Static jig of semiconductor power module

Abstract

The utility model discloses a static jig of a semiconductor power module, which comprises a PCB (printed circuit board) (21), a jig frame (22), support columns (23), top columns (24), probes (25) and probe cushion blocks (26), the PCB (21) is fixed on the jig frame (22), at least one set of probes (25) penetrating through the PCB is arranged on the PCB (21), the support columns (23) are arranged on two sides of the lower part of the jig frame (22), the top columns (24) are arranged on the support columns (23), and the probe cushion blocks (26) are arranged on the top columns (24). A space is formed between the lower portion of the jig frame (22) and a table top where the jig (2) is placed through the supporting columns (23), the two sides of each set of probe (25) are each provided with a jacking column (24), the top ends of the jacking columns (24) are higher than the top ends of the probes (25), the probe cushion block (26) is fixed to the lower portion of the PCB (21), the probes (25) located below the PCB (21) penetrate through the probe cushion block (26), and at least one positioning groove (28) is formed in the side edge of the jig frame (22). According to the utility model, the reliability of the jig is improved, and the workload of jig development is reduced.

Description

Technical Field

[0001] This utility model relates to semiconductor testing systems, specifically to a static fixture for a semiconductor power module. Background Technology

[0002] With technological advancements, the application of power semiconductors such as IGBTs and MOSFET modules has become increasingly widespread. Reliability assessments are necessary during device development, manufacturing, and application. Before conducting electrical evaluations, a quick, non-permanent connection must be established between the device under test (DUT) and the test equipment.

[0003] Currently, testing equipment for modules with multiple independent or semi-independent functional units typically employs a dedicated fixture system. This fixture system is a type of electrical connection that links specific signals on the module to the relevant interfaces of the testing machine. This allows for the use of different test fixtures to accommodate power modules of varying shapes and specifications, while keeping the testing machine interfaces unchanged.

[0004] In current fixture systems, cable connections are widely used to connect the fixture and the testing machine. This method is relatively complex to install, and the lifespan of the cables will decrease rapidly in motion environments.

[0005] Chinese patent CN216209637U discloses an IGBT module testing device. Its mounting platform features a probe mounting plate capable of vertical movement, with multiple probes mounted on its lower surface. The platform also includes multiple movable blocks positioned above a PCB circuit board and adjustable vertically. Spring contacts are located below these movable blocks. When the probes and spring contacts contact the PCB circuit board, the PCB circuit board is energized. This solution achieves PCB circuitry by controlling the contact between the probes and spring contacts via the vertically moving probe mounting plate and movable blocks, eliminating the need for complex power lines. However, the IGBT under test still requires an electrical connection to the PCB circuit board via wires, resulting in complex connections, reduced cable lifespan, and ultimately, low reliability. Utility Model Content

[0006] The technical problem to be solved by this utility model is how to improve the reliability of the fixture and reduce the workload of fixture development.

[0007] This utility model solves the above-mentioned technical problems through the following technical means: a static fixture for a semiconductor power module, including a PCB (21), a fixture frame (22), a support column (23), a top column (24), a probe (25), and a probe pad (26). The PCB (21) is fixed on the fixture frame (22). At least one set of probes (25) penetrating the PCB are provided on the PCB (21). Support columns (23) are provided on both sides of the lower part of the fixture frame (22). The support columns (23) form a space between the lower part of the fixture frame (22) and the table surface on which the fixture (2) is placed. A top column (24) is provided on both sides of each set of probes (25). The top of the top column (24) is higher than the top of the probe (25). The probe pad (26) is fixed below the PCB (21). The probe (25) located below the PCB (21) passes through the probe pad (26). At least one positioning groove (28) is opened on the side of the fixture frame (22).

[0008] Furthermore, the probe (25) and the probe pad (26) are structurally connected by a tight fit.

[0009] Furthermore, the PCB (21) and the probe pad (26) are positioned by pins.

[0010] Furthermore, the probe pad (26) is made of a non-metallic insulating material.

[0011] Furthermore, the fixture frame (22) is provided with at least one positioning hole (27).

[0012] Furthermore, the fixture frame (22) is fixed to the PCB (21) by pins.

[0013] The advantages of this utility model are:

[0014] 1. The removal of easily damaged parts such as relays from traditional fixture systems improves the reliability of the fixture;

[0015] 2. The number of PCBs has been reduced from 3-4 to 1, which reduces the workload of developing new fixtures;

[0016] 3. The fixture frame uses a standardized design, eliminating the need for revisions for the test piece and reducing the workload of fixture development;

[0017] 4. The support point of the probe under test has been changed from the PCB to a top post, which reduces the stress on the PCB, lowers the cost, and improves the fatigue life of the PCB.

