Heat dissipation device for chip

Abstract

The utility model relates to the technical field of chip heat dissipation, and discloses a heat dissipation device for a chip, which comprises an integrated circuit board, the upper surface of the integrated circuit board is fixedly connected with a chip body, and the surface of the chip body is sleeved with a protective frame. The protection frame is arranged, the protection frame is fixed to the upper surface of the integrated circuit board through bolts, the surface of the chip body is covered with the protection frame at the moment, so that the chip body is protected, the heat dissipation silicone grease is attached to the surface of the chip body, and meanwhile due to the fact that the installation frame is installed on the upper surface of the protection frame, the heat dissipation efficiency is improved. The bottom ends of the heat dissipation fins in the chip body are attached to the surface of the heat dissipation silicone grease, the mounting frame is fixed to the top ends of the connecting columns through the bolts, heat generated when the chip body works can be rapidly transmitted to the heat dissipation silicone grease, the heat dissipation area of the heat dissipation silicone grease is greatly increased through the arrangement of the heat dissipation fins, meanwhile, the heat dissipation fan is started, and the heat dissipation efficiency is improved. Due to the arrangement of the connecting columns, a large gap is reserved between the mounting rack and the mounting frame.

Description

Technical Field

[0001] The utility model relates to the technical field of chip heat dissipation, in particular to a heat dissipation device for a chip. Background Art

[0002] An integrated circuit is a miniature electronic device that usually has multiple chips installed on it. When the electronic component chips are working, a large amount of heat will be generated. This excess heat cannot be dissipated quickly and accumulates to generate high temperature, which may damage the working equipment.

[0003] In the process of implementing this application, the inventor found that there are at least the following problems in this technology:

[0004] (1) Existing electronic component chips dissipate heat through ventilation during operation, but the heat dissipation efficiency is very low, which will affect the normal operation of the device;

[0005] (2) Since the existing devices dissipate heat through heat dissipation fins, the heat dissipation fins are fixed on the surface of the chip, which makes it very inconvenient to subsequently inspect and maintain it. Utility Model Content

[0006] In view of the deficiencies in the prior art, the utility model provides a heat dissipation device for a chip, which has the advantages of greatly improving the heat dissipation efficiency and facilitating the disassembly of the heat dissipation fins and convenient inspection and maintenance of the chip, thus solving the problems raised in the background technology.

[0007] The utility model provides the following technical solution: a heat dissipation device for a chip, comprising an integrated circuit board, a chip body is fixedly connected to the upper surface of the integrated circuit board, a protective frame is sleeved on the surface of the chip body, four ends of the protective frame are fixedly connected to the integrated circuit board by bolts, heat dissipation silicone grease is pasted on the upper surface of the chip body, a mounting frame is provided on the upper surface of the protective frame, heat dissipation fins are fixedly connected to the inner wall of the mounting frame, connecting columns are fixedly connected at the four corners of the upper surface of the mounting frame, the top of the connecting column is fixedly connected to the mounting frame by bolts, and a heat dissipation fan is fixedly installed on the inner wall of the mounting frame.

[0008] Preferably, the bottom end of the heat dissipation fin is in contact with the upper surface of the heat dissipation silicone grease, and the heat dissipation fan is located directly above the heat dissipation fin.

[0009] Preferably, both side edges of the installation frame are provided with card slots, and both sides of the upper surface of the protection frame are fixedly connected with limiting columns, and the model specifications of the limiting columns are consistent with those of the card slots.

[0010] Preferably, both ends of the installation frame are fixedly connected with a clamping strip, both sides of the upper surface of the protective frame are provided with sliding grooves, and both sides of the upper surface of the protective frame are provided with a clamping frame, the clamping frame is slidably engaged with the bottom sliding groove, and the model specifications of the clamping frame and the clamping strip are consistent.

[0011] Preferably, a spring is fixedly connected to the inner wall of the slide groove, and the other end of the spring is fixedly connected to the bottom end of the card frame.

[0012] Preferably, the lower surface of the card strip is arranged as an inclined surface, the top end of the card frame is arranged as an inclined surface, and the positions of the card strip and the card frame correspond.

[0013] Compared with the prior art, the utility model has the following beneficial effects:

[0014] 1. A protective frame is provided, and the protective frame is fixed to the upper surface of the integrated circuit board by bolts. At this time, the protective frame covers the surface of the chip body, thereby protecting the chip body, and the heat dissipation silicone grease is attached to the surface of the chip body. At the same time, since the mounting frame is installed on the upper surface of the protective frame, and the bottom ends of the heat dissipation fins inside it are in contact with the surface of the heat dissipation silicone grease, and the mounting frame is fixed to the top of the connecting column by bolts, the heat generated by the chip body during operation will be quickly transferred to the heat dissipation silicone grease, and the setting of the heat dissipation fins greatly increases the heat dissipation area of ​​the heat dissipation silicone grease. At the same time, the cooling fan is started. Due to the setting of the connecting column, a large gap is reserved between the mounting frame and the mounting frame. Under the action of the cooling fan, the air flow velocity in the heat dissipation fins is increased, and the heat can be quickly taken away, which greatly improves the heat dissipation efficiency of the chip body, improves the working performance of the chip body, and increases the service life of the chip body.

