Wafer film turning clamp

Abstract

This invention provides a wafer flipping fixture, relating to the field of semiconductor manufacturing technology. The fixture includes: a circular body; a circular hole at the center of the body; multiple positioning pins distributed around the circular hole on the upper surface of the body; the center of the circle formed by the positioning pins coincides with the center of the circular hole, and its diameter is the same as the outer diameter of the wafer expansion ring; a circular positioning frustum surrounding the circular hole on the lower surface of the body; the center of the positioning frustum coincides with the center of the circular hole; the positioning frustum protrudes away from the body, and its longitudinal section is rectangular; wherein the inner diameter of the film-attaching ring is greater than or equal to the outer diameter of the positioning frustum. This invention can reduce the deviation between the wafer and the center position on the film-attaching ring after flipping.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a wafer flipping fixture. Background Technology

[0002] In semiconductor manufacturing, wafer flipping, also known as wafer transfer, typically refers to the process of flipping and transferring a wafer from one blue film to another, and is an important step in wafer fabrication. For example, a wafer is adhered to the adhesive side of the first blue film. During flipping, the adhesive side of the second blue film is placed facing the adhesive side of the first blue film and covers the wafer. After processing using specific methods, the second blue film is peeled off, causing the wafer to separate from the first blue film. At this point, the wafer is transferred from the first blue film to the second blue film.

[0003] The blue film is typically fixed to the wafer expansion ring and the wafer bonding ring. The wafer expansion ring, also known as the mother-daughter ring, consists of two concentric rings nested together to hold the blue film. The wafer bonding ring, also known as an iron ring or stainless steel ring, is a thin, circular component used for wafer bonding, with a large open area in the center to accommodate the wafer. The blue film is fixed to the edge of the wafer bonding ring.

[0004] In the current process, the wafer is manually flipped from the expansion ring to the lamination ring. For example, the expansion ring is placed on the lamination ring, the position is visually aligned, and the blue film on the expansion ring is pressed to make the wafer contact the blue film on the lamination ring, thus completing the wafer flipping from the expansion ring to the lamination ring. However, manual visual alignment has low accuracy, and the wafer often deviates from the center of the lamination ring after flipping, which adversely affects subsequent processing steps. Utility Model Content

[0005] This utility model provides a wafer flipping fixture to solve the problem that the wafer on the film-applying ring is significantly off-center after flipping in the wafer flipping process from the expansion ring to the film-applying ring.

[0006] In a first aspect, this utility model provides a wafer flipping fixture, wherein the flipping is a flipping process from a die expansion ring to a film application ring; the fixture includes: an annular body; the center of the body is a hollowed-out circular hole; the upper surface of the body is provided with a plurality of positioning pins distributed around the hollowed-out circular hole; the center of the circle formed by the positioning pins coincides with the center of the hollowed-out circular hole, and the diameter is the same as the outer diameter of the die expansion ring; the lower surface of the body is provided with an annular positioning frustum surrounding the hollowed-out circular hole; the center of the positioning frustum coincides with the center of the hollowed-out circular hole; the positioning frustum protrudes in a direction away from the body, and the longitudinal section is rectangular; wherein, the inner diameter of the film application ring is greater than or equal to the outer diameter of the positioning frustum.

[0007] In one possible implementation, an L-shaped right-angle positioning block is also provided on the edge of the body; the first right-angle side of the right-angle positioning block is parallel to the body and points to the center of the hollowed-out circular hole; the second right-angle side of the right-angle positioning block is perpendicular to the body and extends downward toward the body; the distance from the center of the hollowed-out circular hole to the second right-angle side is equal to the distance from the center of the film-applying ring to its straight positioning side.

[0008] In one possible implementation, the upper surface of the body is further provided with multiple dividing lines; at least one of the dividing lines is parallel to the first right-angled side of the right-angled positioning block, and / or at least one of the dividing lines is perpendicular to the first right-angled side of the right-angled positioning block.

[0009] In one possible implementation, the right-angle positioning block is detachably connected to the body.

[0010] In one possible implementation, the right-angle positioning block is bolted to the body.

