Window cleaning kit for wire bonding apparatus, wire bonding apparatus including the same and cleaning method of capillary using the same
A technology of wire bonding and capillary, which is applied in the direction of electrical components, electric solid devices, semiconductor devices, etc., can solve the problems of long-time replacement of capillary, decrease of process benefit rate, and capillary damage, so as to reduce process loss and increase process benefit rate , the effect of reducing replacement costs
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[0028] Hereinafter, a cleaning kit for a wire bonding apparatus, a wire bonding apparatus including the cleaning kit for a wire bonding apparatus, and a capillary cleaning method using the wire bonding apparatus according to preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[0029] figure 1 It is a diagram for explaining a cleaning kit for a wire bonding apparatus according to an embodiment of the present invention, figure 2 to represent figure 1 perspective view of the window splint. at this time, figure 1 A state in which the cleaning kit is installed at positions corresponding to the plurality of holes of the window clamp is shown.
[0030] refer to figure 1 and figure 2 , the cleaning kit 100 for a wire bonding apparatus according to an embodiment of the present invention is used to fix a wire bonding object (not shown), and is mounted on a window clamp 10 having a plurality of holes H for use. ...
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