[0015] 2. By providing an installation frame, the installation frame is attached to the upper surface of the protective frame, and the positions of the card slots and the limit columns are aligned so that the card slots and the limit columns are engaged, which greatly facilitates the correction of the position of the installation frame when installing it. At the same time, the installation frame is pressed, and when the inclined surface at the bottom of the card strip is squeezed with the inclined surface at the top of the card frame, the card frame will be pushed to slide on the upper surface of the protective frame. When the card strip moves to the bottom of the card frame, the elastic force of the spring is applied to the bottom of the card frame, thereby driving the card frame to reset, so that the card frame and the card strip are engaged, thereby completing the quick installation of the installation frame. On the contrary, when the card frame is manually moved, the engaging state of the card frame and the card strip can be released, and the disassembly of the installation frame can be conveniently completed. The device can realize the rapid disassembly and assembly of the installation frame, which is convenient for the staff to inspect and maintain the chip body. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall structure of the utility model device;

[0017] Figure 2 This is a schematic diagram of the protective frame structure of the utility model;

[0018] Figure 3 This is a schematic diagram of the card frame structure of the utility model;

[0019] Figure 4 This is a schematic diagram of the installation frame structure of the utility model;

[0020] Figure 5 This is a schematic diagram of the structure of the mounting frame of the utility model.

[0021] In the figure: 1. integrated circuit board; 2. chip body; 3. protection frame; 4. heat dissipation silicone grease; 5. limit column; 6. slide groove; 7. card frame; 8. spring; 9. installation frame; 10. card slot; 11. card strip; 12. heat dissipation fin; 13. connecting column; 14. mounting frame; 15. cooling fan. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] Reference Figure 1-5 A heat dissipation device for a chip comprises an integrated circuit board 1, a chip body 2 is fixedly connected to the upper surface of the integrated circuit board 1, a protective frame 3 is sleeved on the surface of the chip body 2, four ends of the protective frame 3 are fixedly connected to the integrated circuit board 1 by bolts, a heat dissipation silicone grease 4 is pasted on the upper surface of the chip body 2, a mounting frame 9 is arranged on the upper surface of the protective frame 3, a heat dissipation fin 12 is fixedly connected to the inner wall of the mounting frame 9, connecting columns 13 are fixedly connected at the four corners of the upper surface of the mounting frame 9, a mounting frame 14 is fixedly connected to the top of the connecting column 13 by bolts, and a heat dissipation fan 15 is fixedly installed on the inner wall of the mounting frame 14.

[0024] Among them, the bottom end of the heat sink 12 is in contact with the upper surface of the heat sink grease 4, the heat sink fan 15 is located directly above the heat sink fin 12, and the heat sink grease 4 is in contact with the surface of the chip body 2. At the same time, since the mounting frame 9 is mounted on the upper surface of the protective frame 3, and the bottom end of the heat sink 12 inside it is in contact with the surface of the heat sink grease 4, and the mounting frame 14 is fixed to the top of the connecting column 13 by bolts, the heat generated by the chip body 2 during operation will be quickly transferred to the heat sink grease 4, and the setting of the heat sink fin 12 greatly increases the heat dissipation area of ​​the heat sink grease 4. At the same time, the heat sink fan 15 is started. Due to the setting of the connecting column 13, a large gap is reserved between the mounting frame 14 and the mounting frame 9. Under the action of the heat sink fan 15, the air flow rate in the heat sink fin 12 is increased, which can quickly take away the heat.

[0025] Among them, both side edges of the installation frame 9 are provided with card slots 10, both sides of the upper surface of the protection frame 3 are fixedly connected with limit columns 5, the limit columns 5 match the model specifications of the card slots 10, both ends of the installation frame 9 are fixedly connected with card strips 11, both sides of the upper surface of the protection frame 3 are provided with slide grooves 6, both sides of the upper surface of the protection frame 3 are provided with card frames 7, the card frames 7 are slidably connected with the bottom end slide grooves 6, the card frames 7 match the model specifications of the card strips 11, the inner wall of the slide groove 6 is fixedly connected with a spring 8, the other end of the spring 8 is fixedly connected with the bottom end of the card frame 7, the lower surface of the card strip 11 is an inclined surface setting, the top of the card frame 7 is an inclined surface setting, and the position of the card strip 11 corresponds to the position of the card frame 7. , the card slot 10 is made to correspond to the position of the limit column 5, so that the card slot 10 is engaged with the limit column 5, which greatly facilitates the correction of its position when installing the installation frame 9. At the same time, the installation frame 9 is pressed. When the inclined surface at the bottom end of the card strip 11 is squeezed with the inclined surface at the top end of the card frame 7, the card frame 7 will be pushed to slide on the upper surface of the protective frame 3. When the card strip 11 moves to the bottom of the card frame 7, the elastic force of the spring 8 is applied to the bottom end of the card frame 7, thereby driving the card frame 7 to reset, so that the card frame 7 is engaged with the card strip 11, thereby completing the quick installation of the installation frame 9. On the contrary, when the card frame 7 is manually moved, the engaging state of the card frame 7 and the card strip 11 can be released, and the disassembly of the installation frame 9 can be conveniently completed.

