Novel case structure

Abstract

The utility model discloses a novel case structure. The novel case structure comprises a shell assembly, the heat dissipation assembly is vertically installed on the shell assembly, and the heat dissipation assembly is connected with the shell assembly and used for further cooling the interior of the shell assembly; the control assembly is vertically installed on the shell assembly, the control assembly is connected with the heat dissipation assembly and used for further controlling the heat dissipation assembly, through the arrangement of the heat dissipation assembly, further heat dissipation of parts in the case is facilitated, the situation that aging of the parts in the case is accelerated due to too high temperature is avoided, and the service life of the case is prolonged. And meanwhile, the heat dissipation problem of the case is solved, and the practicability is improved.

Description

Technical Field

[0001] The utility model relates to the technical development field of computer chassis, in particular to a new chassis structure. Background Art

[0002] With the development of desktop hosts, the existing chassis structure has also encountered a bottleneck in design. However, for places such as Internet cafes or Internet bars, the monotonous chassis structure also affects the user experience. As a part of computer accessories, the chassis mainly plays the role of placing and fixing various computer accessories, playing a supporting and protective role. In addition, the computer chassis has the important role of shielding electromagnetic radiation;

[0003] The existing Chinese patent with reference announcement number CN202563407U discloses a computer case shell, whose structure includes a main panel and a support frame, the main panel is provided with a positioning column, the support frame is provided with a bend, and the support frame is fixed to the positioning column of the main panel through the bend. In the above utility model patent, although the support frame is provided with a bend, and the support frame is fixed to the positioning column of the main panel through the bend, the installation between the main panel and the support frame is simple, no screws are required, and this installation method makes the support force and stability of the support frame better, but it does not have further treatment of the heat dissipation inside the chassis, and it is easy to cause damage to the components inside the chassis. At the same time, if the heat dissipation of the chassis as a whole is not well treated, the appearance of the chassis will be changed, and the aesthetics and practicality of the chassis will also be reduced. Therefore, in order to solve this problem, the inventor proposes a new chassis structure. The above technical solution will further complete the heat dissipation function inside the chassis, so that the components inside the chassis are further protected and the practicality is improved. Utility Model Content

[0004] In view of the deficiencies existing in the above technologies, the utility model provides a novel chassis structure.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical solutions: a new chassis structure, including a shell assembly;

[0006] A heat dissipation component, the heat dissipation component is vertically mounted on the housing component, the heat dissipation component is connected to the housing component, and is used to further cool the interior of the housing component;

[0007] A control component is vertically mounted on the shell component and connected to the heat dissipation component for further controlling the heat dissipation component.

[0008] As a further explanation, the heat dissipation assembly includes a dust cover, a cooling fan and a CPU radiator. The dust cover is installed on the outer wall of the shell assembly, and the dust cover is connected to the shell assembly to prevent external dust from entering the interior of the chassis, while further protecting the cooling fan. The cooling fan is installed on the inner wall of the shell assembly, and the cooling fan is connected to the shell assembly to discharge excessive temperature inside the chassis to the outside of the chassis. The CPU radiator is vertically installed on the control assembly.

[0009] As a further explanation, the shell assembly includes a cover plate and an upper side plate, the cover plate is vertically installed on the upper side plate, the upper side plates are distributed on two side edges of the cover plate, the dust cover is located on the outer wall of the upper side plate, and the cooling fan is located on the inner wall of the upper side plate.

[0010] As a further explanation, the shell assembly includes a lower side plate and a bottom plate, the lower side plate is vertically installed on the upper side plate, the lower side plate is connected to the upper side plate for further supporting the upper side plate, and the bottom plate is respectively installed between the two lower side plates, and the bottom plate is connected to the lower side plate for further supporting the lower side plate.

[0011] As a further explanation, the bottom plate is extended outwardly to be provided with an outer cover for protecting the interior of the chassis. The outer cover is vertically mounted on the bottom plate and connected to the bottom plate to further protect the components inside the chassis.

[0012] As a further explanation, the control component includes a power supply, a motherboard and a graphics card. The motherboard is vertically installed on the outer cover, the power supply is vertically installed on the motherboard, and the power supply is electrically connected to the motherboard to facilitate the motherboard to further control the components inside the chassis. The graphics card is installed on one side of the CPU radiator, the CPU radiator is vertically located on the motherboard, and the CPU radiator is connected to the motherboard.

[0013] As a further explanation, the control component includes PCIE and PCI. The PCIE is vertically installed on the mainboard, and the PCIE is connected to the mainboard for connecting to external devices such as the computer mainboard and graphics card. The PCI is vertically installed on the mainboard, and the PCI is connected to the mainboard for connecting to the interface of external devices of the chassis.

[0014] As a further explanation, a positioning frame for positioning the upper side plate is extended outward from the upper side plate, and the positioning frame is installed on a side wall of the upper side plate, and the positioning frame is connected to the upper side plate.

[0015] As a further explanation, a baffle bar for supporting computer components is disposed inside the bottom plate, and the baffle bar is vertically mounted on the bottom plate.

