Data center cooling system and data center

Abstract

The utility model relates to a data center cooling system and a data center, the data center cooling system is used for cooling equipment in a data center machine room, the equipment in the data center machine room comprises air cooling equipment and liquid cooling equipment, and the data center cooling system comprises a cold source device and an air cooling unit. The cold source device is arranged outside a machine room of the data center, and a cooling medium is arranged in the cold source device; the air cooling unit is arranged in a machine room of the data center, the air cooling unit is communicated with the cold source device, and the cooling medium can exchange heat with the air cooling unit so as to dissipate heat of the air cooling equipment or the liquid cooling equipment; the cold source device is communicated with a heat dissipation loop in the liquid cooling equipment, so that a cooling medium flows between the cold source device and the liquid cooling equipment and exchanges heat with the liquid cooling equipment; wherein the cooling medium can be subjected to liquid-gas phase change among the cold source device, the air cooling unit and the liquid cooling equipment, so that heat exchange is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of data center heat dissipation systems, in particular to a data center cooling system and a data center. Background Art

[0002] With the rise of high-performance cloud computing and computing data centers and the development of AI (artificial intelligence) chip technology, all walks of life have higher and higher performance requirements for data center servers. Among them, the power density of CPU (central processing unit) and GPU (graphics processing unit) chips is also getting higher and higher, from more than 100W to the current 300-400W, and even reaching 700W to 1000W or more. The traditional air cooling form is on the verge of a bottleneck, or requires a very large economic cost, and the overall energy-saving solution in the data center cannot meet PUE (data center energy efficiency). In order to solve this problem, server chip liquid cooling technology came into being.

[0003] The existing mainstream liquid cooling solutions mainly include cold plate liquid cooling and immersion liquid cooling. Among them, cold plate liquid cooling has been widely adopted due to its flexibility, relatively low cost and air cooling compatibility. However, the current main solution for cold plate liquid cooling is water or a solution containing water. On the one hand, water is a conductive substance. Once leaked, it will cause damage to IT equipment, which has a great impact. On the other hand, water quality management is very complicated. Improper management can easily lead to dirty blockage and scaling of pipelines and heat exchange systems, affecting heat exchange efficiency and even corrosion and leakage. In addition, the water-cooled cold plate uses the sensible heat of the temperature increase for cooling. There is a bottleneck in its heat removal capacity, and it is no longer capable of cooling higher-performance chips in the future. Utility Model Content

[0004] Based on this, it is necessary to provide a data center cooling system and a data center to address the technical problem that the heat dissipation capacity of the data center through the water-cooled cold plate in the related technology is insufficient.

[0005] A data center cooling system is used to dissipate heat from equipment in a data center computer room, wherein the equipment in the data center computer room includes air cooling equipment and liquid cooling equipment. The data center cooling system includes:

[0006] A cold source device is arranged outside the computer room of the data center, and a cooling medium is arranged in the cold source device;

[0007] An air cooling unit is arranged in the machine room of the data center, the air cooling unit is connected to the cold source device, and the cooling medium can exchange heat with the air cooling unit to dissipate heat of the air cooling device or the liquid cooling device;

[0008] The cold source device is connected to the heat dissipation circuit in the liquid cooling device, so that the cooling medium flows between the cold source device and the liquid cooling device to exchange heat with the liquid cooling device;

[0009] Wherein, the cooling medium can undergo a liquid-gas phase change between the cold source device and the air cooling unit and the liquid cooling equipment to achieve heat exchange.

[0010] In one embodiment, the cold source device comprises:

[0011] Fluorine pump;

[0012] A heat exchanger having an inlet and an outlet, wherein the outlet is connected to the fluorine pump, the liquid cooling device and the air cooling unit are both connected to the fluorine pump, and the liquid cooling device and the air cooling unit are both connected to the inlet;

[0013] A first circulation loop is formed between the heat exchanger, the fluorine pump and the heat dissipation circuit of the liquid cooling device; a second circulation loop is formed between the heat exchanger, the fluorine pump and the air cooling unit, and the cooling medium flows between the first circulation loop or the second circulation loop.

