PCBA board-based intelligent control module
By designing expansion and heat dissipation components on the PCBA board, and utilizing the deformation of the rubber sleeve and heat-insulating rubber sheet to bring the thermally conductive silicone tube into contact with the PCBA board, combined with ventilation slots and copper strips and rings for precise heat conduction, the problem of localized high temperature in bare PCB circuits is solved, achieving efficient heat dissipation and improved module reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN NANFANG ZHIKONG TECH CO LTD
- Filing Date
- 2025-05-26
- Publication Date
- 2026-05-05
AI Technical Summary
Existing technologies struggle to effectively control the localized temperature inside PCB bare board circuit connection modules, leading to aging and performance degradation of internal CPU semiconductor materials, thus affecting module reliability and lifespan.
An intelligent control module including an expansion component and a heat dissipation component was designed. The deformation of the rubber sleeve and the heat insulation rubber sheet drives the thermally conductive silicone tube to adhere to the PCBA board. Combined with ventilation slots and copper strips and copper rings, precise heat conduction and cooling are achieved.
It significantly improves the local cooling effect of PCBA boards, reduces the design cost of different heat dissipation mechanisms, and improves the practicality and versatility of the device.
Smart Images
Figure CN224205485U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of PCBA board technology, specifically to an intelligent control module based on PCBA board. Background Technology
[0002] The intelligent control module of the PCBA board is a core component integrated into the printed circuit board assembly. It works in concert with components such as microprocessors or microcontrollers, sensors, and communication interfaces to achieve automated and intelligent control of the entire PCBA board and related equipment. This module can receive sensor signals, perform logical judgments and data processing according to preset programs, and control the execution elements to complete specific tasks through drive circuits. It also supports communication with external systems to achieve remote monitoring and data interaction, thereby improving the system's operating efficiency, reliability, and flexibility.
[0003] When using intelligent control modules on PCBA boards, high-power components and dense circuit layouts can easily lead to localized overheating. These components consume a lot of electrical energy during operation, most of which is converted into heat. In particular, when the CPU or GPU is under high load or high frequency operation, the heat generation is extremely significant. For example, when a high-performance microprocessor executes complex algorithms, the core temperature may exceed 100°C, which not only affects the performance of the module but may also reduce its reliability.
[0004] If the local temperature inside the PCB bare board circuit connection module cannot be effectively controlled, the semiconductor materials inside the CPU, which are in a high-temperature state for a long time, will age faster, and the transistor performance will gradually degrade, thus shortening the lifespan of the CPU. Current technical means, such as ventilation or adding heat sinks, can reduce the overall temperature to a certain extent, but it is difficult to quickly cool down local high-temperature areas, resulting in limited cooling effect and thus reducing the overall performance and reliability of the system. Therefore, to address the above problems, an intelligent control module based on PCBA board is proposed. Utility Model Content
[0005] The purpose of this invention is to provide an intelligent control module based on a PCBA board to solve the problem that if the local temperature inside the PCB bare board circuit connection module cannot be effectively controlled, the internal semiconductor materials of the CPU will age faster due to long-term exposure to high temperatures.
[0006] To achieve the above objectives, this utility model provides the following technical solution:
[0007] A smart control module based on a PCBA board includes a base plate and a PCBA board body. A protective shell is fixedly connected to the top of the base plate. Ventilation slots are provided at both the front and rear ends of the protective shell. A cover plate is fixedly connected to the top of the protective shell. An expansion component is fixedly connected to the bottom of the cover plate. A heat dissipation component is fixedly connected to the bottom of the expansion component. The expansion component includes a rubber sleeve. A heat-insulating rubber sheet is fixedly connected to the inner side of the rubber sleeve. A heat-insulating groove is provided on the inner side of the heat-insulating rubber sheet. The heat dissipation component includes a thermally conductive silicone tube. A heat-conducting channel is provided on the inner side of the thermally conductive silicone tube. A copper strip and a copper ring are fixedly connected to the inner side of the heat-conducting channel. The top end of the thermally conductive silicone tube is fixedly connected to the bottom end of the rubber sleeve.