[0016] In summary, the utility model has the following beneficial effects: the utility model provides a new chassis structure, which facilitates further heat dissipation of components inside the chassis through the setting of the heat dissipation component, avoids the situation where excessive temperature accelerates aging of components inside the chassis, and at the same time solves the heat dissipation problem of the chassis, thereby improving practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a three-dimensional structural diagram of a new type of chassis structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the internal structure of a new type of chassis structure of the utility model;

[0019] Figure 3 This is a left view of a new chassis structure of the utility model.

[0020] Numbers in the figure: 1-positioning frame, 2-baffle, 10-shell assembly, 101-cover plate, 102-upper side plate, 103-lower side plate, 104-outer cover, 105-bottom plate, 20-control assembly, 201-power supply, 202-mainboard, 203-PCIE, 204-PCI, 205-graphics card 30-heat dissipation assembly, 301-dust cover, 302-cooling fan, 303-CPU radiator. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] like Figure 1-3 As shown, a novel chassis structure includes a shell assembly;

[0023] A heat dissipation component is vertically mounted on the housing component and connected to the housing component to further cool the interior of the housing component;

[0024] A control component is vertically mounted on the shell component and connected to the heat dissipation component for further controlling the heat dissipation component.

[0025] The heat dissipation assembly includes a dust cover 301, a cooling fan 302 and a CPU radiator 303. The dust cover 301 is installed on the outer wall of the shell assembly, and the dust cover 301 is connected to the shell assembly to prevent external dust from entering the interior of the chassis, while further protecting the cooling fan 302. The cooling fan 302 is installed on the inner wall of the shell assembly, and the cooling fan 302 is connected to the shell assembly to discharge the excessively high temperature inside the chassis to the outside of the chassis. The CPU radiator 303 is vertically installed on the control assembly.

[0026] Specifically, by setting the dust cover 301, it is convenient to block the dust from the outside on the outer surface of the chassis to prevent the dust from entering the inside of the chassis. At the same time, the dust cover 301 further protects the cooling fan 302 to prevent some unknown objects from damaging the cooling fan 302, thereby improving the protection of the cooling fan 302. When the temperature inside the chassis is too high, the cooling fans 302 arranged on both sides of the upper side plate 102 will discharge the excessively high temperature inside the chassis to the outside of the chassis, thereby further protecting the components inside the chassis and improving the practicality. By setting the CPU radiator 303, it is mainly used to dissipate heat and keep the temperature of the CPU within a safe range. It is usually composed of a heat sink, a fan and a heat pipe. The heat sink is a metal sheet installed on the CPU, which conducts heat by contacting the CPU. The fan is responsible for blowing air to the heat sink to accelerate the dissipation of heat and improve the practicality.

[0027] The housing assembly includes a cover plate 101 and an upper side plate 102. The cover plate 101 is vertically mounted on the upper side plate 102. The upper side plates 102 are distributed at two side edges of the cover plate 101. The dust cover 301 is located on the outer side wall of the upper side plate 102. The cooling fan 302 is located on the inner side wall of the upper side plate 102. The housing assembly includes a lower side plate 103 and a bottom plate 105. The lower side plate 103 is vertically mounted on the upper side plate 102. The lower side plate 103 is connected to the upper side plate 102 for further supporting the upper side plate 102. The bottom plate 105 is respectively mounted between the two lower side plates 103. The bottom plate 105 is connected to the lower side plate 103 for further supporting the lower side plate 103.

[0028] Specifically, the cover plate 101, the upper side plate 102 and the lower side plate 103 are mainly used to protect the internal circuits and computer components of the chassis, avoid damage to the components inside the chassis due to external influences, and improve practicality. The bottom plate 105 is mainly used to further support the components inside the chassis, thereby improving the stability of the components inside the chassis.

[0029] The bottom plate 105 is extended outward to be provided with an outer cover 104 for protecting the inside of the chassis. The outer cover 104 is vertically mounted on the bottom plate 105 and connected to the bottom plate 105 to further protect the components inside the chassis.

[0030] Specifically, the outer cover 104 is mainly used to further protect the components inside the chassis to prevent external dust from entering the interior of the chassis. The outer cover 104 of the chassis is an irregular shell, which beautifies the appearance of the chassis and improves the user's comfortable experience when using it.

[0031] The control components include a power supply 201, a motherboard 202 and a graphics card 205. The motherboard 202 is vertically mounted on the outer cover 104. The power supply 201 is vertically mounted on the motherboard 202. The power supply 201 is electrically connected to the motherboard 202 to facilitate the motherboard 202 to further control the components inside the chassis. The graphics card 205 is installed on one side of the CPU radiator 303. The CPU radiator 303 is vertically located on the motherboard 202, and the CPU radiator 303 and the motherboard 202 are connected.

