Laser marking machine

Abstract

The utility model discloses a laser marking machine, and relates to the technical field of laser marking equipment. The laser marking machine comprises a laser device assembly and a galvanometer assembly, the laser device comprises a light path piece and a control piece, the light path piece comprises a laser device, an isolator, a first surrounding plate and a partition plate, the first surrounding plate and the partition plate are connected to form a first containing space, the laser device is arranged in the first containing space, and the control piece comprises a second surrounding plate and a driving module. The sides, away from the first containing space, of the second surrounding plate and the partition plate are connected to form a second containing space, and the isolator and the driving module are arranged in the second containing space. The galvanometer assembly is connected with the laser assembly, the light inlet end of the isolator is connected with the laser, the light outlet end of the isolator is connected with the galvanometer assembly, and the driving module is electrically connected with the laser. The laser marking machine is high in integration level, small in size and convenient to carry.

Description

Technical Field

[0001] The present application relates to the technical field of laser marking equipment, and in particular to a laser marking machine. Background Art

[0002] Laser marking is to focus the light beam output by the laser through a two-dimensional scanning galvanometer and then act on the surface of the material for laser marking.

[0003] Traditional laser marking equipment is modularized with laser, marking control card, galvanometer, power supply, etc., and each unit is independently set. Laser marking equipment is relatively large and needs to occupy a space as big as a desktop computer desk. In addition, this type of laser equipment is usually used in a fixed location and is not convenient to move. Utility Model Content

[0004] In view of this, the present application provides a laser marking machine, the purpose of which is to solve one of the technical problems in the prior art.

[0005] To achieve the above objectives, the technical solutions adopted in this application are as follows:

[0006] In a first aspect, an embodiment of the present application provides a laser marking machine, comprising:

[0007] A laser assembly, comprising an optical circuit component and a control component, wherein the optical circuit component comprises a laser, an isolator, a first enclosure and a partition plate, wherein the first enclosure and the partition plate are connected to form a first receiving space, wherein the laser is arranged in the first receiving space, wherein the control component comprises a second enclosure and a drive module, wherein the second enclosure and a side of the partition plate away from the first receiving space are connected to form a second receiving space, wherein the isolator and the drive module are arranged in the second receiving space;

[0008] The galvanometer assembly is connected to the laser assembly, the light input end of the isolator is connected to the laser, the light output end of the isolator is connected to the galvanometer assembly, and the driving module is electrically connected to the laser.

[0009] In one embodiment of the first aspect, the isolator is connected to the partition plate, and the driving module includes:

[0010] A driving plate, the driving plate is connected to the second enclosure plate and is spaced apart from the partition plate, the isolator is located between the driving plate and the partition plate, and the driving plate is arranged close to the light output end of the isolator;

[0011] A marking control card is connected to the second enclosure and spaced apart from the partition plate. The isolator is located between the marking control card and the partition plate. The marking control card is arranged close to the light output end of the isolator.

[0012] In one embodiment of the first aspect, the driving module includes:

[0013] A main control board is connected to a side of the driving board away from the isolator.

[0014] In one embodiment of the first aspect, a USB interface is provided on the second enclosure, and the USB interface is connected to the marking control card.

[0015] In one embodiment of the first aspect, the laser comprises:

[0016] a seed source, the seed source being connected to the first enclosure;

[0017] A primary optical path module and a secondary optical path module, wherein the secondary optical path module is connected to the partition plate, and the primary optical path module is connected to a side of the secondary optical path module away from the partition plate.

[0018] In one embodiment of the first aspect, the laser is a MOPA structure laser.

[0019] In one embodiment of the first aspect, the first enclosure has a first end surface close to the galvanometer assembly, the first end surface is provided with a light outlet, and the light outlet end of the isolator is arranged at the light outlet;

[0020] The galvanometer assembly has a second end surface, and a light inlet is formed on the second end surface, and the light inlet corresponds to the light outlet.

[0021] In one embodiment of the first aspect, the galvanometer assembly and the laser assembly are detachably connected.

[0022] In one of the embodiments of the first aspect, the first end surface of the first enclosure is provided with a plug-in female connector, and the second end surface of the galvanometer assembly is provided with a plug-in male connector, and when the plug-in male connector and the plug-in female connector are connected, the first end surface and the second end surface are fitted together.

[0023] In one of the embodiments of the first aspect, the laser assembly also includes a heat sink, which is disposed in the second containing space and close to the light input end of the isolator. The heat sink is located between the marking control card and the partition plate. The second enclosure is also provided with a heat dissipation hole, which is close to the light output end of the isolator.

