 33-first support groove; 34-second support groove; 35-slot structure. DETAILED DESCRIPTION

[0032] The embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be construed as being limited to the embodiments described herein. Instead, these embodiments are provided to provide a more thorough and complete understanding of the present application. It should be understood that the drawings and embodiments of the present application are only for exemplary purposes and are not intended to limit the scope of protection of the present application.

[0033] It should be understood that the various steps described in the method implementation of the present application can be performed in different orders and / or performed in parallel. In addition, the method implementation may include additional steps and / or omit the steps shown. The scope of the present application is not limited in this respect.

[0034] The term "including" and its variations used in this document are open inclusions, that is, "including but not limited to". The term "based on" means "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment"; the term "some embodiments" means "at least some embodiments". Relevant definitions of other terms will be given in the description below. It should be noted that the concepts of "first", "second", etc. mentioned in this application are only used to distinguish different devices, modules or units, and are not used to limit the order or interdependence of the functions performed by these devices, modules or units.

[0035] It should be noted that the modifications of "one" and "plurality" mentioned in the present application are illustrative rather than restrictive, and those skilled in the art should understand that unless otherwise clearly indicated in the context, it should be understood as "one or more".

[0036] The names of the messages or information exchanged between multiple devices in the embodiments of the present application are only used for illustrative purposes and are not used to limit the scope of these messages or information. Specific embodiments

[0037] The utility model relates to the technical field of wafer accommodation or transportation, and in particular to a wafer accommodation device for accommodating a plurality of wafers placed in parallel. The wafer accommodation device comprises: a first box body 1, a second box body 2 and a wafer supporting unit 3.

[0038] Figure 1 It is a schematic diagram of the overall structure of a wafer containing device; Figure 2 for Figure 1 A schematic diagram of a partial A cross-section of a wafer receiving device; Figure 3 It is a schematic diagram of the first box structure of a wafer containing device; Figure 4 The figure is a schematic diagram of the second box structure of a wafer containing device.

[0039] like Figure 1-4 As shown, the first box body 1 is located at the upper part of the wafer accommodating device, and the second box body 2 is located at the lower part. The first box body 1 has a downward opening, and the second box body 2 has an upward opening. The wafer support unit 3 is arranged between the first box body 1 and the second box body 2 to support the wafer. In the first box body 1, a protruding snap-fit ​​structure 12 is arranged downward in the vertical direction, and a hole is arranged on the snap-fit ​​structure 12; a locking tongue structure 22 is arranged on the outer wall of the second box body 2, and the locking tongue structure 22 is suitable for being inserted into the hole to match the snap-fit ​​structure 12. Among them, the outermost end of the locking tongue structure 22 in the horizontal direction does not protrude from the hole to the outermost end surface of the snap-fit ​​structure 12, or the outermost end of the locking tongue structure 22 in the horizontal direction protrudes from the hole to the snap-fit ​​structure 12 by a distance of 0-1mm. In this embodiment, Figure 2 As shown, the distance ∆x is 0.25 mm. By setting the size relationship between the locking tongue structure and the buckle structure, the locking tongue structure can be easily separated from the buckle structure, so that the on-site handling workers can quickly open the box body of the wafer containing device.

[0040] In some embodiments, in the above-mentioned wafer accommodating device, a first annular groove 11 is arranged on the circumference of the end surface of the opening of the above-mentioned first box body 1, and a second annular groove 21 is arranged on the circumference of the end surface of the opening of the above-mentioned second box body 2, wherein the above-mentioned first annular groove 11 cooperates with the above-mentioned second annular groove 21 to form a placement space, and the above-mentioned placement space is suitable for placing a sealing ring 27, which is used to achieve sealing between the box body and the outside air when the locking tongue structure 22 matches the above-mentioned snap structure 12, thereby increasing the sealing performance.

[0041] In some embodiments, the wafer accommodating device further includes a wafer support unit 3, which includes a top support frame 31 and a side support frame 32. The top support frame 31 is clamped on the inner wall of the top of the first box body. The top support frame 32 is provided with a first support groove 33 matching the shape of the wafer. The inner wall of the side support frame 32 is provided with a second support groove 34 corresponding to the first support groove 31. The first support groove 33 and the second support groove 34 support the multiple wafers at the same time. The wafer support unit is provided to prevent damage to the wafer during transportation.

