Micro differential pressure sensor

By designing a micro-pressure differential sensor in an aviation airborne sensor, using the combination of housing, pressure chip, adapter module and flexible circuit parts, the problems of dirt influence and poor sealing caused by complex cavity inside the sensor are solved, achieving higher reliability and measurement accuracy.

CN222652436UActive Publication Date: 2025-03-21HUISHI (SHANGHAI) MEASUREMENT & CONTROL TECH CO LTD
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Patent Information

Application Number
CN202420248999.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-02-01
Publication Date
2025-03-21
Estimated Expiration
2034-02-01

AI Technical Summary

Technical Problem

The internal cavity structure of existing aviation airborne differential pressure sensors is complex, which easily causes dirt to affect the chip, has poor sealing and low reliability.

Method used

A micro-pressure differential sensor is designed, including a housing, a pressure chip, an adapter module and a flexible circuit component. By setting the pressure chip on the substrate and connecting it with the flexible circuit component through the adapter module, it forms a wrapping form to protect the chip, ensure sealing and improve reliability.

Benefits of technology

It effectively reduces the impact of dirt on the pressure chip, improves the sealing and reliability of the sensor, and ensures measurement accuracy and long-term stability of the equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the technical field of sensors, and discloses a micro-differential pressure sensor, which comprises a shell, a first pressure pipe, a second pressure pipe, a first pressure sensor, a second pressure sensor and a second pressure sensor, and is characterized in that the shell is provided with an inner cavity, and the bottom of the shell is provided with a first pressure pipe; the pressure chip is connected with the shell through a substrate, and the pressure chip and the substrate are arranged in the inner cavity; the upper end of the switching module is provided with a second pressure pipe, the second pressure pipe is communicated with the inner cavity, and the switching module is buckled on the pressure chip; and the flexible circuit component is connected with the pressure chip and external equipment through the switching module. According to the micro differential pressure sensor, the pressure chip is arranged on the substrate, the switching module is arranged to buckle the pressure chip, the pressure chip is wrapped, the protection degree is high, the influence of dirt on the output of the pressure chip is reduced, the pressure chip and the substrate are arranged in the inner cavity, the sealing performance of the whole structure is ensured, and the reliability of the micro differential pressure sensor is improved.
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Description

Technical Field

[0001] The utility model belongs to the technical field of sensors and relates to a micro-pressure difference sensor. Background Art

[0002] Aircraft airborne sensors are high-precision, high-stability sensors that can measure medium pressure, such as fuel pressure, lubricating oil pressure and other indicators. As the system integration level becomes higher and higher, the system has higher requirements on the volume and weight of the sensor. The differential pressure sensor cavity in the prior art has a complex internal structure, which is easy to be contaminated and affect the chip, and has poor sealing and low reliability.

[0003] Based on this, the art urgently needs a micro-differential pressure sensor to solve the above technical problems. Utility Model Content

[0004] In view of this, the utility model provides a micro differential pressure sensor to solve the problems of the complex internal cavity of the sensor affecting the chip, poor sealing and low reliability.

[0005] In order to solve the above technical problems, the utility model provides a micro differential pressure sensor, comprising:

[0006] A shell having an inner cavity, a first pressure tube is disposed at the bottom of the shell, and the first pressure tube is connected to the inner cavity;

[0007] A pressure chip, wherein the pressure chip is connected to the housing via a substrate, and the pressure chip and the substrate are arranged inside the inner cavity;

[0008] A transfer module, wherein a second pressure tube is disposed at the upper end of the transfer module, the second pressure tube is connected to the inner cavity, and the transfer module is buckled on the pressure chip;

[0009] A flexible circuit component is used to connect the pressure chip with an external device through the adapter module.

[0010] As a further improvement of the present invention, the differential pressure sensor further includes a protective cover, the protective cover is bonded to the substrate, and the pressure chip is arranged between the protective cover and the substrate.

[0011] As a further improvement of the present invention, the differential pressure sensor also includes a cover body, which includes a first sleeve and a second sleeve arranged at the upper end of the first sleeve and coaxial with the first sleeve, the first sleeve and the second sleeve are connected to form a convex cavity, the outer wall of the first sleeve is bonded to the inner wall of the shell, and the end of the first sleeve abuts the adapter module.

[0012] As a further improvement of the present invention, a first glue-filling layer is provided between the cover body and the upper end surface of the adapter module.