[0008] As a further optimization of this utility model, the top of the base plate is fixedly connected to the bottom of the PCBA board body, and the PCBA board body is located inside the protective shell.
[0009] As a further optimization of this utility model, the ventilation slot penetrates the interior of the protective shell, the inner side of the protective shell is a hollow structure, and the ventilation slot is connected to the inner side of the protective shell.
[0010] As a further optimization of this utility model, the expansion component and the heat dissipation component are located inside the protective shell, the heat dissipation component is located at the upper end of the PCBA board body, a gap is provided between the bottom end of the heat dissipation component and the top end of the PCBA board body, and the number of heat dissipation components is multiple.
[0011] As a further optimization of this utility model, the upper end of the rubber sleeve is fixedly connected to the bottom end of the cover plate, the upper end of the rubber sleeve is a through structure, and the top end of the heat insulation rubber sheet is fixedly connected to the bottom end of the cover plate.
[0012] As a further optimization of this utility model, the number of heat-insulating rubber sheets is multiple, and the heat-insulating rubber sheets are connected to form multiple hexagons.
[0013] As a further optimization of this utility model, the front and rear ends of the thermally conductive silicone tube are both through structures, and there is a gap between the front and rear ends of the thermally conductive silicone tube and the inner side of the protective shell. The copper ring is annular in shape.
[0014] Compared with the prior art, the beneficial effects of this utility model are:
[0015] In this invention, through the inclusion of expansion and heat dissipation components, the device utilizes the stable sealing structure of the rubber sleeve and the separation of the heat-insulating rubber sheet to cause the gas expansion due to local high temperature, resulting in deformation of the rubber sleeve and heat-insulating rubber sheet. This, in turn, causes the thermally conductive silicone tube to adhere to the localized areas of the PCBA board body with excessive heat, achieving precise heat conduction. Furthermore, the air entering through the ventilation slots cools the thermally conductive silicone tube, copper strip, and copper ring, significantly improving the localized cooling effect on the PCBA board body. In addition, the design of the rubber sleeve's localized deformation can adapt to the heat dissipation work of PCBA boards with various deformations, reducing the design cost of different heat dissipation mechanisms and improving the practicality and versatility of the device. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0017] Figure 2 This is an exploded structural diagram of the entire utility model;
[0018] Figure 3 This is a schematic diagram of the heat dissipation component structure of this utility model;
[0019] Figure 4 This is a cross-sectional structural diagram of the expansion component of this utility model;
[0020] Figure 5 This is a cross-sectional structural diagram of the heat dissipation component of this utility model;
[0021] Figure 6 This utility model Figure 5 A schematic diagram of the structure at point A.
[0022] In the diagram: 1. Base plate; 2. PCBA board body; 3. Protective shell; 4. Ventilation slot; 5. Cover plate;
[0023] 6. Expansion assembly; 61. Rubber sleeve; 62. Thermal insulation rubber sheet; 63. Thermal insulation groove;
[0024] 7. Heat dissipation components; 71. Thermal conductive silicone tube; 72. Heat conduction channel; 73. Copper strip; 74. Copper ring. Detailed Implementation
[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0026] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.
[0027] Please see Figure 1-6 This utility model provides a technical solution:
[0028] A smart control module based on a PCBA board includes a base plate 1 and a PCBA board body 2. A protective shell 3 is fixedly connected to the top of the base plate 1. Ventilation slots 4 are opened at the front and rear ends of the protective shell 3. A cover plate 5 is fixedly connected to the top of the protective shell 3. An expansion component 6 is fixedly connected to the bottom of the cover plate 5. A heat dissipation component 7 is fixedly connected to the bottom of the expansion component 6. The expansion component 6 includes a rubber sleeve 61. A heat insulation rubber sheet 62 is fixedly connected to the inner side of the rubber sleeve 61. A heat insulation groove 63 is provided on the inner side of the heat insulation rubber sheet 62. The heat dissipation component 7 includes a thermally conductive silicone tube 71. A heat conduction channel 72 is opened on the inner side of the thermally conductive silicone tube 71. A copper strip 73 and a copper ring 74 are fixedly connected to the inner side of the heat conduction channel 72. The top of the thermally conductive silicone tube 71 is fixedly connected to the bottom of the rubber sleeve 61.