[0024] Compared with the prior art, the beneficial effects of the present application are as follows: the present application proposes a laser marking machine, comprising a laser assembly and a galvanometer assembly, the laser comprising an optical path component and a control component, the optical path component comprising a laser, an isolator, a first enclosure and a partition plate, the first enclosure and the partition plate are connected to form a first containment space, the laser is arranged in the first containment space, the control component comprises a second enclosure and a drive module, the second enclosure and the partition plate are connected at a side away from the first containment space to form a second containment space, the isolator and the drive module are arranged in the second containment space; the galvanometer assembly is connected to the laser assembly, the light input end of the isolator is connected to the laser, the light output end of the isolator is connected to the galvanometer assembly, the drive module is electrically connected to the laser, and the galvanometer assembly, the laser and the drive module are integrated together, thereby reducing the size of the laser marking machine and facilitating movement and carrying. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 One of the structural schematic diagrams of the laser marking machine in some embodiments of the present application is shown;

[0027] Figure 2 A schematic diagram of the assembly structure of a driving module and an isolator in some embodiments of the present application is shown;

[0028] Figure 3 A schematic diagram of the exploded structure of a laser assembly in some embodiments of the present application is shown;

[0029] Figure 4 The second structural schematic diagram of the laser marking machine in some embodiments of the present application is shown;

[0030] Figure 5 One of the exploded structural schematic diagrams of the laser marking machine in some embodiments of the present application is shown;

[0031] Figure 6 The second schematic diagram of the exploded structure of the laser marking machine in some embodiments of the present application is shown;

[0032] Figure 7 A schematic diagram of the assembled structure of the isolator and the galvanometer assembly in some embodiments of the present application is shown.

[0033] Description of main component symbols: 100-Laser marking machine;

[0034] 110-laser assembly; 111-optical path component; 1111-laser; 1112-isolator; 1113-first enclosure; 1114-partitioning plate; 1115-first receiving space; 112-control component; 1121-second enclosure; 1122-driving module; 1123-second receiving space; 11221-driving board; 11222-marking control card; 11223-main control board; 11213-USB interface; 11111-seed source; 11112-first optical path module; 11113-secondary optical path module; 11211-first end face; 11212-light outlet; 1116-first cover plate; 1124-second cover plate; 11214-plug female connector; 113-heat sink; 11215-heat dissipation hole;

[0035] 120 - galvanometer assembly; 121 - galvanometer; 1211 - second end face; 1212 - light inlet; 1213 - male connector; 122 - field mirror. DETAILED DESCRIPTION

[0036] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0037] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0039] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0040] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0041] With the improvement of design level and manufacturing technology, lasers and supporting processing systems are constantly developing in the direction of smaller size, lighter weight, simpler and higher performance.

[0042] The laser marker in the related technology is composed of several parts such as laser, galvanometer, drive control system, power cable and signal control line. In some specific scenarios, it has disadvantages such as large size, complex structure, high cost and inconvenient use. It has no advantages and is not portable enough in scenarios that require mobile use.

[0043] like Figures 1 to 3 As shown, an embodiment of the present application provides a laser marking machine 100, which is mainly used for marking the surface of a workpiece.

[0044] The laser marking machine 100 includes a laser assembly 110 and a galvanometer assembly 120 .

[0045] The laser assembly 110 includes an optical circuit component 111 and a control component 112 .

[0046] The optical path component 111 includes a laser 1111, an isolator 1112, a first enclosure 1113 and a partition plate 1114. The first enclosure 1113 and the partition plate 1114 are connected to form a first receiving space 1115, and the laser 1111 is disposed in the first receiving space 1115.

[0047] The control member 112 includes a second enclosure 1121 and a driving module 1122. The second enclosure 1121 and a side of the partition plate 1114 away from the first receiving space 1115 are connected to form a second receiving space 1123, and the isolator 1112 and the driving module 1122 are disposed in the second receiving space 1123.

[0048] The galvanometer assembly 120 is connected to the laser assembly 110, the light input end of the isolator 1112 is connected to the laser 1111, the light output end of the isolator 1112 is connected to the galvanometer assembly 120, and the driving module 1122 is electrically connected to the laser 1111. In this way, the laser 1111 is integrated on one side of the partition plate 1114, and the isolator 1112 and the driving module 1122 are integrated on the other side of the partition plate 1114, so that the structure of the laser assembly 110 is more compact and the volume is reduced.

[0049] In some embodiments, the isolator 1112 is connected to the partition plate 1114 , and the driving module 1122 includes a driving board 11221 and a marking control card 11222 .