[0011] In one possible implementation, the film-applying ring has multiple straight positioning edges; the first straight positioning edge has a V-shaped notch; the lower surface of the body also has a V-shaped positioning boss; the distance from the V-shaped positioning boss to the center of the hollowed-out circular hole is equal to the distance from the V-shaped notch to the center of the film-applying ring; the distance from the V-shaped positioning boss to the second right-angled side is equal to the distance from the V-shaped notch to the first straight positioning edge.

[0012] In one possible implementation, there are two V-shaped notches; correspondingly, there are two V-shaped positioning bosses.

[0013] In one possible implementation, the plurality of locating pins comprises four groups; each group includes at least one locating pin; the four groups of locating pins are distributed at 90° intervals.

[0014] In one possible implementation, the diameter of the perforated circular hole is greater than at least one of 2 inches, 4 inches, 6 inches, 8 inches, or 12 inches.

[0015] In one possible implementation, the lower end of the positioning frustum is further provided with a chamfer on the side away from the center.

[0016] In one possible implementation, the fixture is made of aluminum alloy, copper, engineering plastics, or carbon fiber composite materials.

[0017] This invention provides a wafer flipping fixture. By setting an annular arrangement of positioning pins on the upper surface of the fixture, and placing an expansion ring at the center of each positioning pin, the center of the expansion ring coincides with the center of the fixture. Furthermore, by setting an annular positioning frustum on the lower surface of the fixture, the positioning frustum is embedded in a film-applying ring, aligning the center of the film-applying ring with the center of the fixture. Thus, the fixture ensures that the centers of the expansion ring and the film-applying ring coincide. During the flipping process, the wafer on the blue film of the expansion ring is transferred to the blue film of the film-applying ring through a perforated circular hole in the fixture. This invention reduces the deviation between the wafer's position on the film-applying ring and the center position after flipping. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of the upper surface of the wafer flipping fixture provided in this embodiment of the utility model;

[0019] Figure 2 This is a three-dimensional structural diagram of the lower surface of the wafer flipping fixture provided in this embodiment of the present invention;

[0020] Figure 3 This is a schematic diagram of the structure of the expansion ring provided in this embodiment of the utility model;

[0021] Figure 4 This is a schematic diagram of the structure of the film-applying ring provided in an embodiment of the present invention;

[0022] Figure 5 This is a schematic diagram of the positioning relationship structure provided in an embodiment of the present utility model. Detailed Implementation

[0023] To enable those skilled in the art to better understand this solution, the technical solutions in the embodiments of this solution will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this solution, not all of them. Based on the embodiments of this solution, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this solution.

[0024] The term "comprising" and any other variations thereof in the specification, claims, and accompanying drawings of this invention mean "including but not limited to," and are intended to cover a non-exclusive inclusion, not limited to the examples listed herein. Furthermore, the terms "first" and "second," etc., are used to distinguish different objects, not to describe a specific order.

[0025] The implementation of this utility model will be described in detail below with reference to the accompanying drawings:

[0026] Wafer flipping typically occurs after dicing. Its purpose is to replace the film and flip the wafer without damaging the wafer or the chips on it, facilitating subsequent processes such as back inspection, film expansion, and dicing. It's important to note that in wafer flipping, the wafer may be a complete wafer or a wafer composed of a matrix of numerous independent chips. For example, a wafer attached to a blue film may be divided into numerous independent chips after dicing.

[0027] Die-expanding rings are typically used after wafer dicing to increase the distance between individual chips. Wafer-attachment rings usually serve as carriers for inspection and testing. Wafer-attachment rings are essential tools for semiconductor packaging processes such as wafer attaching, dicing, and die bonding. They are used in conjunction with blue film and wafer dicing machines during wafer bonding to fix the outer frame during wafer grinding and dicing, and can also be shipped directly after dicing. The wafer-attachment rings are made of stainless steel, offering advantages such as flatness, high hardness, excellent bending and corrosion resistance, and strong scratch resistance. They are recyclable and washable, making them environmentally friendly and economical. For example, after wafer dicing, die-expanding rings are used for die expansion; after expansion, the wafer film on the die-expanding ring is transferred to the wafer-attachment ring for subsequent processes.

[0028] In existing wafer flipping methods, manual visual alignment has low accuracy, resulting in significant misalignment of the wafer on the lamination ring after flipping. This significant misalignment may exceed the working range of subsequent inspection equipment or require it to spend more time on center alignment, negatively impacting subsequent processing steps.