[0029] As a further implementation of this solution, the top of the base plate 1 is fixedly connected to the bottom of the PCBA board body 2. The PCBA board body 2 is located inside the protective shell 3. The ventilation slot 4 penetrates the interior of the protective shell 3. The inner side of the protective shell 3 is a hollow structure. The ventilation slot 4 is connected to the inner side of the protective shell 3. Through the above settings, the stability and reliability of the entire device are ensured, providing a good foundation for subsequent operations such as heat dissipation. The ventilation slot 4 provides a channel for air circulation, thereby achieving effective cooling of the PCBA board body 2 inside the protective shell 3, which helps to improve heat dissipation efficiency and ensure that the PCBA board body 2 works within a suitable temperature range.
[0030] As a further implementation of this solution, the expansion component 6 and the heat dissipation component 7 are located inside the protective shell 3. The heat dissipation component 7 is located at the upper end of the PCBA board body 2, and a gap is provided between the bottom end of the heat dissipation component 7 and the top end of the PCBA board body 2. There are multiple heat dissipation components 7. Through the above arrangement, this layout can make full use of the space inside the protective shell 3. The arrangement of multiple heat dissipation components 7 can better cooperate with the PCBA board body 2 to play a supporting and guiding role. At the same time, the spacing avoids excessive contact between the heat dissipation component 7 and the PCBA board body 2, reduces the obstruction of heat conduction, and is conducive to heat dissipation.
[0031] As a further implementation of this solution, the upper end of the rubber sleeve 61 is fixedly connected to the bottom end of the cover plate 5. The upper end of the rubber sleeve 61 is a through structure. The top end of the heat insulation rubber sheet 62 is fixedly connected to the bottom end of the cover plate 5. There are multiple heat insulation rubber sheets 62, which are connected to form multiple hexagons. Through the above settings, the hexagonal structure formed by the connection of multiple heat insulation rubber sheets 62 has good stability and uniformity, and can better withstand the force generated by the gas expansion caused by local high temperature, making the deformation more uniform and controllable. This allows for more precise contact between the heat-conducting silicone tube 71 and the local area of excessive heat in the PCBA board body 2, improving the accuracy and effectiveness of heat dissipation.
[0032] As a further implementation of this solution, the front and rear ends of the thermally conductive silicone tube 71 are both through structures, and there is a gap between the front and rear ends of the thermally conductive silicone tube 71 and the inner side of the protective shell 3. The copper ring 74 is in the shape of a ring structure. Through the above settings, the copper strip 73 and the copper ring 74 support the thermally conductive silicone tube 71 and at the same time play a role in absorbing heat.