[0014] In one embodiment, the number of the liquid cooling devices is multiple, and the data center cooling system includes:

[0015] A first main pipeline is connected to the fluorine pump and to the outlet of the heat exchanger;

[0016] A plurality of first branch pipelines are all connected to the first main pipeline and connected to the heat dissipation circuit of each of the liquid cooling devices;

[0017] a second main pipeline, connected to the inlet;

[0018] A plurality of second branch pipelines are all connected to the second main pipeline and are connected to the heat dissipation circuit of each of the liquid cooling devices.

[0019] In one embodiment, the data center cooling system comprises:

[0020] Control unit;

[0021] A plurality of expansion valves are respectively connected to the first branch pipes and are in communication with the control unit;

[0022] A plurality of detection elements, respectively connected to the first branch pipeline and / or the second branch pipeline, and connected to the control unit for communication, the detection elements being used to detect the pressure or temperature on the branch pipeline;

[0023] The control unit is capable of controlling the opening of the expansion valve according to the detection result of the detection element.

[0024] In one embodiment, each of the detection elements comprises:

[0025] a pressure sensor, disposed on the first branch pipeline, for detecting a pressure value of the cooling medium in the first branch pipeline;

[0026] a temperature sensor, disposed on the second branch pipe, for detecting a temperature value of the cooling medium in the second branch pipe;

[0027] The control unit is capable of controlling the opening of the expansion valve according to a difference between the temperature value and a saturation temperature corresponding to the pressure value.

[0028] In one embodiment, the first circulation loop includes a plurality of first branches, each of the first branches includes a plurality of image processors connected in parallel through a liquid inlet pipe, and the liquid inlet pipe corresponding to the image processor in the same branch is connected to the first branch pipe; each of the first branches also includes a plurality of air outlet pipes, and the air outlet pipe corresponding to the image processor in the same branch is connected to the second branch pipe;

[0029] Alternatively, each of the first branches includes a central processor, the central processor is connected to the first main pipeline through the first branch pipeline, and the central processor is also connected to the second main pipeline through the second branch pipeline.

[0030] In one embodiment, the liquid cooling device includes a liquid cooling plate, the heat dissipation circuit is constructed in the liquid cooling plate, heat is exchanged between the cooling medium in the heat dissipation circuit and the liquid cooling plate, and the liquid cooling plate is used to absorb heat in the liquid cooling device.

[0031] In one embodiment, the data center cooling system includes a control unit, and the air-cooling unit also includes an air-cooling supplementary cooling device. The air-cooling supplementary cooling device is arranged in a computer room of the data center. The air-cooling supplementary cooling device is communicatively connected to the control unit, and the control unit can control the opening of the air-cooling supplementary cooling device according to cooling requirements.

[0032] In one embodiment, the cooling medium is Freon.

[0033] A data center comprises the data center cooling system as described above.

[0034] Beneficial effects of the utility model:

[0035] The data center cooling system provided by the utility model provides a cold source for the air cooling unit and the liquid cooling device by connecting the cold source device to the air cooling unit and the liquid cooling device at the same time, thereby dissipating heat for the air cooling device and the liquid cooling device in the data center computer room. The cooling medium in the cold source device can undergo a liquid-gas phase change between the cold source device and the air cooling unit and the liquid cooling device, thereby greatly improving the heat dissipation effect of the data center. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A schematic diagram of the structure of a data center cooling system provided by an embodiment of the utility model;

[0037] Figure 2 A schematic diagram of the piping arrangement for an image processor cabinet in a data center cooling system is provided for an embodiment of the utility model;

[0038] Figure 3 A schematic diagram of the piping arrangement for a central processing unit cabinet in a data center cooling system is provided for one embodiment of the utility model.

[0039] Reference numerals:

[0040] Cold source device 100; fluorine pump 110; heat exchanger 120; inlet 121; outlet 122; fan 130; air cooling unit 200; liquid cooling equipment 300; first main pipeline 410; first branch pipeline 420; second main pipeline 430; second branch pipeline 440; expansion valve 450; detection element 460; pressure sensor 461; temperature sensor 462; image processor 500; liquid inlet pipe 610; air outlet pipe 620; central processing unit 700; air-cooled supplementary cooling device 800; data center room 900; floor 910; roof 920. DETAILED DESCRIPTION

