Solid-state transformer and circuit board stacking structure thereof
By setting a thermally conductive insulating layer and a thermal diffusion layer in the circuit board stack and installing a thermally conductive block, the problem of time-consuming assembly and prone to cracking of the insulating material in the prior art is solved, and more efficient assembly and excellent heat dissipation effect are achieved.
Patent Information
- Application Number
- CN202420548219.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2023-09-11
- Filing Date
- 2024-03-20
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2034-03-20
AI Technical Summary
When assembling the radiator, existing circuit boards need to apply thermal paste twice, which is time-consuming and prone to breaking the insulation material due to human error, and cannot achieve the expected insulation effect.
A circuit board stack is designed, with a thermally conductive insulating layer inside to cover the second surface of the board body, and through thermal pressing bonding, the thermally conductive insulating layer is further covered, and a thermally conductive block is embedded to connect the power element and the thermally conductive insulating layer.
It reduces the number of times the thermal paste is applied, avoids the cracking of the insulating material caused by human error, and improves assembly efficiency and heat dissipation effect.
Smart Images
Figure CN222602651U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to a circuit board stack structure, and in particular to a circuit board stack structure with a heat-conducting insulating layer disposed therein. Background Art
[0002] The high-power power crystals commonly used on the motherboards of today's electronic devices generate a lot of heat when they are working, so the motherboard is generally equipped with a heat sink for the heat dissipation of the power crystals. Since the heat sink is mostly a metal conductor, an insulating layer must be used between the heat sink assembly and the motherboard to prevent short circuits. During the heat sink assembly process, thermal paste must be applied to both sides of the insulating layer for attachment to the motherboard and the heat sink. This assembly process requires applying thermal paste twice, so production is time-consuming, and when the heat sink is assembled to the circuit board, it is easy to cause the insulation material to break due to human locking errors, and the expected insulation effect cannot be achieved.
[0003] In view of this, the inventor has devoted himself to studying the above-mentioned prior art and has applied theoretical knowledge to try his best to solve the above-mentioned problems, which has become the goal of the inventor's improvement. Utility Model Content
[0004] The purpose of the present disclosure is to provide a circuit board stack structure with a heat-conducting insulation layer disposed therein.
[0005] The present invention provides a circuit board stack structure, which includes a board body, a power element, a heat-conducting insulating layer, a heat diffusion layer and a heat-conducting block. The two sides of the board body are a first surface and a second surface respectively. The power element is arranged on the first surface. The heat-conducting insulating layer covers the second surface and is pressed and combined with the second surface. The heat diffusion layer covers the heat-conducting insulating layer and is pressed and combined with the heat-conducting insulating layer. The heat-conducting block is embedded in the board body and is respectively connected to the power element and the heat-conducting insulating layer.
[0006] In one embodiment of the present disclosure, the circuit board stack further includes a heat sink, which is assembled on the board body and the heat diffusion layer is located between the heat sink and the thermal insulation layer.
[0007] In one embodiment of the present disclosure, the circuit board stack further includes a heat conducting layer, and the heat conducting layer is disposed between the heat sink and the heat diffusion layer.
[0008] In one embodiment of the present disclosure, the heat sink is electrically connected to the heat diffusion layer.
[0009] In one embodiment of the present disclosure, the plate body is provided with a through hole, the inner wall of the through hole is provided with a conductive layer, and the conductive layer is respectively connected to the surface circuit and the heat diffusion layer, the through hole is provided with a conductor locking piece, and the conductor locking piece is connected to the heat sink.
[0010] In one embodiment of the present disclosure, the heat sink is electrically connected to the heat diffusion layer via a conductor fastener and a conductive layer.
[0011] In one embodiment of the present disclosure, the board includes a plurality of insulating layers and a plurality of circuit layers, and the plurality of insulating layers and the plurality of circuit layers are stacked alternately.
