Heat dissipation device for bidirectional inverter power device of energy storage power supply

Abstract

The utility model discloses a heat dissipation device for a bidirectional inverter power device of an energy storage power supply, which comprises an ultra-thin vapor chamber, a fin plate and a fan, the ultra-thin vapor chamber is vertically arranged on a circuit board, the fin plate and the power device are respectively arranged on two plate sides of the ultra-thin vapor chamber, and the fan is arranged on the fin plate. The fin plate and the power device are tightly connected with the ultra-thin vapor chamber, the fan is arranged at one end of the fin plate, and an air flow channel between fins on the fin plate is arranged right opposite to the fan. The cooling device can be used for cooling the inverter module of the energy storage battery, is simple and easy to process, and is convenient to implement, and various components are low in price; use and operation are simple, convenient and practical; fins and fan air cooling are simply combined, so that the heat dissipation effect is optimal, and heat of the power device is dispersed to the phase change device with a larger area by using the ultrathin vapor chamber, so that the air cooling fins can dissipate heat of the power device more effectively.

Description

Technical Field

[0001] The utility model belongs to the technical field of power supply heat dissipation devices, and relates to a heat dissipation device for power devices of a bidirectional inverter of an energy storage power supply. Background Art

[0002] Energy storage is mainly used to resolve the contradiction between the continuity of power supply production and the intermittent nature of electricity demand, and to achieve stable operation of electricity on the power generation side, the grid side and the user side.

[0003] The inverter is the heart of energy storage. The primary function of the energy storage inverter is to convert DC into AC power needed for daily life, and the core components to achieve this function are power semiconductors (such as IGBT and MOSFET). These power semiconductors can switch thousands or even tens of thousands of times per second, and then control the circuit changes through control signals to convert DC into sinusoidal AC.

[0004] The switching devices of the inverter, such as MOS tubes, IGBT tubes, etc., will emit a large amount of heat during use and become the power devices of the inverter. A special radiator is needed to dissipate heat during work to discharge the heat in time. Considering the conductive factor, the existing heat dissipation system often cannot choose liquid cooling and can only adopt a general air cooling structure. In addition, since power devices are often small and high-power density components, the convection heat exchange area is too small and the fan heat dissipation effect is very poor. Therefore, a heat dissipation device for power devices of energy storage power inverter is proposed to address the above problems. Utility Model Content

[0005] The technical problem to be solved by the utility model is to propose a heat dissipation device for power devices of a bidirectional inverter of an energy storage power supply, which solves the heat dissipation problem of power devices of the inverter of an energy storage power supply by combining air-cooled fins with phase change devices.

[0006] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0007] A heat dissipation device for power devices of energy storage power inverters, comprising an ultra-thin heat spreader, a fin plate and a fan, wherein the ultra-thin heat spreader is vertically arranged on a circuit board, the fin plate and the power device are respectively arranged on two plate sides of the ultra-thin heat spreader, and the fin plate and the power device are tightly connected to the ultra-thin heat spreader, the fan is arranged at one end of the fin plate, and the air flow channel between the fins on the fin plate is arranged opposite to the fan, so that the effects of air cooling and fin cooling are fully utilized, and the power device with high heat flux density is dissipated as a whole.

[0008] As a preferred solution of the utility model, the free ends of the fins of the fin plate point to the outer side of the ultra-thin heat spreader.

[0009] As a preferred solution of the utility model, a steel sheet with a hole extends from the fin plate for mounting the fan, and the fan is fixedly connected to the hole by bolts.

[0010] As a preferred solution of the utility model, the power device includes a MOS tube and an IGBT module.

[0011] As a preferred solution of the utility model, the contact surface between the fin plate and the power device and / or the ultra-thin heat spreader is coated with a high thermal conductivity interface material, such as thermal grease, thermal mud, liquid gold, etc. The high thermal conductivity interface material can reduce the contact thermal resistance, and utilize the temperature uniformity of the ultra-thin heat spreader to evenly distribute the heat of the power device over a larger area, so that the high heat flux density in a small range is converted into a lower heat flux density in a larger range, thereby enhancing the convective heat exchange effect of the fan.

[0012] As a preferred embodiment of the present invention, the ultra-thin heat spreader is in various shapes such as a flat plate, "I" shape, "U" shape, or "L" shape. The material used for the ultra-thin heat spreader can be common materials such as copper and aluminum, that is, the ultra-thin heat spreader is a copper plate or an aluminum plate.

[0013] As a preferred solution of the utility model, the fin plate and the power device and / or the ultra-thin heat spreader are connected by bolts or bonded together with an interface material having a certain viscosity. In the utility model, the heat dissipation device of the power device can be located at any position of the circuit board that meets the heat dissipation requirements of the power device according to actual design requirements, and various fin shapes and fan sizes and shapes designed according to specific heat dissipation requirements can be used as replacement solutions.

[0014] As a preferred solution of the utility model, silicone grease fibers are provided between the circuit board and the ultra-thin heat spreader, and the thermally conductive silicone grease with the fiber layer simultaneously plays the role of insulation and reducing contact thermal resistance.

[0015] Compared with the prior art, the utility model has the following beneficial effects:

[0016] The utility model can be used for cooling the inverter module of the energy storage battery. The device is simple and easy to process, and various components are low-priced and easy to implement. It is easy to use and operate, convenient and practical. The fins and fan air cooling are simply combined to achieve the best heat dissipation effect, and the heat of the power device is dispersed to a larger area of ​​the phase change device by using an ultra-thin heat spreader, so that the air-cooled fins can dissipate the heat of the power device more effectively. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the application of the heat dissipation device of Example 1 of the utility model;

[0018] Figure 2This is a schematic diagram of the heat dissipation device of Example 1 of the utility model;

[0019] Figure 3 This is a schematic diagram of the connection between the fin plate, the ultra-thin heat sink, and the power device of Example 1 of the utility model;

[0020] Figure 4 This is a schematic diagram of the application of the heat dissipation device of Example 2 of the utility model.

