Window cleaning kit for wire bonding apparatus, wire bonding apparatus including the same and cleaning method of capillary using the same

A technology of wire bonding and capillary, which is applied in the direction of electrical components, electric solid devices, semiconductor devices, etc., can solve the problems of long-time replacement of capillary, decrease of process benefit rate, and capillary damage, so as to reduce process loss and increase process benefit rate , the effect of reducing replacement costs

Inactive Publication Date: 2014-06-04
ILJIN LED
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such chemical treatment of the capillary not only takes a long time, but also has the problem of damage to the capillary itself depending on the situation.
[0008] Due to such a problem, after the capillary is used for a specified time, the capillary itself is replaced instead of chemical agent treatment, but in this case, not only does it take a long time to replace the capillary, but also because work needs to be re-executed when installing a new capillary There is a problem that the profit rate of the process decreases due to the reason of the setting, etc.

Method used

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  • Window cleaning kit for wire bonding apparatus, wire bonding apparatus including the same and cleaning method of capillary using the same
  • Window cleaning kit for wire bonding apparatus, wire bonding apparatus including the same and cleaning method of capillary using the same
  • Window cleaning kit for wire bonding apparatus, wire bonding apparatus including the same and cleaning method of capillary using the same

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Embodiment Construction

[0028] Hereinafter, a cleaning kit for a wire bonding apparatus, a wire bonding apparatus including the cleaning kit for a wire bonding apparatus, and a capillary cleaning method using the wire bonding apparatus according to preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0029] figure 1 It is a diagram for explaining a cleaning kit for a wire bonding apparatus according to an embodiment of the present invention, figure 2 to represent figure 1 perspective view of the window splint. at this time, figure 1 A state in which the cleaning kit is installed at positions corresponding to the plurality of holes of the window clamp is shown.

[0030] refer to figure 1 and figure 2 , the cleaning kit 100 for a wire bonding apparatus according to an embodiment of the present invention is used to fix a wire bonding object (not shown), and is mounted on a window clamp 10 having a plurality of holes H for use. ...

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Abstract

The invention relates to a window cleaning kit for a wire bonding apparatus, a wire bonding apparatus including the same and a cleaning method of capillary using the same; the apparatus can effectively clean foreign matters attached on end portions of the capillaries in a long term process using the wire bonding; the cleaning kit for wire bonding apparatus can fix a wire bonding object, can be arranged on a window clamp plate having a hole in a fixed manner for usage, and can be used as the cleaning kit in a dismounting state; the cleaning kit comprises a vibration generation plate and a grinding sheet; the vibration generation plate is placed on the window clamp plate; the grinding sheet is attached on the vibration generation plate and linked with the vibration generation plate.

Description

technical field [0001] The present invention relates to a cleaning kit for a wire bonding (Wire Bonding) device, a wire bonding device including the cleaning kit for a wire bonding device, and a capillary cleaning method using the wire bonding device. A cleaning kit for generating vibration is attached to a window clamp, a cleaning kit for a wire bonding device capable of effectively cleaning the end of a capillary, a wire bonding device including the cleaning kit for a wire bonding device, and a wire bonding device using the wire bonding device. Capillary cleaning method for combined devices. Background technique [0002] In the manufacturing process of semiconductors, the technology of connecting light-emitting chips and substrates with metal wires using wire bonding devices is widely used. In such a wire bonding process, gold is commonly used as the metal wire. However, in view of the recent demand for higher speed and lower prices of semiconductors, in addition to gold...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/04H01L21/607
CPCH01L24/78B24B1/04H01L2224/7801H01L2224/451H01L2224/45144H01L2224/45147H01L2224/78H01L2224/78703H01L2924/10161H01L2924/00H01L2924/00012H01L2924/00014
Inventor 梁茪旭刘姬珍
Owner ILJIN LED
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