[0012] In one embodiment of the present disclosure, the thermal conductivity of the heat-conductive insulating layer is greater than the thermal conductivity of each insulating layer.
[0013] The present disclosure provides a circuit board stack structure, which includes a board body, a heat-conducting insulating layer, a heat diffusion layer and a heat-conducting block. The board body has a first surface and a second surface opposite to each other, and the board body includes multiple insulation layers and multiple circuit layers. The heat-conducting insulating layer covers the second surface and is pressed and combined with the second surface, and the thermal conductivity of the heat-conducting insulating layer is greater than the thermal conductivity of each insulation layer. The heat diffusion layer covers the heat-conducting insulating layer and is pressed and combined with the heat-conducting insulating layer. The heat-conducting block is embedded in the board body and connects the first surface and the heat-conducting insulating layer.
[0014] The present disclosure further provides a solid-state transformer having a plurality of power conversion modules, at least one of which has a circuit board stack, wherein the circuit board stack includes a board body, a plurality of power components, a heat-conducting insulating layer, a heat diffusion layer, and a plurality of heat-conducting blocks. The board body has a first surface and a second surface opposite to each other. The power components are arranged on the first surface. The heat-conducting insulating layer covers the second surface and is pressed and combined with the second surface. The heat diffusion layer covers the heat-conducting insulating layer and is pressed and combined with the heat-conducting insulating layer. The heat-conducting blocks are embedded in the board body and are respectively connected to the plurality of power components and the heat-conducting insulating layer.
[0015] In one embodiment of the present disclosure, the solid-state transformer further comprises a heat sink, the heat sink is assembled on the board, and the heat diffusion layer is located between the heat sink and the thermal insulation layer. In one embodiment of the present disclosure, the heat sink is electrically connected to the heat diffusion layer.
[0016] In one embodiment of the present disclosure, the heat sink is thermally connected to each power element via a heat conductive layer, a heat diffusion layer, a heat conductive insulation layer, and then via a plurality of heat conductive blocks.
[0017] In one embodiment of the present disclosure, a surface circuit is disposed on the first surface, and each of the power elements is electrically connected to the surface circuit.
[0018] In one embodiment of the present disclosure, the circuit board stack structure of the solid-state transformer further includes a heat sink, which is assembled on the board body and the heat diffusion layer is located between the heat sink and the thermal insulation layer. The board body is provided with a through hole, and a conductive layer is attached to the inner wall of the through hole, and the conductive layer is respectively connected to the surface circuit and the heat diffusion layer. The through hole is provided with a conductor locking piece, and the conductor locking piece is connected to the heat sink.
[0019] In one embodiment of the present disclosure, the heat sink is electrically connected to the heat diffusion layer via a conductor fastener and a conductive layer.
[0020] In one embodiment of the present disclosure, the board includes a plurality of insulating layers and a plurality of circuit layers, and the plurality of insulating layers and the plurality of circuit layers are stacked alternately.
[0021] In one embodiment of the present disclosure, the thermal conductivity of the heat-conductive insulating layer is greater than the thermal conductivity of each insulating layer.
[0022] In one embodiment of the present disclosure, the plurality of heat-conducting blocks are copper blocks or ceramics.
[0023] The circuit board stack of the present disclosure has a heat-conducting insulating layer disposed therein, so that the number of times the thermal paste is applied during assembly can be reduced compared to the prior art. The step of assembling the insulating material is omitted to avoid damage to the insulating material performance caused by human error. The heat-conducting insulating layer can provide heat transfer characteristics, thereby generating a heat conduction path in the direction perpendicular to the board body and a heat-averaging path along the board body, thereby enhancing the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 The figure is a cross-sectional diagram of an exploded state of a circuit board stack structure according to an embodiment of the present disclosure.
[0025] Figure 2 It is a cross-sectional diagram of a circuit board stack structure according to an embodiment of the present disclosure.
[0026] Figure 3 It is a cross-sectional diagram of a circuit board stack structure according to another embodiment of the present disclosure.