[0013] As a further improvement of the present invention, a second glue-filling layer is provided between the outer wall of the adapter module and the inner wall of the shell.

[0014] As a further improvement of the utility model, a through hole is provided on the second sleeve, and the flexible circuit component passes through the through hole to connect the pressure chip with an external device. A pressure ring is sleeved on the flexible circuit component, and the pressure ring is arranged inside the convex cavity and abuts against the second sleeve.

[0015] As a further improvement of the present invention, the protective cover is provided with a first opening relative to the top surface of the pressure chip, and the substrate is provided with a second opening relative to the bottom surface of the pressure chip.

[0016] As a further improvement of the present utility model, a groove is provided around the connecting surface between the first pressure tube and the shell, and the groove is used for placing a sealing ring.

[0017] As a further improvement of the present invention, the outer wall of the first pressure tube is provided with external threads.

[0018] As a further improvement of the present invention, the shell and the cover are made of stainless steel, and the substrate is made of ceramic.

[0019] The technical effect of the present application is: compared with the prior art, the micro differential pressure sensor provided by the present invention forms a wrapping shape for the pressure chip by setting the pressure chip on the substrate and setting the adapter module to buckle the pressure chip, which has a high degree of protection and reduces the influence of dirt on the output of the pressure chip. The pressure chip and the substrate are arranged inside the inner cavity to ensure the sealing of the overall structure and improve the reliability of the micro differential pressure sensor. By setting a protective cover, the protection of the pressure chip is further strengthened to ensure the output accuracy of the pressure chip. By setting the first glue filling layer and the second glue filling layer, the sealing of the overall structure is further improved to ensure the reliability of the micro differential pressure sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only part of the embodiments of the utility model, rather than all the embodiments. For ordinary technicians in this field, without paying creative work, other drawings obtained based on these drawings all fall within the scope of protection of this application.

[0021] Figure 1 It is a stereogram of a micro differential pressure sensor provided by an embodiment of the utility model;

[0022] Figure 2 It is an exploded diagram of a micro differential pressure sensor provided by an embodiment of the utility model;

[0023] Figure 3 It is a cross-sectional view of a micro differential pressure sensor provided by an embodiment of the utility model;

[0024] Figure 4 is a three-dimensional diagram of a substrate provided by an embodiment of the utility model;

[0025] Figure 5 It is a three-dimensional diagram of a substrate and a protective cover provided by an embodiment of the utility model;

[0026] Figure 6 It is a stereoscopic diagram of a shell and a first pressure tube provided in an embodiment of the utility model.

[0027] Among them, 10 is a shell, 11 is an inner cavity, 12 is a first pressure tube, 121 is a groove, 122 is an external thread, 20 is a pressure chip, 21 is a substrate, 211 is a second opening, 22 is a protective cover, 221 is a first opening, 30 is a switching module, 31 is a second pressure tube, 40 is a flexible circuit component, 41 is a pressure ring, 50 is a cover body, 51 is a first sleeve, 52 is a second sleeve, 521 is a through hole, 61 is a first glue potting layer, and 62 is a second glue potting layer. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0029] In order to make the description of the disclosed content more detailed and complete, the following is an illustrative description of the implementation method and specific examples of the utility model; however, this is not the only form of implementing or using the specific examples of the utility model. The implementation method covers the features of multiple specific examples and the method steps and their sequence for constructing and operating these specific examples. However, other specific examples can also be used to achieve the same or equal functions and step sequences. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0030] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0031] It should be understood that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein.

[0032] In the description of the present invention, the terms "front", "rear", "top", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0033] Please refer to Figure 1-Figure 6 The utility model provides a micro-pressure difference sensor to solve the problems of the complex internal cavity of the sensor affecting the chip, poor sealing and low reliability.

[0034] For details, please refer to Figure 1 A three-dimensional diagram of a micro differential pressure sensor provided by an embodiment of the utility model, Figure 2 The present invention is an exploded diagram of a micro differential pressure sensor provided by an embodiment of the present invention. The present invention provides a micro differential pressure sensor, comprising: a housing 10, a pressure chip 20 connected to the housing 10 through a substrate 21, an adapter module 30 buckled on the pressure chip 20, and a flexible circuit component 40 connecting the pressure chip 20 and an external device through the adapter module 30. The present invention forms a wrapping shape for the pressure chip 20 by setting the pressure chip 20 on the substrate 21 and setting the adapter module 30 to buckle the pressure chip 20, thereby providing a high degree of protection and reducing the influence of dirt on the output of the pressure chip 20. The pressure chip 20 and the substrate 21 are arranged inside the inner cavity 11 to ensure the sealing of the overall structure and improve the reliability of the micro differential pressure sensor.

