Low-cost packaged semiconductor laser shell and laser

Abstract

The utility model relates to the technical field of lasers, in particular to a low-cost packaged semiconductor laser shell, which comprises an aluminum shell and a sealing cover arranged at the top end of the aluminum shell, a plurality of copper heat sinks are fixed inside the aluminum shell at equal intervals along the length direction of the aluminum shell, and ceramic heat sinks are fixed on the copper heat sinks. The laser comprises the low-cost packaged semiconductor laser shell, a semiconductor chip welded on the ceramic heat sink, an optical lens arranged in the aluminum shell, an end cap and an electrode arranged on the aluminum shell. The shell is made of aluminum, the weight of the laser is reduced, the copper heat sink and the ceramic heat sink are arranged in the aluminum shell, the heat dissipation effect is good, and meanwhile the production cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of lasers, in particular to a low-cost packaged semiconductor laser housing. Background Art

[0002] The shell of the existing semiconductor laser is basically made of copper, which is heavy and has a high production cost. Therefore, it is urgent to provide a semiconductor laser that is light in weight and low in production cost. Utility Model Content

[0003] The purpose of the utility model is to provide a low-cost packaged semiconductor laser housing and a laser to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a low-cost packaged semiconductor laser housing, comprising an aluminum housing and a sealing cover arranged on the top of the aluminum housing, wherein a plurality of copper heat sinks are fixed at equal intervals inside the aluminum housing along its length direction, and ceramic heat sinks are fixed on each of the copper heat sinks.

[0005] Furthermore, the inner wall of the aluminum shell is chemically nickel plated.

[0006] Furthermore, the surface of the copper heat sink is plated with gold or silver.

[0007] Furthermore, the interior of the aluminum shell is provided with a plurality of step portions decreasingly arranged downward along its length direction, and the step portions include a first area, a second area and a third area decreasingly arranged along the width direction of the aluminum shell, and the copper heat sink is respectively arranged at the top of each first area.

[0008] Furthermore, a first positioning groove for limiting the copper heat sink is arranged at the top of the first area.

[0009] Furthermore, a second positioning groove for limiting the ceramic heat sink is provided on the top of the copper heat sink.

[0010] A laser comprises the low-cost packaged semiconductor laser housing, a semiconductor chip welded on a ceramic heat sink, an optical lens arranged inside the aluminum housing, an end cap and electrodes arranged on the aluminum housing.

[0011] Compared with the prior art, the beneficial effects of the utility model are: the low-cost packaged semiconductor laser housing and laser reduce the weight of the laser by setting the material of the housing to aluminum, and a copper heat sink and a ceramic heat sink are arranged inside the aluminum housing, which has a good heat dissipation effect and reduces the production cost at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0013] Figure 2 For this utility model Figure 1 The enlarged structural diagram at A in the middle;

[0014] Figure 3 It is a schematic diagram of the cross-sectional structure of the utility model.

[0015] In the figure: 1, aluminum shell; 101, step portion; 1011, first area; 1012, second area; 1013, third area; 1014, first positioning groove; 2, sealing cover; 3, copper heat sink; 301, second positioning groove; 4, ceramic heat sink; 5, semiconductor chip; 6, optical lens; 7, end cap; 8, electrode. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0017] In the description of the present invention, it should be noted that the terms "first", "second", etc. are only used for descriptive purposes, and do not specifically refer to the order or sequence, nor are they used to limit the present invention. They are only used to distinguish components or operations described with the same technical terms, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. The term "including" and any variations thereof in the specification and claims of the present invention and the above-mentioned drawings are intended to cover non-exclusive inclusions.

[0018] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "set" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. In addition, in the description of the present utility model, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside" and the like indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model.

[0019] See also Figure 1-3 The utility model provides an embodiment: a low-cost packaged semiconductor laser housing, comprising an aluminum housing 1 and a sealing cover 2 arranged at the top of the aluminum housing 1. In this embodiment, the aluminum housing 1 is specifically a rectangular parallelepiped structure with an open top. The sealing cover 2 is also made of aluminum and is covered on the top of the aluminum housing 1 to form a closed cavity inside. The inner wall of the aluminum housing 1 is chemically nickel-plated for reliable welding.

[0020] A plurality of copper heat sinks 3 are fixed at equal intervals inside the aluminum housing 1 along its length direction. Specifically, a plurality of step portions 101 are arranged downwardly along its length direction inside the aluminum housing 1, and the step portion 101 includes a first area 1011, a second area 1012 and a third area 1013 arranged in a decreasing manner along the width direction of the aluminum housing 1. The copper heat sinks 3 are respectively welded and fixed at the top of each first area 1011. A first positioning groove 1014 for limiting the copper heat sink 3 is arranged at the top of the first area 1011, which can play a role of pre-positioning before welding the copper heat sink 3.

[0021] A ceramic heat sink 4 is welded and fixed on the copper heat sink 3. The surface of the copper heat sink 3 is gold-plated or silver-plated, which can improve the reliability of welding. A second positioning groove 301 is provided on the top of the copper heat sink 3 to limit the ceramic heat sink 4. It can play a role of pre-positioning before welding the ceramic heat sink 4, and at the same time can reduce the use of copper, further reducing the production cost.

[0022] A laser comprises a low-cost packaged semiconductor laser housing, a semiconductor chip 5 welded on a ceramic heat sink 4, an optical lens 6 arranged inside an aluminum housing 1, an end cap 7 and an electrode 8 arranged on the aluminum housing 1. The end cap 7 is arranged on the side of the aluminum housing 1 near the lowest step 101. The optical lens 6 is a prior art and is used for reflecting and collimating light. When working, after a plurality of semiconductor chips 5 emit light, they are collimated in two stages to form a square-like light spot, which is then focused on the end cap 7 and emitted through an optical fiber.

[0023] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-limiting from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A low-cost packaged semiconductor laser housing, characterized in that: The invention comprises an aluminum shell (1) and a sealing cover (2) arranged at the top of the aluminum shell (1); a plurality of copper heat sinks (3) are fixed at equal intervals inside the aluminum shell (1) along its length direction, and ceramic heat sinks (4) are fixed on each of the copper heat sinks (3).

2. The low-cost packaged semiconductor laser housing according to claim 1, characterized in that: The inner side wall of the aluminum housing (1) is chemically nickel plated.

3. The low-cost packaged semiconductor laser housing according to claim 1, characterized in that: The surface of the copper heat sink (3) is plated with gold or silver.

4. The low-cost packaged semiconductor laser housing according to claim 1, characterized in that: The interior of the aluminum housing (1) is provided with a plurality of step portions (101) which are arranged in a decreasing manner downward along the length direction thereof, and the step portion (101) comprises a first area (1011), a second area (1012) and a third area (1013) which are arranged in a decreasing manner along the width direction of the aluminum housing (1), and the copper heat sink (3) is respectively arranged at the top of each first area (1011).

5. The low-cost packaged semiconductor laser housing according to claim 4, characterized in that: A first positioning groove (1014) for limiting the position of the copper heat sink (3) is provided at the top of the first area (1011).

6. The low-cost packaged semiconductor laser housing according to claim 1, characterized in that: A second positioning groove (301) for limiting the position of the ceramic heat sink (4) is provided at the top end of the copper heat sink (3).

7. A laser, characterized in that: The invention comprises a low-cost packaged semiconductor laser housing as claimed in any one of claims 1 to 6, a semiconductor chip (5) welded on a ceramic heat sink (4), an optical lens (6) arranged inside an aluminum housing (1), an end cap (7) and an electrode (8) arranged on the aluminum housing (1).

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