[0027] The reference numerals are as follows:
[0028] 100:Plate body
[0029] 101: First surface
[0030] 102: Second surface
[0031] 103:Piercing
[0032] 104: Conductive layer
[0033] 110: Insulation layer
[0034] 120: Circuit layer
[0035] 120a, 120b: Surface circuit
[0036] 121a: Conductive contact
[0037] 200: Power components
[0038] 310: Thermal insulation layer
[0039] 320: Heat diffusion layer
[0040] 330: Heat conduction block
[0041] 410: Radiator
[0042] 420: Thermal conductive layer
[0043] 430: Conductor lock DETAILED DESCRIPTION
[0044] In the description of the present disclosure, it needs to be understood that the terms "front side", "rear side", "left side", "right side", "front end", "rear end", "end", "longitudinal", "lateral", "vertical", "top", "bottom" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.
[0045] As used herein and not otherwise defined, the terms "substantially" and "approximately" are used to describe and describe small variations. When applied to an event or circumstance, the term may include the exact moment at which the event or circumstance occurred, as well as the event or circumstance occurring to a close approximation. For example, when applied to a numerical value, the term may include a range of variation less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.
[0046] The detailed description and technical contents of the present disclosure will be described as follows with the accompanying drawings. However, the attached drawings are only for illustrative purposes and are not intended to limit the present disclosure.
[0047] Figure 1 It is a cross-sectional diagram of an exploded state of a circuit board stack structure according to an embodiment of the present disclosure; Figure 2 FIG. 1 is a cross-sectional view of a circuit board stack structure according to an embodiment of the present disclosure. Figure 1 and Figure 2 The present disclosure provides a circuit board stack structure. In the simplest implementation, the circuit board stack structure at least includes a board body 100, a thermal insulation layer 310, a heat diffusion layer 320 and a thermal block 330, but the circuit board stack structure can include multiple thermal blocks 330.
[0048] The two sides of the board 100 are a first surface 101 and a second surface 102 opposite to the first surface 101. The board 100 is a laminated structure. Specifically, the board 100 includes a plurality of insulating layers 110 and a plurality of circuit layers 120, and the plurality of insulating layers 110 and the plurality of circuit layers 120 are interlaced and stacked. Moreover, a surface circuit 120a is disposed on the first surface 101. The insulating layer 110 is made of FR4 glass fiber, and its thermal conductivity is about 0.2-0.8W / mK.
[0049] The thermally conductive insulating layer 310 covers the second surface 102 of the board 100, and the thermally conductive insulating layer 310 is bonded to the second surface 102 by hot pressing; the thermally conductive insulating layer 310 is mainly used for the insulation of the second surface 102, and also has better heat transfer characteristics, and the thermal conductivity of the thermally conductive insulating layer 310 is greater than the thermal conductivity of each insulating layer 110, thereby improving the thermal conductivity of the board 100. That is, the thermal conductivity of the thermally conductive insulating layer 310 is greater than 0.8W / mK, and the thermally conductive insulating layer 310 is, for example, FR4 glass fiber (thermal conductivity is, for example, between 0.8W / mK and 2W / mK), thermally conductive adhesive film or ceramic (thermal conductivity is, for example, between 0.8W / mK and 200W / mK) or a sheet made of any of the above compositions, but the present disclosure is not limited thereto. When selecting the material of the thermally conductive insulating layer 310, a material with appropriate dielectric strength and appropriate thermal conductivity (K) is selected according to the use requirements (such as the required working voltage, circuit board thickness limit, and heat dissipation capacity requirements). Accordingly, the insulation properties and thermal conductivity properties of the thermally conductive insulating layer 310 are selected to meet the insulation withstand voltage and thermal conductivity requirements, and the overall thickness of the circuit board stack is taken into account to meet the requirements of reducing the size. Another surface circuit 120b is arranged on the second surface 102. The thermally conductive insulating layer 310 of the thermally conductive adhesive film softens during hot pressing and can fill the step difference between the surface circuit 120b on the second surface 102 and the second surface 102, thereby avoiding the gap between the thermally conductive insulating layer 310 and the second surface 102 to form a thermal resistance.
