Clamp for vacuum welding of semiconductor gas distribution disc
By using a pressure plate assembly composed of multiple pressure blocks and an independent pressure application method, the problem of uneven force in vacuum brazing is solved, ensuring welding quality and efficiency. This method is suitable for vacuum welding of semiconductor gas distribution disks.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-07
- Publication Date
- 2026-03-24
AI Technical Summary
Traditional vacuum brazing fixtures cause uneven stress on the product during the welding process, which can easily lead to localized welding defects. Furthermore, material deformation at high temperatures results in poor flatness and parallelism, affecting product quality and welding efficiency.
The pressure plate assembly, composed of multiple lower pressure blocks, ensures uniform force on each area of the workpiece to be welded by applying pressure independently, increasing the welding contact area, maintaining structural strength and oxidation resistance at high temperatures, and avoiding deformation. Pressure is applied using air pressure or hydraulic press, combined with a protective layer to prevent adhesion.
It achieves uniform stress on the workpiece to be welded, reduces the risk of welding defects, and improves welding efficiency and product quality. It is especially suitable for vacuum brazing of aluminum 6061 double-layer gas distribution discs.
Smart Images
Figure CN224026675U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor device fabrication technology, and relates to a fixture for vacuum welding of semiconductor gas distribution disks. Background Technology
[0002] Traditional vacuum brazing fixtures cannot ensure uniform stress distribution across all parts of a product, easily leading to welding defects in localized areas due to lack of stress during welding, thus rendering the product unusable. Applying excessive force to increase the contact area by causing plastic deformation of the weld surface increases the weight of the fixture, making it too heavy. This increases the energy required for material heating, significantly reducing the welding heating rate and slowing down the cooling process. A large temperature difference between the inside and outside of the product negatively impacts product quality.
[0003] Furthermore, because the welding temperature is close to the solidus temperature of the base material, the base material tends to soften during welding, leading to a decrease in material properties and strength. Existing fixtures apply force through plane-to-plane contact, which, influenced by the flatness and surface roughness of the product and fixture, can easily result in large areas of non-contact. Therefore, the requirements for both the product and the fixture are extremely high. Moreover, material deformation at high temperatures can easily cause partial detachment between the fixture and the product surface, making it impossible to ensure that each product can bear force during welding. This, in turn, compromises the flatness and weld bonding rate after vacuum brazing, significantly increasing processing difficulty and scrap rate.
[0004] Therefore, improving the uniformity of stress distribution during the welding process is crucial for the quality of the finished product and the weld pass rate. Utility Model Content
[0005] To address the shortcomings of existing technologies, the purpose of this utility model is to provide a fixture for vacuum welding of semiconductor gas distribution disks, which solves the problem of uneven pressure during vacuum brazing, avoids product deformation during vacuum brazing of semiconductor gas distribution disks, and reduces the impact of thermal deformation of materials under high brazing temperatures, thus ensuring the flatness and parallelism of the product itself.
[0006] To achieve this objective, the present invention adopts the following technical solution:
[0007] This utility model provides a fixture for vacuum welding of semiconductor gas distribution disks. The fixture includes a pressure application device and a clamping fixture. The clamping fixture includes a pressure plate assembly and a support pad. The support pad is used to support the workpiece to be welded. The pressure plate assembly is used to press the workpiece to be welded. The pressure plate assembly is composed of a plurality of lower pressure blocks arranged in parallel. The pressure application device is used to apply pressure to the plurality of lower pressure blocks respectively.
[0008] This utility model's medium pressure plate assembly consists of multiple lower pressure blocks, each of which independently provides pressure to achieve zoned pressurization. This ensures that each area of the workpiece to be welded is uniformly stressed, increases the welding contact area, and prevents the workpiece from shifting during vacuum brazing, thus avoiding the problem of welding position deviation. It also avoids the problem of workpiece deformation caused by localized high welding temperatures, which leads to a decrease in its flatness and parallelism. In addition, it can reduce the weight of the tooling, which is conducive to improving the heating rate and welding efficiency, thereby ensuring the welding bonding rate of the product.
