The application provides a double-sided
electroplating tool suitable for rotary
sputtering, which comprises a lower ring body, an upper ring body and an upper cover connected in a matching mode, a conductive ring with a group of lower conductive comb teeth is arranged on the lower ring body, an upper conductive ring with a group of upper conductive comb teeth is arranged on the upper ring body, a group of supporting cylinders in contact with the upper cover are uniformly distributed on the upper ring body, a conductive column connected with the upper conductive ring is arranged in the supporting cylinder, a conductive disc is arranged in the upper cover, a group of conductive guide columns corresponding to the conductive column are uniformly distributed on the conductive disc, a conductive shaft extending out of the upper cover is arranged on the conductive disc, and a group of
electroplating liquid exchange holes penetrating through the upper cover and the conductive disc are uniformly distributed on the upper cover. The application has the advantages of simple structure, convenient use, realization of double-sided
electroplating of a
wafer on the basis of a tilted rotary
sputtering electroplating process cavity structure, small difference between double-sided electroplating rates, high uniformity, simple operation, strong applicability and the like.