Wafer transferring and film cutting device and wafer film pasting equipment

Abstract

The utility model belongs to the technical field of semiconductor manufacturing equipment, and particularly relates to a wafer transferring and film cutting device and wafer film pasting equipment. The material taking assembly is provided with a first switcher; a second switcher and a heater are arranged on the cutting assembly; the transfer assembly is arranged on the side of the workbench, an embedding piece is arranged on the transfer assembly, and the embedding piece is used for being detachably connected with the first switcher and the second switcher; and the control assembly is arranged on the workbench, and the control assembly is electrically connected with the heater so that the heater can heat the cutting assembly. According to the utility model, through mutual cooperation of the material taking assembly, the cutting assembly, the transfer assembly and the control assembly, when the transfer assembly drives the material taking assembly to suck wafers, the control assembly supplies power to the cutting assembly for preheating. Compared with the prior art, the time for waiting for heating of the cutter before film cutting is omitted, and the production efficiency is effectively improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor manufacturing equipment, and particularly relates to a wafer transfer and film cutting device and a wafer film attaching device. Background Art

[0002] In the wafer production process, a protective film needs to be applied to the front of the wafer to protect the front lithography circuit and prevent the wafer from cracking, breaking and being contaminated. At the same time, since the wafer is round, the protective film needs to be accurately cut along the edge of the wafer after the wafer is filmed. In conventional wafer filming equipment, a robot usually uses a material suction cup to transfer the wafer, and then replaces the tool to cut the protective film.

[0003] Chinese patent authorization announcement number CN101238569B discloses a thin film pasting device, which is provided with a multi-joint manipulator, including a manipulator body, a tool blade and an adsorption arm. A storage device for placing the tool blade and the adsorption arm is provided on the side of the multi-joint manipulator, and a heater for heating the tool is also provided on the tool blade. When it is working, the wafer is transported by connecting the adsorption arm through the manipulator body, and then the tool blade is taken out from the storage device. The heater heats the tool blade and then cuts the protective film on the surface of the wafer. Although it can meet general use requirements, the tool blade needs to be heated before use, and it cannot be cut immediately, and the production efficiency is low. Therefore, it is necessary to improve the prior art to solve the above problems. Utility Model Content

[0004] The utility model aims to provide a wafer transfer and film cutting device and a wafer film attaching device, aiming to solve the technical problem of low production efficiency when wafer film cutting in the prior art.

[0005] To achieve the above-mentioned purpose, the present invention provides a wafer transfer and film cutting device, comprising:

[0006] A workbench, wherein two placement areas are formed on the workbench;

[0007] A material taking component, the material taking component is placed in one of the placement areas, and a first switch is provided on the material taking component;

[0008] A cutting assembly, the cutting assembly is placed in another placement area, and a second switch and a heater are provided on the cutting assembly;

[0009] A transfer assembly, the transfer assembly is arranged at the side of the workbench, and an insert is arranged on the transfer assembly, and the insert is used to be detachably connected with the first switch and the second switch;

[0010] A control component is disposed on the workbench and is electrically connected to the heater so that the heater heats the cutting component.

[0011] As a preferred solution, the control component includes a heating chamber, a heating power connector and a driving mechanism; the heating chamber is used to place the cutting component; the heating power connector is arranged above the heating chamber, for connecting the second switch and supplying power to the heater; the driving mechanism is used to drive the heating power connector to move, so that the heating power connector is connected or disconnected with the first switch.

[0012] As a preferred solution, the driving mechanism includes a lifting cylinder and a rotating cylinder; the rotating cylinder is connected to the heating power connector and is used to drive the heating power connector to rotate; the lifting cylinder is connected to the workbench and the rotating cylinder and is used to drive the rotating cylinder to lift and lower.

[0013] As a preferred embodiment, the cutting assembly also includes a tool holder and a blade; the blade is detachably arranged at one end of the tool holder; the second switch is arranged on the tool holder; the heater is arranged on the tool holder and is located beside the blade, and the heater is used to heat the blade when the second switch is connected to the heating power connector.

[0014] As a preferred solution, the material picking assembly also includes a bracket and a material picking arm; the material picking arm is detachably arranged on the bracket, and a plurality of suction holes are arranged at the front end of the material picking arm, and the suction holes are used for vacuum adsorption of wafers; the first switch is arranged on the bracket.

[0015] As a preferred solution, the transfer assembly also includes a manipulator, which is located on the side of the workbench; the engaging part is arranged at the front end of the manipulator and is located above the workbench.

[0016] As a preferred solution, a sensor and a positioning pin are provided in the placement area, the sensor is used to detect whether the material picking assembly and / or the cutting assembly is located in the placement area, and the positioning pin is used to limit the material picking assembly and / or the cutting assembly.

[0017] The embodiment of the utility model further provides a wafer film attaching equipment, comprising the wafer transfer and film cutting device.