[0018] 5. All assemblies are equipped with pins for positioning, which improves the overall assembly accuracy. Attached Figure Description

[0019] Figure 1 This is a front view of a semiconductor device testing fixture system (without fixture) according to an embodiment of this utility model;

[0020] Figure 2 This is a perspective view of a semiconductor device testing fixture system (without fixture) according to an embodiment of the present invention;

[0021] Figure 3 This is a perspective view of a semiconductor device testing fixture system (with fixture) according to an embodiment of the present invention;

[0022] Figure 4 This is a side view of a semiconductor device testing fixture system (with fixture) according to an embodiment of the present invention;

[0023] Figure 5 This is a front view of the static fixture for the semiconductor power module according to an embodiment of the present invention;

[0024] Figure 6 This is a perspective view of the static fixture for the semiconductor power module in an embodiment of this utility model;

[0025] Figure 7 This is a perspective view of the static fixture and the test piece of the semiconductor power module in this embodiment of the present invention.

[0026] Figure 8 This is a top perspective view of the static fixture of the semiconductor power module in this embodiment of the utility model. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below in conjunction with the embodiments of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0028] It should be noted that, unless otherwise specified, the following embodiments and features can be combined with each other. Furthermore, the illustrations provided in the following embodiments are merely schematic representations of the basic concept of this utility model. The illustrations only show components relevant to this utility model and are not drawn according to the actual number, shape, and size of the components in implementation. In actual implementation, the form, quantity, and proportion of each component can be arbitrarily changed, and the component layout may also be more complex.

[0029] See also Figures 1 to 4The semiconductor device testing fixture system of this utility model includes a fixture base 1, a static fixture 2 for semiconductor power modules, a driving device 3, an electrical interface 4, and a fixture base probe 5. The fixture base 1 has a fixture compartment that can hold the static fixture 2 for semiconductor power modules.

[0030] The upper part of the fixture base 1 is provided with an upper panel and a lower panel. The drive device 3 is respectively installed on the upper panel of the fixture base 1, and the drive head of the drive device 3 is fixedly connected to the lower panel of the fixture base 1.

[0031] The top side of the fixture base 1 is provided with a fixture base electrical interface 4, and the electrical signal of the testing machine is connected to the fixture base electrical interface 4 through a cable.

[0032] The fixture base probes 5 are fixedly installed below the upper panel of the fixture base 1. The fixture base probes 5 are arranged in a U-shape with the openings facing outwards. The probes on the side of the fixture base probes 5 are electrically connected to the fixture base electrical interface 4.

[0033] A sliding groove 12 is fixedly provided on each of the two sides of the upper part of the lower panel of the fixture base 1. The sliding groove 12 cooperates with the two sides of the static fixture 2 of the semiconductor power module, so that after the two sides of the static fixture 2 of the semiconductor power module are put into the sliding groove 12, they can be pushed into the fixture compartment. At least one side of the sliding groove 12 is provided with a retractable top ball 14 for coarse positioning, and the side of the static fixture 2 of the semiconductor power module is provided with a positioning groove 28 that cooperates with the top ball 14.

[0034] The lower panel of the fixture 1 has a hole in the middle for the workpiece 6 to pass through.

[0035] Continue reading Figures 5 to 8 The static fixture 2 of the semiconductor power module in this embodiment of the present invention includes a PCB 21, a fixture frame 22, a support column 23, a top column 24, a probe 25, a probe pad 26, a positioning hole 27, and a positioning groove 28.

[0036] PCB21 is fixed on fixture frame 22. In this embodiment, the fixture frame 22 and PCB21 are positioned by pins through mounting holes on both sides to ensure relative position accuracy.

[0037] At least one set of probes 25 is provided on PCB 21, penetrating the PCB board, and PCB 21 is soldered to probes 25. At least one top post 24 is provided around the probes 25 on the upper part of PCB 21, with the top of the top post 24 higher than the top of the probe 25. In this embodiment, two sets of probes 25 are respectively arranged opposite to each other on PCB 21, with a top post 24 on each side of each set of probes 25. A probe pad 26 is fixed below PCB 21, and the probes 25 located below PCB 21 pass through the probe pad 26. The probes 25 and probe pad 26 are structurally connected by a tight fit, and PCB 21 bears the torsional force generated by the weight of the probes 25 and probe pad 26. In this embodiment, PCB 21 and probe pad 26 are positioned by pins to ensure relative positional accuracy. The probe pad 26 is made of non-metallic insulating material, including but not limited to epoxy resin board, polyoxymethylene resin, PEEK, etc.

[0038] As a further optimized technical solution, support columns 23 are provided on both sides of the lower part of the fixture frame 22. The support columns 23 form a space between the lower part of the fixture frame 22 and the table surface of the static fixture 2 on which the semiconductor power module is placed, so as to prevent the probe 25 of the static fixture 2 on which the semiconductor power module is placed from contacting the table surface of the static fixture 2 on which the semiconductor power module is placed during storage, thereby reducing the risk of damage to the probe 25.

[0039] The fixture frame 22 is provided with at least one positioning hole 27. In this embodiment, one positioning hole 27 is provided on each side of one side of the fixture frame 22. The positioning hole 27 provides a high-precision positioning interface on the static fixture 2 of the semiconductor power module, which can avoid problems such as fixture tilting during the installation of the static fixture 2 of the semiconductor power module. Positioning posts 16 are provided on the lower part of the upper panel of the fixture base 1 at the positions corresponding to the positioning holes 27, and the positioning posts 16 can enter the positioning holes 27.