[0041] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0042] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0043] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0044] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0046] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0047] See also Figure 1 According to an embodiment of the present invention, a data center cooling system is provided, which is used to dissipate heat for equipment in a computer room 900 of a data center. The equipment in the computer room 900 of the data center includes air cooling equipment and liquid cooling equipment 300. The data center cooling system includes a cold source device 100 and an air cooling unit 200. The cold source device 100 is arranged outside the computer room of the data center, and a cooling medium is arranged in the cold source device 100. The air cooling unit 200 is arranged in the computer room of the data center, and the air cooling unit 200 is connected to the cold source device 100. The cooling medium can exchange heat with the air cooling unit 200 to dissipate heat for the air cooling device or the liquid cooling device 300. The cold source device 100 is connected to the heat dissipation circuit in the liquid cooling device 300, so that the cooling medium flows between the cold source device 100 and the liquid cooling device 300, and exchanges heat with the liquid cooling device 300. The cooling medium can undergo a liquid-gas phase change between the cold source device 100 and the air cooling unit 200 and the liquid cooling device 300 to achieve heat exchange.

[0048] The data center cooling system provided by the technical solution provides a cold source for the air cooling unit 200 and the liquid cooling device 300 by connecting the cold source device 100 to the air cooling unit 200 and the liquid cooling device 300 at the same time, thereby dissipating heat from the air cooling device and the liquid cooling device 300 in the data center computer room 900. The cooling medium in the cold source device 100 can undergo a liquid-gas phase change between the cold source device 100 and the air cooling unit 200 and the liquid cooling device 300, thereby greatly improving the heat dissipation effect of the data center.

[0049] Moreover, in the present embodiment, the cabinets of the liquid cooling equipment 300 and the air cooling equipment are arranged on the floor of the data center room 900, and the cold source device can be arranged on the roof 920 outside the data center room 900. By directly connecting the cold source device 100 with the heat dissipation circuit of the liquid cooling equipment 300, the cooling medium in the cold source device 100 can flow directly into the heat dissipation circuit of the liquid cooling equipment 300, thereby dissipating the heat of the liquid cooling equipment 300. In this way, the cold source is directly supplied to the terminal, thereby improving the heat utilization efficiency of the cold source, and thus reducing the energy efficiency index of the data center (abbreviated as PUE in English, directly replaced by PUE in the following text). It has been verified that the PUE can be reduced to less than 1.1, which is comparable to the immersion liquid cooling system.

[0050] Specifically, the cooling medium is Freon. For example, the cooling medium may be R134A Freon, or R407C Freon, etc. Compared with the cooling method using cooling water, the use of Freon as the cooling medium has the characteristics of no water leakage at the end, no corrosion to the pipeline, no dirt blockage, and high refrigeration reliability. Moreover, compared with the cooling method using cooling water, the use of Freon for cooling has the advantages of high cooling efficiency and strong cooling capacity.

[0051] Stay Engaged Figure 1 It is understood that, specifically, the cold source device 100 includes a fluorine pump 110 and a heat exchanger 120, the heat exchanger 120 is constructed with an inlet 121 and an outlet 122, the outlet 122 is connected to the fluorine pump 110, the liquid cooling equipment 300 and the air cooling unit 200 are both connected to the fluorine pump 110, and the liquid cooling equipment 300 and the air cooling unit 200 are both connected to the inlet 121; wherein, a first circulation loop is formed between the heat exchanger 120, the fluorine pump 110 and the heat dissipation circuit of the liquid cooling equipment 300; a second circulation loop is formed between the heat exchanger 120, the fluorine pump 110 and the air cooling unit 200, and the cooling medium flows between the first circulation loop or the second circulation loop.

[0052] Among them, in the first circulation loop, the liquid cooling medium, that is, Freon, flows out from the outlet 122 of the heat exchanger 120, is pressurized by the fluorine pump 110, and flows to the heat dissipation circuit of the liquid cooling device 300. After heat exchange in the liquid cooling device 300, the cooling medium becomes gaseous and flows into the heat exchanger 120 from the inlet 121 of the heat exchanger 120. The liquid cooling medium changes into liquid cooling medium after heat exchange in the heat exchanger 120. In this way, the heat exchange cycle of the cooling medium in the first circulation loop is realized. Correspondingly, in the second circulation loop, the liquid cooling medium flows out from the outlet 122 of the heat exchanger 120, is pressurized by the fluorine pump 110, and flows to the air cooling unit 200. After heat exchange in the air cooling unit 200, it changes into gaseous cooling medium, and then flows into the heat exchange from the inlet of the heat exchanger 120 for heat exchange and changes into liquid. In this way, the heat exchange cycle of the cooling medium in the second circulation loop is realized.

