Edge internet-of-things proxy device

Abstract

The utility model provides an edge internet-of-things proxy device, which comprises a shell, a mainboard, an interface, an antenna, a first heat dissipation plate, an active heat dissipation assembly and a passive heat dissipation assembly, the mainboard is arranged in the shell, the interface and the antenna are arranged on the surface of the shell, and the first heat dissipation plate, the active heat dissipation assembly and the passive heat dissipation assembly are arranged in the shell. The first heat dissipation plate is in contact connection with the mainboard, the active heat dissipation assembly and the passive heat dissipation assembly are connected with the first heat dissipation plate through heat pipes, and heat dissipation holes matched with the active heat dissipation assembly are formed in the shell. The edge internet-of-things proxy device provided by the utility model has a good heat dissipation effect.

Description

Technical Field

[0001] The utility model relates to the technical field of Internet of Things, and in particular to an edge Internet of Things proxy device. Background Art

[0002] Edge IoT proxy devices are commonly used devices in IoT systems, such as the edge IoT proxy devices disclosed in CN216357722U and CN213906250U. Their function is to provide a physical interface for IoT terminal devices. IoT terminal devices interact with edge IoT proxy devices for data. Edge IoT proxy devices can process and upload data collected by IoT terminal devices, or transmit control signals to IoT terminal devices.

[0003] When the edge IoT proxy device is working, its mainboard sometimes generates more heat, which leads to a temperature rise. Therefore, a heat dissipation structure needs to be provided in the edge IoT proxy device to dissipate heat from its mainboard to prevent its temperature from being too high.

[0004] In view of this, the present utility model is proposed. Utility Model Content

[0005] The utility model aims to provide an edge IoT proxy device, which is used for mainboard heat dissipation and has a good heat dissipation effect.

[0006] In order to solve the above technical problems, an edge IoT agent device includes: a shell, a mainboard, an interface and an antenna, the mainboard is arranged in the shell, the interface and the antenna are arranged on the surface of the shell, and also includes: a first heat sink, an active heat sink component and a passive heat sink component arranged in the shell, the first heat sink is in contact with the mainboard, the active heat sink component and the passive heat sink component are respectively connected to the first heat sink through heat pipes, and the shell is provided with heat dissipation holes compatible with the active heat sink component.

[0007] Furthermore, the first heat sink is a metal plate, and a heat conducting medium is disposed between the first heat sink and the mainboard.

[0008] Furthermore, the active heat dissipation component includes a second heat dissipation plate and a heat dissipation fan, the second heat dissipation plate is connected to the first heat dissipation plate through a first heat pipe, the heat dissipation fan is arranged on the second heat dissipation plate, and the air outlet of the heat dissipation fan is close to the heat dissipation hole.

[0009] Furthermore, the second heat sink is a metal plate.

[0010] Furthermore, the active heat dissipation component also includes: a temperature sensor, which is arranged on the mainboard and is used to detect the temperature of the mainboard.

[0011] Furthermore, the passive heat dissipation component includes: a third heat dissipation plate and a fourth heat dissipation plate, the third heat dissipation plate is arranged on the inner wall of the shell, the fourth heat dissipation plate is arranged on the third heat dissipation plate, and the first heat dissipation plate and the fourth heat dissipation plate are connected through a second heat pipe.

[0012] Furthermore, the third heat sink is a graphite plate, and the fourth heat sink is a metal plate.

[0013] Furthermore, the shell is an aluminum alloy shell.

[0014] Furthermore, the interface is provided with a high-toughness double-layer silicone sealing ring, and the interface includes: DP9 pin 485, 232 interface, dual network interface, HDMI interface and USB interface.

[0015] Furthermore, the mainboard is provided with Wifi, 4G and Lora modules.

[0016] The utility model provides an edge IoT proxy device, which has the following beneficial effects: the heat generated by the mainboard will be transferred to the first heat sink. When the temperature is normal, that is, the heat is not much, it will be dissipated through the passive heat dissipation component. When the temperature is high, that is, the heat is more, it will be dissipated through the active heat dissipation component. Therefore, the edge IoT proxy device of this embodiment has a better heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 The figure is an appearance diagram of an edge IoT agent device;

[0018] Figure 2 This is an internal diagram of an edge IoT agent device.

