Heating filament plate heat dissipation structure of electronic component
By employing a non-contact design for the thermal insulation and heat dissipation components, the problem of friction between the heat dissipation structure and components in high-vibration environments is solved, achieving stable cooling and performance protection for electronic components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN NANFANG ZHIKONG TECH CO LTD
- Filing Date
- 2025-05-19
- Publication Date
- 2026-05-01
AI Technical Summary
In high-vibration environments, the heat dissipation structure of electronic components is in close contact with the components, causing friction, resulting in wear and unstable performance.
The design incorporates thermal insulation and heat dissipation components, employing a non-contact heat dissipation method. It utilizes a heat dissipation path composed of bent copper pipes, an electric fan, and a heat sink to effectively cool electronic components and maintain stability in high-vibration environments.
It effectively reduces the temperature of electronic components, prevents friction damage, ensures component performance and stability, and is suitable for high-vibration environments.
Smart Images
Figure CN224192296U_ABST
Abstract
Description
A heat dissipation structure for a heating wire plate of an electronic component Technical Field
[0001] This utility model relates to the field of heat dissipation structure technology, specifically a heat dissipation structure for a heating wire plate of an electronic component. Background Technology
[0002] The heating wire plate heat dissipation structure of electronic components is a device specifically designed for the rapid conduction and dissipation of heat. It is usually made of a substrate material with high thermal conductivity and a heating wire attached to the surface. This structure optimizes the heat dissipation path, rapidly conducting the heat generated by the heating wire to a large-area heat sink or heat dissipation plate. Then, using heat dissipation methods such as natural convection, forced convection, or heat pipes, the heat is quickly dissipated into the surrounding environment. This effectively reduces the operating temperature of the heating wire and surrounding components, ensuring that electronic components operate stably within a safe temperature range and improving the reliability and service life of the system.
[0003] When some electronic components are installed in high-vibration environments, in order to achieve effective heat dissipation, the heat dissipation structure is usually tightly attached to the electronic components to quickly reduce the operating temperature of the components. However, under high vibration conditions, this tight-fitting design will cause continuous friction between the heat dissipation structure and the electronic components. This friction not only causes surface wear of the electronic components, but may also cause the mechanical structure of the components to loosen, thereby affecting their performance and stability. Therefore, a heat dissipation structure for heating wires of electronic components is proposed to address the above problems. Summary of the Invention
[0004] The purpose of this invention is to provide a heat dissipation structure for a heating wire plate of an electronic component, in order to solve the problem that when some electronic components are installed in a high-vibration environment, the method of tightly fitting the heat dissipation structure to the electronic component to quickly reduce the operating temperature of the component will cause continuous friction between the heat dissipation structure and the electronic component, resulting in surface wear of the electronic component.
[0005] To achieve the above objectives, this utility model provides the following technical solution:
[0006] A heat dissipation structure for a heating wire plate of an electronic component includes an electronic component fixing assembly. A heat insulation assembly is fixedly connected to the bottom end of the electronic component fixing assembly, and a heat dissipation assembly is fixedly connected to the inner side of the heat insulation assembly. The electronic component fixing assembly includes a protective shell with an air inlet at the upper end. The heat dissipation assembly includes an air collecting shell with an electric fan fixedly connected to the front end and a ventilation opening at the rear end. A bent copper tube is fixedly connected to the rear end of the air collecting shell, with a narrow channel on the inner side of the bent copper tube. A guide tube is fixedly connected to the upper end of the bent copper tube, with an air guide channel on the inner side of the guide tube. A diffuser shell is fixedly connected to the rear end of the bent copper tube.
[0007] As a further optimization of this utility model, the heat insulation component includes a heat insulation shell, a fixed base is fixedly connected to the lower end of the heat insulation shell, a first fixed pipe hole is opened at the upper end of the heat insulation shell, and a partition groove is opened on the inner side of the heat insulation shell.
[0008] As a further optimization of this utility model, the front and rear ends of the heat insulation shell are both through structures, and the top of the heat insulation shell is fixedly connected to the bottom of the protective shell.
