Surface-mounted common mode inductor shell and surface-mounted common mode inductor

Abstract

The utility model provides a surface-mounted common-mode inductor shell and a surface-mounted common-mode inductor, the surface-mounted common-mode inductor shell comprises a groove body and surface-mounted pins, the groove body comprises a frame and a bottom wall, the frame surrounds the bottom wall, the surface-mounted pins are arranged on the outer wall surface of the frame, in the height direction of the frame, the bottom surfaces of the surface-mounted pins are lower than the bottom surface of the bottom wall, and the bottom surface of the surface-mounted pins is lower than the bottom surface of the bottom wall. Or the bottom surfaces of the patch pins are flush with the bottom surface of the bottom wall; the chip pins can serve as bonding pads, in the tin soldering process of workers, gaps exist between the bottom wall and the electric device to be welded, welding rods can extend to the positions of the four chip pins through the bottom wall and the electric device to be welded, accurate alignment is not needed, the operable space is large, the welding face is large, welding is firmer, the production efficiency of the inductor is effectively improved, and the manufacturing cost of the inductor is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of inductors, and in particular to a chip-type common-mode inductor housing and a chip-type common-mode inductor. Background Art

[0002] Inductors are commonly used electronic components in the electrical field. They are used to suppress common-mode signals and improve the electrical characteristics of circuits.

[0003] The existing common-mode inductor includes a magnetic core, a coil and a bracket. The bottom of the magnetic core is installed on the bracket, the bracket is fixed on the circuit board, and the two ends of the coil are connected to the circuit board through pins fixed on the bracket. The existing common-mode inductor is connected to the circuit by plug-in. This connection method requires the accuracy of the inductor and circuit board processing, which leads to an increase in the production cost of the inductor and the circuit board. Utility Model Content

[0004] In view of the deficiencies in the prior art, the present application provides a chip common-mode inductor housing and a chip common-mode inductor.

[0005] According to one aspect of the utility model, a chip common-mode inductor housing disclosed in the present application includes: a slot body and a chip pin, the slot body includes a frame and a bottom wall, the frame is surrounded by the bottom wall, the chip pin is arranged on the outer wall surface of the frame, and in the height direction of the frame, the bottom surface of the chip pin is lower than the bottom surface of the bottom wall, or the bottom surface of the chip pin is flush with the bottom surface of the bottom wall.

[0006] Preferably, in the frame height direction, the distance between the bottom surface of the SMD pin and the bottom surface of the bottom wall is at least 0.2 mm.

[0007] Preferably, the frame includes a first side wall, a second side wall, a third side wall and a fourth side wall connected in sequence, the first side wall is also connected to the fourth side wall, and the first side wall and the third side wall are arranged opposite and parallel to each other; there are four patch pins, two of which are arranged at intervals on the first side wall, and the other two patch pins are arranged at intervals on the third side wall.

[0008] Preferably, the patch pin includes a winding post and a limiting block, one end of the winding post is vertically connected to the outer wall surface of the frame, and the limiting block is located at the other end of the winding post and connected to the winding post.

[0009] Preferably, the cross-sections of the winding column and the limiting block are both square, and in the height direction of the frame, the bottom surface of the winding column is flush with the bottom surface of the limiting block.

[0010] Preferably, the frame is provided with at least four wire harness grooves, wherein at least two of the wire harness grooves are located on the outer wall surface of the first side wall, and at least two of the wire harness grooves are located on the outer wall surface of the third side wall, and the wire harness grooves are arranged along the height direction of the frame.

[0011] Preferably, in the frame height direction, the distance between the bottom surface of the SMD pin and the bottom surface of the bottom wall is 0.3 mm.

[0012] According to another aspect of the utility model, the present application also provides a chip common-mode inductor, which includes a chip common-mode inductor housing.

