Packaging structure and optical module
By designing the packaging structure of polygonal columnar mirrors and grooved structures, the problem that traditional packaging cannot meet the needs of multiple chips and multi-color output is solved, and efficient space utilization and heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202421264660.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-04
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-06-04
AI Technical Summary
Traditional laser chip packaging structures cannot meet the diverse market needs, especially in terms of multi-chip packaging and multi-color output.
A package structure is designed, including a substrate, a plurality of reflectors, at least one first pad and a second pad, and a plurality of laser chips. The reflector adopts a polygonal column structure, and partially forms a groove to fit adjacent reflectors. The outgoing light point of the laser chip and the reflection of the reflector are arranged to change the direction of the light exit.
The integrated packaging of multiple laser chips is realized to meet the needs of different scenarios, while improving the space utilization and heat dissipation efficiency of the packaging structure.
Smart Images
Figure CN222637902U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor manufacturing, and in particular to a packaging structure and an optical module. Background Art
[0002] Laser semiconductor chips are increasingly used in the market due to their advantages of miniaturization, low power consumption, high efficiency, easy integration, and tunability. Traditional laser chips use To packaging or plastic packaging, but plastic packaging or To packaging can only be used in specific structures due to the packaging form, and cannot meet the diverse needs of the market; and plastic packaging or To packaging can only package a single chip due to structural limitations, and it is impossible to package multiple chips or achieve multi-color output in the same package. Summary of the invention
[0003] The utility model provides a packaging structure, which can solve at least one problem in the background technology to realize the packaging of multiple chips and improve the utilization rate of the packaging space.
[0004] In the first aspect, the utility model provides a packaging structure, which at least includes a substrate, a plurality of reflectors, at least one first pad and a second pad, and a plurality of laser chips. The plurality of reflectors are located on the substrate; the reflectors include a polygonal columnar structure composed of a reflective surface and a plurality of non-reflective surfaces, and a portion of the polygonal columnar structure forms an embedding groove; adjacent reflectors are embedded through the embedding groove; at least one first pad and at least one second pad surround the plurality of reflectors and are electrically isolated from each other; a plurality of laser chips are located on the first pad and are electrically connected to the first pad and the second pad respectively; the light emitting point of the laser chip is arranged opposite to the reflective surface of the reflector to change the light emitting direction of the laser chip.
[0005] In a second aspect, the utility model further provides an optical module, which adopts the packaging structure of the above embodiment.
[0006] The packaging structure provided by the utility model can not only integrate multiple laser chips into one packaging structure to meet the needs of different scenarios through the coordinated design of multiple laser chips and reflectors, but also make the packaging structure small in size and improve the space utilization of the packaging.
[0007] Other features and beneficial effects of the present invention will be set forth in the following description, and in part will become apparent from the description, or may be understood by implementing the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0008] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, a brief introduction is given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0009] Figure 1 A schematic diagram of a three-dimensional structure of a packaging structure provided by an embodiment of the utility model;
[0010] Figure 2 A schematic diagram of a top view of a packaging structure provided in one embodiment of the utility model;
[0011] Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure of AA;
[0012] Figure 4 is a schematic diagram of a three-dimensional structure of a reflector in one embodiment;
[0013] Figure 5 to Figure 7 A schematic diagram of a top view of a packaging structure provided in another embodiment of the utility model;
[0014] Figure 8 This is a schematic diagram of the three-dimensional structure of a packaging structure provided in other embodiments of the utility model.
[0015] Reference numerals:
[0016] 10 - substrate; 20 - reflector; 20a - reflective surface; 21 - embedding groove; 21a - first embedding groove; 21b - second embedding groove; 31 - first solder pad; 32 - second solder pad; 40 - laser chip; 41 - first electrode layer; 42 - second electrode layer; 50 - packaging frame; 60 - light-transmitting layer. DETAILED DESCRIPTION
[0017] In order to make the purpose, technical solutions and advantages of the embodiments of the utility model clearer, the technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model; the technical features designed in different embodiments of the utility model described below can be combined with each other as long as they do not conflict with each other.