[0029] This utility model provides a wafer flipping fixture that is easy to use, convenient to operate, and has high alignment accuracy. The fixture centers the expansion ring and the film-applying ring by means of the upper and lower surfaces of the fixture, respectively, so as to solve the problem that the wafer on the film-applying ring is significantly off-center after flipping in the wafer flipping process from the expansion ring to the film-applying ring.

[0030] Figure 1 This is a three-dimensional structural diagram of the upper surface of the wafer flipping fixture provided in this embodiment of the utility model; Figure 2 This is a three-dimensional structural diagram of the lower surface of the wafer flipping fixture provided in this embodiment of the present invention; see reference. Figure 1 , Figure 2The film-flipping process is a film-flipping process from the expansion ring to the film-applying ring. The fixture includes: a circular body 1; the center of the body 1 is a hollow circular hole; the upper surface of the body 1 is provided with a plurality of positioning pins 2 distributed around the hollow circular hole; the center of the circle formed by the positioning pins 2 coincides with the center of the hollow circular hole, and the diameter is the same as the outer diameter of the expansion ring; the lower surface of the body 1 is provided with a circular positioning frustum 3 surrounding the hollow circular hole; the center of the positioning frustum 3 coincides with the center of the hollow circular hole; the positioning frustum 3 protrudes in a direction away from the body 1, and the longitudinal section is rectangular; wherein, the inner diameter of the film-applying ring is greater than or equal to the outer diameter of the positioning frustum 3.

[0031] In some embodiments, the film flipping process is a film flipping process from the expansion ring to the film-applying ring.

[0032] Figure 3 This is a schematic diagram of the structure of the crystal expansion ring provided in an embodiment of this utility model. Figure 3 This is a top view. (See reference) Figure 3 The expansion ring consists of an inner ring and an outer ring, with the inner ring nested inside the outer ring. A blue film is sandwiched between the inner and outer rings. The inner diameter of the expansion ring is the same as the inner diameter of the inner ring; the outer diameter of the expansion ring is the same as the outer diameter of the outer ring.

[0033] Figure 4 This is a schematic diagram of the film-applying ring provided in an embodiment of the present invention. Figure 4 This is a top view. (See reference) Figure 4 The overall shape of the film-applying ring is circular, with a hollowed-out circle inside. The center of the film-applying ring mentioned below refers to the center of this hollowed-out circle. Additionally, the outer contour of the film-applying ring can also be circular, and it typically has positioning structures, such as straight positioning edges or V-shaped notches.

[0034] In some embodiments, the fixture includes: an annular body; the center of the body has a hollowed-out circular hole. It should be noted that, on the one hand, the hollowed-out circular hole is used for center positioning of the film-attaching ring, as described in detail below; on the other hand, the hollowed-out circular hole is also used to allow the wafer to pass through the fixture during film flipping, transferring it from above the fixture to below the fixture.

[0035] The size of the circular cutout must match the wafer specifications, typically slightly larger than the wafer diameter. This ensures the wafer can pass through smoothly while providing a stable center reference for the film-attaching ring.

[0036] For example, the diameter of the perforated circular hole is greater than at least one of 2 inches, 4 inches, 6 inches, 8 inches, or 12 inches. That is, the size of the perforated circular hole can be adapted to any one of 2 inches, 4 inches, 6 inches, 8 inches, or 12 inches.

[0037] The above describes the overall structural features of the fixture. The following describes the structural design of the upper surface of the fixture.

[0038] Figure 5 This is a schematic diagram of the positioning relationship structure provided in an embodiment of this utility model. The upper black circle in the diagram represents the die-expanding ring, and the lower black circle represents the film-attaching ring. The black circles are for three-dimensional representation and are only abstract representations of the components they represent; they do not show the complete structure. The middle clamping part is a longitudinal cross-sectional view. (Refer to...) Figure 5 In some embodiments, the upper surface of the body is provided with a plurality of positioning pins 2 distributed around the hollow circular hole; the center of the circle formed by the positioning pins 2 coincides with the center of the hollow circular hole, and the diameter is the same as the outer diameter of the expansion ring.

[0039] For example, the locating pin 2 can be a cylindrical pin.