[0033] Workflow: When dissipating heat from the PCBA board body 2, the existing cooling fan blows air in through the front ventilation slot 4. Ventilation slots 4 are also provided at the front and rear ends of the protective shell 3. Air enters the interior of the protective shell 3 through the ventilation slots 4, thereby cooling the PCBA board body 2 inside the protective shell 3. During operation, the PCBA board body 2 may experience localized overheating. At this time, the PCBA board body 2 radiates electromagnetic waves due to its temperature, which is thermal radiation. This localized heat is transferred to the rubber sleeve 61, causing it to overheat. Due to the stable sealing structure inside the rubber sleeve 61 and the separation by multiple heat-insulating rubber sheets 62, the gas inside the heat-insulating groove 63 near the overheated area expands. This gas expansion causes the heat-insulating rubber sheets 62 and the rubber sleeve near the heat-insulating groove 63 to... The rubber sleeve 61 will deform and expand downwards. After the rubber sleeve 61 expands, the thermal conductive silicone tube 71 will deform and bend. At this time, a part of the thermal conductive silicone tube 71 will move downwards. After moving a certain distance, the thermal conductive silicone tube 71 will come into contact with the part of the PCBA board body 2 that is overheated. Heat is conducted through the thermal conductive silicone tube 71, and the copper ring 74 and copper strip 73 absorb the heat on the thermal conductive silicone tube 71. The air entering through the ventilation slot 4 then enters the interior of the heat conduction channel 72 to cool the thermal conductive silicone tube 71, copper strip 73 and copper ring 74. This design of the thermal conductive silicone tube 71 coming into contact with the PCBA board body 2 locally improves the local cooling effect of the PCBA board body 2. At the same time, the design of the local deformation of the rubber sleeve 61 can adapt to the heat dissipation work of the PCBA board body 2 with various deformations, reduce the need for different heat dissipation mechanisms for different models, and improve the practicality of the device.
[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A smart control module based on a PCBA board, comprising a base plate (1) and a PCBA board body (2), characterized in that: The top of the base plate (1) is fixedly connected to a protective shell (3). Ventilation slots (4) are opened at the front and rear ends of the protective shell (3). The top of the protective shell (3) is fixedly connected to a cover plate (5). The bottom of the cover plate (5) is fixedly connected to an expansion component (6). The bottom of the expansion component (6) is fixedly connected to a heat dissipation component (7). The expansion component (6) includes a rubber sleeve (61), and a heat-insulating rubber sheet (62) is fixedly connected to the inner side of the rubber sleeve (61). A heat-insulating groove (63) is provided on the inner side of the heat-insulating rubber sheet (62). The heat dissipation component (7) includes a thermally conductive silicone tube (71), and a thermally conductive channel (72) is provided on the inner side of the thermally conductive silicone tube (71). A copper strip (73) and a copper ring (74) are fixedly connected to the inner side of the thermally conductive channel (72). The top end of the thermally conductive silicone tube (71) is fixedly connected to the bottom end of the rubber sleeve (61).
2. The intelligent control module based on a PCBA board according to claim 1, characterized in that: The top of the base plate (1) is fixedly connected to the bottom of the PCBA board body (2), and the PCBA board body (2) is located inside the protective shell (3).
3. The intelligent control module based on a PCBA board according to claim 1, characterized in that: The ventilation slot (4) penetrates the interior of the protective shell (3), the inner side of the protective shell (3) is a hollow structure, and the ventilation slot (4) is connected to the inner side of the protective shell (3).
4. The intelligent control module based on a PCBA board according to claim 1, characterized in that: The expansion component (6) and the heat dissipation component (7) are located inside the protective shell (3). The heat dissipation component (7) is located at the upper end of the PCBA board body (2). There is a gap between the bottom end of the heat dissipation component (7) and the top end of the PCBA board body (2). There are multiple heat dissipation components (7).
5. The intelligent control module based on a PCBA board according to claim 1, characterized in that: The upper end of the rubber sleeve (61) is fixedly connected to the bottom end of the cover plate (5). The upper end of the rubber sleeve (61) is a through structure. The top end of the heat insulation rubber sheet (62) is fixedly connected to the bottom end of the cover plate (5).
6. The intelligent control module based on a PCBA board according to claim 1, characterized in that: The number of heat-insulating rubber sheets (62) is multiple, and the heat-insulating rubber sheets (62) are connected to form multiple hexagons.
7. The intelligent control module based on a PCBA board according to claim 1, characterized in that: The front and rear ends of the thermally conductive silicone tube (71) are both through structures. There is a gap between the front and rear ends of the thermally conductive silicone tube (71) and the inner side of the protective shell (3). The copper ring (74) is annular in shape.