[0040] Positioning grooves 28 are provided on both sides of the fixture frame 22 at the positions of the top beads 14 on the sides of the static fixture 2 of the semiconductor power module. In this embodiment, two top beads are provided on one side of the slide groove 12, so four positioning grooves 28 are also provided.

[0041] The operation process of this semiconductor device testing fixture system is as follows:

[0042] 1. Push the static fixture 2 of the semiconductor power module into the fixture seat 1 along the slide groove 12. When the coarse positioning top bead 14 slides into the coarse positioning groove 28, you can feel a clear step, which means the coarse positioning is over.

[0043] 2. Use the drive device 3 to lift the static fixture 2 of the semiconductor power module upward, so that the positioning pin 16 enters the positioning hole 27, and further perform precision positioning of the static fixture 2 of the semiconductor power module through the cooperation of the shaft and the hole;

[0044] 3. After the positioning pin 16 is fully inserted into the positioning hole 27, the static fixture 2 of the semiconductor power module is continuously lifted upward. The lower panel of the fixture seat 1 contacts the bottom of the fixture frame 22 until the fixture seat probe 5 is correctly compressed onto the upper surface of the PCB 21 to form a reliable electrical connection. The spring pressure of the fixture seat probe 5 is transmitted downward through the PCB 21 to the fixture frame 22, and then to the lower panel of the fixture seat 1, forming a nearly vertical force direction to avoid the PCB 21 or the fixture frame 22 bearing torsional force, thereby reducing the strength requirements of these two parts.

[0045] 4. Use the test piece lifting device (not shown) to lift the test piece 6 upwards, so that the probe 25 contacts and compresses the test piece 6 to form a reliable electrical connection. When the test piece 6 is lifted onto the probe 25, the top of the top post 24 contacts the upper panel of the fixture seat 1. The lifting force is transmitted to the upper panel of the fixture seat 1 through the probe 25, the probe pad 26, and the top post 24. The pressure generated when the bottom of the probe 25 is compressed is transmitted to the fixture seat 1 outside the fixture through the probe pad 26 and the top post 24, thus avoiding the force generated when the test piece 6 is lifted on the PCB 21.

[0046] The electrical connection relationships during measurement are as follows:

[0047] A. The electrical signal of the tester is connected to the electrical interface 4 of the fixture seat through a cable, thereby connecting the fixture seat probe 5. The fixture seat probe 5 of the fixture seat 1 contacts the upper surface of the PCB 21 to form an electrical connection.

[0048] B. The electrical signal of the fixture seat 1 is connected to the probe 25 through the fixture seat probe 5, the copper wire on the PCB 21, or the flying wire;

[0049] C. The electrical signal on probe 25 is connected to the device under test 6 to form a complete electrical connection.

[0050] The electrical signals of the testing machine are connected to the electrical interface 4 of the fixture seat via a cable, and then to the fixture seat probe 5. The electrical signals are then connected to the probe 25 via the fixture seat probe 5, and finally to the device under test 6. The static fixture 2 of the semiconductor power module is pushed into the fixture chamber through the slide 12. The top ball 14 and the positioning groove 28 form a coarse positioning, and the user is given feedback on the completion of the coarse positioning through the tactile feedback when sliding in. Then, the positioning post 16 and the positioning hole 27 form a more precise positioning relationship between the static fixture 2 of the semiconductor power module and the fixture seat 1, thereby ensuring the reliability of the electrical connection.

[0051] In this embodiment, the drive device 3 uses a motion cylinder, but other methods can also be used to drive the movement of the fixture seat 5, such as a linear motor, worm gear, etc.

[0052] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A static jig for a semiconductor power module, characterized by: The fixture includes a PCB (21), a fixture frame (22), support columns (23), top columns (24), probes (25), and probe pads (26). The PCB (21) is fixed on the fixture frame (22). At least one set of probes (25) is provided on the PCB (21) and penetrates the PCB. Support columns (23) are provided on both sides of the lower part of the fixture frame (22). The support columns (23) form a space between the lower part of the fixture frame (22) and the table where the fixture (2) is placed. A top column (24) is provided on both sides of each set of probes (25). The top of the top column (24) is higher than the top of the probe (25). The probe pads (26) are fixed on the lower part of the PCB (21). The probes (25) located below the PCB (21) pass through the probe pads (26). At least one positioning groove (28) is provided on the side of the fixture frame (22).

2. A static jig for a semiconductor power module as claimed in claim 1, characterized in that: The probe (25) and the probe pad (26) are structurally connected by a tight fit.

3. A static jig for a semiconductor power module as claimed in claim 1, characterized in that: The PCB (21) and the probe pad (26) are positioned by pins.

4. A static jig for a semiconductor power module as claimed in claim 1, characterized in that: The probe pad (26) is made of non-metallic insulating material.

5. A static jig for a semiconductor power module as claimed in claim 1, characterized in that: The fixture frame (22) is provided with at least one positioning hole (27).

6. A static jig for a semiconductor power module as claimed in claim 1, characterized in that: The fixture frame (22) is fixed to the PCB (21) by pins.

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