Wafer expanding production line
By designing an automated crystal expansion production line, including crystal expansion machines, AOI equipment and defect removal mechanism, the problem of low efficiency of the existing crystal expansion production line is solved, efficient automated production is achieved, and production capacity is improved.
Patent Information
- Application Number
- CN202420351430.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-26
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-02-26
AI Technical Summary
The existing crystal expander production lines are inefficient, and many processes require manual processing, which affects production capacity.
A crystal expansion production line including a crystal expansion machine, a defect removal mechanism and AOI equipment is designed. The crystal diffuser is used to form a wafer ring. The AOI equipment includes a glue decoder and an AOI detection mechanism for automatic glue decoction and detection of defects; the defect removal mechanism is used to automatically remove detected defects.
The automation of crystal expansion, glue decoction, AOI detection and defect removal has been achieved, reducing manual intervention and improving production efficiency and capacity.
Smart Images
Figure CN222619694U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of crystal expansion technology, and in particular to a crystal expansion production line. Background Art
[0002] In the field of solid crystal, solid crystal machine can stably take LED chips from wafer, which requires the preparation of high-quality wafer ring (wafer expanded on sub-ring and mother ring). In this field, the wafer film is expanded on sub-ring and mother ring by using the crystal expander. Most of the crystal expanders are semi-automatic structures. Many processes in the crystal expansion process need to be handled manually, which leads to low production efficiency and affects production capacity. Utility Model Content
[0003] Based on this, it is necessary to provide a wafer expansion production line to improve the production efficiency of wafer rings.
[0004] A crystal expansion production line, the crystal expansion production line comprising:
[0005] A wafer expander, used to form a wafer ring;
[0006] Defect rejection mechanism; and,
[0007] The AOI device is arranged on one side of the wafer expander, and the AOI device includes a disintegrator and an AOI detection mechanism. The disintegrator is used to disintegrate the wafer ring generated by the wafer expander, and the AOI detection mechanism is used to detect defects in the wafer ring after disintegration by the disintegrator, and transport qualified wafer rings to the defect removal mechanism, and the defect removal mechanism is used to remove defects on the surface of the wafer ring after detection by the AOI detection mechanism.
[0008] In one embodiment, the wafer expander comprises:
[0009] A wafer film feeding mechanism, used for providing a wafer film;
[0010] A sub-ring loading mechanism, used for providing a sub-ring, wherein the wafer film provided by the wafer film loading mechanism can be located above the sub-ring provided by the sub-ring loading mechanism, and the wafer film is attached to the sub-ring and adsorbed by the sub-ring loading mechanism;
[0011] A mother ring feeding mechanism, used for providing mother rings;
[0012] The film expansion mechanism is capable of moving along the second direction to the mother ring feeding mechanism to carry the mother ring;
[0013] The sub-ring loading mechanism is configured to move along a first direction so that the sub-ring loading mechanism that attracts the sub-ring and the wafer film moves to a film expansion position, the film expansion mechanism can drive the supported mother ring to move to the film expansion position, and the mother ring at the film expansion position is located above the wafer film, the film expansion mechanism is used to expand the wafer film, and to tighten the mother ring and the sub-ring, and to press the expanded wafer film to form the wafer ring, wherein the first direction is perpendicular to the second direction.
[0014] In one of the embodiments, a film expansion detection component is provided on the film expansion mechanism, and the film expansion detection component is used to monitor the distance between multiple chips on the wafer ring and whether the outer circle contour of the expanded wafer ring meets the requirements.
[0015] In one embodiment, the dissolving machine comprises:
[0016] A debonding mechanism, used for debonding the wafer ring it carries;
[0017] Transfer platform;
[0018] A first manipulator is used to move the wafer ring formed by the wafer expander to the debonding mechanism, and the first manipulator can move the wafer ring after debonding to the transfer platform;
[0019] The second robot is used to move the wafer ring on the transfer platform to the AOI inspection mechanism.
[0020] In one embodiment, the AOI inspection mechanism includes:
[0021] AOI inspection platform, used to detect defects in the wafer ring it carries;
[0022] A material throwing belt line, used for conveying unqualified wafer rings detected by the AOI inspection platform;
[0023] The third robot is used to place unqualified wafer rings on the throwing belt line, or to send qualified wafer rings to the defect removal mechanism.