[0009] As a further optimization of this utility model, the lower end of the protective shell is provided with a second fixed pipe hole, the inner side of the second fixed pipe hole is fixedly connected to the outer side of the bent copper pipe, the inner side of the protective shell is a hollow structure, the air inlet penetrates the upper end of the protective shell, and the air inlet is connected to the inner side of the protective shell.
[0010] As a further optimization of this utility model, an ear base is fixedly connected to the inner side of the protective shell, and an electronic component body is fixedly connected to one side of the ear base.
[0011] As a further optimization of this utility model, the outer side of the bent copper tube is fixedly connected to the inner side of the first fixed tube hole, the upper end of the bent copper tube extends to the inner side of the protective shell, and the bent copper tube is located at the lower end of the electronic component body.
[0012] As a further optimization of this utility model, the following features are provided: the inner side of the air collecting shell near the electric fan has a through hole; the inner side of the air collecting shell is a hollow structure; the inner side of the bent copper tube is connected to the ventilation opening; the rear end of the bent copper tube is connected to the inner side of the air dispersing shell; the air guide is located at the rear end of the narrow channel; and the rear end of the air dispersing shell has an air outlet.
[0013] Compared with the prior art, the beneficial effects of this utility model are:
[0014] In this invention, by setting up a heat insulation component, an electronic component fixing component, and a heat dissipation component, the device can not only ensure that the electronic component body is effectively cooled through a non-contact heat dissipation method, but also be suitable for high-vibration working environments, preventing the heat dissipation structure from rubbing against the electronic component body and causing damage to the electronic component body, thus ensuring the performance and stability of the electronic component body. Attached Figure Description
[0015] Figure 1 is a schematic diagram of the overall structure of this utility model;
[0016] Figure 2 is a cross-sectional structural diagram of the heat insulation component of this utility model;
[0017] Figure 3 is a schematic diagram of the overall exploded structure of this utility model;
[0018] Figure 4 is a cross-sectional structural diagram of the electronic component fixing assembly of this utility model;
[0019] Figure 5 is a cross-sectional structural diagram of the air collecting shell of this utility model;
[0020] Figure 6 is a schematic diagram of the structure at point A in Figure 5 of this utility model;
[0021] Figure 7 is a cross-sectional structural diagram of the bent copper tube of this utility model;
[0022] Figure 8 is a schematic diagram of the structure at point B in Figure 7 of this utility model.
[0023] In the diagram: 1. Insulation component; 11. Insulation shell; 12. Fixing base; 13. First fixing hole; 14. Separating groove;
[0024] 2. Electronic component mounting assembly; 21. Protective housing; 22. Ear mount; 23. Electronic component body; 24. Air inlet; 25. Second mounting hole;
[0025] 3. Heat dissipation components; 31. Air collection housing; 32. Electric fan; 33. Connecting vents; 34. Bending copper pipe; 35. Narrow channel; 36. Duct; 37. Air duct; 38. Air dissipation housing. Detailed Implementation
[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0027] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.
[0028] Please refer to Figures 1-8. This utility model provides a technical solution:
[0029] A heat dissipation structure for a heating wire plate of an electronic component includes an electronic component fixing assembly 2, a heat insulation assembly 1 fixedly connected to the bottom of the electronic component fixing assembly 2, a heat dissipation assembly 3 fixedly connected to the inner side of the heat insulation assembly 1, the electronic component fixing assembly 2 includes a protective shell 21, an air inlet 24 is provided at the upper end of the protective shell 21, the heat dissipation assembly 3 includes an air collecting shell 31, an electric fan 32 fixedly connected to the front end of the air collecting shell 31, a ventilation opening 33 is provided at the rear end of the air collecting shell 31, a bent copper tube 34 is fixedly connected to the rear end of the air collecting shell 31, a narrow channel 35 is provided inside the bent copper tube 34, a conduit 36 is fixedly connected to the upper end of the bent copper tube 34, an air guide channel 37 is provided inside the conduit 36, and a diffuser shell 38 is fixedly connected to the rear end of the bent copper tube 34.