[0053] The above structure can not only reliably dissipate heat for the equipment in the data center, but also has low energy consumption and high energy-saving performance. It should be noted that, in this embodiment, the cold source device 100 also includes a fan 130, which is arranged near the heat exchanger 120 to cool the heat exchanger 120.

[0054] Stay Engaged Figure 1 It is understood that in one embodiment, the number of liquid cooling devices 300 is multiple, and the data center cooling system includes a first main pipeline 410, multiple first branch pipelines 420, a second main pipeline 430, and multiple second branch pipelines 440. The first main pipeline 410 is connected to the fluorine pump 110 and is connected to the outlet 122 of the heat exchanger 120; the multiple first branch pipelines 420 are all connected to the first main pipeline 410 and are connected to the heat dissipation circuit of each liquid cooling device 300; the second main pipeline 430 is connected to the inlet 121 of the heat exchanger 120; the multiple second branch pipelines 440 are all connected to the second main pipeline 430 and are connected to the heat dissipation circuit of each liquid cooling device 300. In this configuration, the first main pipeline 410 is connected to the outlet 122 of the heat exchanger 120 and the fluorine pump 110, and is connected to the heat dissipation circuit of each liquid cooling device 300 through the first branch pipeline 420, so that the cooling medium can flow from the heat exchanger 120 to each liquid cooling device 300 after being pressurized by the fluorine pump 110. The second main pipeline 430 is connected to the inlet 121 of the heat exchanger 120, and multiple second branch pipelines 440 are connected to the second main pipeline 430, and the second branch pipeline 440 is connected to the heat dissipation circuit of the liquid cooling device 300, so that the cooling medium after heat exchange in the heat dissipation circuit flows into the second main pipeline 430 through the second branch pipeline 440 and then flows into the heat exchanger 120.

[0055] Stay Engaged Figure 1 It is understood that, further, the data center cooling system also includes a control unit, multiple expansion valves 450 and a detection element 460, the multiple expansion valves 450 are respectively connected to the first branch pipeline 420, and are communicated with the control unit; multiple detection elements 460 are respectively connected to the first branch pipeline 420 and / or the second branch pipeline 440, and are communicated with the control unit, and the detection element 460 is used to detect the pressure or temperature on the branch pipeline; wherein the control unit can control the opening of the expansion valve 450 according to the detection result of the detection element 460.

[0056] By setting an expansion valve 450 on the first branch pipeline 420, the high-pressure cooling medium is adiabatically expanded through the expansion valve 450 to become low-pressure and low-temperature cooling medium vapor, and the low-pressure and low-temperature cooling medium vapor flows into the heat dissipation circuit of the liquid cooling device 300 through the first branch pipeline 420 for heat exchange, thereby achieving heat dissipation of the liquid cooling device 300. In this embodiment, by setting an expansion valve 450 and a detection element 460, and connecting the expansion valve 450 and the detection element 460 to a control unit, the pressure or temperature on the first branch pipeline 420 or the second branch pipeline 440 is detected by the detection element 460, and the control unit controls the opening of the expansion valve 450 according to the detection result of the detection element 460, so that the liquid cooling device 300 is provided with an appropriate amount of cooling medium according to the different refrigeration requirements in each liquid cooling device 300, thereby ensuring that the liquid cooling device 300 in each cabinet can be accurately cooled.

[0057] Stay Engaged Figure 1 It is understood that, specifically, each detection element 460 includes a pressure sensor 461 and a temperature sensor 462. The pressure sensor 461 is arranged on the first branch pipeline 420, and is used to detect the pressure value of the cooling medium in the first branch pipeline 420; the temperature sensor 462 is arranged on the second branch pipeline 440, and is used to detect the temperature value of the cooling medium in the second branch pipeline 440; wherein the control unit can control the opening of the expansion valve 450 according to the difference between the saturation temperature corresponding to the temperature value and the pressure value.