[0013] The beneficial effects of the present application are as follows: the chip pins can be used as soldering pads. During the soldering process, there is a gap between the bottom wall and the electrical component to be welded, and the welding rod can be extended to the four chip pins through the bottom wall and the electrical component to be welded. There is no need for precise alignment, the operating space is large, the welding surface is large, the welding is more firm, and the production efficiency of the inductor is effectively improved and the manufacturing cost of the inductor is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0015] Figure 1 It is a three-dimensional diagram of the shell of the chip common mode inductor in the embodiment;

[0016] Figure 2 A schematic diagram of the bottom structure of the bottom wall of the housing of the SMD common mode inductor in the embodiment;

[0017] Figure 3 It is a bottom view of the housing of the chip common mode inductor in the embodiment;

[0018] Figure 4 This is a schematic diagram of the structure of a chip common-mode inductor in Embodiment 2;

[0019] Figure 5 This is a schematic diagram of the structure of the chip common-mode inductor in Example 3.

[0020] Reference numerals:

[0021] 1- slot body; 2- SMD pin;

[0022] 11-frame; 12-bottom wall;

[0023] 21-winding column; 22-limiting block;

[0024] 111 - first side wall; 112 - second side wall; 113 - third side wall; 114 - fourth side wall; 115 - cable trough. DETAILED DESCRIPTION

[0025] The following will disclose multiple embodiments of the present application with drawings. For the purpose of clear description, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present application. In other words, in some embodiments of the present application, these practical details are not necessary. In addition, in order to simplify the drawings, some conventional structures and components will be depicted in a simple schematic manner in the drawings.

[0026] It should be noted that all directional indications such as up, down, left, right, front, back... in the embodiments of the present application are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture as shown in the accompanying drawings. If the specific posture changes, the directional indication will also change accordingly.

[0027] In addition, in the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes, and do not specifically refer to the order or sequence, nor are they used to limit the present application. They are only used to distinguish components or operations described with the same technical terms, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present application.

[0028] In order to further understand the application content, features and effects of the present application, the following embodiments are cited and described in detail with reference to the accompanying drawings.

[0029] Embodiment 1

[0030] See also Figures 1 to 4 The shell of the chip common mode inductor in this example includes a slot body 1 and a chip pin 2. The slot body 1 is used to load the magnetic core wound with the coil, and the chip pin 2 is used for winding.

[0031] Among them, the slot body 1 includes a frame 11 and a bottom wall 12, the frame 11 is surrounded by the bottom wall 12, and the patch pin 2 is arranged on the outer wall surface of the frame 11. In the height direction of the frame 11, the bottom surface of the patch pin 2 is lower than the bottom surface of the bottom wall 12, or the bottom surface of the patch pin 2 is flush with the bottom surface of the bottom wall 12.

[0032] In this way, the chip pins 2 can be used as soldering pads. During the soldering process, there is a gap between the bottom wall 12 and the electrical component to be welded. The welding rod can be extended to the four chip pins 2 through the bottom wall 12 and the electrical component to be welded. No precise alignment is required, the operating space is large, the welding surface is large, the welding is more firm, and the production efficiency of the inductor is effectively improved and the manufacturing cost of the inductor is reduced.

[0033] Furthermore, in the height direction of the frame 11, the distance between the bottom surface of the SMD pin 2 and the bottom surface of the bottom wall 12 is at least 0.2 mm. Specifically, the distance between the bottom surface of the SMD pin 2 and the bottom surface of the bottom wall 12 can be 0.2 mm to 0.5 mm.

[0034] In this way, after the coil is wound around the SMD pin 2, the coil can be ensured to be lower than the bottom surface of the bottom wall 12, which is convenient for welding.

[0035] Furthermore, the distance between the bottom surface of the SMD pin 2 and the bottom surface of the bottom wall 12 is 0.3 mm.

[0036] In this way, the position of the SMD pin 2 below the bottom wall 12 is optimal.

[0037] Furthermore, the frame 11 includes a first side wall 111, a second side wall 112, a third side wall 113 and a fourth side wall 114 connected in sequence, the first side wall 111 is also connected to the fourth side wall 114, and the first side wall 111 and the third side wall 113 are arranged opposite to and in parallel; there are four SMD pins 2, two of which are arranged at intervals on the first side wall 111, and the other two SMD pins 2 are arranged at intervals on the third side wall 113.

[0038] In this way, by providing a square housing, the window utilization rate of the inductor in the electrical appliance can be improved. At the same time, the SMD pins 2 can be provided on the opposite first side wall 111 and third side wall 113 to facilitate coil winding.

[0039] Furthermore, the patch pin 2 includes a winding post 21 and a limit block 22 . One end of the winding post 21 is vertically connected to the outer wall surface of the frame 11 . The limit block 22 is located at the other end of the winding post 21 and connected to the winding post 21 .

