Dip soldering machine for manufacturing single-wire NTC (Negative Temperature Coefficient) temperature sensor

Abstract

The utility model discloses a dip soldering machine for manufacturing a single-wire NTC (Negative Temperature Coefficient) temperature sensor, which can be used for automatically dipping soldering flux on a product through a dip soldering moving mechanism and carrying out preheating and dip soldering operations, and a tin scraping mechanism is used for carrying out tin scraping operation in a preheating stage, so that the dip soldering process operation which is manually participated is completely removed, and the production efficiency is improved. And meanwhile, the dip soldering process is completely automatic, and the production efficiency of products is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of dip soldering machines, in particular to a dip soldering machine used for manufacturing a single-wire NTC temperature sensor. Background Art

[0002] Dip soldering is a commonly used electronic component welding technology. The process is to first apply solder paste to the welding surface of the electronic component PCB board, immerse the welding surface into the molten solder for a certain period of time, allow the solder to penetrate into the pins until a solder joint is formed, then take out the PCB board, allow the solder joint to cool and solidify naturally, and complete the tinning of multiple solder joints at one time. Dip soldering has the characteristics of quickly and efficiently completing the welding of a large number of PCB boards, and is especially suitable for mass production.

[0003] At present, the dip soldering operation of PCB boards has gradually changed from manual to automated operation, with dip soldering machines replacing manual operation. In the existing technology, most dip soldering equipment still cannot achieve high-efficiency dip soldering. Before dip soldering, general dip soldering machines require manual application of flux on the soldering surface of the product and tin-scraping treatment on the surface of the solder before placing it on the dip soldering machine for dip soldering. Although it improves production efficiency, it only has the function of dip soldering. Although it can reduce the labor intensity and work risks of workers, it greatly reduces production efficiency due to the need for manual operation such as applying solder paste and scraping tin. Utility Model Content

[0004] Aiming at the disadvantage that the dip soldering machine in the above technology cannot automatically apply flux and scrape tin, resulting in low production efficiency, the utility model provides a dip soldering machine for making a single-wire NTC temperature sensor.

[0005] To achieve the above-mentioned purpose, the utility model provides a dip soldering machine for making a single-wire NTC temperature sensor, comprising a frame, on which a dip soldering moving mechanism, a flux rack, a soldering tin furnace tank and a tin scraping mechanism are provided, the dip soldering moving mechanism is arranged at one end of the soldering tin furnace tank, the flux rack and the tin scraping mechanism are respectively arranged on both sides of the soldering tin furnace tank, the dip soldering moving mechanism is provided with a solder frame, and the solder frame is movably connected to the dip soldering moving mechanism.

[0006] As an improved solution of the utility model, the dip soldering moving mechanism includes a horizontal moving component and a lifting moving component, the horizontal moving component is fixedly arranged on the frame, the horizontal moving component is provided with a first connecting member, the first connecting member is movably connected to the horizontal moving component, the lifting moving component is fixedly connected to the first connecting member, and the solder frame is movably connected to the other side of the lifting moving component.

[0007] As an improved scheme of the utility model, the horizontal movement component includes a first motor, a first guide rail and a first sliding member, the first motor is arranged at one end of the first guide rail, and the first output shaft of the first motor passes through one end of the first guide rail to reach the other end, the first sliding member is sleeved on the first output shaft and is slidably connected to the first guide rail, and the first connecting member is fixedly arranged on the first sliding member; the lifting and moving component includes a second motor, a second guide rail and a second sliding member, the second guide rail is vertically fixedly arranged on a surface of the first connecting member close to the tin furnace, the second motor is arranged at one end of the second guide rail, and the second output shaft of the second motor passes through one end of the second guide rail to reach the other end, the second sliding member is sleeved on the second output shaft and is slidably connected to the second guide rail, the second sliding member is provided with a second connecting member, the second connecting member is fixedly connected to the second sliding member, and the second connecting member is provided with a solder frame on a surface of the second connecting member close to the welding tin furnace groove, and the solder frame is fixedly connected to the second connecting member.

[0008] As an improved solution of the utility model, the tin scraping mechanism includes a cylinder mounting plate, a first cylinder, a second cylinder and a tin scraping sheet. The first cylinder is vertically arranged and fixedly mounted on the cylinder mounting plate. A third connecting member is provided on the first gas rod of the first cylinder, and the two sides of the third connecting member are respectively fixedly connected to the first gas rod and the second cylinder. The second gas rod of the second cylinder is provided with a fourth connecting member, and the fourth connecting member is respectively fixedly connected to the second gas rod and the tin scraping sheet.

[0009] As an improved solution of the utility model, a tin surface detection device for detecting the depth of tin immersion is provided on the solder frame.