[0058] The pressure of the cooling medium in the first branch pipeline 420 is detected by the pressure sensor 461, and the temperature of the cooling medium in the second branch pipeline 440 is detected by the temperature sensor 462, wherein the pressure value of the cooling medium in the first branch pipeline 420 corresponds to the saturation temperature value of the cooling medium, and the control unit can calculate the difference between the temperature value of the cooling medium in the second branch pipeline 440 and the saturation temperature value corresponding to the pressure value, and determine the refrigeration demand based on the difference, and adjust the opening of the expansion valve 450 according to the corresponding refrigeration demand. Thereby, the refrigeration corresponding to each cabinet is more accurate. Moreover, through the combination of pressure and temperature sensors 462 and expansion valves 450, the entire cooling system can accurately control the flow and load supply, adapt to a variety of load types and a variety of operating load conditions, and the system data can be monitored in real time to reduce blind spots in operation and maintenance.

[0059] It should be noted that, in this embodiment, the control system can also determine the refrigeration requirements of different cabinet terminals according to the pressure value corresponding to each first branch pipeline 420, and adjust the pressure of the fluorine pump 110 according to the cabinet terminal with the largest refrigeration demand, so as to ensure that the liquid supply and load flow of the overall system can be fully supplied. In this way, the entire data center cooling system can link the cold source and the equipment terminal, thereby ensuring the system implementation linkage, optimizing energy saving and the reliability of equipment operation.

[0060] In one embodiment, if Figure 2 As shown, the first circulation loop includes a plurality of first branches, each of which includes a plurality of image processors 500 connected in parallel through a liquid inlet pipe 610, and the liquid inlet pipe 610 corresponding to the image processor in the same branch is connected to the first branch pipe; each first branch also includes a plurality of air outlet pipes 620, and the air outlet pipe 620 corresponding to the image processor in the same branch is connected to the second branch pipe; or, Figure 3 As shown, each first branch includes a central processor, which is connected to the first main pipeline 410 through a first branch pipeline 420 , and is also connected to the second main pipeline 430 through a second branch pipeline 440 .

[0061] This embodiment provides two internal pipelines of the liquid cooling device 300. Among them, since the image processor has many chips inside and the workload varies greatly, external precise flow control is more required to ensure the safe operation of the image processor. Therefore, in this embodiment, a cooling medium flows into each image processor in each group of image processors, thereby ensuring the heat dissipation performance of each image processor. The two different processors are cooled by the above two different pipeline distributions.

[0062] In one embodiment, the liquid cooling device 300 includes a liquid cooling plate, a heat dissipation circuit is configured in the liquid cooling plate, heat is exchanged between the cooling medium in the heat dissipation circuit and the liquid cooling plate, and the liquid cooling plate is used to absorb the heat in the liquid cooling device 300. By arranging a heat dissipation circuit in the liquid cooling plate, the cooling medium can flow into the heat dissipation circuit, the plate body of the liquid cooling plate absorbs the heat in the liquid cooling device 300, and the cooling medium absorbs the heat on the liquid cooling plate, thereby achieving heat dissipation of the liquid cooling device 300.

[0063] In one embodiment, the data center cooling system includes a control unit, and the air cooling unit 200 also includes an air cooling supplementary cooling device 800. The air cooling supplementary cooling device 800 is arranged in a computer room of the data center. The air cooling supplementary cooling device 800 is communicatively connected with the control unit, and the control unit can control the air cooling supplementary cooling device 800 to open according to the cooling demand.

[0064] It should be noted that, in this embodiment, the air-cooled supplementary cooling device 800 is an air-cooled air conditioner with a compressor in the prior art. By installing an air-cooled air conditioner in the computer room of the data center, when the cooling of the data center computer room 900 by the cold source device 100 alone cannot meet the cooling demand, the air-cooled supplementary cooling device 800 can be used to compensate for the cooling of the data center computer room 900, so that the cooling in the entire data center computer room 900 meets the demand, thereby ensuring the reliability and stability of the operation of the equipment in the data center.

[0065] An embodiment of the utility model further provides a data center, the data center includes the above data center cooling system. By using the above data center cooling system in the data center, by connecting the cold source device 100 with the air cooling unit 200 and the liquid cooling device 300 at the same time, a cold source is provided for the air cooling unit 200 and the liquid cooling device 300, thereby dissipating heat for the air cooling device and the liquid cooling device 300 in the data center computer room 900. Among them, the cooling medium in the cold source device 100 can undergo a liquid-gas phase change between the cold source device 100 and the air cooling unit 200 and the liquid cooling device 300, thereby greatly improving the heat dissipation effect of the data center.