[0040] For example, multiple positioning pins 2 are distributed around the hollowed-out circular hole. The circle formed by the multiple positioning pins 2 means that each positioning pin 2 is distributed on the same ring. Furthermore, the center of the circle formed by the positioning pins 2 coincides with the center of the hollowed-out circular hole, and the diameter of the circle formed by the positioning pins 2 is the same as the outer diameter of the expansion ring, so that the outer edge of the expansion ring can fit tightly against the inner side of the multiple positioning pins 2, forming a ring-like limiting. After the expansion ring is embedded in each positioning pin 2, the center of the expansion ring coincides with the center of the hollowed-out circular hole, achieving center positioning.

[0041] For example, the top of the positioning pin 2 is chamfered to facilitate the placement of the expansion ring between each positioning pin 2.

[0042] In some embodiments, the plurality of positioning pins 2 comprises four groups; each group includes at least one positioning pin 2; the four groups of positioning pins 2 are distributed at 90° intervals.

[0043] This embodiment uses a positioning pin array to fix and center the expansion ring, ensuring that the expansion ring is aligned with the fixture reference.

[0044] The above describes the structural design of the upper surface of the fixture. The following describes the structural design of the lower surface.

[0045] In some embodiments, the lower surface of the body is provided with an annular positioning frustum 3 surrounding a hollowed-out circular hole; the center of the positioning frustum 3 coincides with the center of the hollowed-out circular hole; the positioning frustum 3 protrudes in a direction away from the body, and the shape of its longitudinal section is rectangular; wherein, the inner diameter of the film-applying ring is greater than or equal to the outer diameter of the positioning frustum 3.

[0046] It should be noted that the overall shape of the positioning frustum 3 is annular, set on the lower surface of the body, and surrounds the hollowed-out circular hole, coinciding with the center of the hollowed-out circular hole in the fixture. This ensures that the upper positioning pin, the middle hollowed-out hole, and the lower positioning frustum of the fixture share the same reference, fundamentally guaranteeing the center alignment of the die expansion ring, the film-attaching ring, and the wafer. It should be noted that in the preceding processing steps, the center of the wafer and the center of the die expansion ring are usually coincident.

[0047] It should be further noted that the positioning frustum protrudes in the direction away from the main body. The longitudinal section is defined as a section perpendicular to the upper or lower surface of the fixture body. The longitudinal section shape of the positioning frustum is rectangular.

[0048] The inner diameter of the film-applying ring (i.e., the diameter of the hollowed-out area in the center of the film-applying ring) must be greater than or equal to the outer diameter of the positioning frustum 3 to ensure that the positioning frustum can be nested into the film-applying ring.

[0049] For example, the lower end of the positioning frustum is also provided with a chamfer on the side away from the center to ensure that the positioning frustum can be more easily nested into the film-applying ring.

[0050] In the wafer flipping process, the film-attaching ring needs to mate with the positioning frustum from the bottom of the fixture. The expansion ring is fixed to the top by positioning pins, forming a bidirectional positioning system. The inner diameter of the film-attaching ring fits precisely onto the positioning frustum. Since the positioning frustum is rectangular, the film-attaching ring will naturally slide to a position where its inner diameter matches the outer diameter of the positioning frustum, achieving center alignment without manual calibration. After nesting, the outer wall of the positioning frustum will tightly fit against the inner wall of the film-attaching ring, restricting radial movement of the film-attaching ring and preventing wafer misalignment due to film-attaching ring displacement during wafer flipping.

[0051] The core of the wafer flipping process is the transfer of the wafer from the top of the fixture through a perforated hole onto the film-coating ring below. The perforated design of the positioning frustum provides space for this action and offers positioning assistance.

[0052] This invention utilizes a ring-shaped arrangement of locating pins on the upper surface of the fixture, with the wafer expansion ring positioned at the center of each pin, aligning the center of the expansion ring with the center of the fixture. Furthermore, a circular locating frustum is provided on the lower surface of the fixture, embedding itself in the film-applying ring, aligning the center of the film-applying ring with the center of the fixture. Thus, the fixture ensures the centers of the expansion ring and the film-applying ring coincide. During film flipping, the wafer on the blue film of the expansion ring is transferred to the blue film of the film-applying ring through a perforated circular hole in the fixture. This invention reduces the deviation between the wafer's position on the film-applying ring and the center position after film flipping.

[0053] The above embodiments solve the problem of center position deviation. The following embodiments illustrate how to solve the problem of rotation angle deviation.