[0009] The fixture provided by this utility model is versatile and applicable to semiconductor gas distribution disks with different structures, especially suitable for the vacuum brazing process of aluminum 6061 double-layer gas distribution disks.
[0010] As a preferred technical solution of this utility model, the projected areas of the plurality of pressing blocks on the plane where the support pad is located are the same.
[0011] As a preferred embodiment of the present invention, the clamping fixture further includes at least two limiting clamps that are movably connected to the supporting pad, and the limiting clamps are used to fix the workpiece to be welded.
[0012] In the application of this invention, the workpiece to be welded is first placed on the surface of the support pad, and then the workpiece is fixed to the support pad using a limiting clamp. After vacuum welding is completed, the limiting clamp is removed, and the workpiece is taken out. This invention does not specifically limit the structure of the limiting clamp; any limiting clamp commonly used in the field can be used. For example, the limiting clamp can be "C"-shaped or "V"-shaped and is movably connected to the support pad by bolts.
[0013] As a preferred technical solution of this utility model, the thickness of the pressing block is 18-28mm, for example, it can be 18mm, 19mm, 20mm, 21mm, 22mm, 23mm, 24mm, 25mm, 26mm, 27mm or 28mm, but it is not limited to the listed values. Other unlisted values within this range are also applicable.
[0014] The length of the pressing block is 40-60mm, for example, it can be 40mm, 42mm, 45mm, 48mm, 50mm, 52mm, 53mm, 55mm, 56mm, 58mm or 60mm, but it is not limited to the listed values. Other unlisted values within this range are also applicable.
[0015] As a preferred technical solution of this utility model, the thickness of the support pad is 15-25mm, for example, it can be 15mm, 16mm, 17mm, 18mm, 19mm, 20mm, 21mm, 22mm, 23mm, 24mm or 25mm, but it is not limited to the listed values. Other unlisted values within this range are also applicable.
[0016] The length of the support pad is 340 to 380 mm, for example, it can be 340 mm, 345 mm, 350 mm, 355 mm, 360 mm, 365 mm, 370 mm, 375 mm or 380 mm, but it is not limited to the listed values. Other unlisted values within this range are also applicable.
[0017] As a preferred embodiment of this utility model, the pressing block is a metal plate with a rectangular cross-section.
[0018] As a preferred technical solution of this utility model, the supporting pad is a rectangular steel, I-beam or channel steel.
[0019] The pressure plate assembly and support pad structure of this utility model have high strength, are not easily deformed, and are resistant to high temperature and oxidation, thus avoiding the problem of deformation under high temperature brazing conditions.
[0020] As a preferred embodiment of this utility model, the outer surfaces of the pressure plate assembly and the support pad are independently provided with protective layers.
[0021] The protective layer provided by this invention has high temperature resistance and oxidation resistance, which can prevent the fixture from sticking to the workpiece after brazing.
[0022] As a preferred embodiment of this utility model, the pressure application device is a pneumatic compressor or a hydraulic compressor.
[0023] As a preferred embodiment of this utility model, a pressure sensing component is independently provided on several of the pressing blocks.
[0024] In application, this invention can independently detect the pressure applied by each pressing block, ensuring that every part of the surface of the workpiece to be welded is subjected to uniform pressure, thus avoiding welding defects.
[0025] The numerical range described in this utility model includes not only the point values listed above, but also any point values within the numerical range not listed above. Due to space limitations and for the sake of brevity, this utility model will not exhaustively list the specific point values included in the range.
[0026] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0027] This utility model provides a vacuum welding fixture for a semiconductor gas distribution plate. By optimizing the pressure plate structure and improving the way welding pressure is applied, the entire pressure plate assembly is divided into multiple lower pressure blocks for zoned pressure application, thereby increasing the welding pressure application area, greatly alleviating the problem of uneven stress on the workpiece, and significantly reducing the risk of welding defects. Attached Figure Description
[0028] Figure 1 This is a schematic diagram of the structure of the vacuum welding fixture for the semiconductor gas distribution disk provided in Embodiment 1 of this utility model.