[0018] The above one or more technical solutions in the wafer transfer and film cutting device and the wafer film attaching equipment provided by the embodiments of the utility model have at least one of the following technical effects:

[0019] The utility model cooperates with the material taking component, cutting component, transfer component and control component. While the transfer component drives the material taking component to take the wafer, the control component supplies power to preheat the cutting component. Compared with the prior art, the time of waiting for the tool to heat up before cutting the film is eliminated, which effectively improves production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0021] Figure 1 A schematic diagram of the overall structure of a wafer transfer and film cutting device provided in an embodiment of the utility model;

[0022] Figure 2 A partially exploded schematic diagram of a wafer transfer and film cutting device provided in an embodiment of the utility model;

[0023] Figure 3 A schematic diagram of the structure of a cutting assembly provided in an embodiment of the utility model;

[0024] Figure 4 A schematic diagram of the structure of a material taking component provided in an embodiment of the utility model;

[0025] Among them, the reference numerals in the figure are:

[0026] 100-working table; 110-placing area; 120-sensor; 130-positioning pin;

[0027] 200- material taking component; 210- first switch; 220- bracket; 230- material taking arm; 231- air suction hole;

[0028] 300-cutting assembly; 310-knife holder; 320-blade; 330-second switch; 340-heater;

[0029] 400-transportation component; 410-fitting part; 420-manipulator;

[0030] 500-control component; 510-heating chamber; 520-heating power connector; 530-driving mechanism; 531-lifting cylinder; 532-rotating cylinder. DETAILED DESCRIPTION

[0031] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0032] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0034] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0035] In one embodiment of the present invention, Figure 1-Figure 2 As shown, a wafer transfer and film cutting device is provided, which includes a workbench 100, a material taking component 200, a cutting component 300, a transfer component 400 and a control component 500.

[0036] Two placement areas 110 are formed on the workbench 100. The shapes of the two placement areas 110 are different to accommodate the material picking assembly 200 and the cutting assembly 300. In this embodiment, a sensor 120 and a positioning pin 130 are provided in each of the placement areas 110. The sensor 120 is used to detect whether the material picking assembly 200 and / or the cutting assembly 300 are located in the placement area 110, and the positioning pin 130 is used to limit the position of the material picking assembly 200 and / or the cutting assembly 300. The sensors 120 and the positioning pin 130 in the two placement areas 110 are adaptively positioned according to the shape and structure of the material picking assembly 200 and the cutting assembly 300.

[0037] The material taking component 200 is placed in one of the placement areas 110, and a first switch 210 is provided on the material taking component 200. Figure 4 As shown, the material picking assembly 200 also includes a bracket 220 and a material picking arm 230; the material picking arm 230 is detachably arranged on the bracket 220, and a plurality of suction holes 231 are arranged at the front end of the material picking arm 230, and the suction holes 231 are connected to an external vacuum source and used for vacuum adsorption of wafers; the first switch 210 is arranged on the bracket 220.

[0038] The cutting assembly 300 is placed in another placement area 110, such as Figure 3 As shown, the cutting assembly 300 is provided with a knife holder 310, a blade 320, a second switch 330 and a heater 340. The blade 320 is detachably provided at one end of the knife holder 310; the second switch 330 is provided on the knife holder 310; the heater 340 is provided on the knife holder 310 and is located beside the blade 320, and the heater 340 is used to heat the blade 320 when the second switch 330 is connected to the heating power connector 520 described below.

[0039] The transfer assembly 400 is disposed at the side of the workbench 100, and a fitting 410 is disposed on the transfer assembly 400, and the fitting 410 is used to be detachably connected to the first switch 210 and the second switch 330. In this embodiment, the transfer assembly 400 also includes a manipulator 420, and the manipulator 420 is located at the side of the workbench 100. The fitting 410 is disposed at the front end of the manipulator 420 and is located above the workbench 100. In this embodiment, the first switch 210 and the second switch 330 have the same structure, and the fitting 410 is adaptively connected to the first switch 210 and the second switch 330, so that the manipulator 420 can freely replace the material taking assembly 200 and the cutting assembly 300.

[0040] The control component 500 is disposed on the workbench 100, and the control component 500 is electrically connected to the heater 340 so that the heater 340 heats the cutting component 300. Specifically, the control component 500 includes a heating chamber 510, a heating power connector 520, and a driving mechanism 530. The heating chamber 510 is disposed below the placement area 110 for placing the cutting component 300. The heating chamber 510 is used to place the cutting component 300 to avoid heat loss on the blade 320 and reduce production costs. The heating power connector 520 is disposed above the heating chamber 510, and is used to connect the second switch 330 and supply power to the heater 340. The driving mechanism 530 is used to drive the heating power connector 520 to move, so that the heating power connector 520 is connected or disconnected with the first switch 210.