[0030] As a further implementation of this solution, the heat insulation component 1 includes a heat insulation shell 11, a fixed base 12 fixedly connected to the lower end of the heat insulation shell 11, a first fixed pipe hole 13 opened at the upper end of the heat insulation shell 11, a partition groove 14 opened on the inner side of the heat insulation shell 11, the front and rear ends of the heat insulation shell 11 are through structures, and the top end of the heat insulation shell 11 is fixedly connected to the bottom end of the protective shell 21. Through the above settings, the structural design of the heat insulation shell 11 provides a stable support foundation for the heat dissipation device, the fixed connection of the fixed base 12 enhances the stability of the overall structure, and the opening of the first fixed pipe hole 13 and the partition groove 14 provides space for heat dissipation path and component installation, so that heat can be smoothly conducted and dissipated.
[0031] As a further implementation of this solution, a second fixing hole 25 is provided at the lower end of the protective shell 21. The inner side of the second fixing hole 25 is fixedly connected to the outer side of the bent copper tube 34. The inner side of the protective shell 21 is a hollow structure. The air inlet 24 penetrates through the upper end of the protective shell 21 and communicates with the inner side of the protective shell 21. An ear seat 22 is fixedly connected to the inner side of the protective shell 21. An electronic component body 23 is fixedly connected to one side of the ear seat 22. Through the above settings, the bent copper tube 34 can be fixed inside the protective shell 21, improving the stability of the bent copper tube 34 structure. The through and communication design of the air inlet 24 further optimizes the heat dissipation path, introduces external cooling air, and enhances the heat dissipation effect.
[0032] As a further implementation of this solution, the outer side of the bent copper tube 34 is fixedly connected to the inner side of the first fixed tube hole 13, and the upper end of the bent copper tube 34 extends to the inner side of the protective shell 21. The bent copper tube 34 is located at the lower end of the electronic component body 23. With the above arrangement, the bent copper tube 34 has good thermal conductivity. It is fixedly connected to the inner side of the first fixed tube hole 13 and extends to the inner side of the protective shell 21. It can quickly absorb the heat emitted by the electronic component body 23 and conduct it to the protective shell 21 and the heat insulation shell 11, thereby achieving preliminary heat dissipation of the electronic component body 23. At the same time, the bent copper tube 34 is located at the lower end of the electronic component body 23, which reasonably arranges the heat dissipation path, so that the heat can be smoothly conducted downward, improving the heat dissipation efficiency and ensuring the stable operation of the electronic component body 23.
[0033] As a further implementation of this solution, the inner side of the air collecting shell 31 near the electric fan 32 has a through hole. The inner side of the air collecting shell 31 is a hollow structure. The inner side of the bent copper tube 34 is connected to the ventilation port 33. The rear end of the bent copper tube 34 is connected to the inner side of the air dissipation shell 38. The air guide duct 37 is located at the rear end of the narrow channel 35. The rear end of the air dissipation shell 38 has an air outlet. Through the above settings, heat is conducted from the bent copper tube 34 to the air dissipation shell 38 and discharged through the air cooling effect. The design of the air guide duct 37 and the narrow channel 35 utilizes the Venturi effect to further enhance the heat dissipation effect and improve the heat dissipation efficiency. At the same time, the opening of the air outlet ensures that heat can be discharged quickly, ensuring the efficient operation of the heat dissipation device.