[0029] Figure 2 for Figure 1 A magnified view of a portion of point A in the middle.
[0030] Figure 3 This is a schematic diagram of the limiting clamp provided in Embodiment 3 of this utility model.
[0031] Figure 4 This is a schematic diagram of the mechanism of the vacuum welding fixture for the semiconductor gas distribution disk provided in Comparative Example 1 of this utility model.
[0032] Figure 5 for Figure 4 A magnified view of a section at point B in the middle.
[0033] Among them, 1-pressure plate assembly; 2-support pad; 3-workpiece to be welded; 4-lower pressure block; 5-limiting clamp. Detailed Implementation
[0034] It should be understood that in the description of this utility model, the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.
[0035] It should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "set," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0036] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.
[0037] In one specific embodiment, the present invention provides a fixture for vacuum welding of a semiconductor gas distribution disk, including a pressure application device and a clamping fixture. The clamping fixture includes a pressure plate assembly and a support pad. The support pad is used to support the workpiece to be welded, and the pressure plate assembly is used to press the workpiece to be welded. The pressure plate assembly is composed of a plurality of lower pressure blocks arranged in parallel, and the pressure application device is used to apply pressure to the plurality of lower pressure blocks respectively.
[0038] In some embodiments, the projected areas of the plurality of pressure blocks on the plane of the support pad are the same. The pressure plate assembly consists of a plurality of pressure blocks of the same size, and pressure is applied to each pressure block to ensure uniform pressure on the surface of the workpiece to be welded.
[0039] In some embodiments, the clamping fixture further includes at least two limiting clamps movably connected to the support pad, the limiting clamps being used to secure the workpiece to be welded. During application, the workpiece to be welded is first placed on the surface of the support pad, then the limiting clamps are used to secure the workpiece to the support pad. After vacuum welding is completed, the limiting clamps are removed, and the workpiece is taken out. Specifically, the limiting clamps can be C-shaped or V-shaped and are movably connected to the support pad by bolts.
[0040] Specifically, the thickness of the lower pressure block is 18-28mm, and the length of the lower pressure block is 40-60mm. The thickness of the support pad is 15-25mm, and the length of the support pad is 340-380mm. The pressure plate assembly of this invention provides uniform pressure and is lightweight, which greatly reduces the problem of poor welding.
[0041] In some embodiments, the lower pressure block is a metal plate with a rectangular cross-section. The support pad is a rectangular steel, I-beam, or channel steel. The pressure plate assembly and support pad structure of this utility model have high strength, are not easily deformed, and are resistant to high temperatures and oxidation, avoiding deformation problems under high-temperature brazing conditions. At the same time, it ensures the parallelism of the workpiece and improves product quality.
[0042] In some embodiments, the outer surfaces of the pressure plate assembly and the support pad are independently provided with protective layers. The protective layers in this invention can be made of materials commonly used by those skilled in the art, possessing high-temperature resistance and oxidation resistance, to avoid the problem of the fixture and workpiece sticking together after brazing. For example, an Al2O3 layer can be sprayed onto the outer surfaces of the pressure plate assembly and the support pad as a protective layer, ensuring no deformation even at 1000℃, which helps improve the flatness of the workpiece. Furthermore, to further prevent the fixture and workpiece from sticking together during brazing, the fixture needs to be pre-cleaned, for example, by sandblasting, hot washing, and degreasing, and then completely dried before clamping the workpiece to be welded.
[0043] In some embodiments, the pressure-applying device is a pneumatic compressor or a hydraulic compressor.
[0044] In some embodiments, several of the pressing blocks are independently equipped with pressure sensing components. During application, the pressure applied by each pressing block can be detected independently to ensure that every part of the surface of the workpiece to be welded is subjected to uniform pressure and to avoid welding defects.
