BGA welding powder manufacturing device

Abstract

The utility model discloses a BGA welding powder manufacturing device, and belongs to the technical field of BGA welding. The device comprises a feeding container, a raw material temporary storage container, a dropping pipette, a forming tank body, a motor and a spiral blade, the raw material temporary storage container is arranged on the top face of the forming tank body, the feeding container is communicated with the raw material temporary storage container, the motor is arranged on the top face of the raw material temporary storage container, and the spiral blade is located in the raw material temporary storage container and fixedly connected with the output end of the motor through a shaft. A feeding hole is formed in the top surface of the forming tank body, a dropping pipette is arranged at the feeding hole, a bottom panel of the raw material temporary storage container is rotationally connected with the side wall of the raw material temporary storage container and fixedly connected with the shaft, a through hole is formed in the bottom panel, the feeding hole in the top surface of the forming tank body is located on a circumferential path formed by movement of the through hole, and a liquid outlet is formed in the bottom of the forming tank body. According to the utility model, on the basis of higher automation, the manufactured BGA welding powder is kept to have a more regular spherical structure, the production efficiency is improved, and the manufactured BGA welding powder is kept to have better use performance.

Description

TECHNICAL FIELD

[0001] The utility model belongs to BGA welding technical field relates to a kind of BGA welding powder production device. BACKGROUND

[0002] Ball Grid Array (BGA) packaging technology is a kind of surface adhesion technology applied to integrated circuit, which is often used to permanently fix devices such as microprocessors, BGA packaging can provide more pins than other packages such as dual in-line package or quad flat package, the bottom surface of the entire device can be used as a pin, not just the surrounding, BGA packaging also has shorter average wire length than the surrounding defined packaging type, thus having better high-speed performance. Therefore, BGA packaging technology is increasingly widely used.

[0003] During the BGA packaging process, BGA solder powder is needed. With the increasing application of BGA packaging technology, the demand for BGA solder powder is also increasing. The BGA solder powder particles need to have a spherical structure, and the more regular the spherical structure, the better the performance. Therefore, it is of great significance to efficiently produce BGA solder powder with a regular spherical structure.

[0004] Therefore, it is necessary to provide a BGA solder powder production device to improve the automation degree of the BGA solder powder production process, improve the production efficiency, and at the same time maintain the BGA solder powder with a more regular spherical structure. SUMMARY

[0005] The utility model discloses a motor drives helical vane and the bottom panel of raw material temporary storage container to rotate, the helical vane can produce downward pushing force to the raw material liquid for preparing BGA solder powder during rotation, the through hole will run around the shaft in a circular manner during the rotation of the bottom panel, during the movement, the through hole will pass through the feed hole position opened on the top surface of the forming tank, when the through hole passes through the feed hole position, the raw material liquid enters the drop tube through the through hole and the feed hole under the pushing force of the helical vane, then, the raw material liquid drips into the forming dispersion liquid stored in the forming tank through the drop tube, after the raw material liquid enters the forming dispersion liquid in the form of droplets, it can form small particles with spherical structure, i.e. BGA solder powder, in the forming dispersion liquid, through the BGA solder powder production device, the time when the through hole passes through the feed hole position can be controlled by controlling the motor speed, so as to control the amount of raw material liquid entering the drop tube from the raw material temporary storage container, so that the raw material liquid can drip out of the drop tube without flowing out in a stream, after the raw material liquid enters the forming dispersion liquid in the form of droplets, it is easier to form a regular spherical structure, thereby realizing the automated production of BGA solder powder, improving the production efficiency, and at the same time making the produced BGA solder powder have a more regular spherical structure.