[0032] Specifically, when the components inside the chassis are to be started, the power supply 201 is started first. After the power supply 201 is started, the components inside the chassis can be used, which improves practicality. Through the setting of the mainboard 202, the mainboard 202 is mainly used to conveniently connect and install other hardware devices, such as a graphics card 205, a hard disk, a network card, etc. At the same time, the mainboard 202 also undertakes data transmission and signal processing, which improves practicality. The graphics card 205 is mainly used to accelerate computer graphics rendering, video decoding and 3D modeling, etc., which improves practicality.

[0033] The control components include PCIE203 and PCI204. PCIE203 is vertically installed on the motherboard 202, and is connected to the motherboard 202, and is used to connect the computer motherboard 202 and external devices such as the graphics card 205. PCI204 is vertically installed on the motherboard 202, and is connected to the motherboard 202, and is used to connect the interface of the chassis external devices.

[0034] Specifically, PCIE203 is mainly used to connect computer motherboard 202 and external devices such as graphics card 205. Compared with traditional PCIE203, PCIE203 has higher bandwidth and faster data transmission speed. Through the setting of PCI204, PCI204 is mainly used for connecting computer and external device interface standard, usually used to expand the function and performance of computer. PCI204 interface can connect various hardware devices, such as graphics card 205, sound card, network card, etc. Through PCI204 interface, these devices can communicate and transmit data with the processor integrated on the motherboard 202, which improves practicality.

[0035] A positioning frame 1 for positioning the upper side plate 102 is provided extending outward from the upper side plate 102 . The positioning frame 1 is installed on a side wall of the upper side plate 102 , and the positioning frame 1 is connected to the upper side plate 102 .

[0036] Specifically, when the upper side plate needs to be further positioned, the positioning frame 1 can be used to further limit the upper side plate, thereby preventing the upper side plate from falling during use and improving the position limitation of the upper side plate.

[0037] A baffle 2 for supporting computer components is disposed inside the bottom plate 105 , and the baffle 2 is vertically mounted on the bottom plate 105 .

[0038] Specifically, by providing the baffle bar 2, the baffle bar 2 is mainly used to further support the components inside the chassis, thereby preventing the components inside the chassis from falling and improving the stability of the components inside the chassis.

[0039] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0040] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A new chassis structure, characterized in that: including a housing assembly; A heat dissipation component, the heat dissipation component is vertically mounted on the housing component, the heat dissipation component is connected to the housing component, and is used to further cool the interior of the housing component; A control component is vertically mounted on the shell component and connected to the heat dissipation component for further controlling the heat dissipation component.

2. A novel chassis structure according to claim 1, characterized in that: The heat dissipation assembly includes a dust cover, a cooling fan and a CPU radiator. The dust cover is installed on the outer wall of the shell assembly, and the dust cover is connected to the shell assembly to prevent external dust from entering the interior of the chassis and further protect the cooling fan. The cooling fan is installed on the inner wall of the shell assembly, and the cooling fan is connected to the shell assembly to discharge excessive temperature inside the chassis to the outside of the chassis. The CPU radiator is vertically installed on the control assembly.

3. A novel chassis structure according to claim 2, characterized in that: The shell assembly includes a cover plate and an upper side plate, the cover plate is vertically installed on the upper side plate, the upper side plates are distributed on two side edges of the cover plate, the dust cover is located on the outer wall of the upper side plate, and the cooling fan is located on the inner wall of the upper side plate.

4. A novel chassis structure according to claim 3, characterized in that: The shell assembly includes a lower side plate and a bottom plate, the lower side plate is vertically installed on the upper side plate, the lower side plate is connected to the upper side plate for further supporting the upper side plate, and the bottom plate is respectively installed between the two lower side plates, the bottom plate is connected to the lower side plate for further supporting the lower side plate.

5. A novel chassis structure according to claim 4, characterized in that: The bottom plate is extended outwardly to be provided with an outer cover for protecting the inside of the chassis. The outer cover is vertically mounted on the bottom plate and connected to the bottom plate to further protect the components inside the chassis.

6. A novel chassis structure according to claim 5, characterized in that: The control component includes a power supply, a motherboard and a graphics card. The motherboard is vertically installed on the outer cover, and the power supply is vertically installed on the motherboard. The power supply is electrically connected to the motherboard to facilitate the motherboard to further control the components inside the chassis. The graphics card is installed on one side of the CPU radiator. The CPU radiator is vertically located on the motherboard, and the CPU radiator is connected to the motherboard.

7. A novel chassis structure according to claim 6, characterized in that: The control component includes PCIE and PCI. The PCIE is vertically installed on the mainboard and connected to the mainboard for connecting external devices such as the computer mainboard and graphics card. The PCI is vertically installed on the mainboard and connected to the mainboard for connecting to the interface of external devices of the chassis.

8. The novel chassis structure according to claim 3 is characterized in that: The side plate is extended outwardly to be provided with a positioning frame for positioning the side plate. The positioning frame is installed on a side wall of the side plate, and the positioning frame is connected to the upper side plate.

9. The novel chassis structure according to claim 4 is characterized in that: The bottom plate is provided with a baffle bar for supporting computer components, and the baffle bar is vertically installed on the bottom plate.

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