[0045] Example 1
[0046] This embodiment provides a fixture for vacuum welding of a semiconductor gas distribution disk, including a pressure application device and a clamping fixture. For example... Figure 1 and Figure 2 As shown, the clamping fixture includes a pressure plate assembly 1 and a support pad 2. The support pad 2 supports the workpiece 3 to be welded, and the pressure plate assembly 1 clamps the workpiece 3. The pressure plate assembly 1 consists of multiple lower pressure blocks 4 arranged side by side, each with identical dimensions: a thickness of 22mm and a length of 50mm. These lower pressure blocks 4 are arranged sequentially to form a pressure plate assembly 1 with a length of 310mm. The lower pressure blocks 4 are rectangular steel plates, and the support pad 2 is made of rectangular steel with a thickness of 20mm and a length of 360mm. Each lower pressure block 4 and the support pad 2 has an independent protective layer on its outer surface to prevent adhesion to the workpiece after welding. A pneumatic compressor is used to apply pressure evenly to the multiple lower pressure blocks 4.
[0047] The process of vacuum brazing an aluminum 6061 double-layer gas distribution plate using the fixture provided in this embodiment includes: placing the double-layer gas distribution plate to be welded on the support pad 2, and arranging multiple pressure blocks 4 in parallel above the gas distribution plate to complete the assembly; applying pressure to each pressure block 4 using a pressure device to clamp and fix the gas distribution plate; placing the solder in the welding position within the fixture to assemble the brazed part; placing the assembled brazed part into a vacuum brazing furnace to perform vacuum brazing; after the vacuum brazing is completed, opening the furnace, removing the brazed part, and unloading the clamping fixture to obtain the welded product.
[0048] Example 2
[0049] This embodiment provides a fixture for vacuum welding of semiconductor gas distribution disks. The difference from Embodiment 1 is that each pressure block 4 is independently equipped with a pressure sensing component to independently detect the pressure applied by each pressure block 4, ensuring that every part of the surface of the workpiece 3 to be welded is subjected to uniform pressure. The rest of the structure is the same as that of Embodiment 1.
[0050] The process of vacuum brazing an aluminum 6061 double-layer gas distribution plate using the fixture provided in this embodiment includes: placing the double-layer gas distribution plate to be welded on the support pad 2, and arranging multiple pressure blocks 4 in parallel above the gas distribution plate to complete the assembly; applying pressure to each pressure block 4 using a pressure device to clamp and fix the gas distribution plate, and using a pressure sensing component to obtain the pressure of the pressure block 4 to ensure uniform force on the surface of the gas distribution plate; placing the solder in the welding position within the fixture to assemble a brazed part; placing the assembled brazed part into a vacuum brazing furnace to perform vacuum brazing; after vacuum brazing is completed, opening the furnace, removing the brazed part, and unloading the clamping fixture to obtain the welded product.
[0051] Example 3
[0052] This embodiment provides a fixture for vacuum welding of a semiconductor gas distribution disk, which differs from Embodiment 1 in that: Figure 3 As shown, the clamping fixture also includes two symmetrically arranged "C"-shaped limit clamps 5, which are independently connected to the support pad 2 by bolts to fix the workpiece 3 to be welded on the support pad 2. The rest of the structure is the same as in Embodiment 1.
[0053] The process of vacuum brazing an aluminum 6061 double-layer gas distribution plate using the fixture provided in this embodiment includes: placing the double-layer gas distribution plate to be welded on the support pad 2, and fixing both sides of the gas distribution plate to the support pad 2 using the limiting clamp 5; then arranging multiple pressure blocks 4 in parallel above the gas distribution plate to complete the assembly; applying pressure to each pressure block 4 using a pressure device to clamp and fix the gas distribution plate; placing the solder in the welding position within the fixture to assemble the brazed part; placing the assembled brazed part into a vacuum brazing furnace to perform vacuum brazing; after vacuum brazing is completed, opening the furnace, removing the brazed part, and unloading the clamping fixture to obtain the welded product.