[0019] In the figure: 1-housing, 2-mainboard, 3-interface, 4-antenna, 5-first heat sink, 6-heat dissipation hole, 7-second heat sink, 8-cooling fan, 9-first heat pipe, 10-air outlet, 11-third heat sink, 12-fourth heat sink, 13-second heat pipe. DETAILED DESCRIPTION

[0020] The core of the utility model is to provide an edge IoT proxy device, which is used for mainboard heat dissipation and has a good heat dissipation effect.

[0021] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution in the embodiments of the utility model is described clearly and completely below. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] An edge IoT proxy device, such as Figures 1-2 As shown, it includes: a shell 1, a main board 2, an interface 3 and an antenna 4, the main board 2 is arranged in the shell 1, and the interface 3 and the antenna 4 are arranged on the surface of the shell 1. The above parts are existing technologies, and reference can be made to existing technologies such as CN213906250U, which will not be elaborated here.

[0023] In order to improve the heat dissipation effect, the present embodiment has also been improved as follows, and also includes: a first heat dissipation plate 5, an active heat dissipation component and a passive heat dissipation component are arranged in the shell 1, the first heat dissipation plate 5 is in contact with the mainboard 2, the active heat dissipation component and the passive heat dissipation component are respectively connected to the first heat dissipation plate 5 through heat pipes, and the shell 1 is provided with a heat dissipation hole 6 adapted to the active heat dissipation component.

[0024] In the edge IoT proxy device of this embodiment, the heat generated by the mainboard 2 will be transferred to the first heat sink 5. When the temperature is normal, that is, the heat is not much, it will be dissipated through the passive heat dissipation component. When the temperature is high, that is, the heat is more, it will be dissipated through the active heat dissipation component. Therefore, the edge IoT proxy device of this embodiment has a better heat dissipation effect.

[0025] In an optional embodiment, the first heat sink 5 is a metal plate, such as an aluminum plate, and a heat conducting medium is disposed between the first heat sink 5 and the mainboard 2 .

[0026] In this optional embodiment, the first heat sink 5 can be fixed to the mainboard 2 or the housing 1 by screws. In addition, a heat conducting medium is provided between the first heat sink 5 and the mainboard 2 to facilitate the mainboard 2 to transfer heat to the first heat sink 5 .

[0027] In an optional embodiment, the active heat dissipation component includes a second heat dissipation plate 7 and a heat dissipation fan 8, the second heat dissipation plate 7 is connected to the first heat dissipation plate 5 through a first heat pipe 9, the heat dissipation fan 8 is arranged on the second heat dissipation plate 7, and the air outlet 10 of the heat dissipation fan 8 is close to the heat dissipation hole 6.

[0028] In this optional embodiment, the cooling fan 8 can be fixed to the second cooling plate 7 by screws, and the air inlet of the cooling fan 8 is attached to the second cooling plate 7; the first heat pipe 9 can be connected to the first cooling plate 5 and the second cooling plate 7 by welding. In addition, the start and stop control of the cooling fan 8 can adopt existing technology, such as the technical solution disclosed in patent CN114658680B.

[0029] In this optional embodiment, when the temperature is high, that is, when there is a lot of heat, the cooling fan 8 is started. After the heat is transferred from the first heat sink 5 to the second heat sink 7, the cooling fan 8 transfers the heat out of the shell 1 through the heat dissipation holes 6 to complete the heat dissipation.

[0030] In an optional embodiment, the second heat dissipation plate 7 is a metal plate, such as an aluminum plate.

[0031] In an optional embodiment, the active heat dissipation component further includes: a temperature sensor, which is disposed on the mainboard 2 and is used to detect the temperature of the mainboard 2 .

[0032] In this optional embodiment, the temperature of the mainboard 2 is collected by the temperature sensor for start and stop control of the cooling fan 8. In addition, the temperature sensor can be set in the existing technology, such as the technical solution disclosed in patent CN218214049U.