[0040] In this way, the coil can be wound around the winding post 21 of the patch pin 2 , and the limiting block 22 limits the position of the coil wound around the winding post 21 to prevent the coil from falling off the winding post 21 .

[0041] Furthermore, the winding post 21 and the limiting block 22 are both square in cross section, and in the height direction of the frame 11 , the bottom surface of the winding post 21 is flush with the bottom surface of the limiting block 22 .

[0042] In this way, the welding operation space is large and the welding is more solid.

[0043] Furthermore, the frame 11 is provided with at least four cable ducts 115 , wherein at least two cable ducts 115 are located on the outer wall surface of the first side wall 111 , at least two cable ducts 115 are located on the outer wall surface of the third side wall 113 , and the cable ducts 115 are arranged along the height direction of the frame 11 .

[0044] In this way, after the two ends of the coil extend out from the opening of the slot body 1, the wire harness slot 115 can play the role of harnessing the wires, thereby optimizing the structure of the shell of the SMD common mode inductor.

[0045] Embodiment 2

[0046] The chip common mode inductor in this example includes a chip common mode inductor housing.

[0047] Embodiment 3

[0048] The chip common mode inductor in this example includes a chip common mode inductor housing, and the slot body 1 is a semi-enclosed structure.

[0049] In summary, the chip pins 2 can be used as soldering pads. During the soldering process, there is a gap between the bottom wall 12 and the electrical component to be welded. The welding rod can be extended to the four chip pins 2 through the bottom wall 12 and the electrical component to be welded. No precise alignment is required. The operating space is large, the welding surface is large, and the welding is more firm, which effectively improves the production efficiency of the inductor and reduces the manufacturing cost of the inductor.

[0050] The above is only the implementation mode of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A chip common mode inductor housing, characterized in that: include: A slot body (1) and a patch pin (2), wherein the slot body (1) comprises a frame (11) and a bottom wall (12), wherein the frame (11) is arranged around the bottom wall (12), and the patch pin (2) is arranged on the outer wall surface of the frame (11), and in the height direction of the frame (11), the bottom surface of the patch pin (2) is lower than the bottom surface of the bottom wall (12), or the bottom surface of the patch pin (2) is flush with the bottom surface of the bottom wall (12).

2. The chip common mode inductor housing according to claim 1, characterized in that: In the height direction of the frame (11), the distance between the bottom surface of the patch pin (2) and the bottom surface of the bottom wall (12) is at least 0.2 millimeters.

3. The chip common mode inductor housing according to claim 1, characterized in that: The frame (11) comprises a first side wall (111), a second side wall (112), a third side wall (113) and a fourth side wall (114) which are connected in sequence, the first side wall (111) is also connected to the fourth side wall (114), and the first side wall (111) and the third side wall (113) are arranged opposite to and in parallel; there are four SMD pins (2), two of which are arranged at intervals on the first side wall (111), and the other two of which are arranged at intervals on the third side wall (113).

4. The chip common mode inductor housing according to claim 1, characterized in that: The patch pin (2) comprises a winding post (21) and a stop block (22); one end of the winding post (21) is vertically connected to the outer wall surface of the frame (11); the stop block (22) is located at the other end of the winding post (21) and is connected to the winding post (21).

5. The chip common mode inductor housing according to claim 4, characterized in that: The winding column (21) and the limiting block (22) are both square in cross section, and in the height direction of the frame (11), the bottom surface of the winding column (21) is flush with the bottom surface of the limiting block (22).

6. The chip common mode inductor housing according to claim 3, characterized in that: The frame (11) is provided with at least four cable slits (115), wherein at least two of the cable slits (115) are located on the outer wall surface of the first side wall (111), and at least two of the cable slits (115) are located on the outer wall surface of the third side wall (113), and the cable slits (115) are arranged along the height direction of the frame (11).

7. The chip common mode inductor housing according to claim 2, characterized in that: In the height direction of the frame (11), the distance between the bottom surface of the patch pin (2) and the bottom surface of the bottom wall (12) is 0.3 millimeters.

8. A chip common mode inductor, characterized in that: The invention comprises the chip-type common-mode inductor housing as described in any one of claims 1-7.

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