[0054] Comparative Example 1
[0055] This comparative example provides a fixture for vacuum welding of a semiconductor gas distribution disk, which differs from Example 1 in that: Figure 4 and Figure 5As shown, the pressure plate assembly 1 is an integral structure, made of a steel plate with a thickness of 30mm and a length of 310mm. The pressure device is used to apply pressure to the pressure plate assembly 1. The rest of the structure is the same as in Example 1.
[0056] The vacuum brazing process for a double-layer gas distribution plate of aluminum 6061 in this comparative example includes: placing the double-layer gas distribution plate to be welded on the support pad 2, and placing the integrated pressure plate assembly 1 above the gas distribution plate to complete the assembly; applying pressure to the pressure plate assembly 1 using a pressure device to clamp and fix the gas distribution plate; placing the solder in the welding position within the fixture to assemble the brazed part; placing the assembled brazed part into the vacuum brazing furnace to perform the vacuum brazing operation; after the vacuum brazing is completed, opening the furnace, removing the brazed part, and unloading the clamping fixture to obtain the welded product.
[0057] In Comparative Example 1, the contact area between the fixture and the workpiece is small, and the fixture is heavy. Pressure is only applied to the contact surface, leaving most of the welding surface unaffected by pressure. This results in large welding gaps, preventing the solder from filling these gaps and easily leading to poor welding. In contrast, Example 1 divides the entire pressure plate assembly 1 into multiple small lower pressure blocks 4 for zoned pressure application, increasing the area of welding pressure application and significantly reducing uneven stress on the product, effectively preventing welding defects.
[0058] The applicant declares that the above description is only a specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present utility model fall within the protection and disclosure scope of the present utility model.
Claims
1. A fixture for vacuum welding of semiconductor gas distribution disks, characterized in that, The aforementioned semiconductor gas distribution disk vacuum welding fixture includes a pressure application device and a clamping fixture. The clamping fixture includes a pressure plate assembly and a support pad. The support pad is used to support the workpiece to be welded. The pressure plate assembly is used to press the workpiece to be welded. The pressure plate assembly is composed of a plurality of lower pressure blocks arranged in parallel. The pressure application device is used to apply pressure to the plurality of lower pressure blocks respectively.
2. The fixture for vacuum welding of semiconductor gas distribution disks according to claim 1, characterized in that, The projected areas of the several pressure blocks on the plane of the support pad are the same.
3. The fixture for vacuum welding of semiconductor gas distribution disks according to claim 1, characterized in that, The clamping fixture also includes at least two limiting clamps that are movably connected to the support pad, the limiting clamps being used to fix the workpiece to be welded.
4. The fixture for vacuum welding of semiconductor gas distribution disks according to claim 1, characterized in that, The thickness of the pressing block is 18-28 mm; The length of the pressing block is 40-60mm.
5. The fixture for vacuum welding of semiconductor gas distribution disks according to claim 1, characterized in that, The thickness of the support pad is 15-25 mm; The length of the support pad is 340–380 mm.
6. The fixture for vacuum welding of semiconductor gas distribution disks according to claim 1, characterized in that, The pressing block is a metal plate with a rectangular cross-section.
7. The fixture for vacuum welding of semiconductor gas distribution disks according to claim 1, characterized in that, The support pad is made of rectangular steel, I-beam steel, or channel steel.
8. The fixture for vacuum welding of semiconductor gas distribution disks according to claim 1, characterized in that, The outer surface of the pressure plate assembly and the support pad are independently provided with a protective layer.
9. The fixture for vacuum welding of semiconductor gas distribution disks according to claim 1, characterized in that, The pressure-applying device is a pneumatic compressor or a hydraulic compressor.
10. The fixture for vacuum welding of semiconductor gas distribution disks according to claim 1, characterized in that, Each of the aforementioned pressure blocks is independently equipped with a pressure sensing component.