High-precision multilayer PCB circuit board

Abstract

The utility model relates to the technical field of circuit boards, in particular to a high-precision multilayer PCB (printed circuit board), which comprises a circuit board body, two sides of the circuit board body are connected with fixing frames in a sliding manner, and a heat dissipation assembly is arranged between a pair of fixing frames; the heat dissipation assembly comprises a supporting plate fixedly connected with the outer side of the fixing frame, a plurality of empty grooves are formed in the inner side of the supporting plate, a plurality of heat dissipation fins matched with the outer side of the circuit board body are fixedly connected to the top of the supporting plate, and ventilation holes are formed in the inner sides of the heat dissipation fins. According to the utility model, through the cooperative arrangement of the fixing frame, the supporting plate, the heat dissipation fins and the circuit board bodies, after a plurality of circuit board bodies are stacked, the heat dissipation fins located at the lower part can be attached to the bottoms of the circuit board bodies located at the upper part, heat dissipation is carried out on the circuit board bodies located at the upper part, and the heat dissipation effect is good.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a high-precision multi-layer PCB circuit board. Background Art

[0002] PCB is the abbreviation of printed circuit board in English. Usually, a conductive pattern made of printed circuits, printed components or a combination of the two on an insulating material according to a predetermined design is called a printed circuit, and a conductive pattern on an insulating substrate that provides electrical connections between components is called a printed circuit board. In the actual use of circuit boards, multiple circuit boards are also spliced ​​and used.

[0003] With respect to the above-mentioned related technologies, the inventor believes that after the existing multiple circuit boards are spliced ​​together, the heat dissipation effect of the circuit boards is poor because the multiple circuit boards are stacked together. The circuit boards are exposed to high temperatures for a long time and may be damaged. Therefore, the utility model provides a high-precision multi-layer PCB circuit board. Utility Model Content

[0004] The purpose of the present application is to provide a high-precision multi-layer PCB circuit board to solve the problem raised in the above background technology that due to multiple circuit boards being stacked together, the heat dissipation effect of the circuit boards is poor, and the circuit boards are exposed to high temperatures for a long time, which may cause damage.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical solutions: a high-precision multi-layer PCB circuit board, comprising a circuit board body, both sides of which are slidably connected with fixed frames, and a heat dissipation component is arranged between a pair of the fixed frames; the heat dissipation component comprises a support plate fixedly connected to the outer side of the fixed frame, a plurality of empty grooves are provided on the inner side of the support plate, a plurality of heat dissipation fins adapted to the outer side of the circuit board body are fixedly connected to the top of the support plate, and ventilation holes are provided on the inner side of the heat dissipation fins.

[0006] Preferably, a rotating block is rotatably connected to the outer side of the fixing frame, and a threaded rod is fixedly connected to the top of the rotating block.

[0007] Preferably, a nut is threadedly connected to the outer side of the threaded rod, and a thread groove matching the threaded rod is formed on the outer side of the fixing frame.

[0008] Preferably, bolts are arranged on the outer side of the fixing frame, and threaded holes matching with the bolts are provided on the inner sides of the fixing frame and the circuit board body.

[0009] Preferably, a plurality of grooves are provided on the outer side of the rotating block, and rubber pads are laid on the inner wall sides of the grooves.

[0010] Preferably, the support plate is made of an aluminum heat-conducting plate, and the heat dissipating fins are aluminum-magnesium alloy heat dissipating fins.

[0011] In summary, the technical effects and advantages of the utility model are:

[0012] 1. In the utility model, by coordinating the fixing frame, the support plate, the heat dissipating fins and the circuit board body, after a plurality of circuit board bodies are stacked, the heat dissipating fins located at the bottom can be attached to the bottom of the circuit board body located at the top, so as to dissipate the heat of the circuit board body located at the top, and the heat dissipation effect is better.

[0013] 2. In the utility model, the splicing and installation of multiple circuit board bodies are realized by the coordinated arrangement of the rotating block, the threaded rod, the threaded groove and the nut, and the arrangement of multiple grooves on the outer side of the rotating block facilitates the twisting of the rotating block. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0015] Figure 1 This is a schematic diagram of the axial structure of the utility model from a first viewing angle;

[0016] Figure 2 This is a schematic diagram of the axial structure of the utility model from a second viewing angle;

[0017] Figure 3 It is a structural schematic diagram of the support plate and the heat dissipation fins in the utility model;

[0018] Figure 4 for Figure 2 A is an enlarged structural diagram of FIG.

