Wafer cleaning device

Abstract

The utility model belongs to the field of wafer processing, and particularly discloses a wafer cleaning device which comprises a cleaning tank and a suspension cage, a partition plate frame is arranged in the suspension cage, and the partition plate frame divides the internal space of the suspension cage into a plurality of containing cavities used for containing wafers. The lifting cage is partitioned by arranging the partition plate frame, after the wafers are placed in the containing cavity, the cleaning procedure is started, stacking of the wafers is avoided, and the cleaning effect of the wafers is improved. And a plurality of wafers can be cleaned at one time, so that the cleaning efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the field of wafer processing, relates to wafer cleaning, and specifically relates to a wafer cleaning device. Background Art

[0002] When polishing the wafer, chemical polishing agent is used in combination with mechanical polishing. Due to the influence of the polishing liquid and the operating environment, various impurities such as inorganic metal ions, dust particles, etc. are easily adhered to the surface of the wafer. In order not to affect the performance of the wafer, the wafer needs to be cleaned.

[0003] When cleaning wafers, the existing wafer cleaning device usually stacks the wafers in a hanging cage, puts them into a cleaning liquid for shaking cleaning, and then cleans them with pure water. This operation cannot be performed in batches, is inefficient, and has an unsatisfactory cleaning effect.

[0004] Patent document with publication number CN116487300A discloses a semiconductor wafer cleaning device, which absorbs the wafer on a rack and then uses a spray assembly to clean the wafer. Only one side can be cleaned during cleaning, and batch cleaning is not possible, resulting in low efficiency. Utility Model Content

[0005] Aiming at the defects and shortcomings of the prior art, the utility model provides a wafer cleaning device.

[0006] A wafer cleaning device comprises a cleaning tank and a hanging cage. A partition frame is arranged inside the hanging cage, and the partition frame divides the inner space of the hanging cage into a plurality of placement cavities for placing wafers.

[0007] When cleaning the wafers, place the wafers one by one into the placement cavity, then place the hanging cage into the cleaning tank, soak the wafers in the hanging cage or open the water source to flush the two sides of the wafers. After cleaning, drain the water and take out the wafers.

[0008] Preferably, the size of the placement cavity is adjustable.

[0009] Preferably, it also includes a guide rail frame, the cage is arranged on the guide rail frame, and the cleaning tank is arranged below the cage; a lifting drive for driving the cage to lift is arranged between the guide rail frame and the cage.

[0010] Preferably, a linear guide is slidably connected to the guide frame, and a first drive is arranged between the guide frame and the linear guide, and the first drive is used to drive the linear guide to move along the width direction of the cleaning tank; a second drive is arranged between the linear guide and the cage, and the second drive is used to drive the cage to move along the length direction of the cleaning tank; the cage is arranged on the linear guide, and the lifting drive is arranged between the cage and the linear guide.

[0011] Preferably, the first drive includes a first drive motor and a plurality of pulleys, the plurality of pulleys are respectively arranged at two ends of the linear guide rail, and the first drive motor is arranged on the linear guide rail and is used for driving the pulleys to rotate.

[0012] Preferably, the second drive includes a screw, a screw nut and a second drive motor, the screw is rotatably connected to the linear guide rail, the screw nut is threadedly connected to the screw, the linear guide rail is provided with a groove for the screw nut to slide, and the second drive motor is arranged on the linear guide rail and is used to drive the screw to rotate.

[0013] Further preferably, the screw rod is a reciprocating screw rod.

[0014] Preferably, the lifting drive includes a telescopic rod, a reel and a third drive motor, the cage and the screw nut are respectively arranged at both ends of the telescopic rod, the reel is rotatably connected to the screw nut, and the third drive motor is arranged on the screw nut and is used to drive the reel to rotate.

[0015] Preferably, it also includes a spray assembly, which is arranged above the cleaning tank.

[0016] Preferably, a plurality of cleaning chambers are provided in the cleaning tank.

[0017] According to actual needs, different types of cleaning liquids can be added to each cleaning chamber.

[0018] Further preferably, the plurality of cleaning chambers are arranged in a grid shape.

[0019] Preferably, a drain port is provided at the bottom of the cleaning tank.

[0020] After cleaning is completed, open the drain port to drain the cleaning fluid.

[0021] Further preferably, each cleaning chamber is provided with the drainage port.

[0022] Preferably, an upper limit drain port is provided on the upper portion of the side wall of the cleaning tank.

[0023] The upper drain port limits the water level in the cleaning tank to prevent overflow when the cage is immersed due to excessive water level.