[0042] In some embodiments, in the wafer accommodation device, the buckle structure 12 is provided with two groups, and the two groups of the buckle structures 12 are symmetrically arranged on both sides of the first box body 1. By symmetrically arranging the buckle structures 12 on both sides of the accommodation device, it is convenient for the production line staff to use both hands at the same time to realize the locking and separation of the locking tongue structure and the clamping structure.

[0043] In some embodiments, Figure 2 As shown, when the buckle structure cooperates with the lock tongue structure, the lowermost end face of the lock tongue structure is the first end face B, the end face opposite to the first end face in the buckle structure is the second end face C, and the angle between the first end face B and the second end face C is an acute angle. When the buckle structure is separated from the locking structure, the angle between the relative contact surfaces of the buckle structure and the lock tongue structure is set to an acute angle to achieve rapid separation; at the same time, when locking, the lock buckle can also be conveniently slid onto the lock tongue.

[0044] In some embodiments, in the wafer accommodation device, the flange structure is symmetrically provided with a plurality of drainage ports, the top of the flange structure extends toward the side wall of the second box body 2 to form a groove, the groove is provided with ribs connecting the flange structure and the second box body 2, and the tops of the plurality of drainage ports are flush with the top of the groove. After the wafer accommodation device is flipped and cooled, rapid drainage can be achieved to achieve rapid drying.

[0045] In some embodiments, in the wafer accommodating device, a plurality of the first support grooves are provided, and the first support grooves are arc-shaped. The shape of the arc-shaped first support groove 33 matches the shape of the wafer, and during the process of moving and transporting the wafer, the wafer is better protected to prevent the chip from being impacted and damaged.

[0046] Figure 5 It is a schematic diagram of the cooperation between the second box structure and the wafer supporting unit of a wafer containing device; Figure 6 It is a schematic diagram of the cooperation between the first box structure and the wafer supporting unit of a wafer containing device.

[0047] In some embodiments, in the above wafer receiving device, Figure 5-6 As shown, the side support frame 32 is composed of four surfaces to form a storage space suitable for accommodating the wafer. The side support frame 32 has an upper opening and a lower opening relative to each other. The upper opening is larger than the lower opening, and the upper opening faces the top support frame 31. In actual use, the second box body 2 is placed on the platform, and then the wafer is placed from the upper opening to abut against the side support frame. After the wafer is placed, the first box body 1 is covered, and the top support frame 31 clamped on the top of the first box body 1 forms further protection for the wafer. The side support frame and the top support frame are made of softer plastic material.

[0048] In some embodiments, in the wafer accommodating device, the second support grooves 34 are provided in multiple groups, and the multiple groups of the second support grooves 34 are symmetrically arranged on the inner wall of the side support frame 32, and the second support grooves 34 include an arc portion and a vertical portion; the second support grooves 34 are located in the extension direction of the arc structure where the first support grooves 33 are located, and the second support grooves 34 occupy two opposite faces of the four faces of the side support frame 32, and one of the other two faces is a closed face, and the other is an H-shaped connection structure face. The distance between adjacent first support grooves 33 is equal to the distance between adjacent second support grooves 34; multiple groups of second support grooves are arranged on two opposite faces of the side support frame 32, and cooperate with the multiple groups of first support grooves on the top support frame to accommodate multiple groups of wafers at the same time, thereby improving the utilization rate of the wafer accommodating device.

[0049] Figure 7 It is another structural schematic diagram of a first box body of a wafer containing device; Figure 8 This is another structural schematic diagram of the second box body of a wafer containing device.

[0050] In some embodiments, in the above wafer receiving device, Figure 7-8 As shown, a protrusion assembly 14 is provided on the inner wall of the top of the first box body 1, and the protrusion assembly 14 clamps the top support frame 31. The protrusion assembly includes a plurality of protrusions for clamping the top support frame.