[0024] In one embodiment, two degumming mechanisms are provided, and the two degumming mechanisms are respectively located at two ends of the moving direction of the first manipulator, and the transfer platform is located in the middle of the two degumming mechanisms.
[0025] In one embodiment, the defect removal mechanism includes a connected downward pressure removal head and a lifting cylinder, and the lifting cylinder can drive the downward pressure removal head to move in a direction close to the wafer ring so that the downward pressure removal head sticks to the defective chip of the wafer ring it carries, and can drive the downward pressure removal head to move in a direction away from the wafer ring to separate the defective chip from the wafer ring.
[0026] In one of the embodiments, it further includes a bull horn plate and a mounting mechanism, wherein the mounting mechanism is used to clamp the wafer ring removed by the defect removal mechanism into the bull horn plate.
[0027] In one embodiment, the mounting mechanism comprises:
[0028] A first clamping assembly, used for clamping the horn plate;
[0029] A first pressing component, which can abut against or separate from the horn plate, and when the first pressing component abuts against the horn plate, the buckle of the horn plate can be opened;
[0030] A second clamping assembly, used to clamp the wafer ring after being removed by the defect removal mechanism;
[0031] The second pressing assembly is connected to the second clamping assembly, and the second pressing assembly can drive the second clamping assembly to move so that the wafer ring extends into the bull horn plate when the first pressing assembly and the bull horn plate are in contact.
[0032] In one embodiment, the mounting mechanism further includes a rotating assembly, wherein the rotating assembly is connected to the second clamping assembly, and the rotating assembly can drive the second clamping assembly to rotate so as to adjust the relative positions of the wafer ring and the bull horn plate.
[0033] The above-mentioned crystal expansion production line is provided with a crystal expansion machine, a disintegrating machine, an AOI detection mechanism and a defect removal mechanism. The crystal expansion machine can generate a wafer ring, and the AOI equipment is arranged on one side of the crystal expansion machine. The disintegrating machine can disintegrate the wafer ring generated by the crystal expansion machine; the AOI detection mechanism can detect the defects of the wafer ring after disintegration by the disintegrating machine, and transport the qualified wafer ring to the defect removal mechanism; the defect removal mechanism can remove the defects on the surface of the qualified wafer ring after detection by the AOI detection mechanism. The crystal expansion production line provided in the present application can realize multiple functions of crystal expansion, disintegrating, AOI detection and defect removal, and no longer requires manual processing, which improves production efficiency and also increases production capacity. BRIEF DESCRIPTION OF THE DRAWINGS
[0034] Figure 1 This is a schematic diagram of the structure of the crystal expansion production line provided in this application.
[0035] Figure 2 This is a schematic diagram of the structure of the film expansion mechanism provided in this application.
[0036] Figure 3 This is a schematic diagram of the structure of the dissolving machine and AOI inspection mechanism provided in this application.
[0037] Figure 4 This is a schematic diagram of the structure of the defect removal mechanism provided in this application.
[0038] Figure 5 This is a schematic diagram of the structure of the installation mechanism provided in this application.
[0039] In the figure:
[0040] 100. Wafer film loading mechanism;
[0041] 200, sub-ring feeding mechanism;
[0042] 300, mother ring feeding mechanism;
[0043] 400, film expansion mechanism; 410, film expansion motor; 420, snap-fit cylinder; 430, film expansion detection member;
[0044] 500, dissolving machine; 510, dissolving mechanism; 520, transfer platform; 530, first manipulator;
[0045] 600, AOI inspection mechanism; 610, AOI inspection platform; 620, throwing belt line; 630, third manipulator;
[0046] 700, defect removal mechanism; 710, downward pressure removal head; 720, lifting cylinder; 730, rolling assembly; 740, driving motor;
[0047] 800, mounting mechanism; 810, first clamping assembly; 820, first pressing assembly; 830, second clamping assembly; 840, second pressing assembly; 850, rotating assembly. DETAILED DESCRIPTION
[0048] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.
[0049] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.
[0050] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0051] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.
[0052] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0053] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.