[0050] like Figure 2 and Figure 3 As shown, the driving plate 11221 is connected to the second enclosure plate 1121 and is spaced apart from the partition plate 1114 . The isolator 1112 is located between the driving plate 11221 and the partition plate 1114 . The driving plate 11221 is arranged close to the light emitting end of the isolator 1112 .

[0051] The marking control card 11222 is connected to the second enclosure 1121 and is spaced apart from the partition 1114. The isolator 1112 is located between the marking control card 11222 and the partition 1114. The marking control card 11222 is located near the light-emitting end of the isolator 1112. In this way, the marking control card 11222 is located at the end away from the galvanometer assembly 120, which is convenient for arranging an interface on the second enclosure 1121.

[0052] In some embodiments, the driving module 1122 further includes a main control board 11223. The main control board 11223 is connected to a side of the driving board 11221 away from the isolator 1112. In this way, the main control board 11223 and the driving board 11221 are stacked, which facilitates wiring and reduces the size of the driving module 1122.

[0053] In the related art, the control interface of the laser or the same type of laser is a DB25 interface and a DB9 interface which occupy a large space.

[0054] In view of the above problems, in some embodiments, Figure 4As shown, a USB interface 11213 is provided on the second enclosure 1121, and the USB interface 11213 is connected to the marking control card 11222. Compared with the wire connection used in the related art or the DB25 interface and DB9 interface that occupy a larger space, the USB interface 11213 has the advantages of occupying less space and being more versatile.

[0055] Of course, the USB interface 11213 can also be replaced with a Type-c interface or an AUX interface. These interfaces also have the advantages of taking up less space and being more versatile.

[0056] In one embodiment, Figure 5 As shown, the laser 1111 includes a seed source 11111, a primary optical path module 11112 and a secondary optical path module 11113 which are connected in sequence.

[0057] The seed source 11111 is connected to the first enclosure 1113, and the primary optical path module 11112 is connected to the secondary optical path module 11113 on a side away from the partition plate 1114. This connection method makes the layout of the laser 1111 more compact and reduces the size of the laser marker.

[0058] In some embodiments, the laser 1111 is a MOPA structure laser 1111. The high-energy pulse laser obtained in the optical fiber using the MOPA structure (Master Oscillator Power-Amplifier) ​​has the same wavelength and repetition frequency as the seed light source, and the shape and width of the time domain pulse are almost unchanged. A seed light source with a certain repetition frequency and pulse width is selected as the master oscillator, and the required high-energy pulse laser output can be obtained after power amplification.

[0059] In some embodiments, the pulse width of the MOPA laser 1111 is in the range of 1-500ns, and the pulse repetition frequency is in the range of 1-4000kHz, so that the MOPA laser 1111 has a peak power three times that of the same type of laser 1111, thereby improving the quality of the marking beam, thereby improving the marking quality and marking efficiency of the laser marking machine 100.

[0060] In some embodiments, Figure 6 and Figure 7 As shown, the first enclosure 1113 has a first end surface 11211 close to the galvanometer assembly 120 . The first end surface 11211 is provided with a light outlet 11212 . The light outlet end of the isolator 1112 is disposed at the light outlet 11212 .

[0061] The galvanometer assembly 120 has a second end surface 1211 , and a light inlet 1212 is formed on the second end surface 1211 . The light inlet 1212 corresponds to the light outlet 11212 .

[0062] In some embodiments, the laser assembly 110 further has a first cover plate 1116 and a second cover plate 1124. The first cover plate 1116 is covered at the opening of the first receiving space 1115, and the second cover plate 1124 is covered at the opening of the second receiving space 1123, so that the appearance and integrity of the laser assembly 110 are better.

[0063] In some embodiments, the galvanometer assembly 120 includes a galvanometer 121 and a field lens 122 . The galvanometer 121 is connected to the light output end of the isolator 1112 . The second end surface 1211 and the light input port 1212 are arranged on the galvanometer 121 . The field lens 122 is arranged on the light output side of the galvanometer 121 .

[0064] In the related art, the galvanometer part is connected to the laser as an integral whole, which is inconvenient to store and carry.

[0065] In this embodiment, the galvanometer assembly 120 and the laser assembly 110 are detachably connected, so that the laser marking machine 100 is easy to store and carry.

[0066] In the related art, the control and connection method between the galvanometer and the laser is through wires, which does not provide a strong sense of integration and the exposed wires also cause visual unsightliness.

[0067] In some embodiments, the first end face 11211 of the first enclosure 1113 is provided with a plug-in female connector 11214, and the second end face 1211 of the galvanometer assembly 120 is provided with a plug-in male connector 1213. When the plug-in male connector 1213 and the plug-in female connector 11214 are connected, the first end face 11211 and the second end face 1211 fit together.