[0051] In some embodiments, a protrusion structure 28 is provided in the second box body 2, and a slot structure 35 is provided at the part where the side support frame 32 abuts against the second box body 2, and the protrusion structure limits the slot structure. The side support frame is limited in multiple directions by the limiting assembly and the protrusion structure to prevent the wafer from shaking during transportation.

[0052] The above descriptions are only some embodiments of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of disclosure involved in the present application is not limited to the technical solutions formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the above disclosed concepts. For example, the above features are replaced with the technical features with similar functions disclosed in this application (but not limited to) by each other to form a technical solution.

[0053] Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are only for illustration, not for limiting the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A wafer accommodating device for accommodating a plurality of wafers placed in parallel, characterized in that: include, A first box body, which is located at the upper part of the wafer accommodating device, the first box body has a downward opening, an end surface of the opening is provided with a protruding buckle structure downward in a vertical direction, and a hole is provided on the buckle structure; A second box body, which is located at the lower part of the wafer accommodating device, and a locking tongue structure is arranged on the outer wall of the second box body, and the locking tongue structure is suitable for being inserted into the hole to match with the buckle structure; The outermost end of the locking tongue structure in the horizontal direction does not protrude from the hole to the outermost end surface of the buckle structure, or the outermost end of the locking tongue structure in the horizontal direction protrudes from the hole to the buckle structure by a distance of 0-1 mm.

2. The wafer accommodation device according to claim 1, wherein a first annular groove is provided on the circumference of the end surface of the opening, and a second annular groove is provided on the circumference of the end surface of the opening of the second box body, wherein: The first annular groove cooperates with the second annular groove to form a placement space, and the placement space is suitable for placing a sealing ring.

3. The wafer accommodating device according to claim 2 further includes a wafer supporting unit, wherein the wafer supporting unit includes a top supporting frame and a side supporting frame, the top supporting frame is clamped on the inner wall of the top of the first box body, the top supporting frame is provided with a first supporting groove matching the shape of the wafer, and the inner wall of the side supporting frame is provided with a second supporting groove corresponding to the first supporting groove, the first supporting groove and the second supporting groove support the multiple wafers simultaneously.

4. The wafer accommodation device according to claim 1, characterized in that: The buckle structures are provided in two groups, and the two groups of buckle structures are symmetrically arranged on two sides of the first box body.

5. The wafer accommodation device according to claim 4, characterized in that: When the buckle structure cooperates with the locking tongue structure, the lowermost end face of the locking tongue structure is the first end face, the end face opposite to the first end face in the buckle structure is the second end face, and the angle between the first end face and the second end face is an acute angle.

6. The wafer accommodation device according to claim 2, characterized in that: A downwardly extending flange structure is provided on the periphery of the second box body; a plurality of drainage openings are symmetrically provided on the flange structure, the top of the flange structure extends toward the side wall of the second box body to form a groove, a rib connecting the flange structure and the second box body is provided in the groove, and the top ends of the plurality of drainage openings are flush with the top ends of the grooves.

7. The wafer accommodation device according to claim 3, characterized in that: There are multiple first support grooves, and the first support grooves are arc-shaped; the side support frame is composed of four surfaces to form a storage space suitable for accommodating the wafer, and the side support frame has a relative upper opening and a lower opening, the upper opening is larger than the lower opening, and the upper opening faces the top support frame.

8. The wafer accommodation device according to claim 7, characterized in that: There are multiple groups of second support grooves, and the multiple groups of second support grooves are symmetrically arranged on the inner wall of the side support frame. The second support groove includes an arc portion and a vertical portion; the second support groove is located in the extension direction of the arc structure where the first support groove is located, and the second support groove occupies two opposite surfaces of the four surfaces of the side support frame. Among the other two surfaces, one is a closed surface, and the other is an H-shaped connection structure surface.

9. The wafer accommodation device according to claim 7, characterized in that: The distance between adjacent first supporting grooves is equal to the distance between adjacent second supporting grooves.

10. The wafer accommodation device according to claim 8, characterized in that: A protrusion assembly is provided on the inner wall at the top of the first box body, and the protrusion assembly clamps the top support frame; a protrusion structure is provided in the second box body, and a slot structure is provided at the part where the side support frame abuts against the second box body, and the protrusion structure limits the slot structure.

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