[0054] In wafer manufacturing processes, to ensure the continuity and efficiency of different process steps, it is necessary not only to ensure that the center position of the wafer is constant, but also to ensure that the rotation angle of the wafer is constant.

[0055] In one possible implementation, an L-shaped right-angle positioning block 4 is also provided on the edge of the body; the first right-angle side of the right-angle positioning block 4 is parallel to the body and points to the center of the hollow circular hole; the second right-angle side of the right-angle positioning block 4 is perpendicular to the body and extends downward toward the body; the distance from the center of the hollow circular hole to the second right-angle side is equal to the distance from the center of the film-applying ring to the straight positioning side.

[0056] The positioning block is L-shaped, consisting of two perpendicular right-angled sides, each serving a different positioning function. The first right-angled side is parallel to the fixture body and extends towards the center of the hollowed-out circular hole; the second right-angled side is perpendicular to the fixture body and extends downwards, convex downwards, aligning with the positioning frustum on the lower surface. The intersection of the two right-angled sides serves as the positioning reference point.

[0057] The distance from the center of the circular cutout to the second right-angled side is equal to the distance from the center of the film-applying ring to the straight positioning edge. This dimensional equality ensures that when the straight positioning edge of the film-applying ring aligns with the second right-angled edge of the positioning block, the center of the film-applying ring is aligned with the center of the cutout in the fixture. This effectively adds a mandatory calibration reference edge to the film-applying ring, avoiding the slight angular deviation that might occur with nesting only the positioning frustum. While the film-applying ring can achieve center alignment using only the circular positioning frustum on the lower surface, it may experience slight circumferential rotation around the center. The vertical edge of the second right-angled side of the L-shaped positioning block provides angular restraint. During installation, the straight positioning edge of the film-applying ring must be tightly fitted with the second right-angled side of the positioning block, completely restricting the rotational freedom of the film-applying ring.

[0058] During the film-turning process, the film-applying ring needs to withstand the tension of the film, such as the pulling force when peeling off the old film and applying the new film. If it is only supported by the nested positioning frustum, the edge of the film-applying ring may deform slightly due to uneven force, resulting in wrinkles in the film. The first right-angled side of the L-shaped positioning block can support the edge of the film-applying ring from the edge of the clamp, forming a dual support structure of central support from the positioning frustum and edge support from the L-shaped block. This disperses the force of the film tension on the film-applying ring, ensuring that the film-applying ring remains flat and preventing the film-applying ring from rotating under force.

[0059] The above explains how to solve the problem of rotation angle deviation of the film-applying ring. The following examples illustrate how to solve the problem of rotation angle deviation of the die-expanding ring.

[0060] In one possible implementation, the upper surface of the body is further provided with multiple dividing lines; at least one of the dividing lines is parallel to the first right-angled side of the right-angled positioning block 4, and / or at least one of the dividing lines is perpendicular to the first right-angled side of the right-angled positioning block 4.

[0061] For example, one of the reticle lines is parallel to the first right-angled side of the right-angled positioning block 4. For example, another reticle line is perpendicular to the first right-angled side of the right-angled positioning block 4. For instance, during operation, the right-angled positioning block 4 is placed in the position closest to the operator. At this time, the reticle line parallel to the first right-angled side indicates the left-right direction, and the reticle line perpendicular to the first right-angled side indicates the front-back direction. The operator can reduce the rotation angle deviation of the die expander ring by rotating it to align the XY direction of the wafer on the expander ring with the reticle line.

[0062] In one possible implementation, the right-angle positioning block 4 is detachably connected to the body. For example, the right-angle positioning block 4 is bolted to the body.

[0063] The film-applying ring typically has multiple straight positioning edges, such as four. One of these straight positioning edges can be fitted with a V-shaped notch to achieve directional positioning of the film-applying ring.

[0064] In one possible implementation, the film-applying ring has multiple straight positioning edges; the first straight positioning edge has a V-shaped notch; the lower surface of the body also has a V-shaped positioning boss; the distance from the V-shaped positioning boss to the center of the hollowed-out circular hole is equal to the distance from the V-shaped notch to the center of the film-applying ring; the distance from the V-shaped positioning boss to the second right-angled side is equal to the distance from the V-shaped notch to the first straight positioning edge.

[0065] In one possible implementation, there are two V-shaped notches; correspondingly, there are two V-shaped positioning bosses.

