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SMD outer package type LED

A packaging and potting technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of poor moisture-proof performance and low reliability, and achieve high moisture-proof performance, strong reliability, and avoid moisture-prone effects

Active Publication Date: 2016-05-18
SHENZHEN JIUZHOU OPTOELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For this reason, the technical problem to be solved by the present invention is that the existing small-sized SMD display devices have poor moisture-proof performance and low reliability, so a MD external package LED with better moisture-proof effect and higher reliability is proposed

Method used

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  • SMD outer package type LED

Examples

Experimental program
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Embodiment

[0023] This embodiment provides a kind of SMD outer packaging type LED, such as Figure 1-2 As shown, it includes a substrate 1 and a potting compound 2 covering the substrate 1. At least four metal pads 3 isolated from each other are provided on the front of the substrate 1, and a light-emitting chip 4 is provided on the metal pads 3. There are three light-emitting chips 4, which are red light, green light and blue light-emitting chips respectively, and are fixed on three mutually isolated metal pads 3 by bonding glue. Arranged in shapes such as fonts, the light-emitting chip 4 and the metal pad 3 are connected by a metal wire 8, and the three metal pads 3 on which the red, green, and blue light-emitting chips 4 are fixed are provided with a circular reflective cup 5 outside , the three-color light-emitting chip is covered inside the reflective cup 5 . The reverse side of the substrate 1 is provided with at least four pins 6 corresponding to the metal pad 3, the pins 6 exten...

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Abstract

The invention discloses an SMD outer package type LED. The LED comprises a substrate and pouring sealant covering the substrate, metal bonding pads are arranged on the front face of the substrate, light-emitting chips are arranged on the metal bonding pads, and pins corresponding to the metal bonding pads are arranged on the reverse face of the substrate and extend out of the pouring sealant. The LED device packaging structure is completely wrapped by the epoxy resin pouring sealant, only two pins are reserved outside, the disadvantage that a traditional SMD device is affected with damp easily is avoided, damp resistance and reliability are high, the multi-bonding-pad design in the SMD surface attachment structure is reserved, the three-color light-emitting chips are integrated into one device, the small-size package device is obtained, the SMD outer package type LED device can be used for an outdoor display screen, and the requirement for high-definition energy-saving and small-spacing display of the outdoor display screen of the market is met.

Description

technical field [0001] The invention belongs to the technical field of LED encapsulation, and in particular relates to an SMD external encapsulation LED. Background technique [0002] LED display has always played an important role in the field of flat panel display relying on its unique advantages such as low power consumption, high brightness, and long life. With the advancement of technology and the development of urbanization, outdoor LED displays have developed rapidly. And it is widely used in squares, large shopping malls, highways, railways and other occasions. [0003] The traditional outdoor LED display is generally an in-line LED. The so-called in-line LED is to package the LED chip in the LED bracket and directly insert it into the circuit board through the positive and negative pins. Its manufacturing process is relatively simple, low in cost, and has good waterproof , anti-ultraviolet performance and heat dissipation capacity, so it has a high market share. H...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/62H01L33/52H01L33/56
CPCH01L33/48H01L33/52H01L33/56H01L33/62
Inventor 廖志伟
Owner SHENZHEN JIUZHOU OPTOELECTRONICS TECH
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