Heating door and window

Abstract

The embodiment of the utility model provides a heating door and window which comprises an inner layer structure, a heating layer, an electrode and an outer layer structure, and the heating layer is a conducting film which is formed on the surface of the inner layer structure by semiconductor metal oxide through vacuum coating. The heating layer is used for performing electric-heat conversion when being electrified; the electrodes are arranged on two sides of the heating layer, are connected with a power supply and are used for electrifying the heating layer; the outer-layer structure and the inner-layer structure are arranged at an interval, the outer-layer structure and the inner-layer structure are fixedly connected to form the integrated structure heating door and window, and a gap between the outer-layer structure and the inner-layer structure is sealed to form a vacuum space. According to the heating door and window, the heating layer can be used for self-heating to provide heat, the vacuum space between the outer layer structure and the inner layer structure can effectively block heat transfer, and heat preservation is conducted.

Description

Technical Field

[0001] This invention relates to the field of door and window insulation technology, and in particular to a hot air window. Background Technology

[0002] Transparent doors and windows are generally used to bring in natural light, thereby illuminating the interior space. In addition to their lighting function, transparent doors and windows can also enhance the heating of the space by introducing solar radiation. However, current technology still has the following areas for improvement: existing transparent doors and windows are prone to significant heat loss in winter. Due to temperature differences, transparent doors and windows lose a large amount of heat, which significantly increases heating costs and energy consumption. Furthermore, due to the heat conduction characteristics of transparent doors and windows, uneven indoor temperatures may occur, causing discomfort. Summary of the Invention

[0003] This invention provides a fever window to solve one or more technical problems encountered in the prior art.

[0004] In a first aspect, embodiments of the present invention provide a fever window, including:

[0005] Inner structure;

[0006] A heating layer, wherein the heating layer is a conductive film formed on the surface of the inner layer structure by vacuum deposition of a semiconductor metal oxide; the heating layer is used to perform electrothermal conversion when energized;

[0007] Electrodes are disposed on both sides of the heating layer and connected to a power source, and are used to energize the heating layer;

[0008] An outer layer structure is provided, which is spaced apart from the inner layer structure and is fixedly connected to the inner layer structure to form an integrated hot air window. The gap between the outer layer structure and the inner layer structure is sealed to form a vacuum space.

[0009] In a preferred embodiment, the light transmittance of the inner layer structure and the outer layer structure is greater than 30%.

[0010] In a preferred embodiment, a plurality of support structures are provided between the inner structure and the outer structure.

[0011] In a preferred embodiment, the hot air window further includes a door and window frame, which is a frame structure made of thermal insulation material. The door and window frame wraps around the outer layer structure and the inner layer structure so that the edges of the outer layer structure and the inner layer structure are both within the door and window frame.

[0012] In a preferred embodiment, the insulation material is one of basalt, foamed cement, silicon carbide fiber, rock wool, and expanded perlite, which is integrally molded into the frame structure.

[0013] In a preferred embodiment, when the heating layer is disposed on the exposed side surface of the inner layer structure, the heating window further includes a protective layer, which is a waterproof and insulating layer formed by vacuum sputtering of silicon dioxide.

[0014] In a preferred embodiment, the heating layer is a conductive film formed by vacuum deposition of one of the semiconductor metal oxides selected from ZnOxS(1-x), InOxS(1-x), SnxIn(1-x)O, ZnxMg(1-x)O and ZnxAl(1-x)O.

[0015] In a preferred embodiment, the thickness of the heating layer is 10 nm to 2000 nm.

[0016] One of the above technical solutions has the following advantages or beneficial effects: it can use the heating layer to generate heat through self-heating, and the vacuum space between the outer and inner structures can effectively block heat transfer and keep the temperature warm.

[0017] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0018] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in the invention and should not be construed as limiting the scope of the invention.

[0019] Figure 1 A cross-sectional schematic diagram of a fever window according to an embodiment of the present invention is shown.

[0020] Figure 2 Another cross-sectional schematic diagram of the fever window according to an embodiment of the present invention is shown. Detailed Implementation

[0021] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0022] In a first aspect, embodiments of the present invention provide a fever window, see [link to previous document]. Figure 1 and Figure 2 As shown, the heat dissipation window includes an inner layer structure 100, a heating layer 300, an electrode 400, and an outer layer structure 200.