[0035] Specifically, the housing 10 has an inner cavity 11, and a first pressure tube 12 is provided at the bottom of the housing 10, and the first pressure tube 12 is connected to the inner cavity 11; the pressure chip 20 and the substrate 21 are arranged inside the inner cavity 11; the first pressure tube 12 is passed through the first pressure and input to the bottom surface of the pressure chip 20 in the inner cavity 11, and the upper end of the adapter module 30 is provided with a second pressure tube 31, and the second pressure tube 31 is connected to the inner cavity 11, and the second pressure tube 31 is passed through the second pressure and input to the top surface of the pressure chip 20 in the inner cavity 11, and the pressure chip 20 measures the pressure difference between the first pressure and the second pressure, and optionally, the first pressure is the medium pressure, and the second pressure is the atmospheric pressure. When in use, the second pressure tube 31 is bent twice according to the installation requirements, the pressure tube is passed through the atmosphere, and the first pressure tube 12 is passed through the medium pressure, forming a pressure difference structure, and after the pressure tube is bent, the volume is smaller, and it is more convenient and easy to install.

[0036] As a further improvement of the utility model, the differential pressure sensor further includes a protective cover 22, the protective cover 22 is bonded to the substrate 21, and the pressure chip 20 is disposed between the protective cover 22 and the substrate 21. By arranging that the protective cover 22 is bonded to the substrate 21, the pressure chip 20 is disposed between the protective cover 22 and the substrate 21, and the pressure chip 20 is wrapped, thereby further strengthening the protection of the pressure chip 20, reducing the influence of dirt on the chip output, and ensuring the output accuracy of the pressure chip 20.

[0037] As a further improvement of the utility model, the differential pressure sensor further includes a cover body 50, the cover body 50 includes a first sleeve 51 and a second sleeve 52 provided at the upper end of the first sleeve 51 and coaxial with the first sleeve 51, the first sleeve 51 and the second sleeve 52 are connected to form a convex cavity, the outer wall of the first sleeve 51 is bonded to the inner wall of the housing 10, and the end of the first sleeve 51 abuts the adapter module 30. Optionally, the outer wall of the first sleeve 51 is bonded to the inner wall of the housing 10, and the bonding can be performed by an adhesive process. By providing the cover body 50, the outer wall of the first sleeve 51 of the cover body 50 is bonded to the inner wall of the housing 10, and the end of the first sleeve 51 of the cover body 50 abuts the adapter module 30, so as to achieve a tight connection between the cover body 50 and the housing 10, and ensure good sealing performance of the sensor.

[0038] As a further improvement of the present invention, see Figure 3A first glue potting layer 61 is provided between the cover body 50 and the upper end surface of the adapter module 30. A second glue potting layer 62 is provided between the outer wall of the adapter module 30 and the inner wall of the housing 10. By providing the first glue potting layer 61 and the second glue potting layer 62, the sealing property of the overall structure is further improved, and the possibility of pressure communication between the top surface and the bottom surface of the pressure chip 20 is eliminated, the sealing property is good, and the reliability of the micro differential pressure sensor is ensured.

[0039] As a further improvement of the present invention, a through hole 521 is provided on the second sleeve 52, and the flexible circuit component 40 passes through the through hole 521 to connect the pressure chip 20 with an external device. A pressure ring 41 is sleeved on the flexible circuit component 40, and the pressure ring 41 is arranged inside the convex cavity and abuts the second sleeve 52. By sleeved the pressure ring 41 on the flexible circuit component 40, and the pressure ring 41 is arranged inside the convex cavity and abuts the second sleeve 52, the flexible circuit component 40 is fixed, ensuring that the flexible circuit component 40 can connect the pressure chip 20 with an external device along the through hole 521, avoiding the flexible circuit component 40 from being easily bent during use, affecting the service life of the micro differential pressure sensor, and improving the overall safety and reliability.