[0010] As an improved solution of the utility model, the tin surface detection device includes a probe mounting plate, a third cylinder and a probe, the probe mounting plate is fixedly mounted on the solder frame, a first through hole is provided on the probe mounting plate, the third cylinder is fixedly mounted on the probe mounting plate, a third gas rod of the third cylinder passes through the first through hole, and the probe is fixedly connected to the third gas rod.

[0011] The beneficial effects of the utility model are as follows: compared with the prior art, the dip soldering machine for manufacturing a single-line NTC temperature sensor provided by the utility model comprises a frame, on which a dip soldering moving mechanism, a flux rack, a soldering tin furnace tank and a tin scraping mechanism are arranged, the dip soldering moving mechanism is arranged at one end of the soldering tin furnace tank, the flux rack and the tin scraping mechanism are respectively arranged at both sides of the soldering tin furnace tank, the dip soldering moving mechanism is provided with a solder frame, and the solder frame is movably connected to the dip soldering moving mechanism; the solder frame can place multiple products for dip soldering at the same time, the dip soldering moving mechanism can automatically dip the solder flux on the products, and perform preheating and dip soldering operations, the tin scraping mechanism performs a tin scraping operation in the preheating stage, and the dip soldering process operation involving manual participation is completely eliminated, the labor intensity and danger of the workers are reduced, and the dip soldering process is fully automated, thereby improving the production efficiency of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a three-dimensional diagram of the utility model;

[0013] Figure 2 It is a right side view of the utility model;

[0014] Figure 3 It is a schematic diagram of the dip soldering moving mechanism of the utility model;

[0015] Figure 4 It is a top view of the utility model.

[0016] The main component symbols are explained as follows: 1. Frame; 2. Dip soldering moving mechanism; 21. Horizontal moving assembly; 211. First motor; 212. First guide rail; 213. First sliding member; 22. Lifting moving assembly; 221. Second motor; 222. Second guide rail; 223. Second sliding member; 3. Flux rack; 4. Tin scraping mechanism; 41. Cylinder mounting plate; 42. First cylinder; 43. Second cylinder; 44. Tin scraping sheet; 5. Solder frame; 51. First card frame; 6. Tin surface detection device; 61. Probe mounting plate; 62. Third cylinder; 63. Probe; 7. Soldering tin furnace trough; 8. First connecting member; 9. Second connecting member; 10. Third connecting member; 11. Fourth connecting member. DETAILED DESCRIPTION

[0017] In order to more clearly illustrate the present invention, the present invention is further described below in conjunction with the accompanying drawings.

[0018] See also Figure 1-Figure 4The utility model discloses a dip soldering machine for making a single-wire NTC temperature sensor, comprising a frame 1, on which a dip soldering mobile mechanism 2, a flux rack 3, a soldering tin furnace tank 7 and a tin scraping mechanism 4 are arranged, the dip soldering mobile mechanism 2 is arranged at one end of the soldering tin furnace tank 7, the flux rack 3 and the tin scraping mechanism 4 are respectively arranged on both sides of the soldering tin furnace tank 7, the dip soldering mobile mechanism 2 is provided with a solder frame 5, and the solder frame 5 is movably connected with the dip soldering mobile mechanism 2; the product is placed on the solder frame 5, and after the dip soldering mobile mechanism 2 picks up the flux on the flux rack 3, the tin scraping mechanism 4 scrapes off the solder on the inner surface of the soldering tin furnace tank 7, the dip soldering mobile mechanism 2 puts the product into the soldering tin furnace tank 7 for soldering, and after the product is placed on the solder frame 5, the dip soldering mobile mechanism 2 is used to pick up the flux on the flux rack 3, and the tin scraping mechanism 4 scrapes off the solder on the inner surface of the soldering tin furnace tank 7, and the dip soldering mobile mechanism 2 puts the product into the soldering tin furnace tank 7 for soldering, and after the product is placed on the solder frame 5, the dip soldering mobile mechanism The structure 2 moves horizontally to move the product above the flux rack 3, lowers the product height, and after the product is dipped in flux, moves it to the top of the soldering tin furnace tank 7. After the scraping mechanism 4 scrapes the tin on the surface, the soldering surface of the product is moved to the top of the soldering tin furnace tank 7 for preheating. After the preheating is completed, it is put into the solder for welding for a certain period of time, and then raised to cool, and the dip soldering of the product is completed. Through PLC programming, the connection and cooperation of the dip soldering moving mechanism 2 and the scraping mechanism 4 can be controlled, and the flux and scraping operations are automatically carried out, thereby reducing the labor intensity and harm of workers. A first card frame 51 is provided on the solder frame 5, and multiple products can be placed through the first card frame 51, and dip soldering of multiple products can be carried out at one time, thereby improving the production efficiency of the dip soldering machine.