[0054] The present application provides a wafer expansion production line, such as Figures 1 to 5 As shown, the crystal expansion production line includes a crystal expansion machine, a defect removal mechanism 700 and an AOI device. The crystal expansion machine is used to form a wafer ring. The AOI device is arranged on one side of the crystal expansion machine. The AOI device includes a debonding machine 500 and an AOI detection mechanism 600. The debonding machine 500 is used to debond the wafer ring generated by the crystal expansion machine. The AOI detection mechanism 600 is used to detect defects in the wafer ring after debonding by the debonding machine 500, and transport the qualified wafer ring to the defect removal mechanism 700. The defect removal mechanism 700 is used to remove defects on the surface of the wafer ring after detection by the AOI detection mechanism 600.
[0055] The above-mentioned crystal expansion production line is provided with a crystal expansion machine, a dissolving machine 500, an AOI detection mechanism 600 and a defect removal mechanism 700. The crystal expansion machine can generate a wafer ring, and the AOI equipment is arranged on one side of the crystal expansion machine. The dissolving machine 500 can dissolve the wafer ring generated by the crystal expansion machine; the AOI detection mechanism 600 can detect the defects of the wafer ring after dissolving by the dissolving machine 500, and transport the qualified wafer ring to the defect removal mechanism 700; the defect removal mechanism 700 can remove the defects on the surface of the qualified wafer ring after detection by the AOI detection mechanism 600. The crystal expansion production line provided in the present application can realize multiple functions of crystal expansion, dissolving, AOI detection and defect removal, and no longer requires manual processing, which improves production efficiency and also increases production capacity.
[0056] like Figure 1 and Figure 2As shown, the crystal expansion machine includes a wafer film loading mechanism 100, a sub-ring loading mechanism 200, a mother ring loading mechanism 300 and a film expansion mechanism 400. The wafer film loading mechanism 100 is used to provide a wafer film; the sub-ring loading mechanism 200 is used to provide a sub-ring, and the wafer film provided by the wafer film loading mechanism 100 can be located above the sub-ring provided by the sub-ring loading mechanism 200, and the wafer film is attached to the sub-ring and adsorbed by the sub-ring loading mechanism 200; the mother ring loading mechanism 300 is used to provide a mother ring; the film expansion mechanism 400 can be arranged along the second direction. Move to the mother ring loading mechanism 300 to carry the mother ring; the child ring loading mechanism 200 is configured to move along the first direction, so that the child ring loading mechanism 200 that attracts the child ring and the wafer film moves to the film expansion position, the film expansion mechanism 400 can drive the carried mother ring to move to the film expansion position, and the mother ring in the film expansion position is located above the wafer film, the film expansion mechanism 400 is used to expand the wafer film, and to tighten the mother ring and the child ring, and to press the expanded wafer film to form a wafer ring, wherein the first direction is perpendicular to the second direction.
[0057] The sub-ring loading mechanism 200 provides a sub-ring, and the sub-ring is clamped on the sub-ring loading mechanism 200, and the wafer film loading mechanism 100 provides a wafer film, which can be moved above the sub-ring, and the sub-ring loading mechanism 200 provides suction to adsorb the wafer film so that the wafer film and the sub-ring are fitted together, and the sub-ring loading mechanism 200 moves along the first direction to drive the sub-ring and the wafer film to move to the film expansion position. At this time, the film expansion mechanism 400 moves along the second direction to the mother ring loading mechanism 300 and carries the mother ring, and then continues to move to the film expansion position, so that the sub-ring, the mother ring, and the wafer film form a wafer ring.
[0058] It should be noted that the sub-ring feeding mechanism 200 can move along the first direction, the film expanding mechanism 400 can move along the second direction, and the film expanding position is the intersection of the first direction and the second direction.
[0059] Specifically, if Figure 1 and Figure 2 As shown, there are multiple sub-ring loading mechanisms 200, multiple mother-ring loading mechanisms 300, and multiple film expansion mechanisms 400, and the multiple sub-ring loading mechanisms 200, multiple mother-ring loading mechanisms 300, and multiple film expansion mechanisms 400 correspond to each other, and one wafer film loading mechanism 100 provides wafer films for two sub-ring loading mechanisms 200. Multiple sub-ring loading mechanisms 200, multiple mother-ring loading mechanisms 300, and multiple film expansion mechanisms 400 correspond to each other, and one wafer film loading mechanism 100 corresponds to two sub-ring loading mechanisms 200.