[0050] The heat diffusion layer 320 covers the heat conductive insulating layer 310, and the heat diffusion layer 320 can be combined with the heat conductive insulating layer 310 by hot pressing. In this embodiment, the heat diffusion layer 320 is a copper foil. The area of the heat conductive insulating layer 310 is not larger than the area of the circuit board stacked plate body 100. The heat diffusion layer 320 covers the heat conductive insulating layer 310 to form a copper surface, and the area of the heat diffusion layer 320 is not larger than the area of the heat conductive insulating layer 310.
[0051] The plate 100 has a through hole 103 (see Figure 1 ), which can penetrate the first surface 101 to the second surface 102 of the board body 100, and a conductive layer 104 is attached to the inner wall of the through hole 103, and the conductive layer 104 is respectively connected to the surface circuit 120a and the heat diffusion layer 320. In this embodiment, the conductive layer 104 is a copper cladding. A conductive contact 121a is provided at the periphery of the through hole 103 in the surface circuit 120a to connect to the conductive layer 104 in the through hole 103.
[0052] The heat conductive block 330 is embedded in the board body 100 and connected to the heat conductive insulating layer 310. In this example, the heat conductive block 330 may be a copper block or a ceramic. The heat conductive block 330 may be formed by laying copper or ceramic at corresponding positions on the surface circuit 120a, each circuit layer 120 and each insulating layer 110 while manufacturing the circuit layer 120 and the surface circuit 120a, thereby accumulating to form the heat conductive block 330.
[0053] The circuit board stack also includes a power element 200. The present disclosure does not limit the form of the power element 200. For example, in the present embodiment, the power element 200 is, for example, a MOSFET of a solid-state transformer (SST) with a high power density (for example, above 40W / L). The power element 200 can be a patch-type structure to reduce the overall volume of the circuit board stack, but is not limited thereto. In the present embodiment, the power element 200 is disposed on the first surface 101 of the board 100 and is electrically connected to the surface circuit 120a. The circuit board stack also includes other electronic components, and the aforementioned power element 200 and other electronic components are disposed together on the first surface 101 of the board 100 and are electrically connected to the surface circuit 120a. In the present embodiment, the power element 200 is connected to the heat conductive block 330.
[0054] The circuit board stack structure further includes a heat sink 410 and a heat conducting layer 420. The heat sink 410 is assembled on the board 100 and the heat diffusion layer 320 is located between the heat sink 410 and the heat conductive insulating layer 310. The heat sink 410 can be a heat sink. The heat conductive layer 420 is disposed between the heat sink 410 and the heat diffusion layer 320. The heat conductive layer 420 can be a heat conductive paste. For example, the heat conductive paste is applied on one side of the heat sink 410 to form the heat conductive layer 420, and then the heat conductive layer 420 is attached to the heat diffusion layer 320. The area of the heat diffusion layer 320 is determined according to the thermal contact area between the heat sink 410 and the heat sink 410. The through hole 103 is provided with a conductor fastener 430, such as a metal screw. The conductor fastener 430 fastens the heat sink 410 and fastens the heat sink 410 to the second surface 102 side of the board 100. The head at one end of the metal screw presses against the conductive contact 121a in the surface circuit 120a. Depending on the coating range of the thermal conductive layer 420, the conductor fastener 430 may penetrate the thermal conductive layer 420 or avoid the thermal conductive layer 420 (i.e., be located outside the edge of the thermal conductive layer 420, not shown in the figure). Moreover, the heat sink 410 is electrically connected to the thermal diffusion layer 320 through the conductor fastener 430 and the conductive layer 104 in the through hole 103, thereby making the heat sink 410 and the thermal diffusion layer 320 have the same potential to avoid generating unexpected current, and no additional insulation treatment is required between the board body 100 and the heat sink 410. The heat sink 410 is insulated from the circuit board by the thermal conductive insulation layer 310. In the limited space of the stacked circuit board structure, the thermal conductive insulation layer 310 can block the potential difference between the power element 200 and the heat sink 410. The heat sink 410 is thermally connected to the power element 200 via the heat conducting layer 420 , the heat diffusion layer 320 , the heat insulating layer 310 and the heat conducting block 330 . Therefore, the heat energy generated by the power element 200 during operation can be transferred to the heat sink 410 through the aforementioned heat transfer path and dissipated into the environment.