[0018] The utility model provides a packaging structure, which at least comprises a substrate, a plurality of reflectors, at least a first welding pad and a second welding pad, and a plurality of laser chips.
[0019] A plurality of reflectors are located on the substrate; the reflectors include a polygonal columnar structure composed of a reflective surface and a plurality of non-reflective surfaces, and a portion of the polygonal columnar structure forms an embedding groove; adjacent reflectors are embedded through the embedding groove; at least one first pad and at least one second pad surround the plurality of reflectors and are electrically isolated from each other; a plurality of laser chips are located on the first pad and are electrically connected to the first pad and the second pad, respectively; the emission light point of the laser chip is arranged relative to the reflective surface of the reflector to change the light emission direction of the laser chip. Through the above arrangement, not only can a plurality of laser chips be integrated into a packaging structure to meet the needs of different scenarios, but also the packaging structure can be made small in size and the space utilization of the packaging can be improved.
[0020] In one embodiment, the polygonal columnar structure is a right-angled triangular prism or a right-angled trapezoidal prism; when there are more than three reflectors, a portion of the edge of both ends of each reflector respectively forms a first embedding groove and a second embedding groove, and the first embedding groove at one end of the reflector is embedded with the second embedding groove at one end of the adjacent reflector to further reduce the invalid space and improve the space utilization of the package.
[0021] In one embodiment, when looking down at the packaging structure from above, the packaging structure is a polygon, each of the laser chips is arranged along a diagonal or a perpendicular line of the polygon, and the emission light point of the laser chip is toward the reflector located at the center of the polygon.
[0022] In one embodiment, the number of the first pads, the second pads, the reflectors, and the laser chips is the same, and the design is specifically performed according to the requirements of the actual packaging structure.
[0023] In one embodiment, the horizontal projection area of the first pad is larger than the horizontal projection area of the second pad to ensure the heat dissipation capability of the first pad.
[0024] In one embodiment, the distance between adjacent first pads and second pads is between 80 μm and 100 μm, so as to avoid leakage between the two pads and improve the compactness of the structure.
[0025] In one embodiment, the laser chip has a first electrode layer and a second electrode layer; the first electrode layer is connected to the first pad, and the second electrode layer is connected to the second pad; the horizontal projection area of the first electrode layer is smaller than the horizontal projection area of the first pad, which is beneficial to the heat dissipation effect of the laser chip.
[0026] In one embodiment, at least part of the laser chips are independently controlled through the first pad and the second pad to achieve a light mixing effect.
[0027] In one embodiment, it further includes a packaging frame and a light-transmitting layer. The packaging frame is disposed on the substrate and surrounds the laser chip and the reflector. The light-transmitting layer covers the packaging frame to protect the laser chip.
[0028] The utility model also provides an optical module, which adopts the packaging structure described in any of the above embodiments to improve space utilization and be applied to more occasions.
[0029] Next, in combination with different embodiments and the accompanying drawings of the specification, the technical solution of the utility model is described and illustrated in detail through a variety of specific implementation methods.
[0030] Embodiment 1
[0031] See also Figure 1 , Figure 2 , Figure 3 , Figure 1 A schematic diagram of a three-dimensional structure of a packaging structure provided by an embodiment of the utility model; Figure 2 A schematic diagram of a top view of a packaging structure provided in one embodiment of the utility model; Figure 3 for Figure 2 To achieve at least one of the advantages or other advantages, the first embodiment discloses a packaging structure including at least a substrate 10, a plurality of reflectors 20, at least one first pad 31 and a second pad 32, and a plurality of laser chips 40.
[0032] The material of the substrate 10 can be reasonably designed according to actual needs, such as silicon, silicon carbide, aluminum oxide, diamond, ceramic, etc., which is not limited here. In this embodiment, the substrate 10 is preferably a ceramic substrate 10, such as an AlN-based ceramic substrate 10, to provide good thermal diffusion capability and withstand mechanical stress during the production process.
[0033] A plurality of reflectors 20 are located on the substrate 10 , wherein the reflectors 20 may be fixed on the substrate 10 by adhesive.