[0060] Specifically, if Figure 1 and Figure 2As shown, the film expansion mechanism 400 includes a film expansion motor 410 and a locking cylinder 420. The film expansion motor 410 can move along the third direction to expand the wafer film. The locking cylinder 420 can move along the third direction so that the mother ring is locked with the child ring to press the expanded wafer film, wherein the third direction, the first direction and the second direction are perpendicular to each other.
[0061] Specifically, if Figure 1 and Figure 2 As shown, a film expansion detection member 430 is provided on the film expansion mechanism 400, and the film expansion detection member 430 is used to monitor the distance between different components of the chip on the wafer ring, and whether the outer circle contour of the wafer ring after expansion meets the requirements. By providing the film expansion detection member 430, the distance between different components of the chip on the wafer ring and whether the outer circle contour of the wafer ring after expansion meets the requirements are monitored.
[0062] like Figure 1 and Figure 3 As shown, the disintegration machine 500 includes a disintegration mechanism 510, a transfer platform 520, a first manipulator 530 and a second manipulator. The disintegration mechanism 510 is used to disintegrate the wafer ring it carries; the first manipulator 530 is used to move the wafer ring formed by the crystal expander to the disintegration mechanism 510, and the first manipulator 530 can move the wafer ring after disintegration to the transfer platform 520; the second manipulator is used to move the wafer ring on the transfer platform 520 to the AOI inspection mechanism 600. The first manipulator 530 can move the wafer ring produced by the crystal expander to the disintegration mechanism 510, so that the disintegration mechanism 510 performs UV disintegration on the wafer ring, and can place the wafer ring after disintegration on the transfer platform 520, and then the wafer ring on the transfer platform 520 (that is, the wafer ring after disintegration) is moved to the AOI inspection mechanism 600 by the second manipulator for AOI inspection.
[0063] Specifically, if Figure 1 and Figure 3 As shown, after the wafer ring is generated, the sub-ring loading mechanism 200 can continue to move along the first direction, and then the first robot 530 can move along the second direction and move the wafer ring on the sub-ring loading mechanism 200 to the debonding mechanism 510.
[0064] Specifically, the degumming mechanism 510 is a double-layer structure with upper and lower layers. The movement of the UV degumming platform in and out is achieved through a motor and belt combination structure to achieve material loading and unloading. The UV lamp bead board can be quickly replaced according to the wavelength requirements of the light source, and the UV lamp bead board controller can control the lamp power to meet the degumming requirements. The degumming cavity is completely sealed, and nitrogen can be passed through to reduce the oxygen content and the temperature can be monitored to protect the chip. The degumming time is adjustable.
[0065] Specifically, if Figure 1 and Figure 3 As shown, two dissolving mechanisms 510 are provided, and the two dissolving mechanisms 510 are respectively located at the two ends of the moving direction of the first manipulator 530, and the transfer platform 520 is located in the middle of the two dissolving mechanisms 510. Two dissolving mechanisms 510 are provided, and the two dissolving mechanisms 510 are respectively located at the two ends of the moving direction of the first manipulator 530, and the dissolving mechanisms 510 and the sub-ring loading mechanisms 200 correspond one to one, and each dissolving mechanism 510 can dissolve the wafer film transported by the corresponding sub-ring loading mechanism 200.
[0066] More specifically, there are four sub-ring loading mechanisms 200 , four mother-ring loading mechanisms 300 and four film expansion mechanisms 400 , two wafer film loading mechanisms 100 , and four debonding mechanisms 510 , which correspond one to one with the four sub-ring loading mechanisms 200 .
[0067] like Figure 1 and Figure 3 As shown, the AOI inspection mechanism 600 includes an AOI inspection platform 610, a material throwing belt line 620, and a third manipulator 630. The AOI inspection platform 610 is used to perform defect detection on the wafer rings it carries; the material throwing belt line 620 is used to transport unqualified wafer rings detected by the AOI inspection platform 610; the third manipulator 630 is used to place unqualified wafer rings on the material throwing belt line 620, or to send qualified wafer rings to the defect removal mechanism 700. The second manipulator places the wafer ring on the transfer platform 520 on the AOI inspection platform 610, and then the AOI inspection platform 610 performs defect detection on the wafer rings it carries, and the third manipulator 630 transports unqualified wafer rings to the material throwing belt line 620, and transports qualified wafer rings to the defect removal mechanism 700.