[0006] In order to overcome the problems in the background art, the utility model discloses the following technical scheme:

[0007] The BGA solder powder manufacturing device includes a feed container 1, a raw material temporary storage container 2, a droplet tube 3, a forming tank body 4, a motor 5 and a helical blade 6, the raw material temporary storage container 2 is arranged on the top surface of the forming tank body 4, the feed container 1 is communicated with the raw material temporary storage container 2, the motor 5 is arranged on the top surface of the raw material temporary storage container 2, the helical blade 6 is located in the raw material temporary storage container 2 and is fixedly connected with the output end of the motor 5 through a shaft 7, a feed hole is formed on the top surface of the forming tank body 4, the droplet tube 3 is arranged at the feed hole, the droplet tube 3 is located in the forming tank body 4, the bottom plate 8 of the raw material temporary storage container 2 is sealingly and rotatably connected with the side wall of the raw material temporary storage container 2 and is fixedly connected with the shaft 7, a through hole 9 is formed in the bottom plate 8, the feed hole on the top surface of the forming tank body 4 is located on the circumferential path formed by the through hole 9, and a liquid outlet 10 is arranged at the bottom of the forming tank body 4.

[0008] Preferably, the through hole 9 is a plurality of through holes and is evenly distributed along the circumference of the bottom plate 8.

[0009] Preferably, the BGA solder powder manufacturing device further includes a support frame 11, and the forming tank body 4 is mounted on the support frame 11.

[0010] Preferably, the diameter of the through hole 9 is greater than 10G.

[0011] Preferably, the upper portion of the droplet tube 3 has a larger diameter than the lower portion, the diameter of the upper portion of the droplet tube 3 is the same as the diameter of the through hole 9, and the diameter of the lower portion of the droplet tube 3 is 10G-34G.

[0012] The utility model discloses the beneficial effects of:

[0013] 1. By using the utility model device, only need to add raw material liquid into the feed container before manufacturing, add the forming dispersion liquid into the forming tank body, then adjust the motor speed to the appropriate value, the device can realize the automatic manufacturing of BGA solder powder, and the degree of automation is higher, and the production efficiency is higher.

[0014] 2. The utility model can make raw material liquid drop into the forming dispersion liquid in the form of droplet, make the droplet easily form spherical structure particles in the forming dispersion liquid, thereby making the BGA solder powder particles obtained by manufacturing keep relatively regular spherical structure. DRAWINGS

[0015] Fig. 1 It is the whole structure section schematic view of the utility model;

[0016] Fig. 2 It is the bottom plate overhead structure schematic view of the utility model.

[0017] In the figure, 1 - feed container, 2 - raw material temporary storage container, 3 - drip tube, 4 - forming tank, 5 - motor, 6 - spiral blade, 7 - shaft, 8 - bottom panel, 9 - through hole, 10 - liquid outlet, 11 - support frame. DETAILED DESCRIPTION

[0018] The present application will be further described in detail with reference to the accompanying drawings, but the scope of protection of the present application is not limited to the content described.

[0019] As Figs. 1-2 shown, the BGA solder powder manufacturing device includes a feed container 1, a raw material temporary storage container 2, a drip tube 3, a forming tank 4, a motor 5, a spiral blade 6, the forming tank 4 top surface is provided with a raw material temporary storage container 2, the feed container 1 and the raw material temporary storage container 2 are communicated, the raw material temporary storage container 2 top surface is provided with a motor 5, the spiral blade 6 is located in the raw material temporary storage container 2 and the spiral blade 6 is fixedly connected with the output end of the motor 5 through the shaft 7, the forming tank 4 top surface is provided with a feed hole, the drip tube 3 is arranged at the feed hole, the drip tube 3 is located inside the forming tank 4, the bottom panel 8 of the raw material temporary storage container 2 is rotatably connected with the sidewall of the raw material temporary storage container 2 and is fixedly connected with the shaft 7, the through hole 9 is arranged on the bottom panel 8, the feed hole of the forming tank 4 top surface is located on the circumferential path formed by the movement of the through hole 9, and the forming tank 4 bottom is provided with a liquid outlet 10.