[0019] The working principle of the utility model is:

[0020] The product is clamped on the solder frame 5 through the first clamping frame 51 set on the solder frame 5, and the product is driven to move above the flux rack 3 by the horizontal moving component 21. The lifting and moving component 22 lowers the height of the product to dip the flux, and then moves to the top of the soldering tin furnace tank 7 for preheating treatment, and the first cylinder 42 of the tin scraping mechanism 4 adjusts the tin scraping sheet 44 to a position at the same height as the tin surface. The tin scraping sheet 44 scrapes the surface tin of the molten solder in the soldering tin furnace tank 7 through the push of the second cylinder 43. Before dip soldering, the third cylinder 6262 of the tin surface detection device 6 pushes the probe 6363 to the tin surface, and the probe 63 will record the current extended height to confirm the height that the lifting and moving component 22 needs to lift. Then the lifting and moving component 22 lowers the solder frame 5 to the height where the product welding surface is immersed in the solder. After the product welding is completed, it is raised again to wait for the solder joint to cool completely to complete the dip soldering operation of the product.

[0021] See also Figure 1 and Figure 3The dip soldering moving mechanism 2 includes a horizontal moving component 21 and a lifting moving component 22. The horizontal moving component 21 is provided with a first connecting member 8, and the first connecting member 8 is movably connected to the horizontal moving component 21. One side of the lifting moving component 22 is fixedly connected to the first connecting member 8, and the solder frame 5 is movably connected to the other side of the lifting moving component 22; the solder frame 5 can perform horizontal linear motion and height linear motion on the product through the horizontal moving component 21 and the lifting moving component 22.

[0022] See also Figure 3 The horizontal moving component 21 includes a first motor 211, a first guide rail 212 and a first sliding member 213. The first motor 211 is arranged at one end of the first guide rail 212, and the first output shaft of the first motor 211 passes through one end of the first guide rail 212 to reach the other end. The first sliding member 213 is sleeved on the first output shaft and is slidably connected to the first guide rail 212. The first connecting member is fixedly arranged on the first sliding member 213; the lifting and moving component 22 includes a second motor 221, a second guide rail 222 and a second sliding member 223. The second guide rail 222 is vertically fixedly arranged on a surface of the first connecting member close to the tin furnace. The second motor 221 is arranged at one end of the second guide rail 222, and the second output shaft of the second motor 221 passes through one end of the second guide rail 222 to reach the other end. The second sliding member 223 is sleeved on the second output shaft and is slidably connected to the second guide rail 222. A second connecting member is provided on the movable member 223, and the second connecting member is fixedly connected to the second sliding member 223. A solder frame 5 is provided on the side of the second connecting member close to the soldering tin furnace groove 7, and the solder frame 5 is fixedly connected to the second connecting member. The forward and reverse driving of the first motor 211 and the second motor 221 can control the solder frame 5 to perform reciprocating linear motion in the horizontal direction and the up and down directions. Since the first guide rail 212 and the first motor 211 are arranged on the frame 1, the second guide rail 222 is slidably matched with the first connecting member and the first sliding member 213 to change the horizontal position of the second guide rail 222, that is, the horizontal position of the lifting and moving assembly 22. It can be understood that the positions of the horizontal moving assembly 21 and the lifting and moving assembly 22 can be interchanged, that is, the lifting and moving assembly 22 is arranged on the frame 1, and the horizontal moving assembly 21 is arranged on the lifting and moving assembly 22 through the connecting member.

[0023] See also Figure 1-Figure 2In another embodiment, all the technical features of the above embodiments are included, and the tin scraping mechanism 4 includes a cylinder mounting plate 41, a first cylinder 42, a second cylinder 43 and a tin scraping sheet 44. The first cylinder 42 is vertically arranged and fixedly mounted on the cylinder mounting plate 41. A third connecting member 10 is provided on the first gas rod of the first cylinder 42, and the two sides of the third connecting member 10 are respectively fixedly connected to the first gas rod and the second cylinder 43. The second gas rod 43 of the second cylinder 43 is provided with a fourth connecting member 11, and the fourth connecting member 11 is respectively fixedly connected to the second gas rod 43 and the tin scraping sheet 44; before dip soldering, the tin on the surface of the solder needs to be scraped off, otherwise it will affect the irregular shape of the solder joint, resulting in problems such as product short circuit, through the first cylinder 42 and the second cylinder 43.

