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Straight-through heat-dissipation double-sided copper substrate and manufacturing method thereof

A copper substrate and double-sided technology, which is applied in the field of direct heat dissipation double-sided copper substrate and its production, can solve the problems of affecting the service life of car lights, the difficulty of popularizing headlights, and poor heat dissipation treatment, so as to increase the exposed heat dissipation area and disperse Heat, optimize the effect of heat dissipation channels

Inactive Publication Date: 2018-10-16
南京尚孚电子电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] At present, it is difficult to popularize LED car headlights, mainly due to poor heat dissipation, poor heat dissipation treatment and easy light decay
Affect the service life of headlights

Method used

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  • Straight-through heat-dissipation double-sided copper substrate and manufacturing method thereof

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Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0028] In describing the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", " The orientation or positional relationship indicated by "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referre...

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Abstract

The invention discloses a straight-through heat-dissipation double-sided copper substrate and a manufacturing method thereof, which comprises a copper substrate body, wherein the top surface and the bottom surface of the copper substrate body are provided with a radiating structure respectively; the heat-dissipation structure includes line grooves formed on both sides of the copper substrate, thecopper substrate body is divided into a first heat-dissipation disc and a second heat-dissipation disc by the line grooves. Pure copper base material is used as the material of the core heat dissipation structure of the circuit substrate, the heat dissipation structure has the advantages of fast heat dissipation, a heat conduction coefficient of 380W / m. k, and high heat capacity, and can effectively disperse the heat of a light source.

Description

technical field [0001] The invention belongs to the technical field of copper substrates, and in particular relates to a double-sided copper substrate for direct heat dissipation and a manufacturing method thereof. Background technique [0002] There are more and more applications of LED light sources in the field of automotive headlights, which are mainly based on LED light source products with the following notable features [0003] One: Long life, generally up to tens of thousands or even hundreds of thousands of hours. There will even be no need to replace lamps throughout the life of the car. Two: high efficiency, low energy consumption. The energy consumption of LED lamps is 1 / 20 of that of halogen lamps. Three: The light quality is high, it is an environmentally friendly product and basically has no radiation, and it is a "green" light source. Four: The structure of the LED light source is simple, the internal bracket structure is sealed with transparent epoxy res...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02F21V29/508F21Y115/10
CPCH05K1/021F21V29/508F21Y2115/10
Inventor 李桂华
Owner 南京尚孚电子电路有限公司
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