[0023] The heating layer 300 is a conductive film formed on the surface of the inner layer structure 100 by vacuum deposition of semiconductor metal oxide; the heating layer 300 is used to perform electrothermal conversion when energized.

[0024] The electrodes 400 are disposed on both sides of the heating layer 300. The electrodes 400 are connected to a power source and are used to energize the heating layer 300.

[0025] The outer layer structure 200 and the inner layer structure 100 are spaced apart and fixedly connected to form an integrated hot air window. The gap between the outer layer structure 200 and the inner layer structure 100 is sealed to form a vacuum space.

[0026] In this embodiment, the heat window can generate heat by using the heating layer 300, and the vacuum space between the outer layer structure 200 and the inner layer structure 100 can effectively block heat transfer and keep the room warm.

[0027] Furthermore, the light transmittance of the inner layer structure 100 and the outer layer structure 200 is greater than 30%.

[0028] Further, see Figure 1 and Figure 2 As shown, a plurality of support structures 500 are provided between the inner layer structure 100 and the outer layer structure 200.

[0029] In one specific embodiment, see Figure 1 and Figure 2 As shown, the hot air window also includes a door and window frame 600, which is a frame structure made of thermal insulation material. The thermal insulation material includes one of basalt, foamed cement, silicon carbide fiber, rock wool and expanded perlite. The door and window frame 600 is integrally molded and wrapped around the outer layer structure 200 and the inner layer structure 100 so that the edges of the outer layer structure 200 and the inner layer structure 100 are both inside the door and window frame 600.

[0030] In one specific embodiment, see Figure 2 As shown, when the heating layer 300 is disposed on the exposed side surface of the inner layer structure 100, the heating window also includes a protective layer 700, which is a waterproof and insulating layer formed by vacuum sputtering of silicon dioxide.

[0031] In one specific embodiment, the heating layer 300 is a conductive film formed by vacuum deposition of one of the semiconductor metal oxides selected from ZnOxS(1-x), InOxS(1-x), SnxIn(1-x)O, ZnxMg(1-x)O and ZnxAl(1-x)O.

[0032] In one specific embodiment, the thickness of the heating layer 300 is 10nm to 2000nm.

[0033] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of those different embodiments or examples.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0035] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in the present invention, and these should all be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A fever clinic window, characterized in that, include: Inner structure; A heating layer, wherein the heating layer is a conductive film formed on the surface of the inner layer structure by vacuum deposition of a semiconductor metal oxide; the heating layer is used to perform electrothermal conversion when energized; Electrodes are disposed on both sides of the heating layer, and the electrodes are connected to a power source to supply power to the heating layer. An outer layer structure is provided, which is spaced apart from the inner layer structure and is fixedly connected to the inner layer structure to form an integrated hot air window. The gap between the outer layer structure and the inner layer structure is sealed to form a vacuum space.

2. The fever window as described in claim 1, characterized in that, The light transmittance of the inner and outer layers is greater than 30%.

3. The fever window as described in claim 1, characterized in that, Several supporting structures are provided between the inner structure and the outer structure.

4. The fever window as described in claim 1, characterized in that, It also includes door and window frames, which are frame structures made of thermal insulation material. The door and window frames are wrapped around the outer and inner layers of the structure so that the edges of the outer and inner layers are both within the door and window frames.

5. The fever window as described in claim 4, characterized in that, The thermal insulation material is one of basalt, foamed cement, silicon carbide fiber, rock wool, and expanded perlite, which is integrally molded into the frame structure.

6. The fever window as described in claim 1, characterized in that, When the heating layer is disposed on the exposed side surface of the inner layer structure, the heating window also includes a protective layer, which is a waterproof and insulating layer formed by vacuum sputtering of silicon dioxide.

7. The fever window as described in any one of claims 1-6, characterized in that, The heating layer is a conductive film formed by vacuum deposition of one of the semiconductor metal oxides selected from ZnOxS(1-x), InOxS(1-x), SnxIn(1-x)O, ZnxMg(1-x)O and ZnxAl(1-x)O.

8. The fever window as described in claim 7, characterized in that, The thickness of the heating layer is 10nm to 2000nm.

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