[0068] Specifically, if Figure 1 and Figure 3 As shown, the AOI inspection platform 610 adopts a marble structure to ensure inspection accuracy, and can realize wafer defect inspection and chip position information recording.
[0069] like Figure 1 and Figure 4As shown, the defect removal mechanism 700 includes a downward pressing removal head 710 and a lifting cylinder 720 connected to each other. The lifting cylinder 720 can drive the downward pressing removal head 710 to move in a direction close to the wafer ring so that the downward pressing removal head 710 is attached to the defective chip of the wafer ring it carries, and can drive the downward pressing removal head 710 to move in a direction away from the wafer ring so as to separate the defective chip from the wafer ring. The downward pressing removal head 710 is driven to move by the lifting cylinder 720 so that the downward pressing removal head 710 is attached to the defective chip of the wafer ring. When the lifting cylinder 720 drives the downward pressing removal head 710 to move in a direction away from the wafer ring, because the downward pressing removal head 710 is attached to the defective chip of the wafer ring, the defective chip can be separated from the wafer ring, thereby removing the defective chip on the wafer ring.
[0070] Specifically, if Figure 1 and Figure 4 As shown, the push-down ejector head 710 can move along the third direction to contact or separate from the wafer ring.
[0071] Specifically, if Figure 1 and Figure 4 As shown, the defect removal mechanism 700 further includes a rolling assembly 730 , which is connected to the downward pressing removal head 710 , and the rolling assembly 730 can drive the adhesive on the downward pressing removal head 710 to roll.
[0072] Specifically, if Figure 1 and Figure 4 As shown, the defect removal mechanism 700 also includes a driving motor 740, the output end of which is connected to the lifting cylinder 720. The driving motor 740 can drive the lifting cylinder 720 to move along the second direction to drive the downward pressing removal head 710 to move along the second direction.
[0073] Furthermore, if Figure 1 and Figure 5 As shown, the wafer expansion production line also includes a horn tray and a mounting mechanism 800, and the mounting mechanism 800 is used to clamp the wafer ring removed by the defect removal mechanism 700 into the horn tray. The mounting mechanism 800 is provided to mount the wafer ring removed by the defect removal mechanism 700 in the horn tray.
[0074] Specifically, if Figure 1 and Figure 5As shown, the installation mechanism 800 includes a first clamping component 810, a first pressing component 820, a second clamping component 830 and a second pressing component 840. The first clamping component 810 is used to clamp the horn plate; the first pressing component 820 can abut against or separate from the horn plate. When the first pressing component 820 abuts against the horn plate, the buckle of the horn plate can be opened; the second clamping component 830 is used to clamp the wafer ring that has been removed by the defect removal mechanism 700; the second pressing component 840 is connected to the second clamping component 830, and the second pressing component 840 can drive the second clamping component 830 to move, so that the wafer ring extends into the horn plate when the first pressing component 820 abuts against the horn plate. By setting the first clamping component 810 to clamp the bull horn plate, and the second clamping component 830 to clamp the wafer ring, the first pressing component 820 can abut against the bull horn plate to open the buckle of the bull horn plate, and then the second pressing component 840 presses the wafer ring into the bull horn plate, and finally the first pressing component 820 is separated from the bull horn plate, so that the buckle of the bull horn plate is buckled.
[0075] Specifically, if Figure 1 and Figure 5 As shown, the installation mechanism 800 also includes a rotating assembly 850, which is connected to the second clamping assembly 830. The rotating assembly 850 can drive the second clamping assembly 830 to rotate to adjust the relative position of the wafer ring and the horn plate. By setting the rotating assembly 850, the rotating assembly 850 drives the second clamping assembly 830 to rotate, and then drives the wafer ring to rotate, thereby adjusting the relative position of the wafer ring and the horn plate, making it easier to clamp the wafer ring into the horn plate.
[0076] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0077] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.