[0066] This utility model embodiment uses a V-shaped positioning boss to fit a straight positioning edge with a V-shaped notch among the multiple straight positioning edges of the film-applying ring, thereby playing a directional positioning role and ensuring that the film-applying ring is correctly oriented when installed under the clamp.

[0067] In one possible implementation, the fixture is made of aluminum alloy, copper, engineering plastics, or carbon fiber composite materials.

[0068] The following examples illustrate how to use a wafer flipping fixture. In use, the wafer bonding ring is placed below the fixture and engaged. Then, a wafer expansion ring is placed above the fixture. Pressing down transfers the chip from the expansion ring onto the bonding ring. For example, the bonding ring is placed on the platform first, followed by the flipping fixture, which then snaps onto the bonding ring. The inner diameter of the bonding ring and the diameter of the fixture's frustum are the same, fitting together. A right-angle positioning block on the fixture holds the straight edge of the bonding ring. The outer diameter of the expansion ring engages with the inner diameter of the fixture's cylindrical pin for center positioning, and then, with the aid of reticle lines, it is manually rotated.

[0069] This utility model embodiment reduces the uncertainty caused by manual operation by fixing the position with a fixture, and reduces the positional offset after wafer flipping; using a fixture improves production efficiency, changing the manual alignment operation to a fixture fixing operation, and reducing the time wasted in the production process.

[0070] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A wafer flipper fixture, comprising: The film flipping process is a film flipping process from the expansion ring to the film-coating ring; the fixture includes: A circular body; the center of the body is a hollowed-out circular hole; The upper surface of the body is provided with a plurality of positioning pins distributed around the hollow circular hole; the center of the circle formed by the positioning pins coincides with the center of the hollow circular hole, and the diameter is the same as the outer diameter of the expansion ring. The lower surface of the body is provided with an annular positioning frustum surrounding a hollowed-out circular hole; the center of the positioning frustum coincides with the center of the hollowed-out circular hole. The positioning frustum protrudes in a direction away from the body, and its longitudinal section is rectangular; wherein, the inner diameter of the film-applying ring is greater than or equal to the outer diameter of the positioning frustum.

2. The wafer flip chip bonder of claim 1 wherein, It also includes an L-shaped right-angle positioning block located on the edge of the body; The first right-angled side of the right-angled positioning block is parallel to the body and points to the center of the hollowed-out circular hole; The second right-angled side of the right-angled positioning block is perpendicular to the body and extends downward toward the body; The distance from the center of the hollowed-out circular hole to the second right-angled side is equal to the distance from the center of the film-applying ring to the straight positioning side.

3. The wafer flip chip bonder of claim 2 wherein, The upper surface of the body is also provided with multiple dividing lines; At least one of the division lines is parallel to the first right-angled side of the right-angled positioning block, and / or at least one of the division lines is perpendicular to the first right-angled side of the right-angled positioning block.

4. The wafer flip chip bonder of claim 2 wherein, The right-angle positioning block is detachably connected to the main body.

5. The wafer flipping fixture as described in claim 4, characterized in that, The right-angle positioning block is bolted to the body.

6. The wafer flipping fixture as described in claim 2, characterized in that, The film-applying ring has multiple straight positioning edges; the first straight positioning edge has a V-shaped notch. The lower surface of the body is also provided with a V-shaped positioning boss; The distance from the V-shaped positioning boss to the center of the hollowed-out circular hole is equal to the distance from the V-shaped notch to the center of the film-applying ring. The distance from the V-shaped positioning boss to the second right-angled side is equal to the distance from the V-shaped notch to the first straight positioning side.

7. The wafer flipping fixture as described in claim 6, characterized in that, There are two V-shaped notches; correspondingly, there are two V-shaped positioning bosses.

8. The wafer flipping fixture as described in claim 1, characterized in that, The plurality of locating pins comprises four groups; each group includes at least one locating pin. The four sets of locating pins are distributed at 90° intervals.

9. The wafer flipping fixture as described in claim 1, characterized in that, The diameter of the hollowed-out circular hole is greater than at least one of 2 inches, 4 inches, 6 inches, 8 inches, or 12 inches.

10. The wafer flipping fixture as described in claim 1, characterized in that, The lower end of the positioning frustum, away from the center, is also chamfered.

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