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Grid welding table array receptacle contacts

A technology for socket contacts and soldering stations, which is applied in the direction of contact parts, component plug-in combinations, coupling devices, etc., and can solve problems such as increased connection resistance and reduced cross-sectional area

Inactive Publication Date: 2008-01-09
TYCO ELECTRONICS JAPAN GK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] Also, if the width of the first elastic plate 206 is reduced, the cross-sectional area of ​​the first elastic plate 206 is reduced, thereby increasing the connection resistance.

Method used

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  • Grid welding table array receptacle contacts
  • Grid welding table array receptacle contacts
  • Grid welding table array receptacle contacts

Examples

Experimental program
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Embodiment Construction

[0029] Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of an LGA socket contact according to a first embodiment of the present invention. FIG. 2 is a plan view of the LGA socket contacts shown in FIG. 1 received in the contact receiving spaces. 3 is a perspective view of an LGA socket contact according to a second embodiment of the present invention. 4 is a plan view of the LGA socket contacts shown in FIG. 3 received in the contact receiving spaces. FIG. 5 is an illustrative schematic diagram of the LGA socket contacts shown in FIG. 3 secured to a strip.

[0030] In FIG. 1, an LGA socket contact (hereinafter simply referred to as "contact") 1 of a first embodiment has a substantially rectangular base plate 2 manufactured by stamping and forming a metal plate. Moreover, several fixing lugs 3 (in this embodiment, two on the upper part and one on the lower part) are provided on both side walls of the bo...

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PUM

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Abstract

A land grid array (LGA) socket contact (1) comprising a base plate part (2) having side anchoring projections (3), an elastic contact part (6) which is connected via a part (5) that is bent through approximately 180 DEG from a side of the base plate part (2), and which has a curved contact part (9) on its tip for contacting a contact pad of an integrated circuit, the contact (1) also including a board connecting part (10) extending from a lower end of the base plate part (2), connectable by soldering to a circuit board. The size of the elastic contact part (6) in a direction perpendicular to the base plate part (2) in the vicinity of the root of the elastic contact part (6) is minimised, so that inter contact pitch in this direction can be reduced, and allows a large amount of displacement of the elastic contact part (6) so that the connection resistance can be minimised.

Description

technical field [0001] The present invention relates to a LGA receptacle contact for a LGA receptacle. Background technique [0002] The LGA socket is used to connect the circuit board and the IC (Integrated Circuit) socket with several contacts on the bottom surface. For example, the contact shown in Figures 7 and 8 is a known contact for such an LGA socket (see US Patent No. 5,984,693). [0003] As shown in FIG. 7, such a contact 100 has a substantially rectangular base plate 101 and is formed by stamping and forming a sheet metal. Moreover, upwardly protruding guide projections 102 are provided at both ends of the upper edge 103 of the bottom plate 101 , and downward protruding engagement pins 104 are provided at both ends of the bottom edge 101 of the bottom plate 101 . In addition, two fixing protrusions 105 are provided on both side walls of the bottom plate 101 and are spaced apart by a predetermined distance in the vertical direction. Moreover, an elastic C-shaped...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R12/32H01R33/76H01R4/48H01R13/24H05K7/10
CPCH01R12/714H01R13/2442H01R12/52H05K7/1069H01R12/57
Inventor 白井浩史桥本信一田口季位
Owner TYCO ELECTRONICS JAPAN GK