[0026] Working principle: when the device is in use, the protective frame 3 is fixed to the upper surface of the integrated circuit board 1 by bolts, and the protective frame 3 at this time covers the surface of the chip body 2, so as to protect the chip body 2, and the heat dissipation silicone grease 4 is attached to the surface of the chip body 2. At the same time, since the mounting frame 9 is mounted on the upper surface of the protective frame 3, and the bottom end of the heat dissipation fin 12 inside it is in contact with the surface of the heat dissipation silicone grease 4, and the mounting frame 14 is fixed to the top of the connecting column 13 by bolts, the heat generated by the chip body 2 during operation will be quickly transferred to the heat dissipation silicone grease 4, and the setting of the heat dissipation fin 12 greatly increases the heat dissipation area of ​​the heat dissipation silicone grease 4, and the heat dissipation fan 15 is started at the same time. Due to the setting of the connecting column 13, a large gap is reserved between the mounting frame 14 and the mounting frame 9. Under the action of the heat dissipation fan 15, The air flow rate in the heat dissipation fins 12 is increased, and the heat can be quickly taken away. The installation frame 9 is attached to the upper surface of the protective frame 3, and the position of the card slot 10 corresponds to the position of the limit column 5, so that the card slot 10 and the limit column 5 are engaged, which greatly facilitates the correction of its position when installing the installation frame 9. At the same time, the installation frame 9 is pressed. When the inclined surface at the bottom end of the card strip 11 is squeezed with the inclined surface at the top of the card frame 7, the card frame 7 will be pushed to slide on the upper surface of the protective frame 3. When the card strip 11 moves to the bottom of the card frame 7, the elastic force of the spring 8 is applied to the bottom end of the card frame 7, thereby driving the card frame 7 to reset, so that the card frame 7 is engaged with the card strip 11, thereby completing the quick installation of the installation frame 9. On the contrary, when the card frame 7 is manually moved, the engaging state of the card frame 7 and the card strip 11 can be released, and the disassembly of the installation frame 9 can be conveniently completed.

[0027] In the description, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. In addition, in the description of the present utility model, unless otherwise specified, "plurality" means two or more.

[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation device for a chip, characterized in that: The invention comprises an integrated circuit board (1), wherein a chip body (2) is fixedly connected to the upper surface of the integrated circuit board (1), a protective frame (3) is sleeved on the surface of the chip body (2), four ends of the protective frame (3) are fixedly connected to the integrated circuit board (1) by bolts, heat dissipation silicone grease (4) is pasted on the upper surface of the chip body (2), a mounting frame (9) is provided on the upper surface of the protective frame (3), a heat dissipation fin (12) is fixedly connected to the inner wall of the mounting frame (9), connecting columns (13) are fixedly connected at the four corners of the upper surface of the mounting frame (9), the top of the connecting column (13) is fixedly connected to a mounting frame (14) by bolts, and a heat dissipation fan (15) is fixedly installed on the inner wall of the mounting frame (14).

2. A chip heat dissipation device according to claim 1, characterized in that: The bottom end of the heat dissipation fin (12) is in contact with the upper surface of the heat dissipation silicone grease (4), and the heat dissipation fan (15) is located directly above the heat dissipation fin (12).

3. A chip heat dissipation device according to claim 1, characterized in that: The edges of both sides of the installation frame (9) are provided with card slots (10), and both sides of the upper surface of the protection frame (3) are fixedly connected to limit posts (5), and the models and specifications of the limit posts (5) are consistent with those of the card slots (10).

4. A chip heat dissipation device according to claim 1, characterized in that: Both ends of the installation frame (9) are fixedly connected with a clamping strip (11), both sides of the upper surface of the protection frame (3) are provided with a slide groove (6), both sides of the upper surface of the protection frame (3) are provided with a clamping frame (7), the clamping frame (7) is slidably engaged with the bottom end slide groove (6), and the model specifications of the clamping frame (7) and the clamping strip (11) are consistent.

5. A chip heat dissipation device according to claim 4, characterized in that: A spring (8) is fixedly connected to the inner wall of the slide groove (6), and the other end of the spring (8) is fixedly connected to the bottom end of the card frame (7).

6. A chip heat dissipation device according to claim 4, characterized in that: The lower surface of the clamping strip (11) is arranged as an inclined surface, the top end of the clamping frame (7) is arranged as an inclined surface, and the positions of the clamping strip (11) and the clamping frame (7) correspond to each other.

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