[0020] When the BGA solder powder is made, first, the raw material liquid (usually molten iron) is added to the feeding container 1, and the raw material liquid flows from the feeding container 1 into the raw material temporary storage container 2. When the motor 5 is running, it can drive the helical blade 6 and the bottom panel 8 to rotate. The rotation of the helical blade 6 can push the raw material liquid in the raw material temporary storage container 2. Since the flowability of molten iron is poorer than that of water and other liquids, only by its own gravity, on the one hand, it will be more difficult for the molten iron to flow from the raw material temporary storage container 2 into the drop tube 3, on the other hand, there may be uneven flowability, which can cause a large difference in the amount of molten iron flowing from the raw material temporary storage container 2 into the drop tube 3 each time, which is not convenient for control. Therefore, by rotating the helical blade 6 to push the molten iron, the molten iron can flow into the drop tube 3 more uniformly. The rotation of the motor 5 also drives the bottom panel 8 to rotate, and the rotation of the bottom panel 8 makes the through hole 9 move in a circular motion around the shaft 7. During the circular motion of the through hole 9, when it passes through the feeding hole on the top surface of the forming tank 4, the raw material temporary storage container 2 and the forming tank 4 are in communication, and the raw material liquid can enter the drop tube 3 from the raw material temporary storage container 2 through the through hole 9 and the feeding hole. When the motor 5 rotates at a high speed, the through hole 9 also passes through the feeding hole at a high speed, so the time for the raw material liquid to enter the drop tube 3 from the raw material temporary storage container 2 is short, and less raw material liquid enters the drop tube 3 from the raw material temporary storage container 2. Conversely, the time for the raw material liquid to enter the drop tube 3 is longer, and more raw material liquid can enter the drop tube 3. Therefore, by controlling the rotation speed of the motor 5, the time for the through hole 9 to pass through the feeding hole can be controlled, and thus the amount of raw material liquid entering the drop tube 3 from the raw material temporary storage container 2 can be controlled. By controlling the rotation speed of the motor 5 within a reasonable range, the amount of raw material liquid entering the drop tube 3 from the raw material temporary storage container 2 can be in the form of droplets, which can be dropped from the drop tube 3 without flowing out of the drop tube 3 in a stream due to excessive amount of raw material liquid. The rotation of the motor 5 within a reasonable range can also control the volume of the droplets within a certain range. After the raw material liquid is dropped from the drop tube 3 in the form of droplets, it enters the pre-added forming dispersion liquid in the forming tank 4 (the forming dispersion liquid usually uses glycerol, poly-alpha olefin base oil (PAO20), white oil (N500), etc., and after the forming dispersion liquid is added, the lower end of the drop tube 3 is immersed in the forming dispersion liquid to prevent the drop tube 3 from impacting the forming dispersion liquid and causing damage to the forming structure). The liquid can directly form a spherical structure in the forming dispersion liquid. When the volume of the droplets is large, a spherical structure with a large particle size can be formed, and when the volume of the droplets is small, a spherical structure with a small particle size can be formed. Therefore, by controlling the volume of the droplets within a certain range, spherical structures with different particle sizes, i.e. BGA solder powders with different particle sizes, can be made.When the solder powder production is completed, the BGA solder powder and the forming dispersion liquid can be discharged from the liquid outlet 10, and then separated to obtain the BGA solder powder. A valve (not shown in the figure) is installed at the liquid outlet 10 to realize that the liquid outlet 10 is in a closed state during the solder powder production process, and the solder powder or the forming dispersion liquid is not discharged. At the same time, before the solder powder production starts, the forming dispersion liquid can be added into the forming tank 4 through the liquid outlet 10. After the forming dispersion liquid is added, the valve is closed, and the liquid outlet 10 can be kept in a closed state during the BGA solder powder production process.

[0021] Preferably, the through holes 9 are evenly distributed along the circumference of the bottom plate 8.

[0022] When the through holes 9 are arranged on the bottom plate 8, the time for the last through hole 9 and the previous through hole 9 to pass through the feeding hole can be shortened under the condition that the rotating speed of the motor 5 is unchanged, so that the frequency of the raw material liquid entering the drop tube 3 from the raw material temporary storage container 2 is improved, the frequency of the liquid drops dropping from the drop tube 3 is improved, and the production efficiency of the BGA solder powder is improved. Only the number of the through holes 9 and the rotating speed of the motor 5 need to be controlled, and the raw material liquid entering the drop tube 3 at the last time and the previous time is prevented from being mixed in the drop tube 3.