[0040] As a further improvement of the present invention, see Figure 4-5 The protective cover 22 is provided with a first opening 221 on the top surface of the pressure chip 20, and the substrate 21 is provided with a second opening 211 on the bottom surface of the pressure chip 20. By providing the first opening 221 on the protective cover 22 relative to the top surface of the pressure chip 20, and providing the second opening 211 on the substrate 21 relative to the bottom surface of the pressure chip 20, the contact position when the first pressure tube 12 is passed through the first pressure and inputted to the bottom surface of the pressure chip 20 in the inner cavity 11, and the contact position when the second pressure tube 31 is passed through the second pressure and inputted to the top surface of the pressure chip 20 in the inner cavity 11 are ensured, thereby improving the measurement accuracy of the pressure difference between the first pressure and the second pressure measured by the pressure chip 20.

[0041] As a further improvement of the present invention, see Figure 6 , the connection surface between the first pressure tube 12 and the shell 10 is provided with a groove 121, and the groove 121 is used to place a sealing ring. The outer wall of the first pressure tube 12 is provided with an external thread 122. By providing a groove 121 on the connection surface between the first pressure tube 12 and the shell 10, and placing a sealing ring in the groove 121, the tightness of the connection between the first pressure tube 12 and the shell 10 is further improved, and the sealing ring further seals to prevent air leakage, ensuring that the first pressure tube 12 is passed through the first pressure and input to the bottom surface of the pressure chip 20 in the inner cavity 11. No leakage will occur, thereby improving the reliability of the micro-differential pressure sensor.

[0042] As a further improvement of the present invention, the material of the housing 10 and the cover 50 is stainless steel, and the material of the substrate 21 is ceramic. By setting the material of the housing 10 and the cover 50 to be stainless steel, the structural strength of the micro differential pressure sensor is improved, and the corrosion resistance of the micro differential pressure sensor is ensured. By setting the material of the substrate 21 to be ceramic, the influence on the chip output can be reduced, and the reliability of the micro differential pressure sensor is improved.

[0043] Furthermore, the volume of the micro differential pressure sensor is no greater than 14.5 mm in diameter×21 mm in length, and the weight is no greater than 25 g, making the micro differential pressure sensor more lightweight and miniaturized.

[0044] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0045] The above embodiments only express the preferred implementation of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A micro differential pressure sensor, characterized in that: include: A shell having an inner cavity, a first pressure tube is disposed at the bottom of the shell, and the first pressure tube is connected to the inner cavity; A pressure chip, wherein the pressure chip is connected to the housing via a substrate, and the pressure chip and the substrate are arranged inside the inner cavity; A transfer module, wherein a second pressure tube is disposed at the upper end of the transfer module, the second pressure tube is connected to the inner cavity, and the transfer module is buckled on the pressure chip; A flexible circuit component is used to connect the pressure chip with an external device through the adapter module.

2. A micro differential pressure sensor according to claim 1, characterized in that: The differential pressure sensor further includes a protective cover, which is bonded to the substrate, and the pressure chip is arranged between the protective cover and the substrate.

3. A micro differential pressure sensor according to claim 1, characterized in that: The differential pressure sensor also includes a cover body, which includes a first sleeve and a second sleeve arranged at the upper end of the first sleeve and coaxial with the first sleeve, the first sleeve and the second sleeve are connected to form a convex cavity, the outer wall of the first sleeve is bonded to the inner wall of the shell, and the end of the first sleeve abuts the adapter module.

4. A micro differential pressure sensor according to claim 3, characterized in that: A first glue potting layer is provided between the cover body and the upper end surface of the adapter module.

5. A micro differential pressure sensor according to claim 1, characterized in that: A second glue potting layer is provided between the outer wall of the adapter module and the inner wall of the shell.

6. A micro differential pressure sensor according to claim 3, characterized in that: The second sleeve is provided with a through hole, and the flexible circuit component passes through the through hole to connect the pressure chip with an external device. The flexible circuit component is sleeved with a pressure ring, which is arranged inside the convex cavity and abuts against the second sleeve.

7. A micro differential pressure sensor according to claim 2, characterized in that: The protective cover is provided with a first opening relative to the top surface of the pressure chip, and the base plate is provided with a second opening relative to the bottom surface of the pressure chip.

8. The micro differential pressure sensor according to claim 1, characterized in that: A groove is arranged on the connecting surface between the first pressure tube and the shell, and the groove is used for placing a sealing ring.

9. A micro differential pressure sensor according to claim 8, characterized in that: The outer wall of the first pressure pipe is provided with external threads.

10. A micro differential pressure sensor according to claim 3, characterized in that: The shell and the cover are made of stainless steel, and the substrate is made of ceramic.