[0034] Workflow: When dissipating heat from the electronic component body 23, the bent copper tube 34, made of copper, absorbs the heat emitted by the electronic component body 23, thus providing initial heat dissipation. A certain distance is maintained between the bent copper tube 34, the conduit 36, and the electronic component body 23. The electric fan 32 draws external air into the air collecting shell 31, through the connecting vent 33, into the bent copper tube 34, then into the air dissipation shell 38 at its rear end, and finally out through the air outlet at the rear end of the air dissipation shell 38. This air cooling process exchanges and dissipates heat from the bent copper tube 34, achieving continuous cooling of the bent copper tube 34 and thus continuously cooling the electronic component body 23. The connecting vent 33 and the air dissipation shell 38 are located inside the partition groove 14 of the heat insulation shell 11, which provides heat insulation. The device can isolate the heat emitted by the electric fan 32 and the diffuser 38 from the protective shell 21. At the same time, as the air passes through the narrow channel 35 inside the curved copper tube 34, the airflow velocity is high when it flows out of the narrow channel 35 and passes the lower end of the air guide 37. Through the Venturi effect, the external air enters the interior of the protective shell 21 through the air inlet 24 and blows onto the electrical components on the surface of the electronic component body 23, thereby achieving the effect of direct contact between the air and the electronic component body 23, and further cooling the electronic component body 23 to ensure its normal operation. The lower end of the protective shell 21 has an air outlet to exhaust the hot air. Based on the above principles, the device can not only ensure that the electronic component body 23 is effectively cooled through a non-contact heat dissipation method, but also be suitable for high-vibration working environments, preventing the heat dissipation structure from rubbing against the electronic component body 23 and causing damage to the electronic component body 23.
[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A heat dissipation structure for a heating wire plate of an electronic component, comprising an electronic component fixing assembly (2), characterized in that: The bottom of the electronic component fixing assembly (2) is fixedly connected to a heat insulation assembly (1), and the heat insulation assembly (1) is fixedly connected to a heat dissipation assembly (3); the electronic component fixing assembly (2) includes a protective shell (21), and the upper end of the protective shell (21) is provided with an air inlet (24); the heat dissipation assembly (3) includes an air collecting shell (31), the front end of the air collecting shell (31) is fixedly connected to an electric fan (32), the rear end of the air collecting shell (31) is provided with a ventilation port (33), the rear end of the air collecting shell (31) is fixedly connected to a bent copper tube (34), the inner side of the bent copper tube (34) is provided with a narrow channel (35), the upper end of the bent copper tube (34) is fixedly connected to a conduit (36), the inner side of the conduit (36) is provided with an air guide channel (37), and the rear end of the bent copper tube (34) is fixedly connected to a diffuser shell (38).
2. The heat dissipation structure of the heating wire plate for an electronic component according to claim 1, characterized in that: The heat insulation component (1) includes a heat insulation shell (11), a fixed base (12) is fixedly connected to the lower end of the heat insulation shell (11), a first fixed tube hole (13) is opened at the upper end of the heat insulation shell (11), and a partition groove (14) is opened on the inner side of the heat insulation shell (11).
3. The heat dissipation structure of the heating wire plate for an electronic component according to claim 2, characterized in that: The front and rear ends of the heat insulation shell (11) are both through structures, and the top of the heat insulation shell (11) is fixedly connected to the bottom of the protective shell (21).
4. The heat dissipation structure of the heating wire plate for an electronic component according to claim 1, characterized in that: The lower end of the protective shell (21) is provided with a second fixed pipe hole (25). The inner side of the second fixed pipe hole (25) is fixedly connected to the outer side of the bent copper pipe (34). The inner side of the protective shell (21) is a hollow structure. The air inlet (24) penetrates the upper end of the protective shell (21). The air inlet (24) is connected to the inner side of the protective shell (21).
5. The heat dissipation structure of the heating wire plate for an electronic component according to claim 1, characterized in that: The protective shell (21) is fixedly connected to the inner side of the ear seat (22), and the electronic component body (23) is fixedly connected to one side of the ear seat (22).
6. The heat dissipation structure of the heating wire plate for an electronic component according to claim 1, characterized in that: The curved copper tube (34) is fixedly connected to the inside of the first fixed tube hole (13) on the outside. The upper end of the curved copper tube (34) extends to the inside of the protective shell (21). The curved copper tube (34) is located at the lower end of the electronic component body (23).
7. The heat dissipation structure of the heating wire plate for an electronic component according to claim 1, characterized in that: The air collecting shell (31) has a through hole on the inner side near the electric fan (32). The inner side of the air collecting shell (31) is a hollow structure. The inner side of the bent copper tube (34) is connected to the ventilation port (33). The rear end of the bent copper tube (34) is connected to the inner side of the air dispersing shell (38). The air guide duct (37) is located at the rear end of the narrow channel (35). The rear end of the air dispersing shell (38) has an air outlet.