OLED capsule structure, encapsulating method of OLED capsule structure, OLED light emitting layer, molding method of OLED light emitting layer, display panel and electronic equipment

An encapsulation method and capsule encapsulation technology, which is applied in the direction of circuits, electrical components, and electric solid devices, can solve the problems of large encapsulation thickness and difficulty in encapsulation of the OLED light-emitting layer, and achieve early barrier of water and oxygen, reduce the difficulty of encapsulation, and reduce the thickness of the encapsulation Effect of Package Thickness

Active Publication Date: 2018-09-21
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this kind of encapsulation makes the encapsulation thickness of the OLED light-emitting layer large, and encapsulation is difficult

Method used

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  • OLED capsule structure, encapsulating method of OLED capsule structure, OLED light emitting layer, molding method of OLED light emitting layer, display panel and electronic equipment
  • OLED capsule structure, encapsulating method of OLED capsule structure, OLED light emitting layer, molding method of OLED light emitting layer, display panel and electronic equipment
  • OLED capsule structure, encapsulating method of OLED capsule structure, OLED light emitting layer, molding method of OLED light emitting layer, display panel and electronic equipment

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Embodiment Construction

[0022] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiment of the application will be clearly described below in conjunction with the accompanying drawings in the embodiment of the application. Obviously, the described embodiment is only the embodiment of the present application. Some of the examples are applied, but not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application.

[0023] The terms "first", "second" and "third" in the specification and claims of the present application and the above drawings are used to distinguish different objects, rather than to describe a specific order. Furthermore, the term "comprise", as well as any variations thereof, is intended to cover a non-exclusive inclusion. For example, a proces...

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Abstract

The invention provides an encapsulating method of an OLED capsule structure. The encapsulating method comprises the following steps of providing a non-polar layered conductive polymer, wherein the surface of the non-polar layered conductive polymer is provided with a plurality of chemical bonds; capturing a plurality of organic electroluminescent molecules of an organic electroluminescent substance through the chemical bonds of the non-polar layered conductive polymer; conducting capsule encapsulating on the non-polar layered conductive polymer capturing the organic electroluminescent molecules. The invention further provides a molding method of an OLED light emitting layer, the OLED capsule structure, an OLED light emitting layer, a display panel and electronic equipment. According to theencapsulating method, by encapsulating the organic electroluminescent molecules in the form of a capsule structure, the water and oxygen can be blocked in advance, the encapsulating difficulty can bereduced, and the encapsulating thickness is reduced.

Description

technical field [0001] The present application relates to the field of display packaging, in particular to an OLED capsule structure and packaging method, an OLED light-emitting layer and a molding method, a display panel and electronic equipment. Background technique [0002] Because the organic luminescent material of the OLED light-emitting layer is easily affected by water and oxygen. Therefore, it is necessary to seal between the upper and lower substrates encapsulating the OLED light-emitting layer, so as to block the influence of water and oxygen on the organic light-emitting substances of the OLED light-emitting layer. However, this kind of encapsulation makes the encapsulation thickness of the light-emitting layer of the OLED large, and the encapsulation is difficult. Contents of the invention [0003] The present application provides an OLED capsule structure and packaging method, an OLED light-emitting layer and a molding method, a display panel and electronic ...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H01L51/56H01L51/52H01L51/50
CPCH10K50/11H10K2101/10H10K50/84H10K71/00
Inventor贾玉虎
OwnerGUANGDONG OPPO MOBILE TELECOMM CORP LTD