[0068] For example, the male and female heads of a pogo pin are used. A pogo pin is a spring-type probe formed by riveting and pre-pressing three basic components, namely a needle shaft, a spring, and a needle tube, with a precise spring structure inside.

[0069] The power supply and signal control of the galvanometer assembly 120 are provided by the female connector on the laser assembly 110. When in use, it only needs to be docked. There is no wireless beam connection in the middle, which is convenient for disassembly and assembly. It also has a beautiful appearance and a strong sense of integration.

[0070] In some embodiments, the laser assembly 110 further includes a heat sink 113 .

[0071] The heat sink 113 is arranged in the second receiving space 1123 and is close to the light incident end of the isolator 1112. The heat sink 113 is located between the marking control card 11222 and the partition plate 1114. The second enclosure 1121 is also provided with a heat dissipation hole 11215. The heat dissipation hole 11215 is arranged close to the light output end of the isolator 1112, or the heat dissipation hole 11215 is arranged at the air outlet end of the heat sink 113.

[0072] In one embodiment, the heat sink 113 is a fan. By providing the heat sink 113 and the heat dissipation holes 11215, the control component 112 and the optical path component 111 can be cooled, thereby improving the continuous working ability of the laser marking machine 100.

[0073] The laser marking machine 100 improved in the present application has a compact structure, high integration, and is easy to move and carry. It can be operated with one hand, or placed on a desktop for processing, and is applicable to a wide range of field lenses 122. In addition, when laser marking is required, it is only necessary to connect the laser assembly 110 to the machine or laptop computer through a common data cable to perform processing and marking, which is simple to operate.

[0074] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0075] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A laser marking machine, characterized in that: include: A laser assembly, comprising an optical circuit component and a control component, wherein the optical circuit component comprises a laser, an isolator, a first enclosure and a partition plate, wherein the first enclosure and the partition plate are connected to form a first receiving space, wherein the laser is arranged in the first receiving space, wherein the control component comprises a second enclosure and a drive module, wherein the second enclosure and a side of the partition plate away from the first receiving space are connected to form a second receiving space, wherein the isolator and the drive module are arranged in the second receiving space; The galvanometer assembly is connected to the laser assembly, the light input end of the isolator is connected to the laser, the light output end of the isolator is connected to the galvanometer assembly, and the driving module is electrically connected to the laser.

2. The laser marking machine according to claim 1, characterized in that: The isolator is connected to the partition plate, and the driving module includes: A driving plate, the driving plate is connected to the second enclosure plate and is spaced apart from the partition plate, the isolator is located between the driving plate and the partition plate, and the driving plate is arranged close to the light output end of the isolator; A marking control card is connected to the second enclosure and spaced apart from the partition plate. The isolator is located between the marking control card and the partition plate. The marking control card is arranged close to the light output end of the isolator.

3. The laser marking machine according to claim 2, characterized in that: The driving module comprises: A main control board is connected to a side of the driving board away from the isolator.

4. The laser marking machine according to claim 2, characterized in that: The second enclosure is provided with a USB interface, and the USB interface is connected to the marking control card.

5. The laser marking machine according to any one of claims 1 to 4, characterized in that: The laser comprises: a seed source, the seed source being connected to the first enclosure; A primary optical path module and a secondary optical path module, wherein the secondary optical path module is connected to the partition plate, and the primary optical path module is connected to a side of the secondary optical path module away from the partition plate.

6. The laser marking machine according to any one of claims 1 to 4, characterized in that: The laser is a MOPA structure laser.

7. The laser marking machine according to any one of claims 1 to 4, characterized in that: The first enclosure has a first end surface close to the galvanometer assembly, the first end surface is provided with a light outlet, and the light outlet end of the isolator is arranged at the light outlet; The galvanometer assembly has a second end surface, and a light inlet is formed on the second end surface, and the light inlet corresponds to the light outlet.

8. The laser marking machine according to claim 7, characterized in that: The galvanometer assembly and the laser assembly are detachably connected.

9. The laser marking machine according to claim 7, characterized in that: The first end surface of the first enclosure is provided with a plug-in female connector, and the second end surface of the galvanometer assembly is provided with a plug-in male connector. When the plug-in male connector and the plug-in female connector are connected, the first end surface and the second end surface fit together.

10. The laser marking machine according to any one of claims 2 to 4, characterized in that: The laser assembly also includes a heat sink, which is arranged in the second receiving space and close to the light input end of the isolator. The heat sink is located between the marking control card and the partition plate. The second enclosure is also provided with a heat dissipation hole, which is close to the light output end of the isolator.

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