[0024] Preferably, a connecting pipe is provided between the liquid discharge port and the spray assembly. The cleaning liquid discharged from the liquid discharge port can be reused, thus saving resources and reducing costs.

[0025] Preferably, the spray assembly includes a plurality of pressure regulating nozzles.

[0026] The pressure-regulating nozzle can adjust the water flow intensity when flushing the wafer according to actual needs, to avoid low wafer cleaning due to too low water pressure; or to avoid wafer damage due to too high water pressure.

[0027] Preferably, a displacement sensor is provided on the telescopic rod.

[0028] The displacement sensor is used to monitor the displacement distance of the cage along the length of the cleaning tank, so as to facilitate the adjustment of the position of the cage.

[0029] Compared with the prior art, the utility model has the following obvious beneficial effects:

[0030] (1) The cage is divided into sections by setting up a partition frame. After the wafer is placed in the cavity, there is a gap between adjacent wafers due to the limitation of the partition frame. When entering the cleaning program, during the spray cleaning, the water flow can impact the two sides of the wafer, improving the cleaning effect of the wafer. In addition, multiple wafers can be cleaned at one time, improving the cleaning efficiency.

[0031] (2) The size of the placement cavity can be adjusted according to the specifications of the wafer to be cleaned, so that when the wafer to be cleaned is placed in the placement cavity, it is convenient for water to flush the two sides of the crystal, thereby improving the cleaning effect.

[0032] (3) A first drive and a second drive are provided to drive the cage to move to multiple cleaning chambers of the cleaning tank, and the position of the cage can be adjusted according to actual conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is a schematic diagram of the overall structure of Example 1 of the present application.

[0034] Figure 2 This is a schematic diagram of the structure of the cage in Example 1 of the present application.

[0035] Figure 3 This is a schematic diagram of the structure of the partition frame in Example 1 of the present application.

[0036] Figure 4 This is a schematic diagram of the second driving structure in Example 1 of the present application.

[0037] Explanation of the reference numerals in the accompanying drawings: 1. Guide rail frame; 2. Linear guide rail; 3. Cleaning tank; 4. Spray assembly; 5. Cage; 6. First drive; 7. Lifting drive; 8. Second drive; 801. Screw rod; 802. Screw rod nut; 803. Second drive motor; 9. Partition frame; 10. Placement cavity; 11. Groove; 12. Partition; 13. Cleaning cavity; 14. Drain port; 15. Upper limit drain port. DETAILED DESCRIPTION

[0038] In order to make the technical problems to be solved, technical solutions and advantages of the present application clearer, they will be described in detail below in conjunction with specific examples, but the protection scope of the present application is not limited to the following specific embodiments.

[0039] Unless otherwise defined, all professional terms used below have the same meaning as those generally understood by those skilled in the art. The professional terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the scope of protection of this application.

[0040] Embodiment 1:

[0041] Reference Figure 1 A wafer cleaning device comprises a guide rail frame 1, a linear guide rail 2, a cleaning tank 3, a spray assembly 4 and a cage 5, wherein the linear guide rail 2 is slidably connected to the guide rail frame 1 along the cleaning tank 3, and a first drive 6 is arranged between the guide rail frame 1 and the linear guide rail 2, and the first drive 6 is used to drive the linear guide rail 2 to move along the width direction of the cleaning tank 3. The cage 5 is arranged on the linear guide rail 2, and a lifting drive 7 for driving the cage 5 to lift is arranged between the cage 5 and the linear guide rail 2. A second drive 8 is arranged between the linear guide rail 2 and the cage 5, and the second drive 8 is used to drive the cage 5 to move along the length direction of the cleaning tank 3. The cleaning tank 3 is arranged below the cage 5, and the spray assembly 4 is arranged above the cleaning tank 3.

[0042] Reference Figure 1 A plurality of cleaning chambers 13 are provided in the cleaning tank 3, and the plurality of cleaning chambers 13 are arranged in a grid shape.

[0043] During the processing of the cleaning tank 3, the cleaning tank 3 is divided into a plurality of cleaning chambers 13 by the partition 12. The partition 12 can be a single partition (such as Figure 1 As shown in FIG. 1 ), the partition 12 may also be arranged in a grid shape. Multiple groups of U-shaped grooves may be processed in the cleaning tank 3, and sealing strips may be arranged between the U-shaped grooves and the partitions. The cleaning tank 3 may be divided into multiple cleaning chambers 13 by inserting the partitions 12 into the U-shaped grooves, and the sealing strips may improve the sealing of the cleaning chambers 13. In another case, there is no need to arrange U-shaped grooves, and the partition 12 and the cleaning tank 3 may be connected by interference fit.