[0066] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0067] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A data center cooling system, used for dissipating heat from equipment in a data center computer room, wherein the equipment in the data center computer room includes air cooling equipment and liquid cooling equipment, characterized in that: The data center cooling system comprises: A cold source device is arranged outside the computer room of the data center, and a cooling medium is arranged in the cold source device; An air cooling unit is arranged in the machine room of the data center, the air cooling unit is connected to the cold source device, and the cooling medium can exchange heat with the air cooling unit to dissipate heat of the air cooling device or the liquid cooling device; The cold source device is connected to the heat dissipation circuit in the liquid cooling device, so that the cooling medium flows between the cold source device and the liquid cooling device to exchange heat with the liquid cooling device; Wherein, the cooling medium can undergo a liquid-gas phase change between the cold source device and the air cooling unit and the liquid cooling equipment to achieve heat exchange.

2. The data center cooling system according to claim 1, characterized in that: The cold source device comprises: Fluorine pump; A heat exchanger having an inlet and an outlet, wherein the outlet is connected to the fluorine pump, the liquid cooling device and the air cooling unit are both connected to the fluorine pump, and the liquid cooling device and the air cooling unit are both connected to the inlet; A first circulation loop is formed between the heat exchanger, the fluorine pump and the heat dissipation circuit of the liquid cooling device; a second circulation loop is formed between the heat exchanger, the fluorine pump and the air cooling unit, and the cooling medium flows between the first circulation loop or the second circulation loop.

3. The data center cooling system according to claim 2, characterized in that: The number of the liquid cooling devices is multiple, and the data center cooling system includes: A first main pipeline is connected to the fluorine pump and to the outlet of the heat exchanger; A plurality of first branch pipelines are all connected to the first main pipeline and connected to the heat dissipation circuit of each of the liquid cooling devices; a second main pipeline, connected to the inlet; A plurality of second branch pipelines are all connected to the second main pipeline and are connected to the heat dissipation circuit of each of the liquid cooling devices.

4. The data center cooling system according to claim 3, characterized in that: The data center cooling system comprises: Control unit; A plurality of expansion valves are respectively connected to the first branch pipes and are in communication with the control unit; A plurality of detection elements, respectively connected to the first branch pipeline and / or the second branch pipeline, and connected to the control unit for communication, the detection elements being used to detect the pressure or temperature on the branch pipeline; The control unit is capable of controlling the opening of the expansion valve according to the detection result of the detection element.

5. The data center cooling system according to claim 4, characterized in that: Each of the detection elements comprises: a pressure sensor, disposed on the first branch pipeline, for detecting a pressure value of the cooling medium in the first branch pipeline; a temperature sensor, disposed on the second branch pipe, for detecting a temperature value of the cooling medium in the second branch pipe; The control unit is capable of controlling the opening of the expansion valve according to a difference between the temperature value and a saturation temperature corresponding to the pressure value.

6. The data center cooling system according to claim 3, characterized in that: The first circulation loop includes a plurality of first branches, each of the first branches includes a plurality of image processors connected in parallel through a liquid inlet pipe, and the liquid inlet pipe corresponding to the image processor in the same branch is connected to the first branch pipe; each of the first branches also includes a plurality of air outlet pipes, and the air outlet pipe corresponding to the image processor in the same branch is connected to the second branch pipe; Alternatively, each of the first branches includes a central processor, the central processor is connected to the first main pipeline through the first branch pipeline, and the central processor is also connected to the second main pipeline through the second branch pipeline.

7. The data center cooling system according to claim 1, characterized in that: The liquid cooling device comprises a liquid cooling plate, the heat dissipation circuit is constructed in the liquid cooling plate, heat is exchanged between the cooling medium in the heat dissipation circuit and the liquid cooling plate, and the liquid cooling plate is used to absorb heat in the liquid cooling device.

8. The data center cooling system according to any one of claims 1 to 7, characterized in that: The data center cooling system includes a control unit, and the air-cooling unit also includes an air-cooling supplementary cooling device. The air-cooling supplementary cooling device is arranged in a computer room of the data center. The air-cooling supplementary cooling device is communicatively connected to the control unit, and the control unit can control the air-cooling supplementary cooling device to be turned on according to cooling requirements.

9. The data center cooling system according to any one of claims 1 to 7, characterized in that: The cooling medium is Freon.

10. A data center, characterized in that: The data center comprises a data center cooling system as described in any one of claims 1-9.

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