[0034] At least one first solder pad 31 and at least one second solder pad 32 are disposed on the substrate 10 around the plurality of reflectors 20 and are electrically isolated from each other; by making the first solder pad 31 and the second solder pad 32 contact the substrate 10 over a large area, the heat dissipation efficiency can be maximized, so that the laser chip 40 can dissipate heat in time during operation. Preferably, the horizontal projection area of the first solder pad 31 is larger than the horizontal projection area of the second solder pad 32 to ensure the heat dissipation capacity of the first solder pad 31. More preferably, Figure 2As shown, the spacing D between adjacent first pads 31 and second pads 32 is between 80 and 100 μm to avoid the possibility of leakage between the two due to a small distance and the problem of too long leads or large volume due to a large distance, thereby improving the compactness of the structure.
[0035] A plurality of laser chips 40 are located on the first pad 31 and are electrically connected to the first pad 31 and the second pad 32, respectively. Specifically, the laser chip 40 has a first electrode layer 41 and a second electrode layer 42. The first electrode layer 41 is connected to the first pad 31, and the second electrode layer 42 is connected to the second pad 32. In this embodiment, the first electrode layer 41 is preferably electrically connected to the first pad 31 and the second electrode layer 42 is electrically connected to the second pad 32 by a welding wire. Preferably, the horizontal projection area of the first electrode layer 41 is smaller than the horizontal projection area of the first pad 31, so as to facilitate the heat dissipation effect of the laser chip 40. As an example, the first electrode layer 41, the second electrode layer 42, the first pad 31, and the second pad 32 may include a metal material with high conductivity, such as a combination structure of one or more of gold, indium, tin, titanium, aluminum, chromium, platinum or nickel.
[0036] The backs of the multiple laser chips 40 are fixed to the first pad 31 by a heat sink, which is usually made of a material with high thermal conductivity, such as copper, aluminum, copper-tungsten alloy or diamond, which can quickly transfer heat from the laser chip 40 to an external heat dissipation system. The design and material selection of the heat sink depend on the specific application and power requirements of the laser diode. Preferably, the colors of the light beams emitted by the multiple laser chips 40 can be the same or different, which is specifically designed according to the requirements and is not limited here.
[0037] When multiple laser chips 40 are packaged, multiple reflectors 20 are required to cooperate with the packaging. However, multiple laser chips 40 and multiple reflectors 20 are independently arranged on the substrate 10, which occupies a large space and cannot be miniaturized. Based on this, in this embodiment, please refer to Figures 4 to 7 The reflector 20 has a polygonal columnar structure composed of a reflective surface 20a and a plurality of non-reflective surfaces, and a portion of the polygonal columnar structure forms an embedding groove 21. Adjacent reflectors 20 are embedded in each other through the embedding groove 21. In addition, the emission point of the laser chip 40 is arranged opposite to the reflective surface 20a of the reflector 20 to change the light emission direction of the laser chip 40.
[0038] When there are two reflectors 20, see Figure 6 The two reflectors 20 are arranged back to back, and an embedding groove 21 is formed at the edges of the two reflectors 20 . The two reflectors 20 are embedded in the embedding groove 21 back to back, thereby reducing the occupied space of the reflectors 20 .
[0039] When there are three or more reflectors 20, a portion of the edges of both ends of each reflector 20 forms a first embedding groove 21a and a second embedding groove 21b respectively; the first embedding groove 21a at one end of the reflector 20 is embedded with the second embedding groove 21b at one end of the adjacent reflector 20. For example, the structures of the first embedding groove 21a and the second embedding groove 21b can be as follows: Figure 4 shown.
[0040] Specifically, each reflector 20 has a first embedding groove 21a and a second embedding groove 21b at both ends, wherein the first embedding groove 21a and the second embedding groove 21b are missing corners formed by inward depression from the top corner of the polygonal columnar structure. In addition, the structures of the first embedding groove 21a and the second embedding groove 21b can be the same or different, and are specifically set according to actual needs. Preferably, the embedding groove 21 is inwardly depressed from the corner of the polygonal columnar structure and does not extend to the reflective surface 20a to avoid affecting the reflective surface 20a.