[0044] In this embodiment, two parallel cleaning chambers 13 are provided. The cleaning tank is divided into two cleaning chambers 13 by providing a partition plate 12 in the cleaning tank.

[0045] Reference Figure 1 A group of drainage ports 14 are provided at the bottom of the side wall of each cleaning chamber 13, and each group of drainage ports 14 includes two drainage ports 14 arranged opposite to each other, so as to speed up the drainage speed. A plug can be detachably connected to each drainage port 14, and the connection methods include but are not limited to threaded connection, crimping with a sealing ring on the plug, and other common connection methods. In practical applications, the number of partitions 12 can be set according to needs.

[0046] An upper limit drain port 15 is provided on the upper part of the side wall of the cleaning tank 3, and the upper limit drain port 15 limits the water level of the cleaning tank 3 to prevent overflow when the cage 5 is immersed due to excessively high water level.

[0047] Reference Figure 2 and Figure 3 The cage 5 is provided with a partition frame 9, which divides the internal space of the cage 5 into a plurality of placement cavities 10 for placing wafers. The size of the placement cavity 10 is adjustable. When the wafer is placed in the placement cavity 10, the wafer is in a side-standing state.

[0048] In actual situations, multiple groups of baffle racks 9 with different specifications can be set to adjust the size of the placement cavity 10, and the baffle racks 9 and the cage 5 are connected by interference fit. When the specifications of the cleaned wafers are larger (smaller), the baffle racks 9 with larger (smaller) specifications are replaced to increase (reduce) the space of the placement cavity 10, so that the larger (smaller) wafers can stand sideways in the placement cavity 10.

[0049] In another embodiment, the cage 5 and the partition frame 9 can be connected by plugging. A vertical groove for plugging the partition frame 9 is provided on the inner wall of the cage 5. Alternatively, a plurality of groups of plug-in strips are provided on the inner wall of the cage 5, and plug-in slots for plugging the plug-in strips are provided on the partition frame 9.

[0050] It should be noted that the side walls, upper and lower bottom surfaces, and partition frame 9 of the cage 5 are all made of mesh materials to facilitate water washing of the wafers.

[0051] The first drive 6 includes a first drive motor and a plurality of pulleys, the plurality of pulleys are rotatably connected to the two ends of the linear guide 2, and the first drive motor is arranged on the linear guide 2 and is used to drive the pulleys to rotate. In this embodiment, a total of four pulleys are arranged, and the four pulleys are arranged at the four corners of the linear guide 2. The output shaft of the first drive motor is fixedly connected to the rotating shaft of any one of the pulleys, the pulley is the driving pulley, and the other pulleys are driven pulleys. In practical applications, the number of pulleys can be selected according to demand, and a reduction gear set and a speed increase gear set can be arranged between the first drive motor and the pulley according to demand.

[0052] Reference Figure 4 The second drive 8 includes a screw rod 801, a screw nut 802 and a second drive motor 803. The screw rod 801 is rotatably connected to the linear guide rail 2 and is arranged parallel to the linear guide rail 2. The screw nut 802 is threadedly connected to the screw rod 801. The linear guide rail 2 is provided with a groove 11 for the screw nut 802 to slide. The second drive motor 803 is arranged on the linear guide rail 2 and is used to drive the screw rod 801 to rotate.

[0053] In practical applications, the screw rod 801 can be a reciprocating screw rod, and the second drive motor 803 can be rotated in one direction to drive the cage 5 to reciprocate along the length direction of the cleaning tank 3. Alternatively, the second drive motor 803 can be a forward and reverse motor, and the moving direction of the cage 5 can be adjusted by controlling the rotation direction of the rotating shaft of the forward and reverse motor.

[0054] The lifting drive 7 includes a telescopic rod, a reel and a third drive motor. The cage 5 and the screw nut 802 are respectively fixedly connected to the two ends of the telescopic rod. The reel is rotatably connected to the screw nut 802. The third drive motor is arranged on the screw nut 802 and is used to drive the reel to rotate. A displacement sensor is arranged on the telescopic rod. The displacement sensor is used to monitor the displacement distance of the cage along the length direction of the cleaning tank, so that the staff can understand the position of the cage in real time and adjust the position of the cage.

[0055] In another embodiment, the lifting drive 7 can be a telescopic cylinder, and the two ends of the telescopic cylinder are respectively fixedly connected to the screw nut 802 and the hanging basket 5.