[0041] Furthermore, the driving mechanism 530 includes a lifting cylinder 531 and a rotating cylinder 532. The rotating cylinder 531 is connected to the heating power connector 520 to drive the heating power connector 520 to rotate; the lifting cylinder 532 is connected to the workbench 100 and the rotating cylinder 532 to drive the rotating cylinder 531 to move up and down.

[0042] The detailed usage process of this solution is as follows:

[0043] Before use, the material picking assembly 200 is placed in one of the placement areas 110; the cutting assembly 300 is placed in another of the placement areas 110 and extends into the heating chamber 510, and the heating power connector 520 is located above the cutting assembly 300 and is electrically connected to the second switch 330, so that the heater 340 located in the heating chamber 510 heats the blade 320 and maintains it at a preset temperature.

[0044] When in use, first, the manipulator 420 is quickly connected to the first switch 210 through the insert 410. The manipulator 420 drives the pick-up arm 230 to move under the wafer, and sucks the wafer to the processing position through the multiple suction holes 231 on the pick-up arm 230.

[0045] Next, after the external calibration mechanism calibrates the position of the wafer on the processing position, the robot 420 drives the material picking arm 230 to transfer the wafer to the film sticking station for film sticking. At the same time, the robot 420 puts the material picking assembly 200 back into the placement area 110 and disconnects the fitting 410 from the first switch 210.

[0046] Then, the lifting cylinder 531 drives the heating power connector 520 to rise up and disconnect from the second switch 330, and the rotating cylinder 531 drives the heating power connector 520 to deviate to one side.

[0047] Then, the robot 420 is quickly connected to the second switch 330 through the fitting 410 , and the robot 420 drives the heated blade 320 to move to the processing position to cut the protective film on the peripheral side of the wafer.

[0048] Finally, the robot 420 puts the cutting assembly 300 back into the placement area 110 and disconnects it from the second switch 330; at the same time, the rotating cylinder 531 drives the heating power connector 520 to rotate and move above the cutting assembly 300, and the lifting cylinder 531 drives the heating power connector 529 to move downward so that the heating power connector 520 is connected to the second switch 330, thereby heating the blade 320 and waiting for the next film cutting action.

[0049] In another embodiment of the utility model, a wafer film attaching device is provided, including the wafer transfer and film cutting device.

[0050] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer transfer and film cutting device, characterized in that: include: A workbench, wherein two placement areas are formed on the workbench; A material taking component, the material taking component is placed in one of the placement areas, and a first switch is provided on the material taking component; A cutting assembly, the cutting assembly is placed in another placement area, and a second switch and a heater are provided on the cutting assembly; A transfer assembly, the transfer assembly is arranged at the side of the workbench, and an insert is arranged on the transfer assembly, and the insert is used to be detachably connected with the first switch and the second switch; A control component is disposed on the workbench and is electrically connected to the heater so that the heater heats the cutting component.

2. The wafer transfer and film cutting device according to claim 1, characterized in that: The control assembly includes a heating chamber, a heating power connector and a driving mechanism; the heating chamber is used to place the cutting assembly; the heating power connector is arranged above the heating chamber, and is used to connect the second switch and supply power to the heater; The driving mechanism is used to drive the heating power connector to move so as to connect or disconnect the heating power connector with the first switch.

3. The wafer transfer and film cutting device according to claim 2, characterized in that: The driving mechanism includes a lifting cylinder and a rotating cylinder; the rotating cylinder is connected to the heating power connector and is used to drive the heating power connector to rotate; the lifting cylinder is connected to the workbench and the rotating cylinder and is used to drive the rotating cylinder to lift and lower.

4. The wafer transfer and film cutting device according to claim 2, characterized in that: The cutting assembly also includes a knife holder and a blade; the blade is detachably arranged at one end of the knife holder; the second switch is arranged on the knife holder; the heater is arranged on the knife holder and is located beside the blade, and the heater is used to heat the blade when the second switch is connected to the heating power connector.

5. The wafer transfer and film cutting device according to any one of claims 1 to 4, characterized in that: The material picking assembly also includes a bracket and a material picking arm; the material picking arm is detachably arranged on the bracket, and a plurality of suction holes are arranged at the front end of the material picking arm, and the suction holes are used for vacuum adsorption of wafers; the first switch is arranged on the bracket.

6. The wafer transfer and film cutting device according to any one of claims 1 to 4, characterized in that: The transfer assembly also includes a manipulator, which is located on the side of the workbench; the engaging part is arranged at the front end of the manipulator and is located above the workbench.

7. The wafer transfer and film cutting device according to any one of claims 1 to 4, characterized in that: A sensor and a positioning pin are arranged in the placement area, the sensor is used to detect whether the material taking component and / or the cutting component is located in the placement area, and the positioning pin is used to limit the material taking component and / or the cutting component.

8. A wafer film attaching device, characterized in that: It comprises the wafer transfer and film cutting device as described in any one of claims 1 to 7.

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