[0033] In an optional embodiment, the passive heat dissipation component includes: a third heat dissipation plate 11 and a fourth heat dissipation plate 12, the third heat dissipation plate 11 is arranged on the inner wall of the shell 1, the fourth heat dissipation plate 12 is arranged on the third heat dissipation plate 11, and the first heat dissipation plate 5 is connected to the fourth heat dissipation plate 12 through a second heat pipe 13.

[0034] In this optional embodiment, the third heat sink 11 can be attached to the inner wall of the shell 1 by bonding, the fourth heat sink 12 can be attached to the third heat sink 11 by bonding, and the second heat pipe 13 can be connected to the first heat sink 5 and the third heat sink 11 by welding.

[0035] In this optional embodiment, when the temperature is normal, that is, when the heat is not much, the heat is transferred from the first heat sink 5 to the fourth heat sink 12, and then dissipated from the housing 1 through the third heat sink 11. To improve the heat dissipation effect, the housing 1 can be set to an aluminum alloy housing 1.

[0036] In an optional embodiment, the third heat sink 11 is a graphite plate, and the fourth heat sink 12 is a metal plate, such as an aluminum plate.

[0037] In an optional embodiment, the shell 1 is an aluminum alloy shell 1.

[0038] In an optional embodiment, the interface 3 is provided with a high-toughness double-layer silicone sealing ring, and the interface 3 includes: DP9 pin 485, 232 interface 3, dual network interface 3, HDMI interface 3 and USB interface 3.

[0039] In an optional embodiment, the mainboard 2 is provided with Wifi, 4G and Lora modules.

[0040] In addition, it should be noted that, in a specific implementation, the angles and bending forms of the first heat pipe 9 and the second heat pipe 13, as well as the angles and directions of the first heat sink 5, the second heat sink 7, the third heat sink 11 and the fourth heat sink 12 can be set according to the specific structure of the edge IoT proxy device, and are not limited here. Figure 2 For illustration only.

[0041] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention, and therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An edge IoT proxy device, comprising: A shell, a mainboard, an interface and an antenna, wherein the mainboard is arranged in the shell, and the interface and the antenna are arranged on the surface of the shell, and it is characterized in that it also includes: a first heat sink, an active heat sink component and a passive heat sink component arranged in the shell, the first heat sink is in contact with the mainboard, the active heat sink component and the passive heat sink component are respectively connected to the first heat sink through heat pipes, and the shell is provided with heat dissipation holes adapted to the active heat sink component.

2. The edge IoT proxy device according to claim 1, characterized in that: The first heat sink is a metal plate, and a heat conducting medium is arranged between the first heat sink and the mainboard.

3. The edge IoT proxy device according to claim 1, characterized in that: The active heat dissipation component includes a second heat dissipation plate and a heat dissipation fan. The second heat dissipation plate is connected to the first heat dissipation plate through a first heat pipe. The heat dissipation fan is arranged on the second heat dissipation plate. The air outlet of the heat dissipation fan is close to the heat dissipation hole.

4. The edge IoT proxy device according to claim 3, characterized in that: The second heat dissipation plate is a metal plate.

5. The edge IoT proxy device according to claim 3, characterized in that: The active heat dissipation component further includes: a temperature sensor, which is arranged on the mainboard and is used to detect the temperature of the mainboard.

6. The edge IoT proxy device according to claim 1, characterized in that: The passive heat dissipation component includes: a third heat dissipation plate and a fourth heat dissipation plate, the third heat dissipation plate is arranged on the inner wall of the shell, the fourth heat dissipation plate is arranged on the third heat dissipation plate, and the first heat dissipation plate is connected to the fourth heat dissipation plate through a second heat pipe.

7. The edge IoT proxy device according to claim 6, characterized in that: The third heat sink is a graphite plate, and the fourth heat sink is a metal plate.

8. The edge IoT proxy device according to claim 1, characterized in that: The shell is an aluminum alloy shell.

9. The edge IoT proxy device according to claim 1, characterized in that: The interface is provided with a high-toughness double-layer silicone sealing ring, and the interface includes: DP9 pin 485, 232 interface, dual network interface, HDMI interface and USB interface.

10. The edge IoT proxy device according to claim 1, characterized in that: The main board is provided with Wifi, 4G and Lora modules.

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