[0041] As an example, when four reflectors 20 are provided, the reflectors 20 may be as follows: Figure 2 , Figure 4 The structure and arrangement shown in FIG. 2 may also be as follows: Figure 5 When two reflectors 20 are provided, the reflectors 20 can be as follows: Figure 6 When there are three reflectors 20, the reflectors 20 can be as follows: Figure 7 It should be noted that the structure and arrangement of the multiple reflectors 20 should not be limited to those shown in the drawings. According to the present concept, those skilled in the art can also make different structural adjustments and arrangement adjustments to the reflectors 20, laser chips 40 and pads according to actual needs, all of which fall within the protection scope of the present utility model.
[0042] By designing the embedding grooves 21 of the plurality of reflectors 20 as described above, it is possible to effectively reduce the space occupied by the reflectors 20 , control the use space of the reflectors 20 , and further control the size of the entire packaging structure, thereby improving the space utilization of the packaging.
[0043] As a preferred option, see Figure 1 , Figure 8, the polygonal columnar structure is a right-angled triangular prism or a right-angled trapezoidal prism. Among them, the inclined surface of the right-angled triangular prism or the right-angled trapezoidal prism is the reflective surface 20a, and the other surfaces are non-reflective surfaces. Preferably, the reflective surface 20a is 45° to the horizontal plane, so that the light beam emitted horizontally by the laser chip 40 is reflected by the 45° reflective surface 20a and emitted from the packaging structure at 90°, which is conducive to more concentrated emitted light beams. Of course, based on the present concept, those skilled in the art can also modify the polygonal columnar structure into other structures in which the reflective surface 20a is at a certain preset angle to the horizontal plane, all of which fall within the protection scope of the present utility model.
[0044] It should be noted that, depending on the actual needs of the packaging structure, the packaging structure may also be provided with other optical elements to process the laser emitted by the laser chip 40 to meet the corresponding emission requirements, such as a collimating lens, a focusing lens, etc., which are not limited here.
[0045] It should also be noted that the packaging structure may include two or more laser chips 40 and a reflector 20 package integration. Among them, one reflector 20 can reflect one or more laser chips 40. The number of first pads 31 and second pads 32 is designed according to the actual connection conditions of each laser chip 40. For example, when all laser chips 40 are controlled together, the first pad 31 and the second pad 32 can be one, and all laser chips 40 are arranged on one first pad 31. When some laser chips 40 are independently controlled and some laser chips 40 are jointly controlled, the jointly controlled laser chips 40 are arranged on the same first pad 31, and the independently controlled laser chips 40 are arranged on different first pads 31. When all laser chips 40 are independently controlled, the number of laser chips 40 is the same as the number of first pads 31 and second pads 32, and each laser chip 40 is arranged on a first pad 31 in a one-to-one correspondence. In this embodiment, at least part of the laser chips 40 are preferably independently controlled by the first pad 31 and the second pad 32, so as to achieve high-intensity output of multiple laser chips 40 of the same color or mixed light output of laser chips 40 of different colors, thereby improving the luminous efficiency. More preferably, the number of the first pad 31, the second pad 32, the reflector 20, and the laser chip 40 is the same. The specific design can be reasonably made according to the functions required by the actual packaging structure, and is not limited here.
[0046] In an optional embodiment, when the substrate 10 is viewed from above the packaging structure, the packaging structure is a polygon, and each of the laser chips 40 is arranged along the diagonal or perpendicular line of the polygon, and the emission point of the laser chip 40 faces the reflector 20 located at the center of the polygon. For example, the packaging structure can be an equilateral triangle, rectangle, pentagon, hexagon or even a circular symmetrical structure. As an example, Figure 2As shown, the overall top view shape of the package structure is a rectangle. When all laser chips 40 are independently controlled, the number of laser chips 40 and reflectors 20 is the same as the number of sides of the polygon, and each laser chip 40 is arranged along the diagonal of the polygon toward the center, thereby maximizing the use of space; Figure 6 As shown, the overall top view shape of the package structure is a hexagon, and each laser chip 40 is arranged toward the center along the perpendicular line of the polygon. The diagonal line of the polygon refers to the line segment connecting any two non-adjacent vertices of the polygon; the perpendicular line of the polygon refers to the perpendicular median of each side of the polygon.