[0019] In the figure: 1. Circuit board body; 2. Fixing frame; 3. Rotating block; 4. Threaded rod; 5. Nut; 6. Bolt; 7. Support plate; 8. Heat sink; 9. Ventilation hole; 10. Empty slot; 11. Threaded hole; 12. Threaded slot. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "set / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0022] Example 1: Reference Figure 1-4 A high-precision multi-layer PCB circuit board shown in the figure includes a circuit board body 1, both sides of the circuit board body 1 are slidably connected with a fixing frame 2, and a heat dissipation component is arranged between a pair of fixing frames 2; the heat dissipation component includes a support plate 7 fixedly connected to the outer side of the fixing frame 2, a plurality of empty grooves 10 are opened on the inner side of the support plate 7, a plurality of heat dissipation fins 8 adapted to the outer side of the circuit board body 1 are fixedly connected to the top of the support plate 7, and ventilation holes 9 are opened on the inner side of the heat dissipation fins 8, so that after multiple circuit board bodies 1 are spliced, the heat dissipation fins 8 can dissipate heat for the corresponding circuit board bodies 1; a rotating block 3 is rotatably connected to the outer side of the fixing frame 2, and a threaded rod 4 is fixedly connected to the top of the rotating block 3, and the splicing of two circuit board bodies 1 can be realized by threading the rotatable threaded rod 4 with the threaded groove 12; a nut 5 is threadedly connected to the outer side of the threaded rod 4, and a threaded groove 12 adapted to the threaded rod 4 is opened on the outer side of the fixing frame 2, so as to facilitate the limited fixing of the threaded rod 4.

[0023] In this embodiment, two circuit board bodies 1 equipped with heat dissipation fins 8 are stacked and placed, the rotating block 3 is twisted to drive the threaded rod 4 to be threadedly connected with the corresponding thread groove 12, and the nut 5 located at the bottom is twisted to abut against the fixing frame 2 located at the top, so as to keep the threaded rod 4 and the fixing frame 2 stable, so that the heat dissipation fins 8 located at the bottom abut against the bottom of the circuit board body 1 located at the top, and the splicing of multiple circuit board bodies 1 is completed. The heat dissipation of the spliced ​​circuit board bodies 1 is carried out through the heat dissipation fins 8, and the setting of the ventilation holes 9 makes the heat dissipation effect better.

[0024] Example 2: Reference Figure 1-4 Based on the same concept as the first embodiment, the present embodiment further proposes that bolts 6 are provided on the outer side of the fixing frame 2, and threaded holes 11 matching with the bolts 6 are provided on the inner sides of the fixing frame 2 and the circuit board body 1, so as to facilitate the connection between the fixing frame 2 and the circuit board body 1; a plurality of grooves are provided on the outer side of the rotating block 3, and rubber pads are laid on the inner wall side of the grooves, so as to facilitate the twisting of the rotating block 3; the supporting plate 7 is made of an aluminum heat conducting plate, and the heat dissipating fins 8 are aluminum-magnesium alloy heat dissipating fins.

[0025] The working principle of the utility model is as follows: a pair of fixing frames 2 are dragged to drive the support plate 7 and a plurality of heat dissipating fins 8 to move to the middle position of the circuit board body 1, and the fixing frames 2 and the circuit board body 1 are connected and fixed using bolts 6.

[0026] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A high-precision multi-layer PCB circuit board, comprising a circuit board body (1), characterized in that: Both sides of the circuit board body (1) are slidably connected to fixing frames (2), and a heat dissipation component is arranged between a pair of the fixing frames (2); The heat dissipation assembly comprises a support plate (7) fixedly connected to the outer side of the fixing frame (2), a plurality of empty grooves (10) are provided on the inner side of the support plate (7), a plurality of heat dissipation fins (8) adapted to the outer side of the circuit board body (1) are fixedly connected to the top of the support plate (7), and ventilation holes (9) are provided on the inner side of the heat dissipation fins (8).

2. A high-precision multi-layer PCB circuit board according to claim 1, characterized in that: The outer side of the fixed frame (2) is rotatably connected to a rotating block (3), and the top of the rotating block (3) is fixedly connected to a threaded rod (4).

3. A high-precision multi-layer PCB circuit board according to claim 2, characterized in that: The outer side of the threaded rod (4) is threadedly connected to a nut (5), and the outer side of the fixing frame (2) is provided with a thread groove (12) adapted to the threaded rod (4).

4. A high-precision multi-layer PCB circuit board according to claim 3, characterized in that: Bolts (6) are arranged on the outer side of the fixing frame (2), and threaded holes (11) matching the bolts (6) are arranged on the inner sides of the fixing frame (2) and the circuit board body (1).

5. A high-precision multi-layer PCB circuit board according to claim 4, characterized in that: The outer side of the rotating block (3) is provided with a plurality of grooves, and the inner wall side surfaces of the grooves are paved with rubber pads.

6. The high-precision multi-layer PCB circuit board according to claim 1, characterized in that: The support plate (7) is made of an aluminum heat-conducting plate, and the heat dissipation fins (8) are aluminum-magnesium alloy heat dissipation fins.

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