Claims
1. A crystal expansion production line, characterized in that: The crystal expansion production line comprises: A wafer expander, used to form a wafer ring; Defect rejection mechanism; and, The AOI device is arranged on one side of the wafer expander, and the AOI device includes a disintegrator and an AOI detection mechanism. The disintegrator is used to disintegrate the wafer ring generated by the wafer expander, and the AOI detection mechanism is used to detect defects in the wafer ring after disintegration by the disintegrator, and transport qualified wafer rings to the defect removal mechanism, and the defect removal mechanism is used to remove defects on the surface of the wafer ring after detection by the AOI detection mechanism.
2. The crystal expansion production line according to claim 1, characterized in that: The crystal expansion machine comprises: A wafer film feeding mechanism, used for providing a wafer film; A sub-ring loading mechanism, used for providing a sub-ring, wherein the wafer film provided by the wafer film loading mechanism can be located above the sub-ring provided by the sub-ring loading mechanism, and the wafer film is attached to the sub-ring and adsorbed by the sub-ring loading mechanism; A mother ring feeding mechanism, used for providing mother rings; The film expansion mechanism is capable of moving along the second direction to the mother ring feeding mechanism to carry the mother ring; The sub-ring loading mechanism is configured to move along a first direction so that the sub-ring loading mechanism that attracts the sub-ring and the wafer film moves to a film expansion position, the film expansion mechanism can drive the supported mother ring to move to the film expansion position, and the mother ring at the film expansion position is located above the wafer film, the film expansion mechanism is used to expand the wafer film, and to tighten the mother ring and the sub-ring, and to press the expanded wafer film to form the wafer ring, wherein the first direction is perpendicular to the second direction.
3. The crystal expansion production line according to claim 2, characterized in that: The film expansion mechanism is provided with a film expansion detection component, which is used to monitor the distance between multiple chips on the wafer ring and whether the outer circle contour of the expanded wafer ring meets the requirements.
4. The crystal expansion production line according to claim 1, characterized in that: The dissolving machine comprises: A debonding mechanism, used for debonding the wafer ring it carries; Transfer platform; A first manipulator is used to move the wafer ring formed by the wafer expander to the debonding mechanism, and the first manipulator can move the wafer ring after debonding to the transfer platform; The second robot is used to move the wafer ring on the transfer platform to the AOI inspection mechanism.
5. The crystal expansion production line according to claim 4, characterized in that: The AOI inspection mechanism includes: AOI inspection platform, used to detect defects in the wafer ring it carries; A material throwing belt line, used for conveying unqualified wafer rings detected by the AOI inspection platform; The third robot is used to place unqualified wafer rings on the throwing belt line, or to send qualified wafer rings to the defect removal mechanism.
6. The crystal expansion production line according to claim 4, characterized in that: The two degumming mechanisms are provided, and the two degumming mechanisms are respectively located at two ends of the moving direction of the first manipulator, and the transfer platform is located in the middle of the two degumming mechanisms.
7. The crystal expansion production line according to claim 1, characterized in that: The defect removal mechanism includes a connected downward pressing removal head and a lifting cylinder. The lifting cylinder can drive the downward pressing removal head to move in a direction close to the wafer ring so that the downward pressing removal head sticks to the defective chip of the wafer ring it carries, and can drive the downward pressing removal head to move in a direction away from the wafer ring to separate the defective chip from the wafer ring.
8. The crystal expansion production line according to claim 1, characterized in that: It also includes a bull horn plate and a mounting mechanism, wherein the mounting mechanism is used to clamp the wafer ring removed by the defect removal mechanism into the bull horn plate.
9. The crystal expansion production line according to claim 8, characterized in that: The mounting mechanism comprises: A first clamping assembly, used for clamping the horn plate; A first pressing component, which can abut against or separate from the horn plate, and when the first pressing component abuts against the horn plate, the buckle of the horn plate can be opened; A second clamping assembly, used to clamp the wafer ring after being removed by the defect removal mechanism; The second pressing assembly is connected to the second clamping assembly, and the second pressing assembly can drive the second clamping assembly to move so that the wafer ring extends into the bull horn plate when the first pressing assembly and the bull horn plate are in contact.
10. The crystal expansion production line according to claim 9, characterized in that: The mounting mechanism further comprises a rotating assembly, wherein the rotating assembly is connected to the second clamping assembly, and the rotating assembly can drive the second clamping assembly to rotate so as to adjust the relative position of the wafer ring and the bull horn plate.