[0024] See also Figure 2-Figure 3 In another embodiment, all the technical features of the above embodiments are included, a tin surface detection device 6 for detecting the height of the tin surface of the solder is provided on the solder frame 5, the tin surface detection device 6 includes a probe mounting plate 61, a third cylinder 62 and a probe 63, the probe mounting plate 61 is fixedly mounted on the solder frame 5, a first through hole is provided on the probe mounting plate, the third cylinder 62 is fixedly mounted on the probe mounting plate 61, the third gas rod of the third cylinder 62 passes through the first through hole, and the probe 63 is fixedly connected to the third gas rod of the third cylinder; when the product is ready for dip soldering operation, the height of the tin surface of the solder is detected by the probe 63, when the probe 63 contacts the tin surface, the PLC will receive a 0V input signal, the probe 63 is reset and the PLC records the current position height of the second motor 221, so as to fix the depth of the solder, to ensure that the product will not be immersed too deeply or cannot contact the solder, and by setting the tin surface detection device 6, the depth of each soldering is guaranteed to be consistent, to ensure that the product will not have defects, to prevent poor welding and cause product short circuit problems.

[0025] The advantages of the utility model are:

[0026] 1) The soldering mobile mechanism can automatically complete the soldering flux dipping, preheating treatment and soldering operation on the product. At the same time, the tin scraping mechanism scrapes the solder, which improves the production efficiency of the soldering machine and reduces the labor intensity and danger of workers.

[0027] 2) Multiple products can be placed on the solder frame for dip soldering at the same time, thus improving the production efficiency of the dip soldering machine.

[0028] The above disclosures are only several specific embodiments of the present invention, but the present invention is not limited thereto, and any changes that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. A dip soldering machine for making a single-wire NTC temperature sensor, comprising a frame, characterized in that: The frame is provided with a soldering dip moving mechanism, a flux rack, a soldering tin furnace tank and a tin scraping mechanism. The soldering dip moving mechanism is arranged at one end of the soldering tin furnace tank, the flux rack and the tin scraping mechanism are respectively arranged at both sides of the soldering tin furnace tank, and the soldering dip moving mechanism is provided with a solder frame, which is movably connected to the soldering dip moving mechanism.

2. A dip soldering machine for manufacturing a single-wire NTC temperature sensor according to claim 1, characterized in that: The dip soldering moving mechanism includes a horizontal moving component and a lifting moving component. The horizontal moving component is fixedly arranged on the frame. The horizontal moving component is provided with a first connecting piece, which is movably connected to the horizontal moving component. The lifting moving component is fixedly connected to the first connecting piece, and the solder frame is movably connected to the other side of the lifting moving component.

3. A dip soldering machine for manufacturing a single-wire NTC temperature sensor according to claim 2, characterized in that: The horizontal movement component includes a first motor, a first guide rail and a first sliding member, the first motor is arranged at one end of the first guide rail, and the first output shaft of the first motor passes through one end of the first guide rail to reach the other end, the first sliding member is sleeved on the first output shaft and is slidably connected to the first guide rail, and the first connecting member is fixedly arranged on the first sliding member; the lifting and moving component includes a second motor, a second guide rail and a second sliding member, the second guide rail is vertically fixedly arranged on a surface of the first connecting member close to the tin furnace, the second motor is arranged at one end of the second guide rail, and the second output shaft of the second motor passes through one end of the second guide rail to reach the other end, the second sliding member is sleeved on the second output shaft and is slidably connected to the second guide rail, the second sliding member is provided with a second connecting member, the second connecting member is fixedly connected to the second sliding member, and a solder frame is provided on a surface of the second connecting member close to the welding tin furnace groove, and the solder frame is fixedly connected to the second connecting member.

4. The dip soldering machine for manufacturing a single-wire NTC temperature sensor according to claim 1, characterized in that: The tin scraping mechanism includes a cylinder mounting plate, a first cylinder, a second cylinder and a tin scraping sheet. The first cylinder is vertically arranged and fixedly mounted on the cylinder mounting plate. A third connecting piece is provided on the first gas rod of the first cylinder. The two sides of the third connecting piece are respectively fixedly connected to the first gas rod and the second cylinder. The second gas rod of the second cylinder is provided with a fourth connecting piece. The fourth connecting piece is respectively fixedly connected to the second gas rod and the tin scraping sheet.

5. The dip soldering machine for manufacturing a single-wire NTC temperature sensor according to claim 1, characterized in that: The solder frame is provided with a tin surface detection device for detecting the depth of tin immersion.

6. A dip soldering machine for manufacturing a single-wire NTC temperature sensor according to claim 5, characterized in that: The tin surface detection device includes a probe mounting plate, a third cylinder and a probe. The probe mounting plate is fixedly mounted on the solder frame. A first through hole is provided on the probe mounting plate. The third cylinder is fixedly mounted on the probe mounting plate. The third gas rod of the third cylinder passes through the first through hole. The probe is fixedly connected to the third gas rod.

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