[0047] Preferably, please continue to see Figure 1 The packaging structure may further include a packaging frame 50 and a light-transmitting layer 60. The packaging frame 50 is disposed on the substrate 10 and surrounds the laser chip 40 and the reflector 20; the light-transmitting layer 60 covers the packaging frame 50. This design effectively protects the laser chip 40 and avoids contamination. The light-transmitting layer 60 is made of a material that allows light to pass through, generally a transparent material or a translucent material. In this embodiment, the material of the light-transmitting layer 60 may be glass, resin glue, transparent silicone, or the like.
[0048] In summary, this embodiment integrates multiple laser chips into one packaging structure through the above-mentioned setting. Compared with the traditional TO packaging, it not only has a simple structure, simple process, and high packaging efficiency, but can also meet the application requirements of high-intensity output of multiple laser chips of the same color or mixed light output of laser chips of different colors, but also can make the packaging structure small in size, improve the space utilization of the packaging, and improve the luminous efficiency.
[0049] Embodiment 2
[0050] The utility model also provides an optical module, which adopts the packaging structure described in the above embodiment to improve space utilization, enhance heat dissipation effect and be applied to more occasions.
[0051] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.
Claims
1. A packaging structure, characterized in that: The packaging structure comprises: substrate; A plurality of reflectors are located on the substrate; the reflectors include a polygonal columnar structure formed by a reflective surface and a plurality of non-reflective surfaces, and a portion of the polygonal columnar structure forms an embedding groove; adjacent reflectors are embedded in each other through the embedding groove; at least one first pad and at least one second pad, surrounding the plurality of reflectors and electrically isolated from each other; A plurality of laser chips are located on the first pad and are electrically connected to the first pad and the second pad respectively; the light emitting point of the laser chip is arranged opposite to the reflecting surface of the reflector to change the light emitting direction of the laser chip.
2. The packaging structure according to claim 1, characterized in that: The polygonal columnar structure is a right-angled triangular prism or a right-angled trapezoidal prism; when there are more than three reflectors, a portion of the edge of both ends of each reflector respectively forms a first embedding groove and a second embedding groove, and the first embedding groove at one end of the reflector is embedded with the second embedding groove at one end of the adjacent reflector.
3. The packaging structure according to claim 1, characterized in that: Looking down at the packaging structure from above, the packaging structure is a polygon, each of the laser chips is arranged along the diagonal line or the perpendicular line of the polygon, and the emission light point of the laser chip is toward the reflector located at the center of the polygon.
4. The packaging structure according to claim 1, characterized in that: The number of the first pads, the second pads, the reflectors and the laser chips is the same.
5. The packaging structure according to claim 1, characterized in that: The horizontal projection area of the first pad is greater than the horizontal projection area of the second pad.
6. The packaging structure according to claim 1, characterized in that: The distance between adjacent first pads and second pads is between 80 μm and 100 μm.
7. The packaging structure according to claim 1, characterized in that: Each of the laser chips has a first electrode layer and a second electrode layer; the first electrode layer is connected to the first pad, and the second electrode layer is connected to the second pad; and the horizontal projection area of the first electrode layer is smaller than the horizontal projection area of the first pad.
8. The packaging structure according to claim 1, characterized in that: At least part of the laser chip is independently controlled via the first pad and the second pad.
9. The packaging structure according to claim 1, characterized in that: It also includes a packaging frame and a light-transmitting layer. The packaging frame is arranged on the substrate and surrounds the laser chip and the reflector; the light-transmitting layer covers the packaging frame.
10. An optical module, characterized in that: A packaging structure as described in any one of claims 1 to 9 is adopted.