[0021] In the figure: 1-power device, 2-ultra-thin heat sink, 3-fin plate, 31-air flow channel, 32-steel sheet, 4-fan, 5-high thermal conductivity interface material, 6-resistor, 7-high frequency electronic transformer, 8-silicone fiber, 9-capacitor, 10-circuit board. DETAILED DESCRIPTION

[0022] In order to allow those skilled in the art to understand the present invention more clearly and intuitively, the present invention will be further described below in conjunction with the accompanying drawings.

[0023] Example 1

[0024] like Figure 1-3 As shown, the heat dissipation device for power devices of energy storage power inverter of this embodiment includes a flat ultra-thin heat spreader 2, a fin plate 3 and a fan 4, wherein the ultra-thin heat spreader 2 is vertically arranged on the circuit board 10, the fin plate 3 and the power device 1 are respectively arranged on the two plate sides of the ultra-thin heat spreader 2, and the fin plate 3 and the power device 1 are tightly connected to the ultra-thin heat spreader 2 by bolts, and the fan 4 is arranged at one end of the fin plate 3, and the wind flow channel 31 between the fins on the fin plate 3 is arranged opposite to the fan 4, so that the effects of air cooling and fin cooling are fully utilized, and the power device 1 with high heat flux density is dissipated as a whole.

[0025] In this embodiment, the free ends of the fins of the fin plate 3 point to the outer side of the ultra-thin heat spreader 2. Specifically, a steel sheet 32 ​​with holes extends from the fin plate 3 for mounting the fan 4, and the fan 4 is fixedly connected to the holes by bolts.

[0026] In this embodiment, the power device 1 is an IGBT module. Figure 1 As shown, this embodiment is aimed at the heat dissipation of the IGBT module. The circuit board 10 is also provided with other structures of the energy storage power inverter, such as a resistor 6, a high-frequency electronic transformer 7, a capacitor 9, etc.

[0027] Furthermore, the contact surfaces of the fin plate 3, the power device 1 and the ultra-thin heat spreader 2 of the present embodiment are coated with a high thermal conductivity interface material 5, such as thermal grease, thermal mud, liquid gold, etc. A silicone grease fiber 8 is provided between the circuit board 10 and the ultra-thin heat spreader 2, and the thermal grease with a fiber layer plays the role of insulation and reducing contact thermal resistance.

[0028] Example 2

[0029] The difference between this embodiment and embodiment 1 is that two sets of heat dissipation devices for power devices are provided to dissipate heat for the IGBT module and the MOSFET tube respectively. Figure 4 shown.

[0030] The above description of the embodiments is to facilitate the understanding and application of the present invention by those skilled in the art. It is obvious that those familiar with the art can easily make various modifications to these embodiments and apply the general principles described herein to other embodiments without creative work. Therefore, the present invention is not limited to the embodiments herein, and improvements and modifications made to the present invention by those skilled in the art based on the disclosure of the present invention should be within the scope of protection of the present invention.

Claims

1. A heat dissipation device for a power device of a bidirectional inverter of an energy storage power supply, characterized in that: It includes an ultra-thin heat spreader, a fin plate and a fan, wherein the ultra-thin heat spreader is vertically arranged on the circuit board, the fin plate and the power device are respectively arranged on two plate sides of the ultra-thin heat spreader, and the fin plate and the power device are tightly connected to the ultra-thin heat spreader, and the fan is arranged at one end of the fin plate, and the air flow channel between the fins on the fin plate is arranged opposite to the fan.

2. A heat dissipation device for a power device of a bidirectional inverter of an energy storage power supply according to claim 1, characterized in that: The free ends of the fins of the fin plate point to the outer side of the ultra-thin heat spreader.

3. A heat dissipation device for a power device of a bidirectional inverter of an energy storage power supply according to claim 1, characterized in that: A steel sheet with a hole extends from the fin plate and is used to mount the fan. The fan is fixedly connected to the hole by bolts.

4. A heat dissipation device for a power device of a bidirectional inverter of an energy storage power supply according to claim 1, characterized in that: The power devices include MOS tubes and IGBT modules.

5. The heat dissipation device for a power device of a bidirectional inverter of an energy storage power supply according to claim 1, characterized in that: The contact surface between the fin plate and the power device and / or the ultra-thin heat spreader is coated with a high thermal conductivity interface material.

6. A heat dissipation device for a power device of a bidirectional inverter of an energy storage power supply according to claim 5, characterized in that: The high thermal conductivity interface material is selected from thermal grease, thermal mud, and liquid gold.

7. The heat dissipation device for a power device of a bidirectional inverter of an energy storage power supply according to claim 1, characterized in that: The ultra-thin heat spreader is flat, I-shaped, U-shaped or L-shaped.

8. The heat dissipation device for a power device of a bidirectional inverter of an energy storage power supply according to claim 1, characterized in that: The ultra-thin heat spreader is a copper plate or an aluminum plate.

9. The heat dissipation device for a power device of a bidirectional inverter of an energy storage power supply according to claim 1, characterized in that: The fin plate is connected to the power device and / or the ultra-thin heat spreader by bolts.

10. The heat dissipation device for a power device of a bidirectional inverter of an energy storage power supply according to claim 1, characterized in that: A thermal conductive silicone grease with a fiber layer is provided between the circuit board and the ultra-thin heat spreader.

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