[0056] It should be noted that the first drive and lifting drive in the present application are not illustrated in the drawings of the specification. In the prior art, any drive structure that can achieve the purpose of the first drive, the second drive and the lifting drive can be used in the present application.

[0057] Reference Figure 1 The spray assembly 4 is fixedly connected to the guide rail frame 1. The spray assembly 4 includes a plurality of pressure-regulating nozzles. A connecting pipe (not shown in the figure) is detachably connected between the discharge port 14 and the pressure-regulating nozzle. The connecting pipe connects the cleaning chamber 13 and the spray assembly 4, and the cleaning liquid can be recycled through the pipe.

[0058] When cleaning the wafers, place the wafers one by one into the placement chamber 10. When the wafers are in the placement chamber, they are in a side-standing state, and there are gaps between adjacent wafers. Then, start the lifting drive 7 to drive the cage 5 to descend and enter the first cleaning chamber 13, turn on the spray assembly 4 to clean the wafers, and drive the cage 5 to rise after cleaning. After the second drive 8 drives the cage 5 to move above the second cleaning chamber 13 along the length direction of the cleaning tank 3, the lifting drive 7 drives the cage 5 to descend again, enter the second cleaning chamber 13, and turn on the spray assembly 4 to clean the wafers. According to actual needs, repeat the above steps to complete the cleaning of the wafers.

[0059] The embodiments described above are only preferred specific implementation methods of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope of the present application according to the technical solution and concept of the present application, which should be covered by the protection scope of the present application.

Claims

1. A wafer cleaning device, characterized in that: It comprises a cleaning tank (3) and a hanging cage (5), wherein a partition frame (9) is arranged inside the hanging cage (5), and the partition frame (9) divides the internal space of the hanging cage (5) into a plurality of placement cavities (10) for placing wafers.

2. The wafer cleaning device according to claim 1, characterized in that: The size of the placement cavity (10) is adjustable.

3. The wafer cleaning device according to claim 1, characterized in that: It also includes a guide rail frame (1), the cage (5) is arranged on the guide rail frame (1), and the cleaning tank (3) is arranged below the cage (5); a lifting drive (7) for driving the cage (5) to rise and fall is arranged between the guide rail frame (1) and the cage (5).

4. The wafer cleaning device according to claim 3, characterized in that: A linear guide rail (2) is slidably connected to the guide rail frame (1); a first drive (6) is arranged between the guide rail frame (1) and the linear guide rail (2); the first drive (6) is used to drive the linear guide rail (2) to move along the width direction of the cleaning tank (3); a second drive (8) is arranged between the linear guide rail (2) and the cage (5); the second drive (8) is used to drive the cage (5) to move along the length direction of the cleaning tank (3); the cage (5) is arranged on the linear guide rail (2); the lifting drive (7) is arranged between the cage (5) and the linear guide rail (2).

5. The wafer cleaning device according to claim 4, characterized in that: The first drive (6) comprises a first drive motor and a plurality of pulleys, wherein the plurality of pulleys are respectively arranged at two ends of the linear guide rail (2), and the first drive motor is arranged on the linear guide rail (2) and is used to drive the pulleys to rotate.

6. The wafer cleaning device according to claim 4, characterized in that: The second drive (8) comprises a screw (801), a screw nut (802) and a second drive motor (803); the screw (801) is rotatably connected to the linear guide rail (2); the screw nut (802) is threadedly connected to the screw (801); a groove (11) for the screw nut (802) to slide is provided on the linear guide rail (2); the second drive motor (803) is arranged on the linear guide rail (2) and is used to drive the screw (801) to rotate.

7. The wafer cleaning device according to claim 6, characterized in that: The lifting drive (7) includes a telescopic rod, a reel and a third driving motor. The cage (5) and the screw nut (802) are respectively arranged at the two ends of the telescopic rod. The reel is rotatably connected to the screw nut (802). The third driving motor is arranged on the screw nut (802) and is used to drive the reel to rotate.

8. The wafer cleaning device according to claim 1, characterized in that: It also comprises a spray assembly (4), wherein the spray assembly (4) is arranged above the cleaning tank (3).

9. The wafer cleaning device according to claim 8, characterized in that: A plurality of cleaning chambers are arranged in the cleaning tank (3); each cleaning chamber is provided with a liquid discharge port (14).

10. The wafer cleaning device according to claim 9, characterized in that: A connecting pipe is provided between the liquid discharge port (14) and the spray assembly (4).

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