[0055] During the assembly process of the circuit board stack structure disclosed in the present invention, the thermal insulation layer 310 and the heat diffusion layer 320 are first pressed together with the board body 100, and then only the procedure of configuring the thermal layer 420 (for example, applying thermal paste) needs to be performed once. Therefore, compared with the prior art, the number of times the thermal paste is applied can be reduced during assembly, thereby improving the assembly efficiency. Reducing the step of applying thermal paste can avoid damage to the performance of the insulating material caused by human error. The thermal insulation layer 310 can provide heat transfer characteristics, thereby generating a heat conduction path in the normal direction Z of the board body 100 (i.e., the direction perpendicular to the board body) and generating a heat-averaging path along the board body 100, thereby enhancing the heat dissipation effect.
[0056] Figure 3 FIG. 1 is a cross-sectional view of a circuit board stack structure according to another embodiment of the present disclosure. Figure 3In the circuit board stack structure disclosed in the present invention, a plurality of power elements 200 may be disposed on the first surface 101 of the board body 100, and a plurality of heat-conducting blocks 330 corresponding to the plurality of power elements 200 may be embedded in the board body 100. Each heat-conducting block 330 is respectively connected to the same heat-conducting insulating layer 310 and each corresponding power element 200. The heat-conducting insulating layer 310 can block the potential of each power element 200 and the potential difference between each power element 200 and the heat sink 410. The embodiments of the present invention can be applied to a solid-state transformer (SST) having a plurality of power conversion modules, and at least one power conversion module includes the circuit board stack structure of the embodiment of the present invention to meet the requirements of withstand voltage and heat dissipation of medium and high voltage systems.
[0057] The above description is only a preferred embodiment of the present utility model and is not intended to limit the patent scope of the present utility model. Other equivalent changes that apply the patent spirit of the present utility model should all fall within the patent scope of the present utility model.
Claims
1. A circuit board stack structure, characterized in that: Include: A plate having a first surface and a second surface opposite to each other; A power element is disposed on the first surface; a heat-conducting insulating layer, covering the second surface and being pressed and bonded to the second surface; a heat diffusion layer, covering the heat conductive insulating layer and being pressed and bonded to the heat conductive insulating layer; and A heat-conducting block is embedded in the plate body and connected to the power element and the heat-conducting insulating layer respectively.
2. The circuit board stack structure according to claim 1, wherein: The invention also comprises a heat sink, which is assembled on the plate body and the heat diffusion layer is located between the heat sink and the heat conductive insulation layer.
3. The circuit board stack structure according to claim 2, wherein: The heat sink is electrically connected to the heat diffusion layer.
4. The circuit board stack structure according to claim 2, wherein: The invention also comprises a heat-conducting layer, which is arranged between the heat sink and the heat diffusion layer.
5. The circuit board stack structure according to claim 4, characterized in that: The heat sink is thermally connected to the power element via the heat-conducting layer, the heat-diffusion layer, the heat-conducting insulating layer and the heat-conducting block.
6. The circuit board stack structure according to claim 1, wherein: A surface circuit is arranged on the first surface, and the power element is electrically connected to the surface circuit.