[0023] Preferably, the BGA solder powder production device further comprises a support frame 11, and the forming tank 4 is installed on the support frame 11.

[0024] The working process of the BGA solder powder production device is as follows: before the BGA solder powder production starts, the forming dispersion liquid is added into the forming tank through the liquid outlet, the valve of the liquid outlet is closed after the forming dispersion liquid is added, the rotating speed of the motor is set, the raw material liquid is poured into the feeding container, and the motor is started. Then, the raw material liquid enters the raw material temporary storage container from the feeding container, and the motor drives the helical blade and the bottom plate to rotate. During the rotation of the bottom plate, when the through hole passes through the feeding hole, the raw material liquid enters the drop tube from the raw material temporary storage container under the pushing action of the helical blade, and then drops into the forming dispersion liquid. The liquid in the drop tube forms spherical structure particles in the forming dispersion liquid. With the continuous rotation of the motor, the raw material liquid enters the drop tube at intervals, and the rotating speed of the motor is controlled to control the interval time of the raw material liquid entering the drop tube from the temporary storage container, so as to control the dropping speed of the liquid drops in the drop tube. The raw material liquid drops from the drop tube at intervals, and the spherical structure particles are formed in the forming dispersion liquid at intervals. The BGA solder powder production is realized. After the production is completed, the valve is opened, the BGA and the forming dispersion liquid are discharged from the liquid outlet, and subsequent separation treatment is performed to obtain the BGA solder powder.

[0025] Finally, it is explained that the above preferred embodiments are only for illustrating the technical solutions of the present application and not for limiting, although the present application has been described in detail through the above preferred embodiments, those skilled in the art should understand that various changes can be made to the form and details thereof without departing from the scope defined by the claims of the present application.

Claims

1. A BGA solder paste making apparatus, characterized by: The BGA solder powder manufacturing device comprises a feeding container (1), a raw material temporary storage container (2), a droplet pipe (3), a forming tank (4), a motor (5), and a spiral blade (6). The raw material temporary storage container (2) is arranged on the top surface of the forming tank (4). The feeding container (1) is in communication with the raw material temporary storage container (2). The motor (5) is arranged on the top surface of the raw material temporary storage container (2). The spiral blade (6) is located in the raw material temporary storage container (2) and is fixedly connected with the output end of the motor (5) through a shaft (7). A feeding hole is formed on the top surface of the forming tank (4). The droplet pipe (3) is arranged at the feeding hole and is located in the forming tank (4). The bottom panel (8) of the raw material temporary storage container (2) is sealingly and rotatably connected with the side wall of the raw material temporary storage container (2) and is fixedly connected with the shaft (7). A through hole (9) is formed on the bottom panel (8). The feeding hole on the top surface of the forming tank (4) is located on the circumferential path formed by the through hole (9). A liquid outlet (10) is arranged at the bottom of the forming tank (4).

2. The BGA solder paste making device of claim 1, wherein: The through hole (9) is a plurality of through holes which are uniformly distributed along the circumference of the bottom panel (8).

3. The BGA solder paste making device of claim 1, wherein: The BGA solder powder manufacturing device further comprises a support frame (11). The forming tank (4) is mounted on the support frame (11).

4. The BGA solder paste making device of claim 1, wherein: The diameter of the through hole (9) is greater than 10G.

5. The apparatus of claim 4, wherein: The upper pipe diameter of the droplet pipe (3) is greater than the lower pipe diameter. The upper pipe diameter of the droplet pipe (3) is the same as the diameter of the through hole (9). The lower pipe diameter of the droplet pipe (3) is 10G-34G. The diameter of the through hole (9) is greater than 10G. The upper pipe diameter of the droplet pipe (3) is greater than the lower pipe diameter. The upper pipe diameter of the droplet pipe (3) is the same as the diameter of the through hole (9). The lower pipe diameter of the droplet pipe (3) is 10G-34G.

Images