7. The circuit board stack structure according to claim 6, wherein: The invention also comprises a heat sink, which is assembled on the plate body and the heat diffusion layer is located between the heat sink and the heat conductive insulation layer. The plate body is provided with a through hole, and a conductive layer is attached to the inner wall of the through hole, and the conductive layer is respectively connected to the surface circuit and the heat diffusion layer. The through hole is provided with a conductor fastener, and the conductor fastener is connected to the heat sink.
8. The circuit board stack structure according to claim 7, wherein: The heat sink is electrically connected to the heat diffusion layer via the conductor fastener and the conductive layer.
9. The circuit board stack structure according to claim 1, wherein: The board body comprises a plurality of insulating layers and a plurality of circuit layers, wherein the plurality of insulating layers and the plurality of circuit layers are stacked in an interlaced manner.
10. The circuit board stack structure according to claim 9, wherein: The thermal conductivity of the heat-conducting insulating layer is greater than the thermal conductivity of each of the insulating layers.
11. A circuit board stack structure, characterized in that: Include: A board having a first surface and a second surface opposite to each other, and comprising a plurality of insulating layers and a plurality of circuit layers; a heat-conductive insulating layer, covering the second surface and being pressed and bonded to the second surface, wherein the thermal conductivity of the heat-conductive insulating layer is greater than the thermal conductivity of each of the insulating layers; a heat diffusion layer, covering the heat conductive insulating layer and being pressed and bonded to the heat conductive insulating layer; as well as A heat-conducting block is embedded in the plate body and connected to the first surface and the heat-conducting insulating layer.
12. A solid-state transformer having a plurality of power conversion modules, characterized in that: At least one of the plurality of power conversion modules has a circuit board stack structure, which includes: A plate having a first surface and a second surface opposite to each other; A plurality of power components are arranged on the first surface; a heat-conducting insulating layer, covering the second surface and being pressed and bonded to the second surface; a heat diffusion layer, covering the heat conductive insulating layer and being pressed and bonded to the heat conductive insulating layer; and A plurality of heat-conducting blocks are embedded in the plate body and respectively connected to a plurality of the power elements and the heat-conducting insulating layer.
13. The solid-state transformer according to claim 12, characterized in that: The circuit board stack structure also includes a heat sink, which is assembled on the board body, and the heat diffusion layer is located between the heat sink and the heat conductive insulation layer, and the heat sink is electrically connected to the heat diffusion layer.
14. The solid-state transformer according to claim 13, characterized in that: The circuit board stack structure also includes a heat-conducting layer, which is disposed between the heat sink and the heat diffusion layer. The heat sink is thermally connected to each power element through the heat-conducting layer, the heat diffusion layer, the heat-conducting insulating layer, and then through a plurality of heat-conducting blocks.
15. The solid-state transformer according to claim 12, wherein: A surface circuit is arranged on the first surface, and each of the power elements is electrically connected to the surface circuit.
16. The solid-state transformer according to claim 15, characterized in that The circuit board stack structure also includes a heat sink, which is assembled on the board body and the heat diffusion layer is located between the heat sink and the heat conductive insulation layer. The board body is provided with a through hole, and a conductive layer is attached to the inner wall of the through hole, and the conductive layer is respectively connected to the surface circuit and the heat diffusion layer. The through hole is provided with a conductor locking piece, and the conductor locking piece is connected to the heat sink. 17 . The solid-state transformer as claimed in claim 16 , wherein the heat sink is electrically connected to the heat diffusion layer via the conductor fastener and the conductive layer. 18 . The solid-state transformer as claimed in claim 12 , wherein the board comprises a plurality of insulating layers and a plurality of circuit layers, and the plurality of insulating layers and the plurality of circuit layers are stacked alternately.
19. The solid-state transformer as claimed in claim 12, wherein the thermal conductivity of the thermally conductive insulating layer is greater than the thermal conductivity of each of the insulating layers.
20. The solid-state transformer as claimed in claim 12, wherein the plurality of thermally conductive blocks are copper blocks or ceramics.